| no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
| 1 |
A Bayesian methodology for assessing reliability during product development
|
|
|
1991
|
31 |
5 |
p. 1042-
1 p.
|
article
|
| 2 |
A comparison of copper and gold wire bonding on integrated circuit devices
|
|
|
1991
|
31 |
5 |
p. 1038-
1 p.
|
article
|
| 3 |
A consideration of reliability in economic distribution quantity for a warehouse
|
Ntuen, Celestine A.
|
|
1991
|
31 |
5 |
p. 913-917
5 p.
|
article
|
| 4 |
AC product defect level and yield loss
|
|
|
1991
|
31 |
5 |
p. 1039-
1 p.
|
article
|
| 5 |
A discussion of yield modeling with defect clustering, circuit repair and circuit redundancy
|
|
|
1991
|
31 |
5 |
p. 1037-
1 p.
|
article
|
| 6 |
A general age replacement model with minimal repair and general random repair cost
|
Sheu, Shey-Huei
|
|
1991
|
31 |
5 |
p. 1009-1017
9 p.
|
article
|
| 7 |
A high energy ion scattering/channeling and low energy ion scattering apparatus for surface analysis
|
|
|
1991
|
31 |
5 |
p. 1056-
1 p.
|
article
|
| 8 |
A linear-time algorithm to compute the reliability of planar cube-free networks
|
|
|
1991
|
31 |
5 |
p. 1046-
1 p.
|
article
|
| 9 |
A method for computing steady-state reliability indexes of a network with limited repair
|
Gagin, Alexander A.
|
|
1991
|
31 |
5 |
p. 985-999
15 p.
|
article
|
| 10 |
A model for mechanisms in plastic-encapsulated microelectronic devices during temperature-humidity tests—II
|
Matthäi, Günter
|
|
1991
|
31 |
5 |
p. 873-878
6 p.
|
article
|
| 11 |
A model for productivity measurement in the electronics industry
|
Sultan, Torky I.
|
|
1991
|
31 |
5 |
p. 907-912
6 p.
|
article
|
| 12 |
Analysis of logistic supportability for complex systems
|
|
|
1991
|
31 |
5 |
p. 1045-1046
2 p.
|
article
|
| 13 |
Analysis of reliability block diagrams with multiple blocks per component
|
|
|
1991
|
31 |
5 |
p. 1042-
1 p.
|
article
|
| 14 |
Analysis of Stochastic Petri Net model with non-exponential distributions using a generalized Markov Renewal Process
|
Jin, Qun
|
|
1991
|
31 |
5 |
p. 933-939
7 p.
|
article
|
| 15 |
Analysis of warranty cost based on reliability
|
|
|
1991
|
31 |
5 |
p. 1045-
1 p.
|
article
|
| 16 |
A new algorithm for minimal disjoint sum of products
|
Chen, Su
|
|
1991
|
31 |
5 |
p. 817-821
5 p.
|
article
|
| 17 |
A new approach to the analysis of reliability block diagrams
|
|
|
1991
|
31 |
5 |
p. 1043-
1 p.
|
article
|
| 18 |
A new high temperature multilayer capacitor with acrylate dielectrics
|
|
|
1991
|
31 |
5 |
p. 1038-
1 p.
|
article
|
| 19 |
A new power cycling technique for accelerated reliability evaluation of plated through holes and interconnects in PCBs
|
|
|
1991
|
31 |
5 |
p. 1039-
1 p.
|
article
|
| 20 |
A new technique for testing TAB bonded LSIs in the Gigahertz frequency range
|
|
|
1991
|
31 |
5 |
p. 1048-
1 p.
|
article
|
| 21 |
An integrated analytic approach for reliability improvement
|
|
|
1991
|
31 |
5 |
p. 1044-
1 p.
|
article
|
| 22 |
An iterative Bayes procedure for reliability assessment
|
|
|
1991
|
31 |
5 |
p. 1041-
1 p.
|
article
|
| 23 |
A 1-out-of-N: G system with common-cause failures and critical human errors
|
Singh, Jai
|
|
1991
|
31 |
5 |
p. 847-849
3 p.
