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                             21 results found
no title author magazine year volume issue page(s) type
1 Advanced 2D/3D ESD device simulation – a powerful tool already used in a pre-Si phase Esmark, K
2001
41 11 p. 1761-1770
10 p.
article
2 A method of thermal testing of microsystems Bratek, Piotr
2001
41 11 p. 1877-1887
11 p.
article
3 An assessment of the value of added screening of electronic components for commercial aerospace applications Hester, Kendall D
2001
41 11 p. 1823-1828
6 p.
article
4 A new lifetime prediction method for hot-carrier degradation in n-MOSFETs with ultrathin gate oxides under V g=V d Mu, Fuchen
2001
41 11 p. 1909-1913
5 p.
article
5 Breakdown and latent damage of ultra-thin gate oxides under ESD stress conditions Wu, J
2001
41 11 p. 1771-1779
9 p.
article
6 Distributed control based on distributed electronic circuits: application to vibration control Kader, Mahamane
2001
41 11 p. 1857-1866
10 p.
article
7 Effect of SiO2/Si interface roughness on gate current Mao, Ling-Feng
2001
41 11 p. 1903-1907
5 p.
article
8 Effects of thermomechanical cycling on lead and lead-free (SnPb and SnAgCu) surface mount solder joints Stam, F.A.
2001
41 11 p. 1815-1822
8 p.
article
9 Electrical degradation and recovery of dielectrics in n++-poly-Si/SiO x /SiO2/p-sub structures designed for application in low-voltage non-volatile memories Irrera, Fernanda
2001
41 11 p. 1809-1813
5 p.
article
10 Electrothermal model for simulation of bulk-Si and SOI diodes in ESD protection circuits Wang, Yu
2001
41 11 p. 1781-1787
7 p.
article
11 Impact of interface nature on deep sub-micron Al-plug resistance Tsui, Bing-Yue
2001
41 11 p. 1889-1896
8 p.
article
12 Influence of device geometry on SOI single-hole transistor characteristics Tang, X
2001
41 11 p. 1841-1846
6 p.
article
13 Layout and bias options for maximizing V t1 in cascoded NMOS output buffers Miller, James W.
2001
41 11 p. 1751-1760
10 p.
article
14 Lead-free plastic area array BGAs and polymer stud grid arraysTM package reliability Wojciechowski, Dominique
2001
41 11 p. 1829-1839
11 p.
article
15 [No title] Mergens, Markus P.J
2001
41 11 p. 1737-
1 p.
article
16 Novel fully silicided ballasting and MFT design techniques for ESD protection in advanced deep sub-micron CMOS technologies Verhaege, Koen G
2001
41 11 p. 1739-1749
11 p.
article
17 On the InGaP/In x Ga1−x As pseudomorphic high electron-mobility transistors for high-temperature operations Lin, Kun-Wei
2001
41 11 p. 1897-1902
6 p.
article
18 Study of the self-alignment of no-flow underfill for micro-BGA assembly Chan, Y.C
2001
41 11 p. 1867-1875
9 p.
article
19 The development of poled polyimide dielectric layers for simultaneous testing and light guiding applications in MCM-Ds Mechtel, D.M
2001
41 11 p. 1847-1855
9 p.
article
20 The importance of standardizing CDM ESD test head parameters to obtain data correlation Henry, Leo G.
2001
41 11 p. 1789-1800
12 p.
article
21 Tools for contactless testing and simulation of CMOS circuits Stellari, F
2001
41 11 p. 1801-1808
8 p.
article
                             21 results found
 
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