nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
A CAD coupled laser beam test system for digital circuit failure analysis
|
|
|
1992 |
32 |
1-2 |
p. 300-301 2 p. |
artikel |
2 |
A case study of ethernet anomalies in a distributed computing environment
|
|
|
1992 |
32 |
1-2 |
p. 289- 1 p. |
artikel |
3 |
A census of tandem system availability between 1985 and 1990
|
|
|
1992 |
32 |
1-2 |
p. 283- 1 p. |
artikel |
4 |
A class of shrinkage estimators for the scale parameter of the exponential distribution
|
|
|
1992 |
32 |
1-2 |
p. 290- 1 p. |
artikel |
5 |
A confidence interval for the availability ratio for systems with weibull operating time and lognormal repair time
|
Masters, B.N. |
|
1992 |
32 |
1-2 |
p. 89-99 11 p. |
artikel |
6 |
A- consecutive-k-out-of-n: G system: the mirror image of a consecutive-k-out-of-n: F system
|
|
|
1992 |
32 |
1-2 |
p. 292- 1 p. |
artikel |
7 |
Ada's fundamental language structures build reliable systems
|
|
|
1992 |
32 |
1-2 |
p. 283- 1 p. |
artikel |
8 |
Ag-Pd thick film conductor for AIN ceramics
|
|
|
1992 |
32 |
1-2 |
p. 298- 1 p. |
artikel |
9 |
A look at optoelectronic integrated circuits
|
|
|
1992 |
32 |
1-2 |
p. 292- 1 p. |
artikel |
10 |
A model for moisture induced corrosion failures in microelectronic packages
|
|
|
1992 |
32 |
1-2 |
p. 284- 1 p. |
artikel |
11 |
A model of charge transport in thermal SiO2 implanted with Si
|
|
|
1992 |
32 |
1-2 |
p. 301- 1 p. |
artikel |
12 |
A model of 1/f noise in polysilicon resistors
|
|
|
1992 |
32 |
1-2 |
p. 299- 1 p. |
artikel |
13 |
Analyzing the mechanical strength of SMT attached solder joints
|
|
|
1992 |
32 |
1-2 |
p. 285- 1 p. |
artikel |
14 |
An approximation analysis for the availability of a parallel redundant system with general distributions
|
Yanagi, Shigeru |
|
1992 |
32 |
1-2 |
p. 143-157 15 p. |
artikel |
15 |
An efficient algorithm to solve inter-programming problems arising in system-reliability design
|
|
|
1992 |
32 |
1-2 |
p. 292- 1 p. |
artikel |
16 |
A new intelligent one-chip microcomputer: the application-specific microcomputer
|
|
|
1992 |
32 |
1-2 |
p. 295-296 2 p. |
artikel |
17 |
A new recursive algorithm for the reliability evaluation of a distributed program
|
Chen, Den-Jyi |
|
1992 |
32 |
1-2 |
p. 25-33 9 p. |
artikel |
18 |
An investigation of pnp polysilicon emitter transistors
|
|
|
1992 |
32 |
1-2 |
p. 297- 1 p. |
artikel |
19 |
A note on recursive estimator of the density function which is not necessarily continuous
|
El-Fahham, M.M. |
|
1992 |
32 |
1-2 |
p. 79-87 9 p. |
artikel |
20 |
A novel Lossy and dispersive interconnect model for integrated circuit simulation
|
|
|
1992 |
32 |
1-2 |
p. 296- 1 p. |
artikel |
21 |
Application of DIN ISO 9000 through 9004 to the practice of nondestructive testing
|
|
|
1992 |
32 |
1-2 |
p. 283- 1 p. |
artikel |
22 |
A proportional hazards approach to correlate SiO2—breakdown voltage and time distributions
|
|
|
1992 |
32 |
1-2 |
p. 288- 1 p. |
artikel |
23 |
A review of the properties of aluminium alloy films used during silicon device fabrication
|
|
|
1992 |
32 |
1-2 |
p. 300- 1 p. |
artikel |
24 |
A simple expression for band gap narrowing (BGN) in heavily doped Si, Ge, GaAs and GexSi1−x strained layers
|
|
|
1992 |
32 |
1-2 |
p. 297- 1 p. |
artikel |
25 |
A simple model for life cycle cost vs maintainability function
|
Govil, K.K. |
|
1992 |
32 |
1-2 |
p. 269-270 2 p. |
artikel |
26 |
A submicron electron-beam tester for VLSI circuits beyond the 4-Mb DRAM
|
|
|
1992 |
32 |
1-2 |
p. 301- 1 p. |
artikel |
27 |
A unified performance reliability analysis of a system with a cumulative down time constraint
|
Nicola, Victor |
|
1992 |
32 |
1-2 |
p. 49-65 17 p. |
artikel |
28 |
Automated analysis of phased-mission reliability
|
|
|
1992 |
32 |
1-2 |
p. 291- 1 p. |
artikel |
29 |
Automated apparatus for long-term testing of electrical brushes
|
|
|
1992 |
32 |
1-2 |
p. 285-286 2 p. |
artikel |
30 |
Automatic soldering technology accommodates computer needs
|
|
|
1992 |
32 |
1-2 |
p. 295- 1 p. |
artikel |
