| no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
| 1 |
Board level reliability of PBGA using flex substrate
|
Hung, S.C
|
|
2001
|
41 |
5 |
p. 677-687
11 p.
|
article
|
| 2 |
Conversion of the under bump metallurgy into intermetallics: the impact on flip chip reliability
|
Stepniak, Frank
|
|
2001
|
41 |
5 |
p. 735-744
10 p.
|
article
|
| 3 |
Die stress drift measurement in IC plastic packages using the piezo-Hall effect
|
Manic, D
|
|
2001
|
41 |
5 |
p. 767-771
5 p.
|
article
|
| 4 |
Effect of trench edge on pMOSFET reliability
|
Lee, Yung-Huei
|
|
2001
|
41 |
5 |
p. 689-696
8 p.
|
article
|
| 5 |
Effects of device passivation materials on solderable metallization of IGBTs
|
Haque, Shatil
|
|
2001
|
41 |
5 |
p. 639-647
9 p.
|
article
|
| 6 |
Effects of the sputtering deposition process of metal gate electrode on the gate dielectric characteristics
|
Yamada, Takayuki
|
|
2001
|
41 |
5 |
p. 697-704
8 p.
|
article
|
| 7 |
Electrical and stability properties and ultrasonic microscope characterisation of low temperature co-fired ceramics resistors
|
Dziedzic, Andrzej
|
|
2001
|
41 |
5 |
p. 669-676
8 p.
|
article
|
| 8 |
Impact of ESD protection device trigger transient on the reliability of ultra-thin gate oxide
|
Cheung, Kin P
|
|
2001
|
41 |
5 |
p. 745-749
5 p.
|
article
|
| 9 |
Influence of the lightly doped drain resistance on the worst-case hot-carrier stress condition for NMOS devices
|
King, Everett E
|
|
2001
|
41 |
5 |
p. 649-660
12 p.
|
article
|
| 10 |
Plasma process-induced damage on thick (6.8 nm) and thin (3.5 nm) gate oxide: parametric shifts, hot-carrier response, and dielectric integrity degradation
|
Hook, Terence B.
|
|
2001
|
41 |
5 |
p. 751-765
15 p.
|
article
|
| 11 |
Rapid power cycling of flip-chip and CSP components on ceramic substrates
|
Lenkkeri, Jaakko
|
|
2001
|
41 |
5 |
p. 661-668
8 p.
|
article
|
| 12 |
Reliability of 80 μm pitch flip chip attachment on flex
|
Palm, Petteri
|
|
2001
|
41 |
5 |
p. 633-638
6 p.
|
article
|
| 13 |
Thermoelectrical degradation processes in NTC thermistors for in-rush current protection of electronic circuits
|
Mrooz, O
|
|
2001
|
41 |
5 |
p. 773-777
5 p.
|
article
|
| 14 |
Tradeoffs in multichip module yield and cost with known good die probability and repair
|
Charles Jr., H.K.
|
|
2001
|
41 |
5 |
p. 715-733
19 p.
|
article
|
| 15 |
Trap generation and breakdown processes in very thin gate oxides
|
Rosenbaum, Elyse
|
|
2001
|
41 |
5 |
p. 625-632
8 p.
|
article
|
| 16 |
Wafer level packaging of a tape flip-chip chip scale packages
|
Hotchkiss, Greg
|
|
2001
|
41 |
5 |
p. 705-713
9 p.
|
article
|
Journal description