|
article
|
| 24 |
Applications of magnetic levitation based micro-automation in semiconductor manufacturing
|
|
|
1991
|
31 |
5 |
p. 1048-
1 p.
|
article
|
| 25 |
Architectural factors influencing the reliability of fault-tolerant VLSI arrays
|
Bobbio, Andrea
|
|
1991
|
31 |
5 |
p. 963-968
6 p.
|
article
|
| 26 |
A redundant metal-polyimide thin film interconnection process for wafer scale dimensions
|
|
|
1991
|
31 |
5 |
p. 1046-
1 p.
|
article
|
| 27 |
A relational database for semiconductor device parametric data
|
|
|
1991
|
31 |
5 |
p. 1038-
1 p.
|
article
|
| 28 |
A review of thermal enhancement techniques for electronic systems
|
|
|
1991
|
31 |
5 |
p. 1050-
1 p.
|
article
|
| 29 |
A rule-based VLSI process flow validation system with macroscopic process simulation
|
|
|
1991
|
31 |
5 |
p. 1048-
1 p.
|
article
|
| 30 |
A single-server two-unit warm standby system with n failure modes, fault detection and inspection
|
Goel, L.R.
|
|
1991
|
31 |
5 |
p. 841-845
5 p.
|
article
|
| 31 |
Atomic layer growth of GaAs by molecular beam epitaxy using desorption of excess Ga atoms
|
|
|
1991
|
31 |
5 |
p. 1055-
1 p.
|
article
|
| 32 |
A two-unit cold standby system with three modes and correlated failures and repairs
|
Goel, L.R.
|
|
1991
|
31 |
5 |
p. 835-840
6 p.
|
article
|
| 33 |
Automated reliability life data analysis of missiles in storage and flight
|
|
|
1991
|
31 |
5 |
p. 1044-
1 p.
|
article
|
| 34 |
Automated visual inspection of bare printed circuit boards
|
|
|
1991
|
31 |
5 |
p. 1040-
1 p.
|
article
|
| 35 |
Automatic testing of metallized ceramic-polyimide (MCP), substrates
|
|
|
1991
|
31 |
5 |
p. 1041-
1 p.
|
article
|
| 36 |
Availability formulae for standby systems of similar units that are preventively maintained
|
|
|
1991
|
31 |
5 |
p. 1046-
1 p.
|
article
|
| 37 |
Behaviour analysis of a urea decomposition system in the fertilizer industry under general repair policy
|
Kumar, Dinesh
|
|
1991
|
31 |
5 |
p. 851-854
4 p.
|
article
|
| 38 |
4959507 Bonded ceramic metal composite substrate, circuit board constructed therewith and methods for production thereof
|
Tanaka, Tadashi
|
|
1991
|
31 |
5 |
p. 1058-
1 p.
|
article
|
| 39 |
Boolean functions with engineering applications and computer programs
|
G.W.A.D.,
|
|
1991
|
31 |
5 |
p. 1031-
1 p.
|
article
|
| 40 |
4956604 Broad band contactor assembly for testing integrated circuit devices
|
Cedrone, Nicholas
|
|
1991
|
31 |
5 |
p. 1058-
1 p.
|
article
|
| 41 |
Characterization of electromigration parameters in VLSI metallizations by 1 tf noise measurements
|
|
|
1991
|
31 |
5 |
p. 1051-
1 p.
|
article
|
| 42 |
Charges and defects in SiO2 films deposited by plasma-enhanced chemical vapor deposition at low temperatures
|
|
|
1991
|
31 |
5 |
p. 1054-
1 p.
|
article
|
| 43 |
4961053 Circuit arrangement for testing integrated circuit components
|
Krug, Heinz
|
|
1991
|
31 |
5 |
p. 1059-
1 p.
|
article
|
| 44 |
Comment on: reliability of modified designs—a Bayes analysis of an accelerated test of electronic assemblies
|
|
|
1991
|
31 |
5 |
p. 1047-
1 p.
|
article
|
| 45 |
Computation of transients in Lossy VLSI packaging interconnections
|
|
|
1991
|
31 |
5 |
p. 1049-
1 p.