31 |
A VLSI design for an efficient multiprocessor cache memory
|
|
|
1992 |
32 |
1-2 |
p. 296- 1 p. |
artikel |
32 |
A Weibull model to characterize lifetimes of aluminum alloy electrical wire connections
|
|
|
1992 |
32 |
1-2 |
p. 290- 1 p. |
artikel |
33 |
Bayes credibility estimation of an exponential parameter for random censoring and incomplete information
|
|
|
1992 |
32 |
1-2 |
p. 286-287 2 p. |
artikel |
34 |
Bayes estimates under asymmetric loss
|
|
|
1992 |
32 |
1-2 |
p. 290- 1 p. |
artikel |
35 |
Bayes predictive analysis of a fundamental software-reliability model
|
|
|
1992 |
32 |
1-2 |
p. 289- 1 p. |
artikel |
36 |
Benzocyclobutene interlayer dielectrics for thin film multichip modules
|
|
|
1992 |
32 |
1-2 |
p. 298-299 2 p. |
artikel |
37 |
Calculation of the Binomial survivor function
|
|
|
1992 |
32 |
1-2 |
p. 287- 1 p. |
artikel |
38 |
Calculation of the Poisson cumulative distribution function
|
|
|
1992 |
32 |
1-2 |
p. 289- 1 p. |
artikel |
39 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
|
|
1992 |
32 |
1-2 |
p. 277-280 4 p. |
artikel |
40 |
Can a noninvasive reliability prediction of electronic boards be accurate?
|
Rawicz, Andrew H. |
|
1992 |
32 |
1-2 |
p. 223-232 10 p. |
artikel |
41 |
Characterization of the Pearson family of distributions
|
|
|
1992 |
32 |
1-2 |
p. 291- 1 p. |
artikel |
42 |
Chip tantalum capacitors take center stage among SMDs
|
|
|
1992 |
32 |
1-2 |
p. 296- 1 p. |
artikel |
43 |
Chip technology now available for aluminum electro-lytic capacitors
|
|
|
1992 |
32 |
1-2 |
p. 286- 1 p. |
artikel |
44 |
Clustered defects in IC fabrication: impact on process control charts
|
|
|
1992 |
32 |
1-2 |
p. 293-294 2 p. |
artikel |
45 |
Combining analog simulation techniques optimizes designs
|
|
|
1992 |
32 |
1-2 |
p. 293- 1 p. |
artikel |
46 |
Comment on: an efficient non-recursive algorithm for computing the reliability of k-out-of-n systems
|
|
|
1992 |
32 |
1-2 |
p. 291- 1 p. |
artikel |
47 |
Communication and transportation network reliability using routing models
|
|
|
1992 |
32 |
1-2 |
p. 288- 1 p. |
artikel |
48 |
Comparison of Bayesian nonparametric estimates of the reliability with rival estimates
|
Papadopoulos, Alex S. |
|
1992 |
32 |
1-2 |
p. 233-240 8 p. |
artikel |
49 |
Comparison of phosphorus, arsenic and boron implants into bulk silicon and SOS
|
|
|
1992 |
32 |
1-2 |
p. 301- 1 p. |
artikel |
50 |
Cost-benefit analysis of a 2-unit priority-standby system with patience-time for repair
|
|
|
1992 |
32 |
1-2 |
p. 290- 1 p. |
artikel |
51 |
Cost-benefit analysis of single server n-unit imperfect switch system with delayed repair
|
Gopalan, M.N. |
|
1992 |
32 |
1-2 |
p. 5-9 5 p. |
artikel |
52 |
Design a digital synchronizer with a low metastable-failure rate
|
|
|
1992 |
32 |
1-2 |
p. 296- 1 p. |
artikel |
53 |
Design guidelines for polymer thick-film technology
|
|
|
1992 |
32 |
1-2 |
p. 300- 1 p. |
artikel |
54 |
Designs meet needs of high-speed, high-density systems
|
|
|
1992 |
32 |
1-2 |
p. 293- 1 p. |
artikel |
55 |
Detection of multiple input bridging and stuck-on faults in CMOS logic circuits using current monitoring
|
|
|
1992 |
32 |
1-2 |
p. 287- 1 p. |
artikel |
56 |
Diffusion of ion implanted phosphorus in silicon in inert ambient
|
|
|
1992 |
32 |
1-2 |
p. 300- 1 p. |
artikel |
57 |
Drain engineering of hot-carrier-resistant MOSFETs using concave silicon surfaces for deep submicron VLSI technology
|
|
|
1992 |
32 |
1-2 |
p. 298- 1 p. |
artikel |
58 |
Dynamic behaviour of SMT chip capacitors during solder reflow
|
|
|
1992 |
32 |
1-2 |
p. 286- 1 p. |
artikel |
59 |
Editorial Board
|
|
|
1992 |
32 |
1-2 |
p. IFC- 1 p. |
artikel |
60 |
Efficient modeling parameter extraction for dual Pearson approach to simulation of implanted impurity profiles in silicon
|
|
|
1992 |
32 |
1-2 |
p. 297-298 2 p. |
artikel |
61 |
Electrical inhomogeneity in alloyed AuGe-Ni contact formed on GaAs
|
|
|
1992 |
32 |
1-2 |
p. 298- 1 p. |
artikel |
62 |
Electronic system packaging: the search for manufacturing the optimum in a sea of constraints
