nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
Accelerated life testing for products without sequence effect
|
|
|
1997 |
37 |
4 |
p. 693- 1 p. |
artikel |
2 |
Accelerated testing for cosmic soft-error rate
|
|
|
1997 |
37 |
4 |
p. 702- 1 p. |
artikel |
3 |
Achieving accurate thermal characterization using a CFD code—a case study of plastic packages
|
|
|
1997 |
37 |
4 |
p. 700-701 2 p. |
artikel |
4 |
A CMOS IC for Gb/s Viterbi decoding: system design and VLSI implementation
|
|
|
1997 |
37 |
4 |
p. 702-703 2 p. |
artikel |
5 |
A combined analysis approach to assessing requirements for safety critical real-time control systems
|
|
|
1997 |
37 |
4 |
p. 692- 1 p. |
artikel |
6 |
A comparison of fault-tolerant state machine architectures for space-borne electronics
|
|
|
1997 |
37 |
4 |
p. 697- 1 p. |
artikel |
7 |
A cost comparison of new MCM technologies
|
|
|
1997 |
37 |
4 |
p. 698- 1 p. |
artikel |
8 |
A hi-density C4/CBGA interconnect technology for a CMOS microprocessor
|
|
|
1997 |
37 |
4 |
p. 703- 1 p. |
artikel |
9 |
A methodology for laser-based thermal diffusivity measurement of advanced multichip module ceramic materials
|
|
|
1997 |
37 |
4 |
p. 709- 1 p. |
artikel |
10 |
Analysis of a two-unit warm standby system subject to degradation
|
Mokaddis, G.S. |
|
1997 |
37 |
4 |
p. 641-647 7 p. |
artikel |
11 |
Analysis of consecutive k-out-of-n: F systems with single repair facility
|
Dinesh Kumar, U. |
|
1997 |
37 |
4 |
p. 587-590 4 p. |
artikel |
12 |
Analysis of step-stress accelerated-life-test data: a new approach
|
|
|
1997 |
37 |
4 |
p. 696- 1 p. |
artikel |
13 |
An assessment of the thermal performance of the PBGA family
|
|
|
1997 |
37 |
4 |
p. 701- 1 p. |
artikel |
14 |
A new bonding technique for microwave devices
|
|
|
1997 |
37 |
4 |
p. 699-700 2 p. |
artikel |
15 |
An input-domain based method to estimate software reliability
|
|
|
1997 |
37 |
4 |
p. 696-697 2 p. |
artikel |
16 |
Annealing effect of vacuum evaporated InSb thin films
|
|
|
1997 |
37 |
4 |
p. 705-706 2 p. |
artikel |
17 |
An optimal maintenance model using a number of different actions
|
Lam, Yeh |
|
1997 |
37 |
4 |
p. 615-622 8 p. |
artikel |
18 |
A novel two-step etching process for reducing plasma-induced oxide damage
|
|
|
1997 |
37 |
4 |
p. 704- 1 p. |
artikel |
19 |
An overview of environmental reliability testing
|
|
|
1997 |
37 |
4 |
p. 688- 1 p. |
artikel |
20 |
A recursive variance-reduction algorithm for estimating communication-network reliability
|
|
|
1997 |
37 |
4 |
p. 694- 1 p. |
artikel |
21 |
A reliability study of a small vehicle
|
Reiche, H. |
|
1997 |
37 |
4 |
p. 555-556 2 p. |
artikel |
22 |
A rigorous method to evaluate the electrical performance of MCM interconnections in frequency and time domains
|
|
|
1997 |
37 |
4 |
p. 700- 1 p. |
artikel |
23 |
A study of composite Bi2O3, In2O3 and RuO2 planar thick film piezoresistive gauges
|
|
|
1997 |
37 |
4 |
p. 706- 1 p. |
artikel |
24 |
Asymptotic thermal analysis of electronic packages and printed-circuit boards
|
|
|
1997 |
37 |
4 |
p. 701- 1 p. |
