Digital Library
Close Browse articles from a journal
 
Search for with title:
ABCDEFGHIJKLMNOPQRSTUVWXYZ

     Journal description
       All volumes of the corresponding journal
         All issues of the corresponding volume
                                       All articles of the corresponding issues
 
                             183 results found
no title author magazine year volume issue page(s) type
1 A CAD coupled laser beam test system for digital circuit failure analysis 1992
 32 1-2 p. 300-301
2 p.
 article
2 A case study of ethernet anomalies in a distributed computing environment 1992
 32 1-2 p. 289-
1 p.
 article
3 A census of tandem system availability between 1985 and 1990 1992
 32 1-2 p. 283-
1 p.
 article
4 A class of shrinkage estimators for the scale parameter of the exponential distribution 1992
 32 1-2 p. 290-
1 p.
 article
5 A confidence interval for the availability ratio for systems with weibull operating time and lognormal repair time Masters, B.N.
 1992
 32 1-2 p. 89-99
11 p.
 article
6 A- consecutive-k-out-of-n: G system: the mirror image of a consecutive-k-out-of-n: F system 1992
 32 1-2 p. 292-
1 p.
 article
7 Ada's fundamental language structures build reliable systems 1992
 32 1-2 p. 283-
1 p.
 article
8 Ag-Pd thick film conductor for AIN ceramics 1992
 32 1-2 p. 298-
1 p.
 article
9 A look at optoelectronic integrated circuits 1992
 32 1-2 p. 292-
1 p.
 article
10 A model for moisture induced corrosion failures in microelectronic packages 1992
 32 1-2 p. 284-
1 p.
 article
11 A model of charge transport in thermal SiO2 implanted with Si 1992
 32 1-2 p. 301-
1 p.
 article
12 A model of 1/f noise in polysilicon resistors 1992
 32 1-2 p. 299-
1 p.
 article
13 Analyzing the mechanical strength of SMT attached solder joints 1992
 32 1-2 p. 285-
1 p.
 article
14 An approximation analysis for the availability of a parallel redundant system with general distributions Yanagi, Shigeru
 1992
 32 1-2 p. 143-157
15 p.
 article
15 An efficient algorithm to solve inter-programming problems arising in system-reliability design 1992
 32 1-2 p. 292-
1 p.
 article
16 A new intelligent one-chip microcomputer: the application-specific microcomputer 1992
 32 1-2 p. 295-296
2 p.
 article
17 A new recursive algorithm for the reliability evaluation of a distributed program Chen, Den-Jyi
 1992
 32 1-2 p. 25-33
9 p.
 article
18 An investigation of pnp polysilicon emitter transistors 1992
 32 1-2 p. 297-
1 p.
 article
19 A note on recursive estimator of the density function which is not necessarily continuous El-Fahham, M.M.
 1992
 32 1-2 p. 79-87
9 p.
 article
20 A novel Lossy and dispersive interconnect model for integrated circuit simulation 1992
 32 1-2 p. 296-
1 p.
 article
21 Application of DIN ISO 9000 through 9004 to the practice of nondestructive testing 1992
 32 1-2 p. 283-
1 p.
 article
22 A proportional hazards approach to correlate SiO2—breakdown voltage and time distributions 1992
 32 1-2 p. 288-
1 p.
 article
23 A review of the properties of aluminium alloy films used during silicon device fabrication 1992
 32 1-2 p. 300-
1 p.
 article
24 A simple expression for band gap narrowing (BGN) in heavily doped Si, Ge, GaAs and GexSi1−x strained layers 1992
 32 1-2 p. 297-
1 p.
 article
25 A simple model for life cycle cost vs maintainability function Govil, K.K.
 1992
 32 1-2 p. 269-270
2 p.
 article
26 A submicron electron-beam tester for VLSI circuits beyond the 4-Mb DRAM 1992
 32 1-2 p. 301-
1 p.
 article
27 A unified performance reliability analysis of a system with a cumulative down time constraint Nicola, Victor
 1992
 32 1-2 p. 49-65
17 p.
