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                             140 gevonden resultaten
nr titel auteur tijdschrift jaar jaarg. afl. pagina('s) type
1 Accelerated life testing for products without sequence effect 1997
 37 4 p. 693-
1 p.
 artikel
2 Accelerated testing for cosmic soft-error rate 1997
 37 4 p. 702-
1 p.
 artikel
3 Achieving accurate thermal characterization using a CFD code—a case study of plastic packages 1997
 37 4 p. 700-701
2 p.
 artikel
4 A CMOS IC for Gb/s Viterbi decoding: system design and VLSI implementation 1997
 37 4 p. 702-703
2 p.
 artikel
5 A combined analysis approach to assessing requirements for safety critical real-time control systems 1997
 37 4 p. 692-
1 p.
 artikel
6 A comparison of fault-tolerant state machine architectures for space-borne electronics 1997
 37 4 p. 697-
1 p.
 artikel
7 A cost comparison of new MCM technologies 1997
 37 4 p. 698-
1 p.
 artikel
8 A hi-density C4/CBGA interconnect technology for a CMOS microprocessor 1997
 37 4 p. 703-
1 p.
 artikel
9 A methodology for laser-based thermal diffusivity measurement of advanced multichip module ceramic materials 1997
 37 4 p. 709-
1 p.
 artikel
10 Analysis of a two-unit warm standby system subject to degradation Mokaddis, G.S.
 1997
 37 4 p. 641-647
7 p.
 artikel
11 Analysis of consecutive k-out-of-n: F systems with single repair facility Dinesh Kumar, U.
 1997
 37 4 p. 587-590
4 p.
 artikel
12 Analysis of step-stress accelerated-life-test data: a new approach 1997
 37 4 p. 696-
1 p.
 artikel
13 An assessment of the thermal performance of the PBGA family 1997
 37 4 p. 701-
1 p.
 artikel
14 A new bonding technique for microwave devices 1997
 37 4 p. 699-700
2 p.
 artikel
15 An input-domain based method to estimate software reliability 1997
 37 4 p. 696-697
2 p.
 artikel
16 Annealing effect of vacuum evaporated InSb thin films 1997
 37 4 p. 705-706
2 p.
 artikel
17 An optimal maintenance model using a number of different actions Lam, Yeh
 1997
 37 4 p. 615-622
8 p.
 artikel
18 A novel two-step etching process for reducing plasma-induced oxide damage 1997
 37 4 p. 704-
1 p.
 artikel
19 An overview of environmental reliability testing 1997
 37 4 p. 688-
1 p.
 artikel
20 A recursive variance-reduction algorithm for estimating communication-network reliability 1997
 37 4 p. 694-
1 p.
 artikel
21 A reliability study of a small vehicle Reiche, H.
 1997
 37 4 p. 555-556
2 p.
 artikel
22 A rigorous method to evaluate the electrical performance of MCM interconnections in frequency and time domains 1997
 37 4 p. 700-
1 p.
 artikel
23 A study of composite Bi2O3, In2O3 and RuO2 planar thick film piezoresistive gauges 1997
 37 4 p. 706-
1 p.
 artikel
24 Asymptotic thermal analysis of electronic packages and printed-circuit boards 1997
 37 4 p. 701-
1 p.
 artikel
25 Atomic force microscopy studies of SiGe films and Si/SiGe heterostructures 1997
 37 4 p. 706-
1 p.
 artikel
26 A unified domination approach for reliability analysis of networks with arbitrary logic in vertices 1997
 37 4 p. 696-
1 p.
 artikel
27 Avalanche breakdown of high-voltage p-n junctions of SiC 1997
 37 4 p. 691-
1 p.
 artikel
28 Case study: the design of a mixed-signal global positioning system receiver using multichip module packaging 1997
 37 4 p. 703-
1 p.
 artikel
29 Comment on: reliability modelling and performance of variable link-capacity networks 1997
 37 4 p. 695-
1 p.
 artikel
30 Compact non-local modelling of impact ionization in SOI MOSFETs for optimal CMOS device/circuit design 1997
 37 4 p. 704-
1 p.
 artikel
31 Comparative redundancy, an alternative to triple modular redundant system design Philp, Kenneth W.
 1997
 37 4 p. 581-585
5 p.
 artikel
32 Comparing the importance of system components by some structural characteristics 1997
 37 4 p. 691-
1 p.
 artikel
33 Component redundancy vs system redundancy in the hazard rate ordering 1997
 37 4 p. 695-
1 p.
 artikel
34 Computational method for reliability data analysis 1997
 37 4 p. 692-
1 p.
 artikel
35 Consecutive-k, r-out-of-n:DFM systems Koutras, M.V.
 1997
 37 4 p. 597-603
7 p.