artikel |
25 |
Atomic force microscopy studies of SiGe films and Si/SiGe heterostructures
|
|
|
1997 |
37 |
4 |
p. 706- 1 p. |
artikel |
26 |
A unified domination approach for reliability analysis of networks with arbitrary logic in vertices
|
|
|
1997 |
37 |
4 |
p. 696- 1 p. |
artikel |
27 |
Avalanche breakdown of high-voltage p-n junctions of SiC
|
|
|
1997 |
37 |
4 |
p. 691- 1 p. |
artikel |
28 |
Case study: the design of a mixed-signal global positioning system receiver using multichip module packaging
|
|
|
1997 |
37 |
4 |
p. 703- 1 p. |
artikel |
29 |
Comment on: reliability modelling and performance of variable link-capacity networks
|
|
|
1997 |
37 |
4 |
p. 695- 1 p. |
artikel |
30 |
Compact non-local modelling of impact ionization in SOI MOSFETs for optimal CMOS device/circuit design
|
|
|
1997 |
37 |
4 |
p. 704- 1 p. |
artikel |
31 |
Comparative redundancy, an alternative to triple modular redundant system design
|
Philp, Kenneth W. |
|
1997 |
37 |
4 |
p. 581-585 5 p. |
artikel |
32 |
Comparing the importance of system components by some structural characteristics
|
|
|
1997 |
37 |
4 |
p. 691- 1 p. |
artikel |
33 |
Component redundancy vs system redundancy in the hazard rate ordering
|
|
|
1997 |
37 |
4 |
p. 695- 1 p. |
artikel |
34 |
Computational method for reliability data analysis
|
|
|
1997 |
37 |
4 |
p. 692- 1 p. |
artikel |
35 |
Consecutive-k, r-out-of-n:DFM systems
|
Koutras, M.V. |
|
1997 |
37 |
4 |
p. 597-603 7 p. |
artikel |
36 |
Consideration of node failures in network-reliability calculation
|
|
|
1997 |
37 |
4 |
p. 693- 1 p. |
artikel |
37 |
Correlation of the decay of tunneling currents with trap generation inside thin oxides
|
|
|
1997 |
37 |
4 |
p. 706- 1 p. |
artikel |
38 |
Damage to substrates during SiO2 etching: opportunities of subsequent removal by optimized cleaning procedures
|
|
|
1997 |
37 |
4 |
p. 704- 1 p. |
artikel |
39 |
Degradation of gold-aluminium ball bonds by aging and contamination
|
|
|
1997 |
37 |
4 |
p. 689- 1 p. |
artikel |
40 |
Dependability standards: an international perspective
|
|
|
1997 |
37 |
4 |
p. 687- 1 p. |
artikel |
41 |
Design and evaluation of an epoxy three-dimensional multichip module
|
|
|
1997 |
37 |
4 |
p. 703- 1 p. |
artikel |
42 |
Designing for fault-tolerance in the commercial environment
|
|
|
1997 |
37 |
4 |
p. 693- 1 p. |
artikel |
43 |
Determining the discrete-time reliability of a repairable 2-out-of-(N + 1): F system
|
|
|
1997 |
37 |
4 |
p. 696- 1 p. |
artikel |
44 |
Development of a fault isolation procedure
|
|
|
1997 |
37 |
4 |
p. 693- 1 p. |
artikel |
45 |
Development of an inspection process for ball-grid-array technology using scanned-beam X-ray laminography
|
|
|
1997 |
37 |
4 |
p. 699- 1 p. |
artikel |
46 |
Development of ultra-compact plastic-packaged high-isolation GaAs SPDT switch
|
|
|
1997 |
37 |
4 |
p. 688- 1 p. |
artikel |
47 |
Discrimination of individual gases/odours using polar plot of an integrated thick film sensor array
|
|
|
1997 |
37 |
4 |
p. 706- 1 p. |
artikel |
48 |