 article
28 Automated analysis of phased-mission reliability 1992
 32 1-2 p. 291-
1 p.
 article
29 Automated apparatus for long-term testing of electrical brushes 1992
 32 1-2 p. 285-286
2 p.
 article
30 Automatic soldering technology accommodates computer needs 1992
 32 1-2 p. 295-
1 p.
 article
31 A VLSI design for an efficient multiprocessor cache memory 1992
 32 1-2 p. 296-
1 p.
 article
32 A Weibull model to characterize lifetimes of aluminum alloy electrical wire connections 1992
 32 1-2 p. 290-
1 p.
 article
33 Bayes credibility estimation of an exponential parameter for random censoring and incomplete information 1992
 32 1-2 p. 286-287
2 p.
 article
34 Bayes estimates under asymmetric loss 1992
 32 1-2 p. 290-
1 p.
 article
35 Bayes predictive analysis of a fundamental software-reliability model 1992
 32 1-2 p. 289-
1 p.
 article
36 Benzocyclobutene interlayer dielectrics for thin film multichip modules 1992
 32 1-2 p. 298-299
2 p.
 article
37 Calculation of the Binomial survivor function 1992
 32 1-2 p. 287-
1 p.
 article
38 Calculation of the Poisson cumulative distribution function 1992
 32 1-2 p. 289-
1 p.
 article
39 Calendar of international conferences, symposia, lectures and meetings of interest 1992
 32 1-2 p. 277-280
4 p.
 article
40 Can a noninvasive reliability prediction of electronic boards be accurate? Rawicz, Andrew H.
 1992
 32 1-2 p. 223-232
10 p.
 article
41 Characterization of the Pearson family of distributions 1992
 32 1-2 p. 291-
1 p.
 article
42 Chip tantalum capacitors take center stage among SMDs 1992
 32 1-2 p. 296-
1 p.
 article
43 Chip technology now available for aluminum electro-lytic capacitors 1992
 32 1-2 p. 286-
1 p.
 article
44 Clustered defects in IC fabrication: impact on process control charts 1992
 32 1-2 p. 293-294
2 p.
 article
45 Combining analog simulation techniques optimizes designs 1992
 32 1-2 p. 293-
1 p.
 article
46 Comment on: an efficient non-recursive algorithm for computing the reliability of k-out-of-n systems 1992
 32 1-2 p. 291-
1 p.
 article
47 Communication and transportation network reliability using routing models 1992
 32 1-2 p. 288-
1 p.
 article
48 Comparison of Bayesian nonparametric estimates of the reliability with rival estimates Papadopoulos, Alex S.
 1992
 32 1-2 p. 233-240
8 p.
 article
49 Comparison of phosphorus, arsenic and boron implants into bulk silicon and SOS 1992
 32 1-2 p. 301-
1 p.
 article
50 Cost-benefit analysis of a 2-unit priority-standby system with patience-time for repair 1992
 32 1-2 p. 290-
1 p.
 article
51 Cost-benefit analysis of single server n-unit imperfect switch system with delayed repair Gopalan, M.N.
 1992
 32 1-2 p. 5-9
5 p.
 article
52 Design a digital synchronizer with a low metastable-failure rate 1992
 32 1-2 p. 296-
1 p.
 article
53 Design guidelines for polymer thick-film technology 1992
 32 1-2 p. 300-
1 p.
 article
54 Designs meet needs of high-speed, high-density systems 1992
 32 1-2 p. 293-
1 p.
 article
55 Detection of multiple input bridging and stuck-on faults in CMOS logic circuits using current monitoring 1992
 32 1-2 p. 287-
1 p.
 article
56 Diffusion of ion implanted phosphorus in silicon in inert ambient 1992
 32 1-2 p. 300-
1 p.
 article
57 Drain engineering of hot-carrier-resistant MOSFETs using concave silicon surfaces for deep submicron VLSI technology 1992
 32 1-2 p. 298-
1 p.
 article
58 Dynamic behaviour of SMT chip capacitors during solder reflow 1992
 32 1-2 p. 286-
1 p.
