| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
An analytical comparison of the thermal performance of various ball grid array packaging technologies
|
Harvey, P.M.
|
|
2000
|
40 |
3 |
p. 485-495
11 p.
|
artikel
|
| 2 |
A new application of acoustic micro imaging: screening MCM-C multilayer defects
|
Harsányi, G.
|
|
2000
|
40 |
3 |
p. 477-484
8 p.
|
artikel
|
| 3 |
A new reliability growth model: its mathematical comparison to the Duane model
|
Donovan, John
|
|
2000
|
40 |
3 |
p. 533-539
7 p.
|
artikel
|
| 4 |
An overview to integrated power module design for high power electronics packaging
|
Lostetter, A.B.
|
|
2000
|
40 |
3 |
p. 365-379
15 p.
|
artikel
|
| 5 |
Capacitance extraction of integrated-circuit interconnects by matrix decomposition based on MEI concept
|
Liu, Y.W.
|
|
2000
|
40 |
3 |
p. 451-454
4 p.
|
artikel
|
| 6 |
Characterization of interfacial thermal resistance by acoustic micrography imaging
|
Haque, Shatil
|
|
2000
|
40 |
3 |
p. 465-476
12 p.
|
artikel
|
| 7 |
Crossing point current of electron and proton irradiated power P-i-N diodes
|
Vobecký, J.
|
|
2000
|
40 |
3 |
p. 427-433
7 p.
|
artikel
|
| 8 |
Electrically active defects generated by MERIE and RIE-mode plasmas in thin SiO2-Si structures
|
Atanassova, E.
|
|
2000
|
40 |
3 |
p. 381-425
45 p.
|
artikel
|
| 9 |
Investigation of the thermal stress field in a multilevel aluminium metallisation in VLSI systems
|
Igic, P.M.
|
|
2000
|
40 |
3 |
p. 443-450
8 p.
|
artikel
|
| 10 |
Low cost bumping by stencil printing: process qualification for 200 μm pitch
|
Kloeser, Joachim
|
|
2000
|
40 |
3 |
p. 497-505
9 p.
|
artikel
|
| 11 |
Mechanical properties of nanoscale copper under shear
|
Heino, P.
|
|
2000
|
40 |
3 |
p. 435-441
7 p.
|
artikel
|
| 12 |
Static and dynamic finite element modelling of thermal fatigue effects in insulated gate bipolar transistor modules
|
Rodriguez, M.P.
|
|
2000
|
40 |
3 |
p. 455-463
9 p.
|
artikel
|
| 13 |
Thermal ink jet dynamics: modeling, simulation, and testing
|
Rembe, Christian
|
|
2000
|
40 |
3 |
p. 525-532
8 p.
|
artikel
|
| 14 |
Thermal modelling of hybrid circuits: simulation method comparison
|
Janicki, M.
|
|
2000
|
40 |
3 |
p. 541-546
6 p.
|
artikel
|
| 15 |
THERMAN: a thermal simulation tool for IC chips, microstructures and PW boards
|
Székely, Vladimı́r
|
|
2000
|
40 |
3 |
p. 517-524
8 p.
|
artikel
|
| 16 |
Transient electro-thermal simulation of microsystems with space-continuous thermal models in an analogue behavioural simulator
|
Jakovljevic, Mirko
|
|
2000
|
40 |
3 |
p. 507-516
10 p.
|
artikel
|
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