|
|
|
1992 |
32 |
1-2 |
p. 292- 1 p. |
artikel |
63 |
Electro-optic sampling of high-speed devices and integrated circuits
|
|
|
1992 |
32 |
1-2 |
p. 286- 1 p. |
artikel |
64 |
Empirically based analysis of failures in software systems
|
|
|
1992 |
32 |
1-2 |
p. 288- 1 p. |
artikel |
65 |
Enhancement of flip-chip fatigue life by encapsulation
|
|
|
1992 |
32 |
1-2 |
p. 284- 1 p. |
artikel |
66 |
Error log analysis: statistical modeling and heuristic trend analysis
|
|
|
1992 |
32 |
1-2 |
p. 287- 1 p. |
artikel |
67 |
Evaluating fault trees (AND and OR gates only) with repeated events
|
|
|
1992 |
32 |
1-2 |
p. 289- 1 p. |
artikel |
68 |
Evaluation and design of an ultra-reliable distributed architecture for fault tolerance
|
|
|
1992 |
32 |
1-2 |
p. 289- 1 p. |
artikel |
69 |
Evaluation of fuzzy reliability of a non-series parallel network
|
Chowdhury, Sumandra Ghosh |
|
1992 |
32 |
1-2 |
p. 1-4 4 p. |
artikel |
70 |
Event-tree analysis by fuzzy probability
|
|
|
1992 |
32 |
1-2 |
p. 291- 1 p. |
artikel |
71 |
Experimental evaluation of the fault tolerance of an atomic multicast system
|
|
|
1992 |
32 |
1-2 |
p. 291- 1 p. |
artikel |
72 |
Extended behavioral decomposition for estimating ultrahigh reliability
|
|
|
1992 |
32 |
1-2 |
p. 283- 1 p. |
artikel |
73 |
Extrapolation of high-voltage stress measurements to lowvoltage operation for thin silicon-oxide films
|
|
|
1992 |
32 |
1-2 |
p. 299- 1 p. |
artikel |
74 |
Fabrication of high density multichip modules
|
|
|
1992 |
32 |
1-2 |
p. 293- 1 p. |
artikel |
75 |
Fault-tolerant programs and their reliability
|
|
|
1992 |
32 |
1-2 |
p. 288-289 2 p. |
artikel |
76 |
Fault-trees for a voting circuit; synthesis and joint analysis
|
Schneeweiss, Winfrid G. |
|
1992 |
32 |
1-2 |
p. 35-47 13 p. |
artikel |
77 |
Fitting maintenance cost vs maintainability data to a standard curve
|
Govil, K.K. |
|
1992 |
32 |
1-2 |
p. 267-268 2 p. |
artikel |
78 |
Flexible picosecond probing of integrated circuits with chopped electron beams
|
|
|
1992 |
32 |
1-2 |
p. 294- 1 p. |
artikel |
79 |
1/f noise in ceramic superconductors and granular resistors
|
|
|
1992 |
32 |
1-2 |
p. 299- 1 p. |
artikel |
80 |
Focused ion beam technology
|
|
|
1992 |
32 |
1-2 |
p. 300- 1 p. |
artikel |
81 |
Formation of voids in silicone RTV dispersion under beam-leaded silicon integrated circuits
|
|
|
1992 |
32 |
1-2 |
p. 284-285 2 p. |
artikel |
82 |
Fundamentals of manipulator calibration
|
G.W.A.D., |
|
1992 |
32 |
1-2 |
p. 275-276 2 p. |
artikel |
83 |
Hierarchical Bayesian approach to reliability estimation under competing risk
|
Badarinathi, Ravija |
|
1992 |
32 |
1-2 |
p. 249-258 10 p. |
artikel |
84 |
Hierarchical Bayesian reliability analysis using Erlang families of priors and hyperpriors
|
Bhattacharya, Samir K. |
|
1992 |
32 |
1-2 |
p. 241-247 7 p. |
artikel |
85 |
High-speed GaAs/AIGaAs optoelectronic devices for computer applications
|
|
|
1992 |
32 |
1-2 |
p. 296- 1 p. |
artikel |
86 |
High temperature millisecond annealing of arsenic implanted silicon
|
|
|
1992 |
32 |
1-2 |
p. 301-302 2 p. |
artikel |
87 |
High thermal conductivity aluminum nitride ceramic substrates and packages
|
|
|
1992 |
32 |
1-2 |
p. 294- 1 p. |
artikel |
88 |
Hi-Q chip model ceramic capacitors handle high frequencies
|
|
|
1992 |
32 |
1-2 |
p. 286- 1 p. |
artikel |
89 |
Hybrid ICs find market, adopt new technology
|
|
|
1992 |
32 |
1-2 |
p. 300- 1 p. |
artikel |
90 |
IC tester industry gears up for large-memory DRAMs
|
|
|
1992 |
32 |
1-2 |
p. 292- 1 p. |
artikel |
91 |
Impact ionization in silicon: a review and update
|
|
|
1992 |
32 |
1-2 |
p. 301- 1 p. |
artikel |
92 |
Impact of network failures on the performance degradation of a class of cluster-based multiprocessors
|
|
|
1992 |
32 |
1-2 |
p. 285- 1 p. |
artikel |
93 |
Implementing fault-tolerance via modular redundancy with comparison
|
|
|
1992 |
32 |
1-2 |
p. 287-288 2 p. |
artikel |
94 |
In-line statistical process control and feedback for VLSI integrated circuit manufacturing
