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140 results found

no	title	author	magazine	year	volume	issue	page(s)	type
1	Accelerated life testing for products without sequence effect			1997	37	4	p. 693- 1 p.	article
2	Accelerated testing for cosmic soft-error rate			1997	37	4	p. 702- 1 p.	article
3	Achieving accurate thermal characterization using a CFD code—a case study of plastic packages			1997	37	4	p. 700-701 2 p.	article
4	A CMOS IC for Gb/s Viterbi decoding: system design and VLSI implementation			1997	37	4	p. 702-703 2 p.	article
5	A combined analysis approach to assessing requirements for safety critical real-time control systems			1997	37	4	p. 692- 1 p.	article
6	A comparison of fault-tolerant state machine architectures for space-borne electronics			1997	37	4	p. 697- 1 p.	article
7	A cost comparison of new MCM technologies			1997	37	4	p. 698- 1 p.	article
8	A hi-density C4/CBGA interconnect technology for a CMOS microprocessor			1997	37	4	p. 703- 1 p.	article
9	A methodology for laser-based thermal diffusivity measurement of advanced multichip module ceramic materials			1997	37	4	p. 709- 1 p.	article
10	Analysis of a two-unit warm standby system subject to degradation	Mokaddis, G.S.		1997	37	4	p. 641-647 7 p.	article
11	Analysis of consecutive k-out-of-n: F systems with single repair facility	Dinesh Kumar, U.		1997	37	4	p. 587-590 4 p.	article
12	Analysis of step-stress accelerated-life-test data: a new approach			1997	37	4	p. 696- 1 p.	article
13	An assessment of the thermal performance of the PBGA family			1997	37	4	p. 701- 1 p.	article
14	A new bonding technique for microwave devices			1997	37	4	p. 699-700 2 p.	article
15	An input-domain based method to estimate software reliability			1997	37	4	p. 696-697 2 p.	article
16	Annealing effect of vacuum evaporated InSb thin films			1997	37	4	p. 705-706 2 p.	article
17	An optimal maintenance model using a number of different actions	Lam, Yeh		1997	37	4	p. 615-622 8 p.	article
18	A novel two-step etching process for reducing plasma-induced oxide damage			1997	37	4	p. 704- 1 p.	article
19	An overview of environmental reliability testing			1997	37	4	p. 688- 1 p.	article
20	A recursive variance-reduction algorithm for estimating communication-network reliability			1997	37	4	p. 694- 1 p.	article
21	A reliability study of a small vehicle	Reiche, H.		1997	37	4	p. 555-556 2 p.	article
22	A rigorous method to evaluate the electrical performance of MCM interconnections in frequency and time domains			1997	37	4	p. 700- 1 p.	article
23	A study of composite Bi2O3, In2O3 and RuO2 planar thick film piezoresistive gauges			1997	37	4	p. 706- 1 p.	article
24	Asymptotic thermal analysis of electronic packages and printed-circuit boards			1997	37	4	p. 701- 1 p.	article
25	Atomic force microscopy studies of SiGe films and Si/SiGe heterostructures			1997	37	4	p. 706- 1 p.	article
26	A unified domination approach for reliability analysis of networks with arbitrary logic in vertices			1997	37	4	p. 696- 1 p.	article
27	Avalanche breakdown of high-voltage p-n junctions of SiC			1997	37	4	p. 691- 1 p.	article
28	Case study: the design of a mixed-signal global positioning system receiver using multichip module packaging			1997	37	4	p. 703- 1 p.	article
29	Comment on: reliability modelling and performance of variable link-capacity networks			1997	37	4	p. 695- 1 p.	article
30	Compact non-local modelling of impact ionization in SOI MOSFETs for optimal CMOS device/circuit design			1997	37	4	p. 704- 1 p.	article
31	Comparative redundancy, an alternative to triple modular redundant system design	Philp, Kenneth W.		1997	37	4	p. 581-585 5 p.	article
32	Comparing the importance of system components by some structural characteristics			1997	37	4	p. 691- 1 p.	article
33	Component redundancy vs system redundancy in the hazard rate ordering			1997	37	4	p. 695- 1 p.	article
34	Computational method for reliability data analysis			1997	37	4	p. 692- 1 p.	article
35	Consecutive-k, r-out-of-n:DFM systems	Koutras, M.V.		1997	37	4	p. 597-603 7 p.	article
