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                             37 gevonden resultaten
nr titel auteur tijdschrift jaar jaarg. afl. pagina('s) type
1 A biased percolation model for the analysis of electronic-device degradation Gingl, Z.
1998
38 4 p. 515-521
7 p.
artikel
2 Accelerated popcorn testing of high solder-reflow crack resistant molding compounds Tubbs, T.R.
1998
38 4 p. 665-669
5 p.
artikel
3 A hybrid model for weekday replacements with infant mortality failures Smotherman, Mark
1998
38 4 p. 685-688
4 p.
artikel
4 A modular neural network approach to microelectronic circuit yield optimization Ilumoka, A.A.
1998
38 4 p. 571-580
10 p.
artikel
5 A study on failure probability of a system including a protecting device Takagi, Keiji
1998
38 4 p. 677-679
3 p.
artikel
6 CORRELATION BETWEEN LIGHT EMISSION AND CURRENTS IN PSEUDOMORPHIC HEMTs Cova, P
1998
38 4 p. 507-510
4 p.
artikel
7 Damage to n-MOSFETs from electrical stress Relationship to processing damage and impact on device reliability Trabzon, L.
1998
38 4 p. 651-657
7 p.
artikel
8 Design and analysis of a self-testing-and-repairing random access memory “STAR–RAM” with error correction A. Mehdi, Kamal
1998
38 4 p. 605-617
13 p.
artikel
9 Design of random inspection rate for a flexible assembly system: a heuristic genetic algorithm approach Lin, Chinho
1998
38 4 p. 545-551
7 p.
artikel
10 Discussion on Physical Models for Burst Noise in a Forward Biased P–N Junction and Their Experimental Validation Dai, Yisong
1998
38 4 p. 671-675
5 p.
artikel
11 Editorial 1998
38 4 p. iii-
1 p.
artikel
12 Electrostatic discharge (ESD) protection for CMOS output buffers in scaled-down VLSI technology Ker, Ming-Dou
1998
38 4 p. 619-639
21 p.
artikel
13 Fault tree analysis in case of multiple faults, especially covered and uncovered ones Schneeweiss, Winfrid G.
1998
38 4 p. 659-663
5 p.
artikel
14 FUNCTIONALITY FAULT MODEL: A BASIS FOR TECHNOLOGY-SPECIFIC TEST GENERATION žemva, Andrej
1998
38 4 p. 597-604
8 p.
artikel
15 HOT-CARRIER RELIABILITY IN n-MOSFETs USED AS PASS-TRANSISTORS Goguenheim, D
1998
38 4 p. 539-544
6 p.
artikel
16 Impact of latch phenomenon on low-frequency noise in SOI MOSFETs Jomaah, J.
1998
38 4 p. 567-570
4 p.
artikel
17 Impact of pre-conditioning, voltage bias and temperature on reliability of plastic encapsulated microcircuits Sharma, P
1998
38 4 p. 581-584
4 p.
artikel
18 INTRODUCTORY INVITED PAPERFailure mechanisms due to metallurgical interactions in commercially available AlGaAs/GaAs and AlGaAs/InGaAs HEMTs Meneghesso, Gaudenzio
1998
38 4 p. 497-506
10 p.
artikel
19 Localized monitoring of electromigration with early resistance change measurements Manca, J.V
1998
38 4 p. 641-650
10 p.
artikel
20 Methodology for creating “rejuvenating” devices Baskin, E.M.
1998
38 4 p. 531-537
7 p.
artikel
21 Persistent photoconductivity as a tool for monitoring oxide cluster concentration in silicon wafers Haddab, Y.
1998
38 4 p. 511-514
4 p.
artikel
22 Plastic encapsulated microcircuit reliability predicition: why? Hakim, Edward B.
1998
38 4 p. 681-683
3 p.
artikel
23 Product review 1998
38 4 p. 701-
1 p.
artikel
24 Product review 1998
38 4 p. 698-
1 p.
artikel
25 Product review 1998
38 4 p. 707-
1 p.
artikel
26 Product review 1998
38 4 p. 699-
1 p.
artikel
27 Product review 1998
38 4 p. 700-
1 p.
artikel
28 Product review 1998
38 4 p. 702-
1 p.
artikel
29 Product review 1998
38 4 p. 708-
1 p.
artikel
30 Product review 1998
38 4 p. 705-706
2 p.
artikel
31 Product review 1998
38 4 p. 697-
1 p.
artikel
32 Product review 1998
38 4 p. 703-704
2 p.
artikel
33 Reliability and qualification methodology of 60 W QCW linear bar arrays Stoltz, M.P
1998
38 4 p. 689-696
8 p.
artikel
34 Stochastic analysis of a repairable system with three units and two repair facilities Li, Wei
1998
38 4 p. 585-595
11 p.
artikel
35 Thermal microscopy and heat generation in electronic devices 1 1 Invited paper from the 8th European Symposium Reliability of Electron Devices, Failure Physics and Analysis (ESREF'97), Bordeaux, France, 7–10 October 1997. Majumdar, A
1998
38 4 p. 559-565
7 p.
artikel
36 Thermomechanical failures in microelectronic interconnects Evans, J.W.
1998
38 4 p. 523-529
7 p.
artikel
37 Three-dimensional modeling of the heat flow into a GaAs substrate. Influence of thermal phenomena on the RF behavior of power HBTs and technological optimization Souverain, P.
1998
38 4 p. 553-557
5 p.
artikel
                             37 gevonden resultaten
 
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