|
|
|
1992 |
32 |
1-2 |
p. 294-295 2 p. |
artikel |
95 |
Intermetallic formation on the fracture of Sn/Pb solder and Pd/Ag conductor interfaces
|
|
|
1992 |
32 |
1-2 |
p. 284- 1 p. |
artikel |
96 |
Introduction and certification of a quality assurance system
|
|
|
1992 |
32 |
1-2 |
p. 291- 1 p. |
artikel |
97 |
Investigation of arsenic-implanted silicon by optical reflectometry
|
|
|
1992 |
32 |
1-2 |
p. 301- 1 p. |
artikel |
98 |
Laptop PCs propel progress in half-pitch connectors
|
|
|
1992 |
32 |
1-2 |
p. 285- 1 p. |
artikel |
99 |
Large-scale GaAs ICs challenge bipolar ICs in speed, power, cost
|
|
|
1992 |
32 |
1-2 |
p. 296- 1 p. |
artikel |
100 |
Laser trimming of thick film metal resistors on aluminum nitride substrates
|
|
|
1992 |
32 |
1-2 |
p. 299- 1 p. |
artikel |
101 |
LED array modules by new technology microbump bonding method
|
|
|
1992 |
32 |
1-2 |
p. 294- 1 p. |
artikel |
102 |
Light simulation of molecular beam epitaxy
|
|
|
1992 |
32 |
1-2 |
p. 301- 1 p. |
artikel |
103 |
Makers expect ASICs to reverse computer slump
|
|
|
1992 |
32 |
1-2 |
p. 292- 1 p. |
artikel |
104 |
Mass production back-grinding/wafer-thinning technology for GaAs devices
|
|
|
1992 |
32 |
1-2 |
p. 295- 1 p. |
artikel |
105 |
Measurement of the standoff height between a flip-mounted IC chip and its substrate
|
|
|
1992 |
32 |
1-2 |
p. 293- 1 p. |
artikel |
106 |
Modelling of epitaxial growth rate of silicon by vapour phase epitaxy
|
|
|
1992 |
32 |
1-2 |
p. 298- 1 p. |
artikel |
107 |
Monte Carlo analysis of semiconductor devices: the DAMOCLES program
|
|
|
1992 |
32 |
1-2 |
p. 284- 1 p. |
artikel |
108 |
Multichip modules for advanced applications
|
|
|
1992 |
32 |
1-2 |
p. 294- 1 p. |
artikel |
109 |
Multilayer ceramic packaging alternatives
|
|
|
1992 |
32 |
1-2 |
p. 295- 1 p. |
artikel |
110 |
New development of thin plastic package with high terminal counts
|
|
|
1992 |
32 |
1-2 |
p. 295- 1 p. |
artikel |
111 |
Nonparametric confidence bounds, using censored data on the mean residual life
|
|
|
1992 |
32 |
1-2 |
p. 287- 1 p. |
artikel |
112 |
Ohmic contact electromigration
|
Scorzoni, Andrea |
|
1992 |
32 |
1-2 |
p. 167-174 8 p. |
artikel |
113 |
On comparison of estimators in a generalized life model
|
Dey, Dipak K. |
|
1992 |
32 |
1-2 |
p. 207-221 15 p. |
artikel |
114 |
On optimizing yield reliability and area overhead in large memory arrays
|
Noore, A. |
|
1992 |
32 |
1-2 |
p. 67-77 11 p. |
artikel |
115 |
On the analysis of accelerated life-testing experiments
|
|
|
1992 |
32 |
1-2 |
p. 291- 1 p. |
artikel |
116 |
On the possibility of internal gettering in commercially available silicon wafers
|
|
|
1992 |
32 |
1-2 |
p. 295- 1 p. |
artikel |
117 |
On the robustness of LDD and nMOS transistors subjected to measurement of drain breakdown voltage
|
|
|
1992 |
32 |
1-2 |
p. 286- 1 p. |
artikel |
118 |
Optically controlled current-voltage characteristics of ion-implanted MESFETs
|
|
|
1992 |
32 |
1-2 |
p. 301- 1 p. |
artikel |
119 |
Optimal allocation and control problems for software-testing resources
|
|
|
1992 |
32 |
1-2 |
p. 288- 1 p. |
artikel |
120 |
Optimal design of k-out-of-n redundant systems
|
Pham, Hoang |
|
1992 |
32 |
1-2 |
p. 119-126 8 p. |
artikel |
121 |
Optimal maintainability allocation using the geometric programming method
|
Govil, K.K. |
|
1992 |
32 |
1-2 |
p. 265-266 2 p. |
artikel |
122 |
Optimum reliability investment in the electronics industry
|
Sultan, Torky I. |
|
1992 |
32 |
1-2 |
p. 159-166 8 p. |
artikel |
123 |
Optimum software release policy with random life-cycle
|
|
|
1992 |
32 |
1-2 |
p. 289- 1 p. |
artikel |
124 |
Origin of gas impurities in sputtering plasmas during thin film deposition
|
|
|
1992 |
32 |
1-2 |
p. 299- 1 p. |
artikel |
125 |
Parallel Petri net path searching on a local area network—Object oriented Pascal implementation
|
Anneberg, L. |
|
1992 |
32 |
1-2 |
p. 199-206 8 p. |
artikel |
126 |
Passive chip components follow high-density trends
|
|
|
1992 |
32 |
1-2 |
p. 293- 1 p. |
artikel |
127 |