Dynamic analysis of qualitative circuits for failure mode and effects analysis
|
|
|
1997 |
37 |
4 |
p. 697-698 2 p. |
artikel |
49 |
Effect of GE incorporation on the performance of P-channel polycrystalline Si1−xGex thin-film transistors
|
|
|
1997 |
37 |
4 |
p. 705- 1 p. |
artikel |
50 |
Effects of the rear interface states and fixed charges on the electrical characteristics of thin film transistors with thin amorphous silicon layers
|
|
|
1997 |
37 |
4 |
p. 704- 1 p. |
artikel |
51 |
Effortless incremental design FMEA
|
|
|
1997 |
37 |
4 |
p. 692- 1 p. |
artikel |
52 |
Electron and proton irradiation-induced degradation of epitaxial InP solar cells
|
|
|
1997 |
37 |
4 |
p. 690- 1 p. |
artikel |
53 |
Estimation of parameters of a model of a complex repairable system
|
Dey, Sanku |
|
1997 |
37 |
4 |
p. 673-676 4 p. |
artikel |
54 |
Estimation of the degradation of amorphous silicon solar cells
|
Yanagisawa, Takeshi |
|
1997 |
37 |
4 |
p. 549-554 6 p. |
artikel |
55 |
Experimental investigation of subcooled liquid nitrogen impingement cooling of a silicon chip
|
|
|
1997 |
37 |
4 |
p. 701- 1 p. |
artikel |
56 |
Fault tree models for the analysis of complex computer-based systems
|
|
|
1997 |
37 |
4 |
p. 692- 1 p. |
artikel |
57 |
Field-based analysis of a high pincount board connector
|
|
|
1997 |
37 |
4 |
p. 689- 1 p. |
artikel |
58 |
Fine line thin dielectric circuit board characterization
|
|
|
1997 |
37 |
4 |
p. 702- 1 p. |
artikel |
59 |
Focused beam machining and deposition for nanofabrication S. T. Davies and B. Khamsehpour. Vacuum, 47 (5), 455 (1996)
|
|
|
1997 |
37 |
4 |
p. 708- 1 p. |
artikel |
60 |
Focused ion beam preparation of inclined planes in semiconductor materials
|
|
|
1997 |
37 |
4 |
p. 708- 1 p. |
artikel |
61 |
Formulas for analyzing a redundant robot configuration with a built-in safety system
|
Dhillon, B.S. |
|
1997 |
37 |
4 |
p. 557-563 7 p. |
artikel |
62 |
Fuzzy reliability using a discrete stress-strength interference model
|
|
|
1997 |
37 |
4 |
p. 691-692 2 p. |
artikel |
63 |
Genetics based redudancy optimization
|
Ramachandran, V. |
|
1997 |
37 |
4 |
p. 661-663 3 p. |
artikel |
64 |
Growth and characterization of HTSC thin films for microelectronics devices
|
|
|
1997 |
37 |
4 |
p. 707- 1 p. |
artikel |
65 |
Growth of CuGaSe2 film by molecular beam epitaxy
|
|
|
1997 |
37 |
4 |
p. 709- 1 p. |
artikel |
66 |
Higher-integrated spread-type stacked capacitor and its suitable arsenic solid-diffusion method
|
|
|
1997 |
37 |
4 |
p. 688- 1 p. |
artikel |
67 |
High-frequency measurement of multilayer ceramic capacitors
|
|
|
1997 |
37 |
4 |
p. 689- 1 p. |
artikel |
68 |
High speed laser ablation of microvia holes in non-woven Aramid reinforced printed wiring boards to reduce cost
|
|
|
1997 |
37 |
4 |
p. 707-708 2 p. |
artikel |
69 |
How to model reliability-growth when times of design modifications are known
|
|
|
1997 |
37 |
4 |
p. 697- 1 p. |
artikel |
70 |
Hybrid assembly: a strategy for expanding the role of ‘advanced’ assembly technology
|
|
|
1997 |
37 |
4 |
p. 706-707 2 p. |
artikel |
71 |
