| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A new experimental method to evaluate creep fatigue life of flip-chip solder joints with underfill
|
Xie, D.J.
|
|
2000
|
40 |
7 |
p. 1191-1198
8 p.
|
artikel
|
| 2 |
An investigation on the plasma treatment of integrated circuit bond pads
|
Chong, Y.F
|
|
2000
|
40 |
7 |
p. 1199-1206
8 p.
|
artikel
|
| 3 |
Assembly-level reliability of flex-substrate BGA, elastomer-on-flex packages and 0.5 mm pitch partial array packages
|
Lall, Pradeep
|
|
2000
|
40 |
7 |
p. 1081-1095
15 p.
|
artikel
|
| 4 |
Bonding strengths at plastic encapsulant–gold-plated copper leadframe interface
|
Yi, Sung
|
|
2000
|
40 |
7 |
p. 1207-1214
8 p.
|
artikel
|
| 5 |
Chip scale package issues
|
Ghaffarian, Reza
|
|
2000
|
40 |
7 |
p. 1157-1161
5 p.
|
artikel
|
| 6 |
Coupled package-device modeling for microelectromechanical systems
|
Bart, Stephen F
|
|
2000
|
40 |
7 |
p. 1235-1241
7 p.
|
artikel
|
| 7 |
Electro-conductive adhesives for high density package and flip-chip interconnections
|
Wojciechowski, Dominique
|
|
2000
|
40 |
7 |
p. 1215-1226
12 p.
|
artikel
|
| 8 |
Guidelines to select underfills for flip chip on board assemblies and compliant interposers for chip scale package assemblies
|
Okura, J.H
|
|
2000
|
40 |
7 |
p. 1173-1180
8 p.
|
artikel
|
| 9 |
In process stress analysis of flip-chip assemblies during underfill cure
|
Palaniappan, P
|
|
2000
|
40 |
7 |
p. 1181-1190
10 p.
|
artikel
|
| 10 |
Mechanical cycling fatigue of PBGA package interconnects
|
Leicht, Larry
|
|
2000
|
40 |
7 |
p. 1129-1133
5 p.
|
artikel
|
| 11 |
Method for rapid testing of thermo-mechanical characteristics of solder joints
|
Nowottnick, M
|
|
2000
|
40 |
7 |
p. 1135-1146
12 p.
|
artikel
|
| 12 |
Near-CSP plastic ball grid array
|
Owens, Norman L
|
|
2000
|
40 |
7 |
p. 1109-1116
8 p.
|
artikel
|
| 13 |
[No title]
|
Danto, Yves
|
|
2000
|
40 |
7 |
p. 1069-1071
3 p.
|
artikel
|
| 14 |
Reliability evaluation of adhesive bonded SMT components in industrial applications
|
Périchaud, M.G.
|
|
2000
|
40 |
7 |
p. 1227-1234
8 p.
|
artikel
|
| 15 |
Reliability of new packaging concepts
|
Sinnadurai, Nihal
|
|
2000
|
40 |
7 |
p. 1073-1080
8 p.
|
artikel
|
| 16 |
Simulation of fatigue distributions for ball grid arrays by the Monte Carlo method
|
Evans, John W
|
|
2000
|
40 |
7 |
p. 1147-1155
9 p.
|
artikel
|
| 17 |
Solder joint fatigue life of fine pitch BGAs – impact of design and material choices
|
Darveaux, Robert
|
|
2000
|
40 |
7 |
p. 1117-1127
11 p.
|
artikel
|
| 18 |
Thermo-mechanical finite element analysis in press-packed IGBT design
|
Pirondi, A
|
|
2000
|
40 |
7 |
p. 1163-1172
10 p.
|
artikel
|
| 19 |
Vibration reliability characterization of PBGA assemblies
|
Yang, Q.J
|
|
2000
|
40 |
7 |
p. 1097-1107
11 p.
|
artikel
|
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