|
article
|
| 46 |
Computer networks and systems: queueing theory and performance evaluation
|
Popentiu, Florin
|
|
1991
|
31 |
5 |
p. 1029-
1 p.
|
article
|
| 47 |
Correlation between electrical resistance and microstructure in gold wirebonds on aluminum films
|
|
|
1991
|
31 |
5 |
p. 1049-
1 p.
|
article
|
| 48 |
Cost analysis of a multi-component parallel redundant complex system with overloading effect and waiting under critical human error
|
Gupta, P.P.
|
|
1991
|
31 |
5 |
p. 865-868
4 p.
|
article
|
| 49 |
Creep fatigue modeling for solder joint reliability predictions including the microstructural evolution of the solder
|
|
|
1991
|
31 |
5 |
p. 1039-
1 p.
|
article
|
| 50 |
Creep of thin metallic films
|
|
|
1991
|
31 |
5 |
p. 1054-
1 p.
|
article
|
| 51 |
Damage in silicon caused by magnetron ion etching and its recovery effect
|
|
|
1991
|
31 |
5 |
p. 1056-
1 p.
|
article
|
| 52 |
3D CMOS devices in recrystallized silicon
|
|
|
1991
|
31 |
5 |
p. 1039-
1 p.
|
article
|
| 53 |
Defect cluster analysis for wafer-scale integration
|
|
|
1991
|
31 |
5 |
p. 1046-
1 p.
|
article
|
| 54 |
Defects in high-dose oxygen implanted silicon: a TEM study
|
|
|
1991
|
31 |
5 |
p. 1056-
1 p.
|
article
|
| 55 |
Demonstrating reliability and reliability growth with environmental stress screening data
|
|
|
1991
|
31 |
5 |
p. 1044-
1 p.
|
article
|
| 56 |
Developing criteria for determining corrective action thresholds during reliability verification testing (RVT)
|
|
|
1991
|
31 |
5 |
p. 1042-
1 p.
|
article
|
| 57 |
Development of a methodology for evaluating computer integrated manufacturing (CIM) implementation performance
|
|
|
1991
|
31 |
5 |
p. 1051-
1 p.
|
article
|
| 58 |
Development of copper wire bonding application technology
|
|
|
1991
|
31 |
5 |
p. 1049-
1 p.
|
article
|
| 59 |
4963824 Diagnostics of a board containing a plurality of hybrid electronic components
|
Hsieh, EdwardP
|
|
1991
|
31 |
5 |
p. 1060-
1 p.
|
article
|
| 60 |
Dry etching of III–V semiconductors: influence of substrate temperature on the anisotropy and induced damage
|
|
|
1991
|
31 |
5 |
p. 1055-
1 p.
|
article
|
| 61 |
Dry processing in microelectronics: towards low pressure plasma technology
|
|
|
1991
|
31 |
5 |
p. 1055-
1 p.
|
article
|
| 62 |
Dynamic models for statistical inference from accelerated life tests
|
|
|
1991
|
31 |
5 |
p. 1042-
1 p.
|
article
|
| 63 |
Effects of polymer/metal interaction in thin-film multichip module applications
|
|
|
1991
|
31 |
5 |
p. 1040-
1 p.
|
article
|
| 64 |
Electron-polariton interactions in submicron semiconductor structures
|
|
|
1991
|
31 |
5 |
p. 1052-
1 p.
|
article
|
| 65 |
Enhanced reliability in Si MOSFETs with channel lengths under 0.2 micron
|
|
|
1991
|
31 |
5 |
p. 1052-
1 p.
|
article
|
| 66 |
Equilibrium distributions of finite-state Markov processes
|
|
|
1991
|
31 |
5 |
p. 1046-
1 p.
|
article
|
| 67 |
ESCA and SEXAFS investigations of insulating materials for ULSI microelectronics
|
|
|
1991
|
31 |
5 |
p. 1053-
1 p.
|
article
|
| 68 |
4961812 Etch-back apparatus for integrated circuit failure analysis
|
Baerg, William
|
|
1991
|
31 |
5 |
p. 1059-1060
2 p.