Hypothesis-test for reliability in a stress-strength model, with prior information
|
|
|
1997 |
37 |
4 |
p. 694- 1 p. |
artikel |
72 |
International standards: their role in a global economy
|
|
|
1997 |
37 |
4 |
p. 688- 1 p. |
artikel |
73 |
Interplay of 2D and 3D charge carriers in Si-δ-doped InSb layers grown epitaxially on GaAs
|
|
|
1997 |
37 |
4 |
p. 705- 1 p. |
artikel |
74 |
Intersubband lifetimes in Si/SiGe quantum wells
|
|
|
1997 |
37 |
4 |
p. 703- 1 p. |
artikel |
75 |
Investigation of low power all-optical bistability in an InGaAsInAlAs superlattice
|
|
|
1997 |
37 |
4 |
p. 704- 1 p. |
artikel |
76 |
Lateral electron depletion in focused-ion-beam implanted pseudomorphic heterostructures with InxGa1−xAs channels
|
|
|
1997 |
37 |
4 |
p. 708-709 2 p. |
artikel |
77 |
Level crossing of nanometer size InAs islands in GaAs
|
|
|
1997 |
37 |
4 |
p. 705- 1 p. |
artikel |
78 |
Lower and upper bounds for the reliability of connected-(r,s)-out-of-(m,n): F lattice systems
|
|
|
1997 |
37 |
4 |
p. 696- 1 p. |
artikel |
79 |
MBE growth physics: application to device technology
|
|
|
1997 |
37 |
4 |
p. 708- 1 p. |
artikel |
80 |
Mean time to first failure of repairable systems with one cold spare
|
|
|
1997 |
37 |
4 |
p. 695-696 2 p. |
artikel |
81 |
Modelling and simulation of a satellite constellation based on petri nets
|
|
|
1997 |
37 |
4 |
p. 698- 1 p. |
artikel |
82 |
Modelling effects of focused ion beams
|
|
|
1997 |
37 |
4 |
p. 708- 1 p. |
artikel |
83 |
Modelling of gate-induced drain leakage in relation to technological parameters and temperature
|
Bouhdada, A. |
|
1997 |
37 |
4 |
p. 649-652 4 p. |
artikel |
84 |
Modelling the cosmic-ray-induced soft-error rate in integrated circuits: an overview
|
|
|
1997 |
37 |
4 |
p. 691- 1 p. |
artikel |
85 |
Modified block-replacement for multiple-component systems
|
|
|
1997 |
37 |
4 |
p. 693-694 2 p. |
artikel |
86 |
Modified ‘Practical Bayes-Estimators’
|
|
|
1997 |
37 |
4 |
p. 694- 1 p. |
artikel |
87 |
Multichannel optical modules compatible with the fiber-in-board technology
|
|
|
1997 |
37 |
4 |
p. 700- 1 p. |
artikel |
88 |
New complementary BiCMOS digital gates for low-voltage environments
|
|
|
1997 |
37 |
4 |
p. 704-705 2 p. |
artikel |
89 |
New optical and electrical hybrid packaging techniques using optical waveguides for optoelectronic multichip modules
|
|
|
1997 |
37 |
4 |
p. 707- 1 p. |
artikel |
90 |
Optimal algorithms for synthesis of reliable application-specific heterogeneous multiprocessors
|
|
|
1997 |
37 |
4 |
p. 694-695 2 p. |
artikel |
91 |
Optimal assignment of priorities for the machine interference problems
|
Yi-Chih Hsieh, |
|
1997 |
37 |
4 |
p. 635-640 6 p. |
artikel |
92 |
Optimal design improving a communication network reliability
|
Fang-Ming Shao, |
|
1997 |
37 |
4 |
p. 591-595 5 p. |
artikel |
93 |
Optimization of connecting two communication networks subject to a reliability constraint
|
Lian-Chang Zhao, |
|
1997 |
37 |
4 |
p. 629-633 5 p. |
artikel |
94 |
Optimum design and selection of heat sinks
|
|
|
1997 |
37 |
4 |
p. 699- 1 p. |
artikel |