 article
59 Editorial Board 1992
 32 1-2 p. IFC-
1 p.
 article
60 Efficient modeling parameter extraction for dual Pearson approach to simulation of implanted impurity profiles in silicon 1992
 32 1-2 p. 297-298
2 p.
 article
61 Electrical inhomogeneity in alloyed AuGe-Ni contact formed on GaAs 1992
 32 1-2 p. 298-
1 p.
 article
62 Electronic system packaging: the search for manufacturing the optimum in a sea of constraints 1992
 32 1-2 p. 292-
1 p.
 article
63 Electro-optic sampling of high-speed devices and integrated circuits 1992
 32 1-2 p. 286-
1 p.
 article
64 Empirically based analysis of failures in software systems 1992
 32 1-2 p. 288-
1 p.
 article
65 Enhancement of flip-chip fatigue life by encapsulation 1992
 32 1-2 p. 284-
1 p.
 article
66 Error log analysis: statistical modeling and heuristic trend analysis 1992
 32 1-2 p. 287-
1 p.
 article
67 Evaluating fault trees (AND and OR gates only) with repeated events 1992
 32 1-2 p. 289-
1 p.
 article
68 Evaluation and design of an ultra-reliable distributed architecture for fault tolerance 1992
 32 1-2 p. 289-
1 p.
 article
69 Evaluation of fuzzy reliability of a non-series parallel network Chowdhury, Sumandra Ghosh
 1992
 32 1-2 p. 1-4
4 p.
 article
70 Event-tree analysis by fuzzy probability 1992
 32 1-2 p. 291-
1 p.
 article
71 Experimental evaluation of the fault tolerance of an atomic multicast system 1992
 32 1-2 p. 291-
1 p.
 article
72 Extended behavioral decomposition for estimating ultrahigh reliability 1992
 32 1-2 p. 283-
1 p.
 article
73 Extrapolation of high-voltage stress measurements to lowvoltage operation for thin silicon-oxide films 1992
 32 1-2 p. 299-
1 p.
 article
74 Fabrication of high density multichip modules 1992
 32 1-2 p. 293-
1 p.
 article
75 Fault-tolerant programs and their reliability 1992
 32 1-2 p. 288-289
2 p.
 article
76 Fault-trees for a voting circuit; synthesis and joint analysis Schneeweiss, Winfrid G.
 1992
 32 1-2 p. 35-47
13 p.
 article
77 Fitting maintenance cost vs maintainability data to a standard curve Govil, K.K.
 1992
 32 1-2 p. 267-268
2 p.
 article
78 Flexible picosecond probing of integrated circuits with chopped electron beams 1992
 32 1-2 p. 294-
1 p.
 article
79 1/f noise in ceramic superconductors and granular resistors 1992
 32 1-2 p. 299-
1 p.
 article
80 Focused ion beam technology 1992
 32 1-2 p. 300-
1 p.
 article
81 Formation of voids in silicone RTV dispersion under beam-leaded silicon integrated circuits 1992
 32 1-2 p. 284-285
2 p.
 article
82 Fundamentals of manipulator calibration G.W.A.D.,
 1992
 32 1-2 p. 275-276
2 p.
 article
83 Hierarchical Bayesian approach to reliability estimation under competing risk Badarinathi, Ravija
 1992
 32 1-2 p. 249-258
10 p.
 article
84 Hierarchical Bayesian reliability analysis using Erlang families of priors and hyperpriors Bhattacharya, Samir K.
 1992
 32 1-2 p. 241-247
7 p.
 article
85 High-speed GaAs/AIGaAs optoelectronic devices for computer applications 1992
 32 1-2 p. 296-
1 p.
 article
86 High temperature millisecond annealing of arsenic implanted silicon 1992
 32 1-2 p. 301-302
2 p.
 article
87 High thermal conductivity aluminum nitride ceramic substrates and packages 1992
 32 1-2 p. 294-
1 p.
 article
88 Hi-Q chip model ceramic capacitors handle high frequencies 1992
 32 1-2 p. 286-
1 p.
