| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Aging of the over-voltage protection elements caused by over-voltages
|
Osmokrovic, Predrag
|
|
2002
|
42 |
12 |
p. 1959-1966
8 p.
|
artikel
|
| 2 |
Analysis of burn-in time using the general law of reliability
|
Baskin, E.M
|
|
2002
|
42 |
12 |
p. 1967-1974
8 p.
|
artikel
|
| 3 |
An analytical effective channel-length modulation model for velocity overshoot in submicron MOSFETs based on energy-balance formulation
|
Lim, K.Y.
|
|
2002
|
42 |
12 |
p. 1857-1864
8 p.
|
artikel
|
| 4 |
An IGBT DC subcircuit model with non-destructive parameters extraction and comparison with measurements
|
Yuan, Shoucai
|
|
2002
|
42 |
12 |
p. 1991-1996
6 p.
|
artikel
|
| 5 |
Anisotropic conductive film flip chip joining using thin chips
|
Jokinen, Erja
|
|
2002
|
42 |
12 |
p. 1913-1920
8 p.
|
artikel
|
| 6 |
Atomic-layer-deposited silicon-nitride/SiO2 stack––a highly potential gate dielectrics for advanced CMOS technology
|
Nakajima, Anri
|
|
2002
|
42 |
12 |
p. 1823-1835
13 p.
|
artikel
|
| 7 |
Author Index to Volume 42
|
|
|
2002
|
42 |
12 |
p. 2029-2034
6 p.
|
artikel
|
| 8 |
Effect of substrate flexibility on solder joint reliability
|
Liu, Xingsheng
|
|
2002
|
42 |
12 |
p. 1883-1891
9 p.
|
artikel
|
| 9 |
Encapsulation of naked dies for bulk silicon etching with TMAH
|
Liebert, Silke
|
|
2002
|
42 |
12 |
p. 1939-1944
6 p.
|
artikel
|
| 10 |
Failure criteria of flip chip joints during accelerated testing
|
Stepniak, Frank
|
|
2002
|
42 |
12 |
p. 1921-1930
10 p.
|
artikel
|
| 11 |
Integrated process capability analysis with an application in backlight module
|
Huang, M.L.
|
|
2002
|
42 |
12 |
p. 2009-2014
6 p.
|
artikel
|
| 12 |
International IEEE conference on the business of electronic product reliability and liability
|
|
|
2002
|
42 |
12 |
p. I-II
nvt p.
|
artikel
|
| 13 |
On-state and off-state stress-induced degradation in unhydrogenated solid phase crystallized polysilicon thin film transistors
|
Kouvatsos, Dimitrios N
|
|
2002
|
42 |
12 |
p. 1875-1882
8 p.
|
artikel
|
| 14 |
On the analytical description of ageing kinetics in ceramic manganite-based NTC thermistors
|
Balitska, V.O
|
|
2002
|
42 |
12 |
p. 2003-2007
5 p.
|
artikel
|
| 15 |
On the correlation between radiation-induced oxide- and border-trap effects in the gate-oxide nMOSFET’s
|
Djezzar, Boualem
|
|
2002
|
42 |
12 |
p. 1865-1874
10 p.
|
artikel
|
| 16 |
Open contact analysis of single bit failure in 0.18 μm technology
|
Song, Zhigang
|
|
2002
|
42 |
12 |
p. 1997-2001
5 p.
|
artikel
|
| 17 |
Prediction of electromigration-void formation in copper conductors based on the electron configuration of matrix and solute atoms
|
Zehe, A.
|
|
2002
|
42 |
12 |
p. 1849-1855
7 p.
|
artikel
|
| 18 |
Procedure for design optimization of a T-cap flip chip package
|
Ni, Chin-Yu
|
|
2002
|
42 |
12 |
p. 1903-1911
9 p.
|
artikel
|
| 19 |
Reliability studies and design improvement of mirror image CSP assembly
|
Xie, Dongji
|
|
2002
|
42 |
12 |
p. 1931-1937
7 p.
|
artikel
|
| 20 |
Solder joint reliability of a polymer reinforced wafer level package
|
Kim, Deok-Hoon
|
|
2002
|
42 |
12 |
p. 1837-1848
12 p.
|
artikel
|
| 21 |
Study of short-circuiting between adjacent joints under electric field effects in fine pitch anisotropic conductive adhesive interconnects
|
Chiu, Y.W
|
|
2002
|
42 |
12 |
p. 1945-1951
7 p.
|
artikel
|
| 22 |
Testing process capability for one-sided specification limit with application to the voltage level translator
|
Lin, P.C.
|
|
2002
|
42 |
12 |
p. 1975-1983
9 p.
|
artikel
|
| 23 |
The optimization design of bump interconnections in flip chip packages from the electrical standpoint
|
Liu, De-Shin
|
|
2002
|
42 |
12 |
p. 1893-1901
9 p.
|
artikel
|
| 24 |
Thin film, thick film microstrip band pass filter: a comparison and effect of bulk overlay
|
Rane, Sunit
|
|
2002
|
42 |
12 |
p. 1953-1958
6 p.
|
artikel
|
| 25 |
Ultra-shallow n+p junction formed by PH3 and AsH3 plasma immersion ion implantation
|
Yang, B.L
|
|
2002
|
42 |
12 |
p. 1985-1989
5 p.
|
artikel
|
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