Picosecond noninvasive optical detection of internal electrical signals in flip-chip-mounted silicon integrated circuits
|
|
|
1992 |
32 |
1-2 |
p. 296- 1 p. |
artikel |
128 |
Picosecond photoemission probing of integrated circuits: capabilities, limitations, and applications
|
|
|
1992 |
32 |
1-2 |
p. 284- 1 p. |
artikel |
129 |
Point defect generation and arsenic diffusion in silicon in inert ambient
|
|
|
1992 |
32 |
1-2 |
p. 297- 1 p. |
artikel |
130 |
Point defect populations in amorphous and crystalline silicon
|
|
|
1992 |
32 |
1-2 |
p. 298- 1 p. |
artikel |
131 |
Potential and problems of high-temperature electronics and CMOS integrated circuits (25–250°C)—an overview
|
|
|
1992 |
32 |
1-2 |
p. 292- 1 p. |
artikel |
132 |
Practical experimental designs applied to haloing (Measling) on Teflon circuit boards
|
|
|
1992 |
32 |
1-2 |
p. 284- 1 p. |
artikel |
133 |
Predicting and eliminating built-in test false alarms
|
|
|
1992 |
32 |
1-2 |
p. 288- 1 p. |
artikel |
134 |
Principles of wet chemical processing in ULSI microfabrication
|
|
|
1992 |
32 |
1-2 |
p. 293- 1 p. |
artikel |
135 |
Printed wiring board inner layer contamination study
|
|
|
1992 |
32 |
1-2 |
p. 285- 1 p. |
artikel |
136 |
Product audit: quality assurance of quality assurance
|
|
|
1992 |
32 |
1-2 |
p. 283- 1 p. |
artikel |
137 |
Publications, notices, calls for papers, Etc.
|
|
|
1992 |
32 |
1-2 |
p. 281- 1 p. |
artikel |
138 |
Redundancy optimization of k-out-of-n systems with common-cause failures
|
|
|
1992 |
32 |
1-2 |
p. 290- 1 p. |
artikel |
139 |
Redundant-system demonstrated-reliability approximation using piece-part failure rates
|
|
|
1992 |
32 |
1-2 |
p. 285- 1 p. |
artikel |
140 |
Reliability analysis of a human operator under different levels of stress
|
Chung, Who Kee |
|
1992 |
32 |
1-2 |
p. 127-131 5 p. |
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141 |
Reliability analysis of two-unit warm standby system with partial failure mode and inspection time
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Pandey, D.K. |
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1992 |
32 |
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p. 17-19 3 p. |
artikel |
142 |
Reliability demonstration testing for software
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1992 |
32 |
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p. 290- 1 p. |
artikel |
143 |
Reliability of modified designs: a Bayes analysis of an accelerated test of electronic assemblies
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1992 |
32 |
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p. 287- 1 p. |
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144 |
Reliability optimization in generalized stochastic-flow networks
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1992 |
32 |
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p. 287- 1 p. |
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145 |
Resistor networks increasing overall mounting density
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1992 |
32 |
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p. 299- 1 p. |
artikel |
146 |
Rules and criteria for when to stop testing a piece of software
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Petrova, E. |
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1992 |
32 |
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p. 101-117 17 p. |
artikel |
147 |
Selecting, under type-II censoring, Weibull populations that are more reliable
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1992 |
32 |
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p. 287- 1 p. |
artikel |
148 |
Self-annealing in ion-implanted Si and GaAs
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1992 |
32 |
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p. 301- 1 p. |
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149 |
Silicon micromechanics: sensors and actuators on a chip
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1992 |
32 |
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p. 292- 1 p. |
