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                             130 results found
no title author magazine year volume issue page(s) type
1 A comparison between microwave reflectance, thermal wave modulated reflectance and defect etching for detecting transition metals in silicon 1993
 33 9 p. 1434-
1 p.
 article
2 A configurable integrated test methodology for monolithic microwave integrated circuit production 1993
 33 9 p. 1431-
1 p.
 article
3 A decomposition method for optimization of large-system reliability 1993
 33 9 p. 1423-
1 p.
 article
4 A directed-graph classifier of semiconductor wafer-test patterns 1993
 33 9 p. 1420-
1 p.
 article
5 A method for ion etching depth control 1993
 33 9 p. 1438-
1 p.
 article
6 A Monte Carlo simulation algorithm for finding MTBF 1993
 33 9 p. 1423-
1 p.
 article
7 Analysis of a fault-tolerance scheme for processor ensembles 1993
 33 9 p. 1425-1426
2 p.
 article
8 An automated electrical defect identification and location method for CMOS processes using a specially designed test chip 1993
 33 9 p. 1421-1422
2 p.
 article
9 An automated oracle for software testing 1993
 33 9 p. 1425-
1 p.
 article
10 An evaluation of CAD-aided programming systems for coordinate measuring machines 1993
 33 9 p. 1428-
1 p.
 article
11 A new technique in a cutset evaluation Elias, S.S.
 1993
 33 9 p. 1351-1355
5 p.
 article
12 An exponential SRGM with a bound on the number of failures Kapur, P.K.
 1993
 33 9 p. 1245-1249
5 p.
 article
13 An information model for a CAM data base to support flexible manufacture of printed circuit boards 1993
 33 9 p. 1421-
1 p.
 article
14 An innovative bonding technique for optical chips using solder bumps that eliminate chip positioning adjustments 1993
 33 9 p. 1430-
1 p.
 article
15 An O(kn) algorithm for a circular consecutive-k-out-of-n:F system 1993
 33 9 p. 1426-
1 p.
 article
16 A note on reliability allocation under a preventive maintenance schedule Wong, Jsun Y.
 1993
 33 9 p. 1411-1414
4 p.
 article
17 A novel technique for in-line monitoring of micro-contamination and process induced damage 1993
 33 9 p. 1429-
1 p.
 article
18 A novel technique for the simultaneous measurement of ambipolar carrier lifetime and diffusion coefficient in silicon 1993
 33 9 p. 1433-
1 p.
 article
19 A simple method for generating K-trees of a network Rath, Debaraj
 1993
 33 9 p. 1241-1244
4 p.
 article
20 A stochastic algorithm for high speed capacitance extraction in integrated circuits 1993
 33 9 p. 1420-1421
2 p.
 article
21 A unified mobility model for device simulation—II. Temperature dependence of carrier mobility and life-time 1993
 33 9 p. 1424-
1 p.
 article
22 Back-surface washing system enhances circuit board reliability 1993
 33 9 p. 1431-
1 p.
 article
23 BaPbO3-based thick film resistor 1993
 33 9 p. 1435-
1 p.
 article
24 Bayes attribute acceptance-sampling plan 1993
 33 9 p. 1424-
1 p.
 article
25 Bayes binomial sampling by attributes with a general-beta prior distribution 1993
 33 9 p. 1426-
1 p.
 article
26 Bayesian estimation under Poisson testing using the LINEX loss function Jaisingh, Lloyd R.
 1993
 33 9 p. 1259-1265
7 p.
 article
27 Bonding state in GaAs/Si interface 1993
 33 9 p. 1435-
1 p.
 article
28 CAFE—the MIT computer-aided fabrication environment 1993
 33 9 p. 1429-
1 p.
 article
29 Characteristics of the resist development process in electron beam lithography 1993
 33 9 p. 1437-
1 p.
 article
30 Common-cause failure analysis of a parallel system with warm standby Dhillon, B.S.
 1993
 33 9 p. 1321-1342
22 p.
 article
31 Comparison of bipolar NPN polysilicon emitter interface formation at three different manufacturing sites 1993
 33 9 p. 1434-
1 p.
 article
32 Concurrent engineering for consumer, industrial products, and Government systems 1993
 33 9 p. 1419-
1 p.