|
article
|
| 69 |
Exact reliability formula for consecutive-k-out-of-n:F systems with homogeneous Markov dependence
|
|
|
1991
|
31 |
5 |
p. 1046-
1 p.
|
article
|
| 70 |
Fast fault-tree evaluation for many sets of input data
|
|
|
1991
|
31 |
5 |
p. 1043-
1 p.
|
article
|
| 71 |
Fault trees and sequence dependencies
|
|
|
1991
|
31 |
5 |
p. 1045-
1 p.
|
article
|
| 72 |
Field failures of electronic systems
|
|
|
1991
|
31 |
5 |
p. 1045-
1 p.
|
article
|
| 73 |
Field-induced instabilities in polyimide passivated lateral p-n-p transistors
|
|
|
1991
|
31 |
5 |
p. 1040-1041
2 p.
|
article
|
| 74 |
Flip-chip soldering to bare copper circuits
|
|
|
1991
|
31 |
5 |
p. 1048-
1 p.
|
article
|
| 75 |
Fuzzy measure of complex system outages
|
Ramachandran, V.
|
|
1991
|
31 |
5 |
p. 885-887
3 p.
|
article
|
| 76 |
Growth and properties of GaSb, Ga 1−x In x Sb and Ga 1−x Al x Sb epilayers by MOCVD
|
|
|
1991
|
31 |
5 |
p. 1053-
1 p.
|
article
|
| 77 |
Healing of voids in the aluminum metallization of integrated circuit chips
|
|
|
1991
|
31 |
5 |
p. 1040-
1 p.
|
article
|
| 78 |
High performance screen printable silicone as selective hybrid IC encapsulant
|
|
|
1991
|
31 |
5 |
p. 1054-
1 p.
|
article
|
| 79 |
Hybrid ICs and SMT: competing or compatible technologies?
|
|
|
1991
|
31 |
5 |
p. 1054-
1 p.
|
article
|
| 80 |
Hybrid IC technologies promote miniature equipment design
|
|
|
1991
|
31 |
5 |
p. 1054-
1 p.
|
article
|
| 81 |
Hybrid technology creates ICs with dual strength
|
|
|
1991
|
31 |
5 |
p. 1054-
1 p.
|
article
|
| 82 |
Implementation of tungsten metallization in multilevel interconnection technologies
|
|
|
1991
|
31 |
5 |
p. 1049-
1 p.
|
article
|
| 83 |
Improved and new surface analysis and depth profiling methods for the analysis of semiconductor technology problems
|
|
|
1991
|
31 |
5 |
p. 1050-1051
2 p.
|
article
|
| 84 |
Improving “MIL-HDBK-217 Type” models for mechanical reliability prediction
|
|
|
1991
|
31 |
5 |
p. 1042-
1 p.
|
article
|
| 85 |
Improving reliability and maintainability programs with configuration management—the next revolution
|
|
|
1991
|
31 |
5 |
p. 1044-1045
2 p.
|
article
|
| 86 |
India's high-tec microelectronics revolution
|
|
|
1991
|
31 |
5 |
p. 1047-
1 p.
|
article
|
| 87 |
Influence of the surface electron processes on the kinetics of silicon etching by fluorine atoms
|
|
|
1991
|
31 |
5 |
p. 1053-
1 p.
|
article
|
| 88 |
Investigations of failure mechanisms of TAB-bonded chips during thermal ageing
|
|
|
1991
|
31 |
5 |
p. 1040-
1 p.
|
article
|
| 89 |
Joint project produces anti-static film for electron beam lithography
|
|
|
1991
|
31 |
5 |
p. 1055-
1 p.
|
article
|
| 90 |
Large scale multilayer glass-ceramic substrate for supercomputer
|
|
|
1991
|
31 |
5 |
p. 1049-
1 p.
|
article
|
| 91 |
Loop wiring cuts costs, enhances reliability
|
|
|
1991
|
31 |
5 |
p. 1048-
1 p.