 artikel
36 Consideration of node failures in network-reliability calculation 1997
 37 4 p. 693-
1 p.
 artikel
37 Correlation of the decay of tunneling currents with trap generation inside thin oxides 1997
 37 4 p. 706-
1 p.
 artikel
38 Damage to substrates during SiO2 etching: opportunities of subsequent removal by optimized cleaning procedures 1997
 37 4 p. 704-
1 p.
 artikel
39 Degradation of gold-aluminium ball bonds by aging and contamination 1997
 37 4 p. 689-
1 p.
 artikel
40 Dependability standards: an international perspective 1997
 37 4 p. 687-
1 p.
 artikel
41 Design and evaluation of an epoxy three-dimensional multichip module 1997
 37 4 p. 703-
1 p.
 artikel
42 Designing for fault-tolerance in the commercial environment 1997
 37 4 p. 693-
1 p.
 artikel
43 Determining the discrete-time reliability of a repairable 2-out-of-(N + 1): F system 1997
 37 4 p. 696-
1 p.
 artikel
44 Development of a fault isolation procedure 1997
 37 4 p. 693-
1 p.
 artikel
45 Development of an inspection process for ball-grid-array technology using scanned-beam X-ray laminography 1997
 37 4 p. 699-
1 p.
 artikel
46 Development of ultra-compact plastic-packaged high-isolation GaAs SPDT switch 1997
 37 4 p. 688-
1 p.
 artikel
47 Discrimination of individual gases/odours using polar plot of an integrated thick film sensor array 1997
 37 4 p. 706-
1 p.
 artikel
48 Dynamic analysis of qualitative circuits for failure mode and effects analysis 1997
 37 4 p. 697-698
2 p.
 artikel
49 Effect of GE incorporation on the performance of P-channel polycrystalline Si1−xGex thin-film transistors 1997
 37 4 p. 705-
1 p.
 artikel
50 Effects of the rear interface states and fixed charges on the electrical characteristics of thin film transistors with thin amorphous silicon layers 1997
 37 4 p. 704-
1 p.
 artikel
51 Effortless incremental design FMEA 1997
 37 4 p. 692-
1 p.
 artikel
52 Electron and proton irradiation-induced degradation of epitaxial InP solar cells 1997
 37 4 p. 690-
1 p.
 artikel
53 Estimation of parameters of a model of a complex repairable system Dey, Sanku
 1997
 37 4 p. 673-676
4 p.
 artikel
54 Estimation of the degradation of amorphous silicon solar cells Yanagisawa, Takeshi
 1997
 37 4 p. 549-554
6 p.
 artikel
55 Experimental investigation of subcooled liquid nitrogen impingement cooling of a silicon chip 1997
 37 4 p. 701-
1 p.
 artikel
56 Fault tree models for the analysis of complex computer-based systems 1997
 37 4 p. 692-
1 p.
 artikel
57 Field-based analysis of a high pincount board connector 1997
 37 4 p. 689-
1 p.
 artikel
58 Fine line thin dielectric circuit board characterization 1997
 37 4 p. 702-
1 p.
 artikel
59 Focused beam machining and deposition for nanofabrication S. T. Davies and B. Khamsehpour. Vacuum, 47 (5), 455 (1996) 1997
 37 4 p. 708-
1 p.
 artikel
60 Focused ion beam preparation of inclined planes in semiconductor materials 1997
 37 4 p. 708-
1 p.
 artikel
61 Formulas for analyzing a redundant robot configuration with a built-in safety system Dhillon, B.S.
 1997
 37 4 p. 557-563
7 p.
 artikel
62 Fuzzy reliability using a discrete stress-strength interference model 1997
 37 4 p. 691-692
2 p.
 artikel
63 Genetics based redudancy optimization Ramachandran, V.
 1997
 37 4 p. 661-663
3 p.
 artikel
64 Growth and characterization of HTSC thin films for microelectronics devices 1997
 37 4 p. 707-
1 p.
 artikel
65 Growth of CuGaSe2 film by molecular beam epitaxy 1997
 37 4 p. 709-
1 p.
 artikel
66 Higher-integrated spread-type stacked capacitor and its suitable arsenic solid-diffusion method 1997
 37 4 p. 688-
1 p.
 artikel
67 High-frequency measurement of multilayer ceramic capacitors 1997
 37 4 p. 689-
1 p.
 artikel
68 High speed laser ablation of microvia holes in non-woven Aramid reinforced printed wiring boards to reduce cost 1997
 37 4 p. 707-708
2 p.
 artikel
69 How to model reliability-growth when times of design modifications are known 1997
 37 4 p. 697-
1 p.
 artikel
70 Hybrid assembly: a strategy for expanding the role of ‘advanced’ assembly technology 1997
 37 4 p. 706-707
2 p.
