no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
1 |
Advanced 2D/3D ESD device simulation – a powerful tool already used in a pre-Si phase
|
Esmark, K |
|
2001 |
41 |
11 |
p. 1761-1770 10 p. |
article |
2 |
A method of thermal testing of microsystems
|
Bratek, Piotr |
|
2001 |
41 |
11 |
p. 1877-1887 11 p. |
article |
3 |
An assessment of the value of added screening of electronic components for commercial aerospace applications
|
Hester, Kendall D |
|
2001 |
41 |
11 |
p. 1823-1828 6 p. |
article |
4 |
A new lifetime prediction method for hot-carrier degradation in n-MOSFETs with ultrathin gate oxides under V g=V d
|
Mu, Fuchen |
|
2001 |
41 |
11 |
p. 1909-1913 5 p. |
article |
5 |
Breakdown and latent damage of ultra-thin gate oxides under ESD stress conditions
|
Wu, J |
|
2001 |
41 |
11 |
p. 1771-1779 9 p. |
article |
6 |
Distributed control based on distributed electronic circuits: application to vibration control
|
Kader, Mahamane |
|
2001 |
41 |
11 |
p. 1857-1866 10 p. |
article |
7 |
Effect of SiO2/Si interface roughness on gate current
|
Mao, Ling-Feng |
|
2001 |
41 |
11 |
p. 1903-1907 5 p. |
article |
8 |
Effects of thermomechanical cycling on lead and lead-free (SnPb and SnAgCu) surface mount solder joints
|
Stam, F.A. |
|
2001 |
41 |
11 |
p. 1815-1822 8 p. |
article |
9 |
Electrical degradation and recovery of dielectrics in n++-poly-Si/SiO x /SiO2/p-sub structures designed for application in low-voltage non-volatile memories
|
Irrera, Fernanda |
|
2001 |
41 |
11 |
p. 1809-1813 5 p. |
article |
10 |
Electrothermal model for simulation of bulk-Si and SOI diodes in ESD protection circuits
|
Wang, Yu |
|
2001 |
41 |
11 |
p. 1781-1787 7 p. |
article |
11 |
Impact of interface nature on deep sub-micron Al-plug resistance
|
Tsui, Bing-Yue |
|
2001 |
41 |
11 |
p. 1889-1896 8 p. |
article |
12 |
Influence of device geometry on SOI single-hole transistor characteristics
|
Tang, X |
|
2001 |
41 |
11 |
p. 1841-1846 6 p. |
article |
13 |
Layout and bias options for maximizing V t1 in cascoded NMOS output buffers
|
Miller, James W. |
|
2001 |
41 |
11 |
p. 1751-1760 10 p. |
article |
14 |
Lead-free plastic area array BGAs and polymer stud grid arraysTM package reliability
|
Wojciechowski, Dominique |
|
2001 |
41 |
11 |
p. 1829-1839 11 p. |
article |
15 |
[No title]
|
Mergens, Markus P.J |
|
2001 |
41 |
11 |
p. 1737- 1 p. |
article |
16 |
Novel fully silicided ballasting and MFT design techniques for ESD protection in advanced deep sub-micron CMOS technologies
|
Verhaege, Koen G |
|
2001 |
41 |
11 |
p. 1739-1749 11 p. |
article |
17 |
On the InGaP/In x Ga1−x As pseudomorphic high electron-mobility transistors for high-temperature operations
|
Lin, Kun-Wei |
|
2001 |
41 |
11 |
p. 1897-1902 6 p. |
article |
18 |
Study of the self-alignment of no-flow underfill for micro-BGA assembly
|
Chan, Y.C |
|
2001 |
41 |
11 |
p. 1867-1875 9 p. |
article |
19 |
The development of poled polyimide dielectric layers for simultaneous testing and light guiding applications in MCM-Ds
|
Mechtel, D.M |
|
2001 |
41 |
11 |
p. 1847-1855 9 p. |
article |
20 |
The importance of standardizing CDM ESD test head parameters to obtain data correlation
|
Henry, Leo G. |
|
2001 |
41 |
11 |
p. 1789-1800 12 p. |
article |
21 |
Tools for contactless testing and simulation of CMOS circuits
|
Stellari, F |
|
2001 |
41 |
11 |
p. 1801-1808 8 p. |
article |