|
article
|
| 92 |
Low pressure chemical vapour deposition of silicon and germanium on silicon using contamination-minimized processing
|
|
|
1991
|
31 |
5 |
p. 1052-
1 p.
|
article
|
| 93 |
Low temperature co-fired glass ceramic high density interconnect substrate with improved thermal management
|
|
|
1991
|
31 |
5 |
p. 1054-
1 p.
|
article
|
| 94 |
Manufactures consider fixtureless in-circuit testers
|
|
|
1991
|
31 |
5 |
p. 1040-
1 p.
|
article
|
| 95 |
Manufacturing system control with Petri nets in cellular manufacturing systems
|
|
|
1991
|
31 |
5 |
p. 1046-
1 p.
|
article
|
| 96 |
Measurement assurance in reliability assessment
|
|
|
1991
|
31 |
5 |
p. 1043-
1 p.
|
article
|
| 97 |
Mechanical engineering issues and electronic equipment reliability: incurred costs without compensating benefits
|
|
|
1991
|
31 |
5 |
p. 1037-
1 p.
|
article
|
| 98 |
Mechanisms of defect formation and growth during thermal ramping and annealing in oxygen implanted silicon-on-insulator material
|
|
|
1991
|
31 |
5 |
p. 1055-1056
2 p.
|
article
|
| 99 |
4960489 Method for self-aligned manufacture of contacts between interconnects contained in wiring levels arranged above one another in an integrated circuit
|
Roeska, Guenther
|
|
1991
|
31 |
5 |
p. 1058-
1 p.
|
article
|
| 100 |
4962461 Method for the reproducable formation of material layers and/or the treatment of semiconductor materials layers
|
Meyer, Meinhard
|
|
1991
|
31 |
5 |
p. 1060-
1 p.
|
article
|
| 101 |
4955131 Method of building a variety of complex high performance IC devices
|
Chall, LouisEdmond
|
|
1991
|
31 |
5 |
p. 1057-
1 p.
|
article
|
| 102 |
4963825 Method of screening eprom-related devices for endurance failure
|
Mielke, NealR
|
|
1991
|
31 |
5 |
p. 1060-1061
2 p.
|
article
|
| 103 |
Minimax review schedules for degradable systems under a specified operational reliability
|
Ntuen, Celestine A.
|
|
1991
|
31 |
5 |
p. 927-931
5 p.
|
article
|
| 104 |
Modeling the effect of reliability on performance
|
|
|
1991
|
31 |
5 |
p. 1043-
1 p.
|
article
|
| 105 |
Modelling the effects of neutron radiation on the Gummel-Poon parameters for bipolar NPN transistors
|
Hajghassem, H.S.
|
|
1991
|
31 |
5 |
p. 969-984
16 p.
|
article
|
| 106 |
MTBCF calculation for system with unequal periodic maintenance times
|
|
|
1991
|
31 |
5 |
p. 1041-
1 p.
|
article
|
| 107 |
MTBF Warranty/Guarantee for multiple user avionics
|
|
|
1991
|
31 |
5 |
p. 1045-
1 p.
|
article
|
| 108 |
Multi-quantum well modulator arrays fabricated by gas source MBE
|
|
|
1991
|
31 |
5 |
p. 1055-
1 p.
|
article
|
| 109 |
New method of water cleaning for circuit substrate
|
|
|
1991
|
31 |
5 |
p. 1050-
1 p.
|
article
|
| 110 |
New polymeric multilayer substrates and packaging
|
|
|
1991
|
31 |
5 |
p. 1048-
1 p.
|
article
|
| 111 |
One-step surface implantation and reaction by laser irradiation of multistructures deposited on Si and Ge samples
|
|
|
1991
|
31 |
5 |
p. 1055-
1 p.
|
article
|
| 112 |
On the increase of system reliability by parallel redundancy
|
|
|
1991
|
31 |
5 |
p. 1046-
1 p.
|
article
|
| 113 |
Optical and electrical investigation of ion bombarded GaAs
|
|
|
1991
|
31 |
5 |
p. 1055-
1 p.
|
article
|
| 114 |
Optical components—the new challenge in packaging
|
|
|
1991
|
31 |
5 |
p. 1049-
1 p.
