nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
Accurate natural convection modelling for magnetic components
|
Valchev, Vencislav |
|
2003 |
43 |
5 |
p. 795-802 8 p. |
artikel |
2 |
Calendar of forthcoming events
|
|
|
2003 |
43 |
5 |
p. I-IX nvt p. |
artikel |
3 |
Development of the green plastic encapsulation for high density wirebonded leaded packages
|
Lin, T.Y. |
|
2003 |
43 |
5 |
p. 811-817 7 p. |
artikel |
4 |
Electrical reliability of highly reliable 256M-bit mobile DRAM with top-edge round STI and dual gate oxide
|
Lee, Chihoon |
|
2003 |
43 |
5 |
p. 735-739 5 p. |
artikel |
5 |
Field failure due to creep corrosion on components with palladium pre-plated leadframes
|
Zhao, Ping |
|
2003 |
43 |
5 |
p. 775-783 9 p. |
artikel |
6 |
High Performance Memory Testing: Design Principles, Fault Modeling and Self-Test; R. Dean Adams, Kluwer Academic Publishers, Boston, 2003, Hardcover, pp. 247, plus XIII, €142, ISBN 1-4020-7255-4
|
Stojcev, Mile |
|
2003 |
43 |
5 |
p. 819- 1 p. |
artikel |
7 |
Hot carrier degradation behavior in SOI dynamic-threshold-voltage nMOSFET’s (n-DTMOSFET) measured by gated-diode configuration
|
Huang, Ru |
|
2003 |
43 |
5 |
p. 707-711 5 p. |
artikel |
8 |
Improvement of poly-silicon hole induced gate oxide failure by silicon rich oxidation
|
Tseng, Summer F.C. |
|
2003 |
43 |
5 |
p. 713-724 12 p. |
artikel |
9 |
Integrating testability with design space exploration
|
Zwolinski, M. |
|
2003 |
43 |
5 |
p. 685-693 9 p. |
artikel |
10 |
Isothermal aging characteristics of Sn–Pb micro solder bumps
|
Kim, K.S. |
|
2003 |
43 |
5 |
p. 757-763 7 p. |
artikel |
11 |
Optimization of on-chip ESD protection structures for minimal parasitic capacitance
|
Gao, Xiaofang |
|
2003 |
43 |
5 |
p. 725-733 9 p. |
artikel |
12 |
Prediction and verification of process induced warpage of electronic packages
|
van Driel, W.D. |
|
2003 |
43 |
5 |
p. 765-774 10 p. |
artikel |
13 |
Qualification approaches and thermal cycle test results for CSP/BGA/FCBGA
|
Ghaffarian, Reza |
|
2003 |
43 |
5 |
p. 695-706 12 p. |
artikel |
14 |
Reliability assessment and hygroswelling modeling of FCBGA with no-flow underfill
|
Tee, Tong Yan |
|
2003 |
43 |
5 |
p. 741-749 9 p. |
artikel |
15 |
Reliability of Au bump––Cu direct interconnections fabricated by means of surface activated bonding method
|
Wang, Qian |
|
2003 |
43 |
5 |
p. 751-756 6 p. |
artikel |
16 |
Surface topographical characterization of silver-plated film on the wedge bondability of leaded IC packages
|
Lin, T.Y. |
|
2003 |
43 |
5 |
p. 803-809 7 p. |
artikel |
17 |
Thermal design of a broadband communication system with detailed modeling of TBGA packages
|
Zhao, Z. |
|
2003 |
43 |
5 |
p. 785-793 9 p. |
artikel |