| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Applications of temperature phase measurements to IC testing
|
Altet, J.
|
|
2004
|
44 |
1 |
p. 95-103
9 p.
|
artikel
|
| 2 |
A review of electrostatic discharge (ESD) in advanced semiconductor technology
|
Voldman, Steven H.
|
|
2004
|
44 |
1 |
p. 33-46
14 p.
|
artikel
|
| 3 |
Chip on paper technology utilizing anisotropically conductive adhesive for smart label applications
|
Rasul, Jad S.
|
|
2004
|
44 |
1 |
p. 135-140
6 p.
|
artikel
|
| 4 |
Design and simulation of micromechanical thermal converter for RF power sensor microsystem
|
Jakovenko, Jiri
|
|
2004
|
44 |
1 |
p. 141-148
8 p.
|
artikel
|
| 5 |
Design criteria for low distortion in feedback OPAMP circuits; Bjornar Hernes, Trond Saether, Kluwer Academic Publishers, Boston, 2003. Hardcover, pp. 160, plus XXV, 110 €. ISBN 1-4020-7356-9
|
Stojcev, Mile
|
|
2004
|
44 |
1 |
p. 181-182
2 p.
|
artikel
|
| 6 |
Effects of electrical stress on mid-gap interface trap density and capture cross sections in n-MOSFETs characterized by pulsed interface probing measurements
|
Kwon, Hyuck In
|
|
2004
|
44 |
1 |
p. 47-51
5 p.
|
artikel
|
| 7 |
Electron transport through broken down ultra-thin SiO2 layers in MOS devices
|
Miranda, Enrique
|
|
2004
|
44 |
1 |
p. 1-23
23 p.
|
artikel
|
| 8 |
Fatigue analysis of high-speed photodiode submodule by using FEM
|
Kim, K.S.
|
|
2004
|
44 |
1 |
p. 167-171
5 p.
|
artikel
|
| 9 |
Flip-chip packaging solution for CMOS image sensor device
|
Kim, Jong-heon
|
|
2004
|
44 |
1 |
p. 155-161
7 p.
|
artikel
|
| 10 |
Hole injection enhanced hot-carrier degradation in PMOSFETs used for systems on chip applications with 6.5–2 nm thick gate-oxides
|
Bravaix, A.
|
|
2004
|
44 |
1 |
p. 65-77
13 p.
|
artikel
|
| 11 |
Implementation of self-checking two-level combinational logic on FPGA and CPLD circuits
|
Stojčev, Mile K
|
|
2004
|
44 |
1 |
p. 173-178
6 p.
|
artikel
|
| 12 |
Influence of mobility model on extraction of stress dependent source–drain series resistance
|
De Souza, M.M.
|
|
2004
|
44 |
1 |
p. 25-32
8 p.
|
artikel
|
| 13 |
Integrated vapor pressure, hygroswelling, and thermo-mechanical stress modeling of QFN package during reflow with interfacial fracture mechanics analysis
|
Tee, Tong Yan
|
|
2004
|
44 |
1 |
p. 105-114
10 p.
|
artikel
|
| 14 |
New distributed model of NPT IGBT dedicated to power circuits design
|
Bonnet, G.
|
|
2004
|
44 |
1 |
p. 79-88
10 p.
|
artikel
|
| 15 |
Origin of 1/f noise in lateral PNP bipolar transistors
|
Zhao, Enhai
|
|
2004
|
44 |
1 |
p. 89-94
6 p.
|
artikel
|
| 16 |
Simulation of partially and near fully depleted SOI MOSFET devices and circuits using SPICE compatible physical subcircuit model
|
Imam, Mohamed A.
|
|
2004
|
44 |
1 |
p. 53-63
11 p.
|
artikel
|
| 17 |
Single-equation model for low and high voltage soft breakdown conduction
|
Miranda, E.
|
|
2004
|
44 |
1 |
p. 163-166
4 p.
|
artikel
|
| 18 |
System on chip design languages; Anne Mignotte, Eugenio Villar, Lynn Horobin, editors, Kluwer Academic Publishers, Boston, 2002. Hardcover, pp. 283, plus IX, 141 €. ISBN 1-4020-7046-2
|
Stojcev, Mile
|
|
2004
|
44 |
1 |
p. 179-
1 p.
|
artikel
|
| 19 |
The effect of model building on the accuracy of fatigue life predictions in electronic packages
|
Towashiraporn, P.
|
|
2004
|
44 |
1 |
p. 115-127
13 p.
|
artikel
|
| 20 |
Thermal distribution calculations for block level placement in embedded systems
|
Patrikar, Rajendra M.
|
|
2004
|
44 |
1 |
p. 129-134
6 p.
|
artikel
|
| 21 |
Thermosonic flip-chip bonding for SAW filter
|
Tomioka, Taizo
|
|
2004
|
44 |
1 |
p. 149-154
6 p.
|
artikel
|
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