95 |
Optimum interchangement time for a two-dissimilar-unit with two types of repairman
|
Sridharan, V. |
|
1997 |
37 |
4 |
p. 669-671 3 p. |
artikel |
96 |
Optoelectronic packaging of two-dimensional surface active devices
|
|
|
1997 |
37 |
4 |
p. 699- 1 p. |
artikel |
97 |
Planning and optimizing environmental stress screening
|
|
|
1997 |
37 |
4 |
p. 687- 1 p. |
artikel |
98 |
Plastic-encapsulated microcircuit reliability and cost-effectiveness study
|
|
|
1997 |
37 |
4 |
p. 690-691 2 p. |
artikel |
99 |
Poisson mixture yield models for integrated circuits: A critical review
|
Raghavachari, M. |
|
1997 |
37 |
4 |
p. 565-580 16 p. |
artikel |
100 |
Polarization-sensitive photocurrents of metal-semiconductor structures with flat and microrelief interfaces
|
|
|
1997 |
37 |
4 |
p. 706- 1 p. |
artikel |
101 |
Probabilistic analysis of a two-unit cold standby redundant system subject to failure of controlled weather device
|
Mahmoud, M.A.W. |
|
1997 |
37 |
4 |
p. 623-628 6 p. |
artikel |
102 |
Proposed new DoD standard for product acceptance
|
|
|
1997 |
37 |
4 |
p. 687-688 2 p. |
artikel |
103 |
Prospects for terahertz technology
|
|
|
1997 |
37 |
4 |
p. 698- 1 p. |
artikel |
104 |
Quality enhances reliability. A utility's big customer will willingly sign up for power that flows smoothly enough not to trip up electronic equipment
|
|
|
1997 |
37 |
4 |
p. 687- 1 p. |
artikel |
105 |
Quantum functional devices for advanced electronics
|
|
|
1997 |
37 |
4 |
p. 705- 1 p. |
artikel |
106 |
Reliability analysis and comparison of several structures
|
Lim, Jae-Hak |
|
1997 |
37 |
4 |
p. 653-660 8 p. |
artikel |
107 |
Reliability and Au-concentration in OLB solder fillets of TAB-devices having a 75 μm pitch
|
|
|
1997 |
37 |
4 |
p. 689- 1 p. |
artikel |
108 |
Reliability assessment of fielded plastic and hermetically packaged microelectronics
|
|
|
1997 |
37 |
4 |
p. 690- 1 p. |
artikel |
109 |
Reliability investigations of fluxless flip chip inter-connections on green tape ceramic substrates
|
|
|
1997 |
37 |
4 |
p. 698- 1 p. |
artikel |
110 |
Reliability of a cascade system with exponential strength and gamma stress
|
Rekha, A. |
|
1997 |
37 |
4 |
p. 683-685 3 p. |
artikel |
111 |
Robust parameter-estimation using the bootstrap method for the 2-parameter Weibull distribution
|
|
|
1997 |
37 |
4 |
p. 695- 1 p. |
artikel |
112 |
Safety assessment, reliability, and the Probability-Operation diagram
|
|
|
1997 |
37 |
4 |
p. 695- 1 p. |
artikel |
113 |
Semiconductor lithography for the next millennium
|
|
|
1997 |
37 |
4 |
p. 698- 1 p. |
artikel |
114 |
Solving ML equations for 2-parameter Poisson-process models for ungrouped software-failure data
|
|
|
1997 |
37 |
4 |
p. 697- 1 p. |
artikel |
115 |
Some remarks on rare-event approximation
|
|
|
1997 |
37 |
4 |
p. 687- 1 p. |
artikel |
116 |
SPICE application in the study of the behaviour of multi-state systems described by Markov models
|
Abuelma'atti, Muhammad Taher |
|
1997 |
37 |
4 |
p. 609-613 5 p. |
artikel |
117 |
SPICE-models for high-pincount board connectors
|
