no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
1 |
A biased percolation model for the analysis of electronic-device degradation
|
Gingl, Z. |
|
1998 |
38 |
4 |
p. 515-521 7 p. |
article |
2 |
Accelerated popcorn testing of high solder-reflow crack resistant molding compounds
|
Tubbs, T.R. |
|
1998 |
38 |
4 |
p. 665-669 5 p. |
article |
3 |
A hybrid model for weekday replacements with infant mortality failures
|
Smotherman, Mark |
|
1998 |
38 |
4 |
p. 685-688 4 p. |
article |
4 |
A modular neural network approach to microelectronic circuit yield optimization
|
Ilumoka, A.A. |
|
1998 |
38 |
4 |
p. 571-580 10 p. |
article |
5 |
A study on failure probability of a system including a protecting device
|
Takagi, Keiji |
|
1998 |
38 |
4 |
p. 677-679 3 p. |
article |
6 |
CORRELATION BETWEEN LIGHT EMISSION AND CURRENTS IN PSEUDOMORPHIC HEMTs
|
Cova, P |
|
1998 |
38 |
4 |
p. 507-510 4 p. |
article |
7 |
Damage to n-MOSFETs from electrical stress Relationship to processing damage and impact on device reliability
|
Trabzon, L. |
|
1998 |
38 |
4 |
p. 651-657 7 p. |
article |
8 |
Design and analysis of a self-testing-and-repairing random access memory “STAR–RAM” with error correction
|
A. Mehdi, Kamal |
|
1998 |
38 |
4 |
p. 605-617 13 p. |
article |
9 |
Design of random inspection rate for a flexible assembly system: a heuristic genetic algorithm approach
|
Lin, Chinho |
|
1998 |
38 |
4 |
p. 545-551 7 p. |
article |
10 |
Discussion on Physical Models for Burst Noise in a Forward Biased P–N Junction and Their Experimental Validation
|
Dai, Yisong |
|
1998 |
38 |
4 |
p. 671-675 5 p. |
article |
11 |
Editorial
|
|
|
1998 |
38 |
4 |
p. iii- 1 p. |
article |
12 |
Electrostatic discharge (ESD) protection for CMOS output buffers in scaled-down VLSI technology
|
Ker, Ming-Dou |
|
1998 |
38 |
4 |
p. 619-639 21 p. |
article |
13 |
Fault tree analysis in case of multiple faults, especially covered and uncovered ones
|
Schneeweiss, Winfrid G. |
|
1998 |
38 |
4 |
p. 659-663 5 p. |
article |
14 |
FUNCTIONALITY FAULT MODEL: A BASIS FOR TECHNOLOGY-SPECIFIC TEST GENERATION
|
žemva, Andrej |
|
1998 |
38 |
4 |
p. 597-604 8 p. |
article |
15 |
HOT-CARRIER RELIABILITY IN n-MOSFETs USED AS PASS-TRANSISTORS
|
Goguenheim, D |
|
1998 |
38 |
4 |
p. 539-544 6 p. |
article |
16 |
Impact of latch phenomenon on low-frequency noise in SOI MOSFETs
|
Jomaah, J. |
|
1998 |
38 |
4 |
p. 567-570 4 p. |
article |
17 |
Impact of pre-conditioning, voltage bias and temperature on reliability of plastic encapsulated microcircuits
|
Sharma, P |
|
1998 |
38 |
4 |
p. 581-584 4 p. |
article |
18 |
INTRODUCTORY INVITED PAPERFailure mechanisms due to metallurgical interactions in commercially available AlGaAs/GaAs and AlGaAs/InGaAs HEMTs
|
Meneghesso, Gaudenzio |
|
1998 |
38 |
4 |
p. 497-506 10 p. |
article |
19 |
Localized monitoring of electromigration with early resistance change measurements
|
Manca, J.V |
|
1998 |
38 |
4 |
p. 641-650 10 p. |
article |
20 |
Methodology for creating “rejuvenating” devices
|
Baskin, E.M. |
|
1998 |
38 |
4 |
p. 531-537 7 p. |
article |
21 |
Persistent photoconductivity as a tool for monitoring oxide cluster concentration in silicon wafers
|
Haddab, Y. |
|
1998 |
38 |
4 |
p. 511-514 4 p. |
article |
22 |
Plastic encapsulated microcircuit reliability predicition: why?
|
Hakim, Edward B. |
|
1998 |
38 |
4 |
p. 681-683 3 p. |
article |
23 |
Product review
|
|
|
1998 |
38 |
4 |
p. 701- 1 p. |
article |
24 |
Product review
|
|
|
1998 |
38 |
4 |
p. 698- 1 p. |
article |
25 |
Product review
|
|
|
1998 |
38 |
4 |
p. 707- 1 p. |
article |
26 |
Product review
|
|
|
1998 |
38 |
4 |
p. 699- 1 p. |
article |
27 |
Product review
|
|
|
1998 |
38 |
4 |
p. 700- 1 p. |
article |
28 |
Product review
|
|
|
1998 |
38 |
4 |
p. 702- 1 p. |
article |
29 |
Product review
|
|
|
1998 |
38 |
4 |
p. 708- 1 p. |
article |
30 |
Product review
|
|
|
1998 |
38 |
4 |
p. 705-706 2 p. |
article |
31 |
Product review
|
|
|
1998 |
38 |
4 |
p. 697- 1 p. |
article |
32 |
Product review
|
|
|
1998 |
38 |
4 |
p. 703-704 2 p. |
article |
33 |
Reliability and qualification methodology of 60 W QCW linear bar arrays
|
Stoltz, M.P |
|
1998 |
38 |
4 |
p. 689-696 8 p. |
article |
34 |
Stochastic analysis of a repairable system with three units and two repair facilities
|
Li, Wei |
|
1998 |
38 |
4 |
p. 585-595 11 p. |
article |
35 |
Thermal microscopy and heat generation in electronic devices 1 1 Invited paper from the 8th European Symposium Reliability of Electron Devices, Failure Physics and Analysis (ESREF'97), Bordeaux, France, 7–10 October 1997.
|
Majumdar, A |
|
1998 |
38 |
4 |
p. 559-565 7 p. |
article |
36 |
Thermomechanical failures in microelectronic interconnects
|
Evans, J.W. |
|
1998 |
38 |
4 |
p. 523-529 7 p. |
article |
37 |
Three-dimensional modeling of the heat flow into a GaAs substrate. Influence of thermal phenomena on the RF behavior of power HBTs and technological optimization
|
Souverain, P. |
|
1998 |
38 |
4 |
p. 553-557 5 p. |
article |