36	Consideration of node failures in network-reliability calculation			1997	37	4	p. 693- 1 p.	article
37	Correlation of the decay of tunneling currents with trap generation inside thin oxides			1997	37	4	p. 706- 1 p.	article
38	Damage to substrates during SiO2 etching: opportunities of subsequent removal by optimized cleaning procedures			1997	37	4	p. 704- 1 p.	article
39	Degradation of gold-aluminium ball bonds by aging and contamination			1997	37	4	p. 689- 1 p.	article
40	Dependability standards: an international perspective			1997	37	4	p. 687- 1 p.	article
41	Design and evaluation of an epoxy three-dimensional multichip module			1997	37	4	p. 703- 1 p.	article
42	Designing for fault-tolerance in the commercial environment			1997	37	4	p. 693- 1 p.	article
43	Determining the discrete-time reliability of a repairable 2-out-of-(N + 1): F system			1997	37	4	p. 696- 1 p.	article
44	Development of a fault isolation procedure			1997	37	4	p. 693- 1 p.	article
45	Development of an inspection process for ball-grid-array technology using scanned-beam X-ray laminography			1997	37	4	p. 699- 1 p.	article
46	Development of ultra-compact plastic-packaged high-isolation GaAs SPDT switch			1997	37	4	p. 688- 1 p.	article
47	Discrimination of individual gases/odours using polar plot of an integrated thick film sensor array			1997	37	4	p. 706- 1 p.	article
48	Dynamic analysis of qualitative circuits for failure mode and effects analysis			1997	37	4	p. 697-698 2 p.	article
49	Effect of GE incorporation on the performance of P-channel polycrystalline Si1−xGex thin-film transistors			1997	37	4	p. 705- 1 p.	article
50	Effects of the rear interface states and fixed charges on the electrical characteristics of thin film transistors with thin amorphous silicon layers			1997	37	4	p. 704- 1 p.	article
51	Effortless incremental design FMEA			1997	37	4	p. 692- 1 p.	article
52	Electron and proton irradiation-induced degradation of epitaxial InP solar cells			1997	37	4	p. 690- 1 p.	article
53	Estimation of parameters of a model of a complex repairable system	Dey, Sanku		1997	37	4	p. 673-676 4 p.	article
54	Estimation of the degradation of amorphous silicon solar cells	Yanagisawa, Takeshi		1997	37	4	p. 549-554 6 p.	article
55	Experimental investigation of subcooled liquid nitrogen impingement cooling of a silicon chip			1997	37	4	p. 701- 1 p.	article
56	Fault tree models for the analysis of complex computer-based systems			1997	37	4	p. 692- 1 p.	article
57	Field-based analysis of a high pincount board connector			1997	37	4	p. 689- 1 p.	article
58	Fine line thin dielectric circuit board characterization			1997	37	4	p. 702- 1 p.	article
59	Focused beam machining and deposition for nanofabrication S. T. Davies and B. Khamsehpour. Vacuum, 47 (5), 455 (1996)			1997	37	4	p. 708- 1 p.	article
60	Focused ion beam preparation of inclined planes in semiconductor materials			1997	37	4	p. 708- 1 p.	article
61	Formulas for analyzing a redundant robot configuration with a built-in safety system	Dhillon, B.S.		1997	37	4	p. 557-563 7 p.	article
62	Fuzzy reliability using a discrete stress-strength interference model			1997	37	4	p. 691-692 2 p.	article
63	Genetics based redudancy optimization	Ramachandran, V.		1997	37	4	p. 661-663 3 p.	article
64	Growth and characterization of HTSC thin films for microelectronics devices			1997	37	4	p. 707- 1 p.	article
65	Growth of CuGaSe2 film by molecular beam epitaxy			1997	37	4	p. 709- 1 p.	article
66	Higher-integrated spread-type stacked capacitor and its suitable arsenic solid-diffusion method			1997	37	4	p. 688- 1 p.	article
67	High-frequency measurement of multilayer ceramic capacitors			1997	37	4	p. 689- 1 p.	article
68	High speed laser ablation of microvia holes in non-woven Aramid reinforced printed wiring boards to reduce cost			1997	37	4	p. 707-708 2 p.	article
69	How to model reliability-growth when times of design modifications are known			1997	37	4	p. 697- 1 p.	article
70	Hybrid assembly: a strategy for expanding the role of ‘advanced’ assembly technology			1997	37	4	p. 706-707 2 p.	article
