| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A physical approach on SCOBIC investigation in VLSI
|
Beauchêne, T.
|
|
2003
|
43 |
1 |
p. 173-177
5 p.
|
artikel
|
| 2 |
A review of ULSI failure analysis techniques for DRAMs. Part II: Defect isolation and visualization
|
Ruprecht, Michael
|
|
2003
|
43 |
1 |
p. 17-41
25 p.
|
artikel
|
| 3 |
Calendar for forthcoming events
|
|
|
2003
|
43 |
1 |
p. I-VI
nvt p.
|
artikel
|
| 4 |
Degradation mechanism of power devices under di/dt thermal shocks: turn-on of a TRIAC in Q3
|
Forster, S.
|
|
2003
|
43 |
1 |
p. 89-98
10 p.
|
artikel
|
| 5 |
Degradation of RuO2 thin films in hydrogen atmosphere at temperatures between 150 and 250 °C
|
Jelenkovic, Emil V
|
|
2003
|
43 |
1 |
p. 49-55
7 p.
|
artikel
|
| 6 |
Early reliability assessment by using deep censoring
|
Schafft, Harry A.
|
|
2003
|
43 |
1 |
p. 1-16
16 p.
|
artikel
|
| 7 |
Effect of nitridation on the reliability of thick gate oxides
|
Wu, C.-T.
|
|
2003
|
43 |
1 |
p. 43-47
5 p.
|
artikel
|
| 8 |
Effects of gamma-ray irradiation on polycrystalline silicon thin-film transistors
|
Hastas, N.A.
|
|
2003
|
43 |
1 |
p. 57-60
4 p.
|
artikel
|
| 9 |
Electrical qualification of new ultrathin integration techniques
|
Cazarré, A.
|
|
2003
|
43 |
1 |
p. 111-115
5 p.
|
artikel
|
| 10 |
Enhanced reliability for low-temperature gate dielectric of MOS devices by N2O or NO plasma nitridation
|
Or, David C.T.
|
|
2003
|
43 |
1 |
p. 163-166
4 p.
|
artikel
|
| 11 |
Impact of probing procedure on flip chip reliability
|
Chen, Kuo-Ming
|
|
2003
|
43 |
1 |
p. 123-130
8 p.
|
artikel
|
| 12 |
Implant dose monitoring by MOS C–V measurement
|
Sorge, Roland
|
|
2003
|
43 |
1 |
p. 167-171
5 p.
|
artikel
|
| 13 |
Influences of the moisture absorption on PBGA package’s warpage during IR reflow process
|
Chien, Chi-Hui
|
|
2003
|
43 |
1 |
p. 131-139
9 p.
|
artikel
|
| 14 |
LVTSCR structures for latch-up free ESD protection of BiCMOS RF circuits
|
Vashchenko, V.
|
|
2003
|
43 |
1 |
p. 61-69
9 p.
|
artikel
|
| 15 |
Modeling facet heating in ridge lasers
|
Romo, G.
|
|
2003
|
43 |
1 |
p. 99-110
12 p.
|
artikel
|
| 16 |
Neural net analysis of integrated circuit yield dependence on CMOS process control parameters
|
Karilahti, M.
|
|
2003
|
43 |
1 |
p. 117-121
5 p.
|
artikel
|
| 17 |
Power p–i–n diodes for snubberless application: H+ irradiation for soft and reliable reverse recovery
|
Cova, P.
|
|
2003
|
43 |
1 |
p. 81-87
7 p.
|
artikel
|
| 18 |
TCAD and SPICE modeling help solve ESD protection issues in analog CMOS technology
|
Trémouilles, D.
|
|
2003
|
43 |
1 |
p. 71-79
9 p.
|
artikel
|
| 19 |
Thermomechanical deformation of a bimaterial plate––as applied to laminate IC assemblies
|
Moore, Thomas D.
|
|
2003
|
43 |
1 |
p. 155-162
8 p.
|
artikel
|
| 20 |
Wirebonding at higher ultrasonic frequencies: reliability and process implications
|
Charles Jr., H.K
|
|
2003
|
43 |
1 |
p. 141-153
13 p.
|
artikel
|
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