 article
33 Contact resistivity of shallow junctions formed by implantation through Pt or PtSi 1993
 33 9 p. 1437-
1 p.
 article
34 Continual progress marks electronic componentinstallation techniques 1993
 33 9 p. 1422-
1 p.
 article
35 Cost analysis of a man-machine system operating under changing operator conditions Singh, S.K.
 1993
 33 9 p. 1267-1274
8 p.
 article
36 Cost analysis of the M/M/R machine-repair problem with mixed standby spares Wang, Kuo-Hsiung
 1993
 33 9 p. 1293-1301
9 p.
 article
37 Cost saving opportunities with multichip modules 1993
 33 9 p. 1427-
1 p.
 article
38 Defect clustering viewed through generalized Poisson distribution 1993
 33 9 p. 1426-
1 p.
 article
39 Defect localization induced by hot carrier injection in short-channel MOSFETs: Concept, modeling and characterization Cristoloveanu, Sorin
 1993
 33 9 p. 1365-1385
21 p.
 article
40 Diffusion equation for GIx/G/r machine interference problem with spare machines Jain, M.
 1993
 33 9 p. 1415-1418
4 p.
 article
41 Effective buffer insertion of clock tree for high-speed VLSI circuits 1993
 33 9 p. 1431-1432
2 p.
 article
42 Effect of gold on the reliability of fine pitch surface mount solder joints 1993
 33 9 p. 1422-
1 p.
 article
43 Electrical characterization of hole transport in heavily-doped shallow implanted emitters 1993
 33 9 p. 1436-
1 p.
 article
44 Emerging trends in e-beam diagnostics 1993
 33 9 p. 1427-
1 p.
 article
45 Empirical formulas and global reliability evaluation of reliability graphs Aziz, M.A.
 1993
 33 9 p. 1233-1236
4 p.
 article
46 ESD-degradation mechanisms of GaAs microwave devices and device protection Bock, K.
 1993
 33 9 p. 1397-1410
14 p.
 article
47 Extended tables for the moments of gamma-distribution order statistics 1993
 33 9 p. 1424-
1 p.
 article
48 Extraordinary technologies enhance usefulness of standard cells, ASICs 1993
 33 9 p. 1430-
1 p.
 article
49 Fixed-time life tests based on fuzzy life characteristics 1993
 33 9 p. 1425-
1 p.
 article
50 Flow graph development method Qamber, Isa S.
 1993
 33 9 p. 1387-1395
9 p.
 article
51 GaAs/AlGaAs (SQW GRIN-SCH) LEDs monolithically integrated with Si-MOS drivers 1993
 33 9 p. 1431-
1 p.
 article
52 Graphical representation of two mixed-Weibull distributions 1993
 33 9 p. 1422-
1 p.
 article
53 Growth by molecular beam epitaxy (MBE) and structural characterization of GaAs and AlGaAs on silicon 1993
 33 9 p. 1433-1434
2 p.
 article
54 Growth of thin thermal silicon dioxide films with low defect density 1993
 33 9 p. 1433-
1 p.
 article
55 Highly flat GexSi1−x/Si heterointerfaces grown by molecular beam epitaxy in two-dimensional growth mode 1993
 33 9 p. 1434-1435
2 p.
 article
56 Hints and kinks 1993
 33 9 p. 1419-1420
2 p.
 article
57 IC manufacturing diagnosis based on statistical analysis techniques 1993
 33 9 p. 1428-1429
2 p.
 article
58 Impact of low-temperature transient-enhanced diffusion of dopants in silicon 1993
 33 9 p. 1434-
1 p.
 article
59 Laser interconnection techniques for defect avoidance in large-area restructurable silicon systems 1993
 33 9 p. 1437-
1 p.
 article
60 Long-channel silicon-on-insulator MOSFET theory 1993
 33 9 p. 1432-
1 p.
 article
61 Lower confidence bound on the percentage improvement in comparing two failure rates 1993
 33 9 p. 1424-
1 p.
 article
62 Low temperature CMOS—a brief review 1993
 33 9 p. 1433-
1 p.
 article
63 Makers tackle challenge of improving automatic assembly technology 1993
 33 9 p. 1430-
1 p.