 article
89 Hybrid ICs find market, adopt new technology 1992
 32 1-2 p. 300-
1 p.
 article
90 IC tester industry gears up for large-memory DRAMs 1992
 32 1-2 p. 292-
1 p.
 article
91 Impact ionization in silicon: a review and update 1992
 32 1-2 p. 301-
1 p.
 article
92 Impact of network failures on the performance degradation of a class of cluster-based multiprocessors 1992
 32 1-2 p. 285-
1 p.
 article
93 Implementing fault-tolerance via modular redundancy with comparison 1992
 32 1-2 p. 287-288
2 p.
 article
94 In-line statistical process control and feedback for VLSI integrated circuit manufacturing 1992
 32 1-2 p. 294-295
2 p.
 article
95 Intermetallic formation on the fracture of Sn/Pb solder and Pd/Ag conductor interfaces 1992
 32 1-2 p. 284-
1 p.
 article
96 Introduction and certification of a quality assurance system 1992
 32 1-2 p. 291-
1 p.
 article
97 Investigation of arsenic-implanted silicon by optical reflectometry 1992
 32 1-2 p. 301-
1 p.
 article
98 Laptop PCs propel progress in half-pitch connectors 1992
 32 1-2 p. 285-
1 p.
 article
99 Large-scale GaAs ICs challenge bipolar ICs in speed, power, cost 1992
 32 1-2 p. 296-
1 p.
 article
100 Laser trimming of thick film metal resistors on aluminum nitride substrates 1992
 32 1-2 p. 299-
1 p.
 article
101 LED array modules by new technology microbump bonding method 1992
 32 1-2 p. 294-
1 p.
 article
102 Light simulation of molecular beam epitaxy 1992
 32 1-2 p. 301-
1 p.
 article
103 Makers expect ASICs to reverse computer slump 1992
 32 1-2 p. 292-
1 p.
 article
104 Mass production back-grinding/wafer-thinning technology for GaAs devices 1992
 32 1-2 p. 295-
1 p.
 article
105 Measurement of the standoff height between a flip-mounted IC chip and its substrate 1992
 32 1-2 p. 293-
1 p.
 article
106 Modelling of epitaxial growth rate of silicon by vapour phase epitaxy 1992
 32 1-2 p. 298-
1 p.
 article
107 Monte Carlo analysis of semiconductor devices: the DAMOCLES program 1992
 32 1-2 p. 284-
1 p.
 article
108 Multichip modules for advanced applications 1992
 32 1-2 p. 294-
1 p.
 article
109 Multilayer ceramic packaging alternatives 1992
 32 1-2 p. 295-
1 p.
 article
110 New development of thin plastic package with high terminal counts 1992
 32 1-2 p. 295-
1 p.
 article
111 Nonparametric confidence bounds, using censored data on the mean residual life 1992
 32 1-2 p. 287-
1 p.
 article
112 Ohmic contact electromigration Scorzoni, Andrea
 1992
 32 1-2 p. 167-174
8 p.
 article
113 On comparison of estimators in a generalized life model Dey, Dipak K.
 1992
 32 1-2 p. 207-221
15 p.
 article
114 On optimizing yield reliability and area overhead in large memory arrays Noore, A.
 1992
 32 1-2 p. 67-77
11 p.
 article
115 On the analysis of accelerated life-testing experiments 1992
 32 1-2 p. 291-
1 p.
 article
116 On the possibility of internal gettering in commercially available silicon wafers 1992
 32 1-2 p. 295-
1 p.
 article
117 On the robustness of LDD and nMOS transistors subjected to measurement of drain breakdown voltage 1992
 32 1-2 p. 286-
1 p.
 article
118 Optically controlled current-voltage characteristics of ion-implanted MESFETs 1992
 32 1-2 p. 301-
1 p.
 article
119 Optimal allocation and control problems for software-testing resources 1992
 32 1-2 p. 288-
1 p.
 article
120 Optimal design of k-out-of-n redundant systems Pham, Hoang
 1992
 32 1-2 p. 119-126
8 p.
 article
121 Optimal maintainability allocation using the geometric programming method Govil, K.K.
 1992
 32 1-2 p. 265-266
2 p.