artikel |
150 |
Simulated fault injection: a methodology to evaluate fault tolerant microprocessor architectures
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1992 |
32 |
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p. 290- 1 p. |
artikel |
151 |
Simulation and design of Lossy transmission lines in a thin-film multichip package
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1992 |
32 |
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p. 300- 1 p. |
artikel |
152 |
Simulation of electromigration behaviour in Al metallization of integrated circuits
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Scherge, M. |
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1992 |
32 |
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p. 21-24 4 p. |
artikel |
153 |
Solder joint reliability of fine pitch surface mount technology assemblies
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1992 |
32 |
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p. 285- 1 p. |
artikel |
154 |
Stochastic modelling of a two-stage transfer-line production system with end buffer and random demand
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Gopalan, M.N. |
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1992 |
32 |
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p. 11-15 5 p. |
artikel |
155 |
Submicron-gate-length GaAs MESFETs
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1992 |
32 |
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p. 296- 1 p. |
artikel |
156 |
Supply formats change with chip use trends
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1992 |
32 |
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p. 292-293 2 p. |
artikel |
157 |
Synchronization techniques for distributed systems: An overview
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Jeffrey Mee, W. |
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1992 |
32 |
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p. 175-197 23 p. |
artikel |
158 |
System availability monitoring
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1992 |
32 |
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p. 288- 1 p. |
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159 |
Technical trends in optical connector development
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1992 |
32 |
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p. 296- 1 p. |
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160 |
Technology prevents reflow soldering defects linked to miniaturization
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1992 |
32 |
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p. 295- 1 p. |
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161 |
Temperature cycling effects between Sn/Pb solder and thick film Pd/Ag conductor metallization
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1992 |
32 |
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p. 299- 1 p. |
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162 |
Test generation for VLSI chips with embedded memories
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1992 |
32 |
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p. 294- 1 p. |
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163 |
Testing printed board assemblies in SMD technology
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1992 |
32 |
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p. 284- 1 p. |
artikel |
164 |
Testing whether one distribution is more IFR than another
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Wei, Xianhua |
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1992 |
32 |
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p. 271-273 3 p. |
artikel |
165 |
Test planning as a basis for process control
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1992 |
32 |
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p. 290- 1 p. |
artikel |
166 |
The anisotropic model for simulation of a multilayer structure dry etching