|
article
|
| 115 |
Optical generation and radiative recombination parameters for energy models of carrier transport in direct gap semiconductors
|
|
|
1991
|
31 |
5 |
p. 1053-
1 p.
|
article
|
| 116 |
Optimal design of systems subject to two kinds of failure
|
|
|
1991
|
31 |
5 |
p. 1044-
1 p.
|
article
|
| 117 |
Optimal learning time for human operators
|
Cǎtuneanu, V.M.
|
|
1991
|
31 |
5 |
p. 889-893
5 p.
|
article
|
| 118 |
Optimal strategies for scheduling checkpoints and preventive maintenance
|
|
|
1991
|
31 |
5 |
p. 1043-
1 p.
|
article
|
| 119 |
Optimization of software testing time with debugging improvement
|
Cǎtuneanu, V.M.
|
|
1991
|
31 |
5 |
p. 901-906
6 p.
|
article
|
| 120 |
Optimum simple step-stress accelerated life tests with censoring
|
|
|
1991
|
31 |
5 |
p. 1041-
1 p.
|
article
|
| 121 |
Oxide implantation for threshold voltage control
|
|
|
1991
|
31 |
5 |
p. 1056-
1 p.
|
article
|
| 122 |
PC chip sets reduce chip count
|
|
|
1991
|
31 |
5 |
p. 1051-
1 p.
|
article
|
| 123 |
Periodic replacement with minimal repair at failure and general random repair cost for a multi-unit system
|
Sheu, Shey-Huei
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1991
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31 |
5 |
p. 1019-1025
7 p.
|
article
|
| 124 |
Petri Nets in dynamic process planning
|
|
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1991
|
31 |
5 |
p. 1046-
1 p.
|
article
|
| 125 |
Practical models for determining standby redundancy levels
|
|
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1991
|
31 |
5 |
p. 1043-
1 p.
|
article
|
| 126 |
Practical reliability engineering (Third Edition)
|
G.W.A.D.,
|
|
1991
|
31 |
5 |
p. 1030-
1 p.
|
article
|
| 127 |
Preparation, structure, and fracture modes of Pb-Sn and Pb-In terminated flip-chips attached to gold capped microsockets
|
|
|
1991
|
31 |
5 |
p. 1050-
1 p.
|
article
|
| 128 |
4961052 Probing plate for wafer testing
|
Tada, Tetsuo
|
|
1991
|
31 |
5 |
p. 1059-
1 p.
|
article
|
| 129 |
Process design for a crystallization system in the urea fertilizer industry
|
Kumar, Dinesh
|
|
1991
|
31 |
5 |
p. 855-859
5 p.
|
article
|
| 130 |
Profit analysis of a two-unit redundant system with provision for rest and correlated failures and repairs
|
Goel, L.R.
|
|
1991
|
31 |
5 |
p. 827-833
7 p.
|
article
|
| 131 |
Proptotype packages in aluminum nitride for high performance electronic systems
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|
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1991
|
31 |
5 |
p. 1047-1048
2 p.
|
article
|
| 132 |
Publications, notices, calls for papers, etc.
|
|
|
1991
|
31 |
5 |
p. 1033-1036
4 p.
|
article
|
| 133 |
Quality monitoring of continuous flow processes
|
|
|
1991
|
31 |
5 |
p. 1051-
1 p.
|
article
|
| 134 |
Quantitative analysis of software quality during the “design and implementation” phase
|
Joshi, Suneel M.
|
|
1991
|
31 |
5 |
p. 879-884
6 p.
|
article
|
| 135 |
Radio network modeling using criticality and conditional probability theory
|
|
|
1991
|
31 |
5 |
p. 1045-
1 p.
|
article
|
| 136 |
Range of high energy phosphorus and medium energy boron ions implanted in polymers
|
|
|
1991
|
31 |
5 |
p. 1054-1055
2 p.
|
article
|
| 137 |
Relation between delamination and temperature cycling induced failures in plastic packaged devices
|
|
|
1991
|
31 |
5 |
p. 1040-
1 p.