71	Hypothesis-test for reliability in a stress-strength model, with prior information			1997	37	4	p. 694- 1 p.	article
72	International standards: their role in a global economy			1997	37	4	p. 688- 1 p.	article
73	Interplay of 2D and 3D charge carriers in Si-δ-doped InSb layers grown epitaxially on GaAs			1997	37	4	p. 705- 1 p.	article
74	Intersubband lifetimes in Si/SiGe quantum wells			1997	37	4	p. 703- 1 p.	article
75	Investigation of low power all-optical bistability in an InGaAsInAlAs superlattice			1997	37	4	p. 704- 1 p.	article
76	Lateral electron depletion in focused-ion-beam implanted pseudomorphic heterostructures with InxGa1−xAs channels			1997	37	4	p. 708-709 2 p.	article
77	Level crossing of nanometer size InAs islands in GaAs			1997	37	4	p. 705- 1 p.	article
78	Lower and upper bounds for the reliability of connected-(r,s)-out-of-(m,n): F lattice systems			1997	37	4	p. 696- 1 p.	article
79	MBE growth physics: application to device technology			1997	37	4	p. 708- 1 p.	article
80	Mean time to first failure of repairable systems with one cold spare			1997	37	4	p. 695-696 2 p.	article
81	Modelling and simulation of a satellite constellation based on petri nets			1997	37	4	p. 698- 1 p.	article
82	Modelling effects of focused ion beams			1997	37	4	p. 708- 1 p.	article
83	Modelling of gate-induced drain leakage in relation to technological parameters and temperature	Bouhdada, A.		1997	37	4	p. 649-652 4 p.	article
84	Modelling the cosmic-ray-induced soft-error rate in integrated circuits: an overview			1997	37	4	p. 691- 1 p.	article
85	Modified block-replacement for multiple-component systems			1997	37	4	p. 693-694 2 p.	article
86	Modified ‘Practical Bayes-Estimators’			1997	37	4	p. 694- 1 p.	article
87	Multichannel optical modules compatible with the fiber-in-board technology			1997	37	4	p. 700- 1 p.	article
88	New complementary BiCMOS digital gates for low-voltage environments			1997	37	4	p. 704-705 2 p.	article
89	New optical and electrical hybrid packaging techniques using optical waveguides for optoelectronic multichip modules			1997	37	4	p. 707- 1 p.	article
90	Optimal algorithms for synthesis of reliable application-specific heterogeneous multiprocessors			1997	37	4	p. 694-695 2 p.	article
91	Optimal assignment of priorities for the machine interference problems	Yi-Chih Hsieh,		1997	37	4	p. 635-640 6 p.	article
92	Optimal design improving a communication network reliability	Fang-Ming Shao,		1997	37	4	p. 591-595 5 p.	article
93	Optimization of connecting two communication networks subject to a reliability constraint	Lian-Chang Zhao,		1997	37	4	p. 629-633 5 p.	article
94	Optimum design and selection of heat sinks			1997	37	4	p. 699- 1 p.	article
95	Optimum interchangement time for a two-dissimilar-unit with two types of repairman	Sridharan, V.		1997	37	4	p. 669-671 3 p.	article
96	Optoelectronic packaging of two-dimensional surface active devices			1997	37	4	p. 699- 1 p.	article
97	Planning and optimizing environmental stress screening			1997	37	4	p. 687- 1 p.	article
98	Plastic-encapsulated microcircuit reliability and cost-effectiveness study			1997	37	4	p. 690-691 2 p.	article
99	Poisson mixture yield models for integrated circuits: A critical review	Raghavachari, M.		1997	37	4	p. 565-580 16 p.	article
100	Polarization-sensitive photocurrents of metal-semiconductor structures with flat and microrelief interfaces			1997	37	4	p. 706- 1 p.	article
101	Probabilistic analysis of a two-unit cold standby redundant system subject to failure of controlled weather device	Mahmoud, M.A.W.		1997	37	4	p. 623-628 6 p.	article
102	Proposed new DoD standard for product acceptance			1997	37	4	p. 687-688 2 p.	article
103	Prospects for terahertz technology			1997	37	4	p. 698- 1 p.	article
104	Quality enhances reliability. A utility's big customer will willingly sign up for power that flows smoothly enough not to trip up electronic equipment			1997	37	4	p. 687- 1 p.	article
105	Quantum functional devices for advanced electronics			1997	37	4	p. 705- 1 p.	article
106	Reliability analysis and comparison of several structures	Lim, Jae-Hak		1997	37	4	p. 653-660 8 p.	article