|
|
1997 |
37 |
4 |
p. 700- 1 p. |
artikel |
118 |
Strong magnetic field dependence of laser emission from quantum wires formed by cleaved edge overgrowth
|
|
|
1997 |
37 |
4 |
p. 709- 1 p. |
artikel |
119 |
Structured test methodologies and test economics for multichip modules
|
|
|
1997 |
37 |
4 |
p. 701- 1 p. |
artikel |
120 |
Submicro- and nanometer structure fabricating using direct electron-beam writing and reactive ion etching
|
|
|
1997 |
37 |
4 |
p. 708- 1 p. |
artikel |
121 |
Survival function of a component under random strength attenuation
|
Rekha, A. |
|
1997 |
37 |
4 |
p. 677-681 5 p. |
artikel |
122 |
System design methodologies: aiming at the 100 h design cycle
|
|
|
1997 |
37 |
4 |
p. 702- 1 p. |
artikel |
123 |
System reliability with common-cause hazard to obey an exponential power model
|
El-Damcese, M.A. |
|
1997 |
37 |
4 |
p. 605-608 4 p. |
artikel |
124 |
Technical note
|
Ramachandran, V. |
|
1997 |
37 |
4 |
p. 665-667 3 p. |
artikel |
125 |
Temperature and stress time history responses in electronic packaging
|
|
|
1997 |
37 |
4 |
p. 699- 1 p. |
artikel |
126 |
The appropriateness of plastic encapsulated microcircuits in a specific wooden-round application
|
|
|
1997 |
37 |
4 |
p. 690- 1 p. |
artikel |
127 |
The conduction properties of the silicon/off-stoichiometry-SiO2 diode
|
|
|
1997 |
37 |
4 |
p. 705- 1 p. |
artikel |
128 |
The contamination audit—a vital tool for yield improvement
|
|
|
1997 |
37 |
4 |
p. 698- 1 p. |
artikel |
129 |
The evolution of IBM high performance cooling technology
|
|
|
1997 |
37 |
4 |
p. 700- 1 p. |
artikel |
130 |
The failure of Bayes system reliability inference based on data with multi-level applicability
|
|
|
1997 |
37 |
4 |
p. 694- 1 p. |
artikel |
131 |
Thermal characterization of electronic devices with boundary condition independent compact models
|
|
|
1997 |
37 |
4 |
p. 702- 1 p. |
artikel |
132 |
The use of imprecise component reliability distributions in reliability calculations
|
|
|
1997 |
37 |
4 |
p. 695- 1 p. |
artikel |
133 |
Thin-film multimaterial optoelectronic integrated circuits
|
|
|
1997 |
37 |
4 |
p. 707- 1 p. |
artikel |
134 |
Things are changing A report on the reliability and maintainability symposium 1996
|
Reiche, Hans |
|
1997 |
37 |
4 |
p. 711-712 2 p. |
artikel |
135 |
Time-domain characterization and circuit modelling of a multilayer ceramic package
|
|
|
1997 |
37 |
4 |
p. 699- 1 p. |
artikel |
136 |
Transformations of Star-Delta and Delta-Star reliability networks
|
|
|
1997 |
37 |
4 |
p. 693- 1 p. |
artikel |
137 |
Tutorial: temperature as an input to microelectronics-reliability models
|
|
|
1997 |
37 |
4 |
p. 697- 1 p. |
artikel |
138 |
Use of BCB in high frequency MCM interconnects
|
|
|
1997 |
37 |
4 |
p. 699- 1 p. |
artikel |
139 |
Using polymer thick film for cost-effective EMC protection on PCBs for automotive applications
|
|
|
1997 |
37 |
4 |
p. 688-689 2 p. |
artikel |
140 |
Worst case circuit analysis—an overview (electronic parts/circuits tolerance analysis)
|
|
|
1997 |
37 |
4 |
p. 692- 1 p. |
artikel |