|
article
|
| 138 |
Reliability analysis of a conveyor belt system, with only one server, subject to failures and idleness after repair
|
Tewari, P.C.
|
|
1991
|
31 |
5 |
p. 823-826
4 p.
|
article
|
| 139 |
Reliability analysis of communication networks by decomposition
|
Beichelt, F.
|
|
1991
|
31 |
5 |
p. 869-872
4 p.
|
article
|
| 140 |
Reliability analysis of redundant aircraft systems with possible latent failures
|
|
|
1991
|
31 |
5 |
p. 1041-
1 p.
|
article
|
| 141 |
Reliability analysis of warehouse containers under life test policies
|
Ntuen, Celestine A.
|
|
1991
|
31 |
5 |
p. 919-925
7 p.
|
article
|
| 142 |
Reliability demonstration test and OC curves for attribute data
|
|
|
1991
|
31 |
5 |
p. 1046-
1 p.
|
article
|
| 143 |
Reliability enhancement of submodule redundancy
|
|
|
1991
|
31 |
5 |
p. 1044-
1 p.
|
article
|
| 144 |
Reliability evaluation of a phased mission system with time varying redundancy and failure probability
|
Lee, Kang W.
|
|
1991
|
31 |
5 |
p. 955-961
7 p.
|
article
|
| 145 |
Reliability of compound semiconductor microwave field-effect devices: failure mechanisms and test methods
|
|
|
1991
|
31 |
5 |
p. 1039-
1 p.
|
article
|
| 146 |
Reliability of voting in fault-tolerant software systems for small output-spaces
|
|
|
1991
|
31 |
5 |
p. 1047-
1 p.
|
article
|
| 147 |
Reliability prediction model for gyroscopes
|
|
|
1991
|
31 |
5 |
p. 1043-
1 p.
|
article
|
| 148 |
Reliability prediction of electronic packages
|
|
|
1991
|
31 |
5 |
p. 1041-1042
2 p.
|
article
|
| 149 |
Revised theory of linearly-graded silicon junctions: an analytical approach
|
|
|
1991
|
31 |
5 |
p. 1052-
1 p.
|
article
|
| 150 |
Rie-induced damage in MOS structures
|
|
|
1991
|
31 |
5 |
p. 1053-
1 p.
|
article
|
| 151 |
Robust minimum-distance estimation using the 3-parameter Weibull distribution
|
|
|
1991
|
31 |
5 |
p. 1047-
1 p.
|
article
|
| 152 |
Selective CVD of germanium on silicon and its applications
|
|
|
1991
|
31 |
5 |
p. 1052-1053
2 p.
|
article
|
| 153 |
Self-aligned flip-chip assembly of photonic devices with electrical and optical connections
|
|
|
1991
|
31 |
5 |
p. 1049-
1 p.
|
article
|
| 154 |
Series queue with general bulk service, random breakdown and vacation
|
Nadarajan, R.
|
|
1991
|
31 |
5 |
p. 861-863
3 p.
|
article
|
| 155 |
Shortcomings in MIL-STD-1629A guidelines for criticality analysis
|
|
|
1991
|
31 |
5 |
p. 1044-
1 p.
|
article
|
| 156 |
Silicon metallization by synchrotron-radiation-induced W(CO)6 surface reaction
|
|
|
1991
|
31 |
5 |
p. 1056-
1 p.
|
article
|
| 157 |
Silicon wafer preparation for low-temperature selective epitaxial growth
|
|
|
1991
|
31 |
5 |
p. 1053-
1 p.
|
article
|
| 158 |
SIMOX devices and circuits
|
|
|
1991
|
31 |
5 |
p. 1051-
1 p.
|
article
|
| 159 |
Simulation of three-dimensional effects in VLSI devices
|
|
|
1991
|
31 |
5 |
p. 1051-
1 p.
|
article
|
| 160 |
Society of reliability engineers bulletin
|
|
|
1991
|
31 |
5 |
p. 1027-1028
2 p.
|
article
|
| 161 |
Software reliability release policy with testing effort
|
Cǎtuneanu, V.M.
|
|
1991
|
31 |
5 |
p. 895-899
5 p.