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1992 |
32 |
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p. 293- 1 p. |
artikel |
167 |
The case for full convection reflow
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1992 |
32 |
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p. 294- 1 p. |
artikel |
168 |
The combined effects of strain and heavy doping on the indirect band gap of Si and GexSi1−x alloys
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1992 |
32 |
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p. 297- 1 p. |
artikel |
169 |
The development of ultra-high-frequency VLSI device test systems
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1992 |
32 |
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p. 293- 1 p. |
artikel |
170 |
The effectiveness of adding standby redundancy at system and component levels
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1992 |
32 |
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p. 288- 1 p. |
artikel |
171 |
The effect of statically and dynamically replicated components on system reliability
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1992 |
32 |
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p. 291-292 2 p. |
artikel |
172 |
The effects of localized hot-carrier-induced charge in VLSI switching circuits
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1992 |
32 |
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p. 297- 1 p. |
artikel |
173 |
The effects of variables sampling on component reliability
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1992 |
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p. 290- 1 p. |
artikel |
174 |
The mean time-to-failure of some special series-parallel arrays
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1992 |
32 |
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p. 292- 1 p. |
artikel |
175 |
The modeling of multi-layer structures and the impact of emitter-base coupling on the determination of base recombination parameters
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1992 |
32 |
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p. 298- 1 p. |
artikel |
176 |
Thermal breakdown in GaAs MES diodes
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1992 |
32 |
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p. 286- 1 p. |
artikel |
177 |
Thermal fatigue life of Pb-Sn alloy interconnections
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1992 |
32 |
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p. 285- 1 p. |
artikel |
178 |
The zero-truncated negative binomial distribution as a failure model from the Bayesian approach
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Kyriakoussis, A. |
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1992 |
32 |
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p. 259-264 6 p. |
artikel |
179 |
Thick film resistors for AIN ceramics
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1992 |
32 |
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p. 300- 1 p. |
artikel |
180 |
Ultra high reliable spacecraft computer system design considerations
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Rayapati, Venkatapathi Naidu |
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1992 |
32 |
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p. 133-142 10 p. |
artikel |
181 |
Ultra-thin dielectrics for semiconductor applications—growth and characteristics
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1992 |
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p. 298- 1 p. |
artikel |
182 |
Vacuum mechatronics and self-contained manufacturing for microelectronics processing
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1992 |
32 |
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p. 294- 1 p. |
artikel |
183 |
VXI packaging and power issues heat up
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1992 |
32 |
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p. 294- 1 p. |
artikel |