107	Reliability and Au-concentration in OLB solder fillets of TAB-devices having a 75 μm pitch			1997	37	4	p. 689- 1 p.	article
108	Reliability assessment of fielded plastic and hermetically packaged microelectronics			1997	37	4	p. 690- 1 p.	article
109	Reliability investigations of fluxless flip chip inter-connections on green tape ceramic substrates			1997	37	4	p. 698- 1 p.	article
110	Reliability of a cascade system with exponential strength and gamma stress	Rekha, A.		1997	37	4	p. 683-685 3 p.	article
111	Robust parameter-estimation using the bootstrap method for the 2-parameter Weibull distribution			1997	37	4	p. 695- 1 p.	article
112	Safety assessment, reliability, and the Probability-Operation diagram			1997	37	4	p. 695- 1 p.	article
113	Semiconductor lithography for the next millennium			1997	37	4	p. 698- 1 p.	article
114	Solving ML equations for 2-parameter Poisson-process models for ungrouped software-failure data			1997	37	4	p. 697- 1 p.	article
115	Some remarks on rare-event approximation			1997	37	4	p. 687- 1 p.	article
116	SPICE application in the study of the behaviour of multi-state systems described by Markov models	Abuelma'atti, Muhammad Taher		1997	37	4	p. 609-613 5 p.	article
117	SPICE-models for high-pincount board connectors			1997	37	4	p. 700- 1 p.	article
118	Strong magnetic field dependence of laser emission from quantum wires formed by cleaved edge overgrowth			1997	37	4	p. 709- 1 p.	article
119	Structured test methodologies and test economics for multichip modules			1997	37	4	p. 701- 1 p.	article
120	Submicro- and nanometer structure fabricating using direct electron-beam writing and reactive ion etching			1997	37	4	p. 708- 1 p.	article
121	Survival function of a component under random strength attenuation	Rekha, A.		1997	37	4	p. 677-681 5 p.	article
122	System design methodologies: aiming at the 100 h design cycle			1997	37	4	p. 702- 1 p.	article
123	System reliability with common-cause hazard to obey an exponential power model	El-Damcese, M.A.		1997	37	4	p. 605-608 4 p.	article
124	Technical note	Ramachandran, V.		1997	37	4	p. 665-667 3 p.	article
125	Temperature and stress time history responses in electronic packaging			1997	37	4	p. 699- 1 p.	article
126	The appropriateness of plastic encapsulated microcircuits in a specific wooden-round application			1997	37	4	p. 690- 1 p.	article
127	The conduction properties of the silicon/off-stoichiometry-SiO2 diode			1997	37	4	p. 705- 1 p.	article
128	The contamination audit—a vital tool for yield improvement			1997	37	4	p. 698- 1 p.	article
129	The evolution of IBM high performance cooling technology			1997	37	4	p. 700- 1 p.	article
130	The failure of Bayes system reliability inference based on data with multi-level applicability			1997	37	4	p. 694- 1 p.	article
131	Thermal characterization of electronic devices with boundary condition independent compact models			1997	37	4	p. 702- 1 p.	article
132	The use of imprecise component reliability distributions in reliability calculations			1997	37	4	p. 695- 1 p.	article
133	Thin-film multimaterial optoelectronic integrated circuits			1997	37	4	p. 707- 1 p.	article
134	Things are changing A report on the reliability and maintainability symposium 1996	Reiche, Hans		1997	37	4	p. 711-712 2 p.	article
135	Time-domain characterization and circuit modelling of a multilayer ceramic package			1997	37	4	p. 699- 1 p.	article
136	Transformations of Star-Delta and Delta-Star reliability networks			1997	37	4	p. 693- 1 p.	article
137	Tutorial: temperature as an input to microelectronics-reliability models			1997	37	4	p. 697- 1 p.	article
138	Use of BCB in high frequency MCM interconnects			1997	37	4	p. 699- 1 p.	article
139	Using polymer thick film for cost-effective EMC protection on PCBs for automotive applications			1997	37	4	p. 688-689 2 p.	article
140	Worst case circuit analysis—an overview (electronic parts/circuits tolerance analysis)			1997	37	4	p. 692- 1 p.	article

140 results found

Koninklijke Bibliotheek - National Library of the Netherlands