 article
64 Maximum likelihood estimates, from censored data, for mixed-Weibull distributions 1993
 33 9 p. 1423-
1 p.
 article
65 Maximum likelihood estimation of Burr XII distribution parameters under Type II censoring Wingo, Dallas R.
 1993
 33 9 p. 1251-1257
7 p.
 article
66 Measurements of interface state density in partially- and fully-depleted silicon-on-insulator MOSFETs by a high-low-frequency transconductance method 1993
 33 9 p. 1435-
1 p.
 article
67 Measuring software reliability 1993
 33 9 p. 1427-
1 p.
 article
68 Measuring the opaque substrate temperature by infrared laser beams 1993
 33 9 p. 1437-
1 p.
 article
69 Method for semiconductor process optimization using functional representations of spatial variations and selectivity 1993
 33 9 p. 1430-
1 p.
 article
70 Microwave IC control components for phased-array antennas 1993
 33 9 p. 1431-
1 p.
 article
71 MIL reliability: a new approach 1993
 33 9 p. 1419-
1 p.
 article
72 Minimizing damage and contamination in RIE processes by extracted-plasma-parameter analysis 1993
 33 9 p. 1438-
1 p.
 article
73 Modelling of a high throughput hot-wall reactor for selective epitaxial growth of silicon 1993
 33 9 p. 1434-
1 p.
 article
74 Modelling of deep silicon etching in multicomponent plasma 1993
 33 9 p. 1434-
1 p.
 article
75 Molecular beam epitaxy—aspects and applications 1993
 33 9 p. 1437-
1 p.
 article
76 Multiple function trends sweep into hybrid IC field 1993
 33 9 p. 1435-
1 p.
 article
77 Novel effects of heating rate on the activation/recrystallization of boron-implanted Si substrates 1993
 33 9 p. 1437-
1 p.
 article
78 Novel near-field probe for on-wafer integrated circuit measurements 1993
 33 9 p. 1430-
1 p.
 article
79 N2 reflow soldering assists environmental protection 1993
 33 9 p. 1422-
1 p.
 article
80 On Onaga's upper bound on the mean values of probabilistic maximum flows 1993
 33 9 p. 1424-
1 p.
 article
81 Optimization models for selection of programmes, considering cost and reliability 1993
 33 9 p. 1425-
1 p.
 article
82 Optimization of high performance BiCMOS buffer circuit for chip area, delay and power dissipation 1993
 33 9 p. 1431-
1 p.
 article
83 Optimization of restoration cost for complex technical systems at centralized structure of repair Martynenko, O.N.
 1993
 33 9 p. 1227-1232
6 p.
 article
84 Order statistics based modeling of gracefully degrading computing systems Chaganty, N.R.
 1993
 33 9 p. 1281-1291
11 p.
 article
85 Parallel algorithms for terminal-pair reliability 1993
 33 9 p. 1423-1424
2 p.
 article
86 PCB continuous line system proceeds from manufacture to inspection 1993
 33 9 p. 1422-
1 p.
 article
87 Prediction of electromigration failure in W/Al-Cu multilayered metallizations by 1/f noise measurements 1993
 33 9 p. 1421-
1 p.
 article
88 Pre-tinning and flux considerations on the reliability of solder surfaces 1993
 33 9 p. 1430-
1 p.
 article
89 Preventive replacement in systems with dependent components 1993
 33 9 p. 1421-
1 p.
 article
90 Process-based cost modelling 1993
 33 9 p. 1428-
1 p.
 article
91 Production and inspection—flexible and integrated 1993
 33 9 p. 1429-
1 p.
 article
92 Promising alternative approach for high-power GaAs/Si MESFETs fabrication 1993
 33 9 p. 1432-
1 p.
 article
93 Pulsed particle beam treatment of implanted silicon 1993
 33 9 p. 1438-
1 p.
 article
94 Quality certification in the single European market 1993
 33 9 p. 1427-1428
2 p.
 article
95 Quality increases competitiveness 1993
 33 9 p. 1428-
1 p.
 article
96 Quality of hybrid circuits after soldering with “no residue” flux 1993
 33 9 p. 1435-
1 p.