 article
122 Optimum reliability investment in the electronics industry Sultan, Torky I.
 1992
 32 1-2 p. 159-166
8 p.
 article
123 Optimum software release policy with random life-cycle 1992
 32 1-2 p. 289-
1 p.
 article
124 Origin of gas impurities in sputtering plasmas during thin film deposition 1992
 32 1-2 p. 299-
1 p.
 article
125 Parallel Petri net path searching on a local area network—Object oriented Pascal implementation Anneberg, L.
 1992
 32 1-2 p. 199-206
8 p.
 article
126 Passive chip components follow high-density trends 1992
 32 1-2 p. 293-
1 p.
 article
127 Picosecond noninvasive optical detection of internal electrical signals in flip-chip-mounted silicon integrated circuits 1992
 32 1-2 p. 296-
1 p.
 article
128 Picosecond photoemission probing of integrated circuits: capabilities, limitations, and applications 1992
 32 1-2 p. 284-
1 p.
 article
129 Point defect generation and arsenic diffusion in silicon in inert ambient 1992
 32 1-2 p. 297-
1 p.
 article
130 Point defect populations in amorphous and crystalline silicon 1992
 32 1-2 p. 298-
1 p.
 article
131 Potential and problems of high-temperature electronics and CMOS integrated circuits (25–250°C)—an overview 1992
 32 1-2 p. 292-
1 p.
 article
132 Practical experimental designs applied to haloing (Measling) on Teflon circuit boards 1992
 32 1-2 p. 284-
1 p.
 article
133 Predicting and eliminating built-in test false alarms 1992
 32 1-2 p. 288-
1 p.
 article
134 Principles of wet chemical processing in ULSI microfabrication 1992
 32 1-2 p. 293-
1 p.
 article
135 Printed wiring board inner layer contamination study 1992
 32 1-2 p. 285-
1 p.
 article
136 Product audit: quality assurance of quality assurance 1992
 32 1-2 p. 283-
1 p.
 article
137 Publications, notices, calls for papers, Etc. 1992
 32 1-2 p. 281-
1 p.
 article
138 Redundancy optimization of k-out-of-n systems with common-cause failures 1992
 32 1-2 p. 290-
1 p.
 article
139 Redundant-system demonstrated-reliability approximation using piece-part failure rates 1992
 32 1-2 p. 285-
1 p.
 article
140 Reliability analysis of a human operator under different levels of stress Chung, Who Kee
 1992
 32 1-2 p. 127-131
5 p.
 article
141 Reliability analysis of two-unit warm standby system with partial failure mode and inspection time Pandey, D.K.
 1992
 32 1-2 p. 17-19
3 p.
 article
142 Reliability demonstration testing for software 1992
 32 1-2 p. 290-
1 p.
 article
143 Reliability of modified designs: a Bayes analysis of an accelerated test of electronic assemblies 1992
 32 1-2 p. 287-
1 p.
 article
144 Reliability optimization in generalized stochastic-flow networks 1992
 32 1-2 p. 287-
1 p.
 article
145 Resistor networks increasing overall mounting density 1992
 32 1-2 p. 299-
1 p.
 article
146 Rules and criteria for when to stop testing a piece of software Petrova, E.
 1992
 32 1-2 p. 101-117
17 p.
 article
147 Selecting, under type-II censoring, Weibull populations that are more reliable 1992
 32 1-2 p. 287-
1 p.
 article
148 Self-annealing in ion-implanted Si and GaAs 1992
 32 1-2 p. 301-
1 p.
 article
149 Silicon micromechanics: sensors and actuators on a chip 1992
 32 1-2 p. 292-
1 p.
 article
150 Simulated fault injection: a methodology to evaluate fault tolerant microprocessor architectures 1992
 32 1-2 p. 290-
1 p.
 article
151 Simulation and design of Lossy transmission lines in a thin-film multichip package 1992
 32 1-2 p. 300-
1 p.
 article
152 Simulation of electromigration behaviour in Al metallization of integrated circuits Scherge, M.
 1992
 32 1-2 p. 21-24
4 p.