 artikel
71 Hypothesis-test for reliability in a stress-strength model, with prior information 1997
 37 4 p. 694-
1 p.
 artikel
72 International standards: their role in a global economy 1997
 37 4 p. 688-
1 p.
 artikel
73 Interplay of 2D and 3D charge carriers in Si-δ-doped InSb layers grown epitaxially on GaAs 1997
 37 4 p. 705-
1 p.
 artikel
74 Intersubband lifetimes in Si/SiGe quantum wells 1997
 37 4 p. 703-
1 p.
 artikel
75 Investigation of low power all-optical bistability in an InGaAsInAlAs superlattice 1997
 37 4 p. 704-
1 p.
 artikel
76 Lateral electron depletion in focused-ion-beam implanted pseudomorphic heterostructures with InxGa1−xAs channels 1997
 37 4 p. 708-709
2 p.
 artikel
77 Level crossing of nanometer size InAs islands in GaAs 1997
 37 4 p. 705-
1 p.
 artikel
78 Lower and upper bounds for the reliability of connected-(r,s)-out-of-(m,n): F lattice systems 1997
 37 4 p. 696-
1 p.
 artikel
79 MBE growth physics: application to device technology 1997
 37 4 p. 708-
1 p.
 artikel
80 Mean time to first failure of repairable systems with one cold spare 1997
 37 4 p. 695-696
2 p.
 artikel
81 Modelling and simulation of a satellite constellation based on petri nets 1997
 37 4 p. 698-
1 p.
 artikel
82 Modelling effects of focused ion beams 1997
 37 4 p. 708-
1 p.
 artikel
83 Modelling of gate-induced drain leakage in relation to technological parameters and temperature Bouhdada, A.
 1997
 37 4 p. 649-652
4 p.
 artikel
84 Modelling the cosmic-ray-induced soft-error rate in integrated circuits: an overview 1997
 37 4 p. 691-
1 p.
 artikel
85 Modified block-replacement for multiple-component systems 1997
 37 4 p. 693-694
2 p.
 artikel
86 Modified ‘Practical Bayes-Estimators’ 1997
 37 4 p. 694-
1 p.
 artikel
87 Multichannel optical modules compatible with the fiber-in-board technology 1997
 37 4 p. 700-
1 p.
 artikel
88 New complementary BiCMOS digital gates for low-voltage environments 1997
 37 4 p. 704-705
2 p.
 artikel
89 New optical and electrical hybrid packaging techniques using optical waveguides for optoelectronic multichip modules 1997
 37 4 p. 707-
1 p.
 artikel
90 Optimal algorithms for synthesis of reliable application-specific heterogeneous multiprocessors 1997
 37 4 p. 694-695
2 p.
 artikel
91 Optimal assignment of priorities for the machine interference problems Yi-Chih Hsieh,
 1997
 37 4 p. 635-640
6 p.
 artikel
92 Optimal design improving a communication network reliability Fang-Ming Shao,
 1997
 37 4 p. 591-595
5 p.
 artikel
93 Optimization of connecting two communication networks subject to a reliability constraint Lian-Chang Zhao,
 1997
 37 4 p. 629-633
5 p.
 artikel
94 Optimum design and selection of heat sinks 1997
 37 4 p. 699-
1 p.
 artikel
95 Optimum interchangement time for a two-dissimilar-unit with two types of repairman Sridharan, V.
 1997
 37 4 p. 669-671
3 p.
 artikel
96 Optoelectronic packaging of two-dimensional surface active devices 1997
 37 4 p. 699-
1 p.
 artikel
97 Planning and optimizing environmental stress screening 1997
 37 4 p. 687-
1 p.
 artikel
98 Plastic-encapsulated microcircuit reliability and cost-effectiveness study 1997
 37 4 p. 690-691
2 p.
 artikel
99 Poisson mixture yield models for integrated circuits: A critical review Raghavachari, M.
 1997
 37 4 p. 565-580
16 p.
 artikel
100 Polarization-sensitive photocurrents of metal-semiconductor structures with flat and microrelief interfaces 1997
 37 4 p. 706-
1 p.
 artikel
101 Probabilistic analysis of a two-unit cold standby redundant system subject to failure of controlled weather device Mahmoud, M.A.W.