 article
97 Quality of service and supervision in the French network 1993
 33 9 p. 1419-
1 p.
 article
98 Rapid thermal processing uniformity using multivariable control of a circularly symmetric three zone lamp 1993
 33 9 p. 1429-1430
2 p.
 article
99 Reactive ion etching technology in thin-film-transistor processing 1993
 33 9 p. 1436-
1 p.
 article
100 Reliability analyses for a tree-structured hierarchic control system 1993
 33 9 p. 1424-
1 p.
 article
101 Reliability analysis of a multicomponent system in a multistate Markovian environment Deng, Yonglu
 1993
 33 9 p. 1237-1239
3 p.
 article
102 Reliability and availability analysis of a system with warm standby and common cause failures Dhillon, B.S.
 1993
 33 9 p. 1343-1349
7 p.
 article
103 Reliability comparison of token-ring network schemes 1993
 33 9 p. 1425-
1 p.
 article
104 Reliability of commercial relays during life tests at low electrical contact load 1993
 33 9 p. 1420-
1 p.
 article
105 Reliability of fully and partially replicated systems 1993
 33 9 p. 1422-1423
2 p.
 article
106 Reliability optimization of communication networks using simulated annealing Atiqullah, Mir M.
 1993
 33 9 p. 1303-1319
17 p.
 article
107 Repair of circuits by laser seeding and constriction induced plating 1993
 33 9 p. 1436-
1 p.
 article
108 Robust character of exponential SPRT Sharma, K.K.
 1993
 33 9 p. 1223-1225
3 p.
 article
109 Safety-related systems. Competence, liability and practice 1993
 33 9 p. 1420-
1 p.
 article
110 Silicon wafer cleaning with CF4/H2 plasma and its effect on the properties of dry thermally grown oxide 1993
 33 9 p. 1432-
1 p.
 article
111 Soldering equipment works in freon-free environment 1993
 33 9 p. 1431-
1 p.
 article
112 SPRAM technology cultivates characteristics useful in many fields 1993
 33 9 p. 1432-
1 p.
 article
113 Stochastic analysis of a system operating in a multiple environment Agnihotri, R.K.
 1993
 33 9 p. 1219-1222
4 p.
 article
114 Systolic VLSI arrays for the metric approach to pattern recognition 1993
 33 9 p. 1432-
1 p.
 article
115 Temperature dependence of reactive ion beam etching of GaAs with CH4/H2 1993
 33 9 p. 1437-
1 p.
 article
116 The changing face of surface mount technology 1993
 33 9 p. 1427-
1 p.
 article
117 The effect of applied frequencies and multiple firing on the resistance of thick film resistors 1993
 33 9 p. 1435-
1 p.
 article
118 The effect of the number of defect mechanisms on fault clustering and its detection using yield model parameters 1993
 33 9 p. 1427-
1 p.
 article
119 The European quality award 1993
 33 9 p. 1428-
1 p.
 article
120 The reliability model on a two stage CIMS production line Min, Tan
 1993
 33 9 p. 1275-1280
6 p.
 article
121 Thermal stability of polysilicon resistors 1993
 33 9 p. 1435-1436
2 p.
 article
122 The SURE approach to reliability analysis 1993
 33 9 p. 1426-
1 p.
 article
123 Thin-film transistor/liquid crystal display technology—an introduction 1993
 33 9 p. 1436-
1 p.
 article
124 Throughput availability in Markov systems 1993
 33 9 p. 1424-
1 p.
 article
125 Uncertainty importance of system components by fuzzy and interval probability Utkin, Lev V.
 1993
 33 9 p. 1357-1364
8 p.
 article
126 Usefulness of MTTF of s-independent case in other cases 1993
 33 9 p. 1425-
1 p.
 article
127 Using reliability analysis software 1993
 33 9 p. 1425-
1 p.
 article
128 Versatile COF, COB HIC technology attracts industry attention 1993
 33 9 p. 1420-
1 p.
 article
129 Wear and contamination of electroplated gold films in line contact 1993
 33 9 p. 1421-
1 p.
 article
130 World semiconductor market recovers gradually 1993
 33 9 p. 1428-
1 p.
 article
                             130 results found
 
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