|
article
|
| 162 |
Statistical equipment modeling for VLSI manufacturing: an application for LPCVD
|
|
|
1991
|
31 |
5 |
p. 1047-
1 p.
|
article
|
| 163 |
Statistical precision and robustness of the AMSAA continuous reliability growth estimators
|
|
|
1991
|
31 |
5 |
p. 1042-
1 p.
|
article
|
| 164 |
Strength and reliability of ceramic modules soldered to flexible cables
|
|
|
1991
|
31 |
5 |
p. 1039-1040
2 p.
|
article
|
| 165 |
Structural, optical and electronical properties of mixed dielectric films
|
|
|
1991
|
31 |
5 |
p. 1038-
1 p.
|
article
|
| 166 |
Studies of some wide gap II–VI semiconductor based p-n junctions
|
|
|
1991
|
31 |
5 |
p. 1052-
1 p.
|
article
|
| 167 |
Study of avalanche multiplication in planar-terminated junctions
|
|
|
1991
|
31 |
5 |
p. 1052-
1 p.
|
article
|
| 168 |
Surface active buffered hydrogen fluoride having excellent wettability for ULSI processing
|
|
|
1991
|
31 |
5 |
p. 1048-
1 p.
|
article
|
| 169 |
TEM analysis of failed bits and improvement of data retention properties in megabit-drams
|
|
|
1991
|
31 |
5 |
p. 1041-
1 p.
|
article
|
| 170 |
4961050 Test fixture for microstrip assemblies
|
Harwood, WarrenK
|
|
1991
|
31 |
5 |
p. 1059-
1 p.
|
article
|
| 171 |
4954772 Test method of an electrostatic breakdown of a semiconductor device and an apparatus therefor
|
Funakoshi, Haru
|
|
1991
|
31 |
5 |
p. 1057-
1 p.
|
article
|
| 172 |
The association of component solderability testing with board level soldering performance
|
|
|
1991
|
31 |
5 |
p. 1039-
1 p.
|
article
|
| 173 |
The chemically deposited layers as a diffusion source in microelectronics
|
|
|
1991
|
31 |
5 |
p. 1052-
1 p.
|
article
|
| 174 |
The epitaxial growth on CaF2 and BaF2 single-crystal films on a sapphire substrate
|
|
|
1991
|
31 |
5 |
p. 1052-
1 p.
|
article
|
| 175 |
The impact of packaging on the reliability of flip-chip solder bonded devices
|
|
|
1991
|
31 |
5 |
p. 1050-
1 p.
|
article
|
| 176 |
Thermally induced IC package cracking
|
|
|
1991
|
31 |
5 |
p. 1038-
1 p.
|
article
|
| 177 |
The state-dependent queue: M/M/1/N with reneging and general balk functions
|
Abou-El-Ata, M.O.
|
|
1991
|
31 |
5 |
p. 1001-1007
7 p.
|
article
|
| 178 |
The use environments of electronic assemblies and their impact on surface mount solder attachment reliability
|
|
|
1991
|
31 |
5 |
p. 1047-
1 p.
|
article
|
| 179 |
The use of simulation in semiconductor technology development
|
|
|
1991
|
31 |
5 |
p. 1051-
1 p.
|
article
|
| 180 |
Total quality management: an approach and a case study
|
|
|
1991
|
31 |
5 |
p. 1037-
1 p.
|
article
|
| 181 |
Undersea lightguide cable reliability analyses
|
|
|
1991
|
31 |
5 |
p. 1042-
1 p.
|
article
|
| 182 |
Vibration and shock testing for computers
|
|
|
1991
|
31 |
5 |
p. 1043-
1 p.
|
article
|
| 183 |
4956602 Wafer scale testing of redundant integrated circuit dies
|
Parrish, WilliamJ
|
|
1991
|
31 |
5 |
p. 1057-1058
2 p.
|
article
|
| 184 |
Weak limits of random quasi-ranges and random quasi-half-ranges
|
Barakat, H.M.
|
|
1991
|
31 |
5 |
p. 941-953
13 p.
|
article
|
Journal description