 article
153 Solder joint reliability of fine pitch surface mount technology assemblies 1992
 32 1-2 p. 285-
1 p.
 article
154 Stochastic modelling of a two-stage transfer-line production system with end buffer and random demand Gopalan, M.N.
 1992
 32 1-2 p. 11-15
5 p.
 article
155 Submicron-gate-length GaAs MESFETs 1992
 32 1-2 p. 296-
1 p.
 article
156 Supply formats change with chip use trends 1992
 32 1-2 p. 292-293
2 p.
 article
157 Synchronization techniques for distributed systems: An overview Jeffrey Mee, W.
 1992
 32 1-2 p. 175-197
23 p.
 article
158 System availability monitoring 1992
 32 1-2 p. 288-
1 p.
 article
159 Technical trends in optical connector development 1992
 32 1-2 p. 296-
1 p.
 article
160 Technology prevents reflow soldering defects linked to miniaturization 1992
 32 1-2 p. 295-
1 p.
 article
161 Temperature cycling effects between Sn/Pb solder and thick film Pd/Ag conductor metallization 1992
 32 1-2 p. 299-
1 p.
 article
162 Test generation for VLSI chips with embedded memories 1992
 32 1-2 p. 294-
1 p.
 article
163 Testing printed board assemblies in SMD technology 1992
 32 1-2 p. 284-
1 p.
 article
164 Testing whether one distribution is more IFR than another Wei, Xianhua
 1992
 32 1-2 p. 271-273
3 p.
 article
165 Test planning as a basis for process control 1992
 32 1-2 p. 290-
1 p.
 article
166 The anisotropic model for simulation of a multilayer structure dry etching 1992
 32 1-2 p. 293-
1 p.
 article
167 The case for full convection reflow 1992
 32 1-2 p. 294-
1 p.
 article
168 The combined effects of strain and heavy doping on the indirect band gap of Si and GexSi1−x alloys 1992
 32 1-2 p. 297-
1 p.
 article
169 The development of ultra-high-frequency VLSI device test systems 1992
 32 1-2 p. 293-
1 p.
 article
170 The effectiveness of adding standby redundancy at system and component levels 1992
 32 1-2 p. 288-
1 p.
 article
171 The effect of statically and dynamically replicated components on system reliability 1992
 32 1-2 p. 291-292
2 p.
 article
172 The effects of localized hot-carrier-induced charge in VLSI switching circuits 1992
 32 1-2 p. 297-
1 p.
 article
173 The effects of variables sampling on component reliability 1992
 32 1-2 p. 290-
1 p.
 article
174 The mean time-to-failure of some special series-parallel arrays 1992
 32 1-2 p. 292-
1 p.
 article
175 The modeling of multi-layer structures and the impact of emitter-base coupling on the determination of base recombination parameters 1992
 32 1-2 p. 298-
1 p.
 article
176 Thermal breakdown in GaAs MES diodes 1992
 32 1-2 p. 286-
1 p.
 article
177 Thermal fatigue life of Pb-Sn alloy interconnections 1992
 32 1-2 p. 285-
1 p.
 article
178 The zero-truncated negative binomial distribution as a failure model from the Bayesian approach Kyriakoussis, A.
 1992
 32 1-2 p. 259-264
6 p.
 article
179 Thick film resistors for AIN ceramics 1992
 32 1-2 p. 300-
1 p.
 article
180 Ultra high reliable spacecraft computer system design considerations Rayapati, Venkatapathi Naidu
 1992
 32 1-2 p. 133-142
10 p.
 article
181 Ultra-thin dielectrics for semiconductor applications—growth and characteristics 1992
 32 1-2 p. 298-
1 p.
 article
182 Vacuum mechatronics and self-contained manufacturing for microelectronics processing 1992
 32 1-2 p. 294-
1 p.
 article
183 VXI packaging and power issues heat up 1992
 32 1-2 p. 294-
1 p.
 article
                             183 results found
 
 Koninklijke Bibliotheek - National Library of the Netherlands