 1997
 37 4 p. 623-628
6 p.
 artikel
102 Proposed new DoD standard for product acceptance 1997
 37 4 p. 687-688
2 p.
 artikel
103 Prospects for terahertz technology 1997
 37 4 p. 698-
1 p.
 artikel
104 Quality enhances reliability. A utility's big customer will willingly sign up for power that flows smoothly enough not to trip up electronic equipment 1997
 37 4 p. 687-
1 p.
 artikel
105 Quantum functional devices for advanced electronics 1997
 37 4 p. 705-
1 p.
 artikel
106 Reliability analysis and comparison of several structures Lim, Jae-Hak
 1997
 37 4 p. 653-660
8 p.
 artikel
107 Reliability and Au-concentration in OLB solder fillets of TAB-devices having a 75 μm pitch 1997
 37 4 p. 689-
1 p.
 artikel
108 Reliability assessment of fielded plastic and hermetically packaged microelectronics 1997
 37 4 p. 690-
1 p.
 artikel
109 Reliability investigations of fluxless flip chip inter-connections on green tape ceramic substrates 1997
 37 4 p. 698-
1 p.
 artikel
110 Reliability of a cascade system with exponential strength and gamma stress Rekha, A.
 1997
 37 4 p. 683-685
3 p.
 artikel
111 Robust parameter-estimation using the bootstrap method for the 2-parameter Weibull distribution 1997
 37 4 p. 695-
1 p.
 artikel
112 Safety assessment, reliability, and the Probability-Operation diagram 1997
 37 4 p. 695-
1 p.
 artikel
113 Semiconductor lithography for the next millennium 1997
 37 4 p. 698-
1 p.
 artikel
114 Solving ML equations for 2-parameter Poisson-process models for ungrouped software-failure data 1997
 37 4 p. 697-
1 p.
 artikel
115 Some remarks on rare-event approximation 1997
 37 4 p. 687-
1 p.
 artikel
116 SPICE application in the study of the behaviour of multi-state systems described by Markov models Abuelma'atti, Muhammad Taher
 1997
 37 4 p. 609-613
5 p.
 artikel
117 SPICE-models for high-pincount board connectors 1997
 37 4 p. 700-
1 p.
 artikel
118 Strong magnetic field dependence of laser emission from quantum wires formed by cleaved edge overgrowth 1997
 37 4 p. 709-
1 p.
 artikel
119 Structured test methodologies and test economics for multichip modules 1997
 37 4 p. 701-
1 p.
 artikel
120 Submicro- and nanometer structure fabricating using direct electron-beam writing and reactive ion etching 1997
 37 4 p. 708-
1 p.
 artikel
121 Survival function of a component under random strength attenuation Rekha, A.
 1997
 37 4 p. 677-681
5 p.
 artikel
122 System design methodologies: aiming at the 100 h design cycle 1997
 37 4 p. 702-
1 p.
 artikel
123 System reliability with common-cause hazard to obey an exponential power model El-Damcese, M.A.
 1997
 37 4 p. 605-608
4 p.
 artikel
124 Technical note Ramachandran, V.
 1997
 37 4 p. 665-667
3 p.
 artikel
125 Temperature and stress time history responses in electronic packaging 1997
 37 4 p. 699-
1 p.
 artikel
126 The appropriateness of plastic encapsulated microcircuits in a specific wooden-round application 1997
 37 4 p. 690-
1 p.
 artikel
127 The conduction properties of the silicon/off-stoichiometry-SiO2 diode 1997
 37 4 p. 705-
1 p.
 artikel
128 The contamination audit—a vital tool for yield improvement 1997
 37 4 p. 698-
1 p.
 artikel
129 The evolution of IBM high performance cooling technology 1997
 37 4 p. 700-
1 p.
 artikel
130 The failure of Bayes system reliability inference based on data with multi-level applicability 1997
 37 4 p. 694-
1 p.
 artikel
131 Thermal characterization of electronic devices with boundary condition independent compact models 1997
 37 4 p. 702-
1 p.
 artikel
132 The use of imprecise component reliability distributions in reliability calculations 1997
 37 4 p. 695-
1 p.
 artikel
133 Thin-film multimaterial optoelectronic integrated circuits 1997
 37 4 p. 707-
1 p.
 artikel
134 Things are changing A report on the reliability and maintainability symposium 1996 Reiche, Hans
 1997
 37 4 p. 711-712
2 p.
 artikel
135 Time-domain characterization and circuit modelling of a multilayer ceramic package 1997
 37 4 p. 699-
1 p.
 artikel
136 Transformations of Star-Delta and Delta-Star reliability networks 1997
 37 4 p. 693-
1 p.
 artikel
137 Tutorial: temperature as an input to microelectronics-reliability models 1997
 37 4 p. 697-
1 p.
 artikel
138 Use of BCB in high frequency MCM interconnects 1997
 37 4 p. 699-
1 p.
 artikel
139 Using polymer thick film for cost-effective EMC protection on PCBs for automotive applications 1997
 37 4 p. 688-689
2 p.
 artikel
140 Worst case circuit analysis—an overview (electronic parts/circuits tolerance analysis) 1997
 37 4 p. 692-
1 p.
 artikel
                             140 gevonden resultaten
 
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