| no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
| 1 |
A compact test structure for characterisation of leakage currents in sub-micron CMOS technologies
|
Ning, Zhenqiu
|
|
2001
|
41 |
12 |
p. 1939-1945
7 p.
|
article
|
| 2 |
A hierarchical approach to large circuit symbolic simulation
|
Đorđević, S.
|
|
2001
|
41 |
12 |
p. 2041-2049
9 p.
|
article
|
| 3 |
A reliability comparison of InGaP/GaAs HBTs with and without passivation ledge
|
Yan, B.P
|
|
2001
|
41 |
12 |
p. 1959-1963
5 p.
|
article
|
| 4 |
Author Index
|
|
|
2001
|
41 |
12 |
p. 2091-2095
5 p.
|
article
|
| 5 |
Characteristic study of anisotropic-conductive film for chip-on-film packaging
|
Chang, Shyh-Ming
|
|
2001
|
41 |
12 |
p. 2001-2009
9 p.
|
article
|
| 6 |
Degradation of thin oxides during electrical stress
|
Bersuker, Gennadi
|
|
2001
|
41 |
12 |
p. 1923-1931
9 p.
|
article
|
| 7 |
Effect of solder creep on the reliability of large area die attachment
|
Zhuang, W.D.
|
|
2001
|
41 |
12 |
p. 2011-2021
11 p.
|
article
|
| 8 |
Extraction of the lateral distribution of interface traps in MOSFETs by a novel combined gated-diode technique
|
He, Jin
|
|
2001
|
41 |
12 |
p. 1953-1957
5 p.
|
article
|
| 9 |
Flip-chip structure transient thermal model
|
Fedasyuk, D.
|
|
2001
|
41 |
12 |
p. 1965-1970
6 p.
|
article
|
| 10 |
Impact of gate oxide nitridation process on 1/f noise in 0.18 μm CMOS
|
Da Rold, M
|
|
2001
|
41 |
12 |
p. 1933-1938
6 p.
|
article
|
| 11 |
Low and high temperature device reliability investigations of buried p-channel MOSFETs of a 0.17 μm technology
|
Ambatiello, Alexander
|
|
2001
|
41 |
12 |
p. 1915-1921
7 p.
|
article
|
| 12 |
Monitoring of power dissipated in microelectronic structures
|
Dziurdzia, Piotr
|
|
2001
|
41 |
12 |
p. 1971-1978
8 p.
|
article
|
| 13 |
Noise as a tool for non-destructive testing of single-crystal silicon solar cells
|
Chobola, Z
|
|
2001
|
41 |
12 |
p. 1947-1952
6 p.
|
article
|
| 14 |
Probabilistic analysis of CMOS physical defects in VLSI circuits for test coverage improvement
|
Blyzniuk, M.
|
|
2001
|
41 |
12 |
p. 2023-2040
18 p.
|
article
|
| 15 |
Process capability indices and product reliability
|
Ramakrishnan, Bharatwaj
|
|
2001
|
41 |
12 |
p. 2067-2070
4 p.
|
article
|
| 16 |
Reliability of microBGA assembly using no-flow underfill
|
Tu, P.L.
|
|
2001
|
41 |
12 |
p. 1993-2000
8 p.
|
article
|
| 17 |
SIMS study of silicon oxynitride prepared by oxidation of silicon-rich silicon nitride layer
|
Poon, M.C
|
|
2001
|
41 |
12 |
p. 2071-2074
4 p.
|
article
|
| 18 |
Stacked solder bumping technology for improved solder joint reliability
|
Liu, Xingsheng
|
|
2001
|
41 |
12 |
p. 1979-1992
14 p.
|
article
|
| 19 |
The Hi-noon neural simulator and its applications
|
Damper, R.I.
|
|
2001
|
41 |
12 |
p. 2051-2065
15 p.
|
article
|
Journal description