| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A decomposition scheme for the analysis of fault trees and other combinatorial circuits
|
|
|
1990
|
30 |
5 |
p. 1011-
1 p.
|
artikel
|
| 2 |
A generalized fault simulator for combinational logic circuits
|
|
|
1990
|
30 |
5 |
p. 1010-
1 p.
|
artikel
|
| 3 |
A model for mechanisms in plastic encapsulated microelectronic devices during temperature-humidity tests—I
|
Matthaei, Guenter
|
|
1990
|
30 |
5 |
p. 835-838
4 p.
|
artikel
|
| 4 |
Analysis and evaluation of TAB bonds
|
|
|
1990
|
30 |
5 |
p. 1007-
1 p.
|
artikel
|
| 5 |
Analysis of faults of integrated circuits with the JENATECH-inspection microscope
|
|
|
1990
|
30 |
5 |
p. 1008-
1 p.
|
artikel
|
| 6 |
A new class of bathtub-shaped hazard rates and its application in a comparison of two test-statistics
|
|
|
1990
|
30 |
5 |
p. 1010-
1 p.
|
artikel
|
| 7 |
A new multi-layer ion implantation model for process simulation
|
|
|
1990
|
30 |
5 |
p. 1017-
1 p.
|
artikel
|
| 8 |
An improved silicon p-channel MESFET with a BF2 implanted thin channel and ErSi2 gate
|
|
|
1990
|
30 |
5 |
p. 1017-
1 p.
|
artikel
|
| 9 |
An interactive knowledge-based system for forecasting new product reliability
|
|
|
1990
|
30 |
5 |
p. 1009-
1 p.
|
artikel
|
| 10 |
4858208 Apparatus and method for testing semiconductor devices
|
Swapp, MavinC
|
|
1990
|
30 |
5 |
p. iii-
1 p.
|
artikel
|
| 11 |
4851097 Apparatus for repairing a pattern film
|
Hattori, Osamu
|
|
1990
|
30 |
5 |
p. i-
1 p.
|
artikel
|
| 12 |
4857838 Apparatus for testing electronic components, in particular IC's
|
Willberg, Hans-Heinrich
|
|
1990
|
30 |
5 |
p. iii-
1 p.
|
artikel
|
| 13 |
Applied electromagnetics in materials
|
G.W.A.D.,
|
|
1990
|
30 |
5 |
p. 994-
1 p.
|
artikel
|
| 14 |
A prolog based expert system for the allocation of quality assurance program resources
|
|
|
1990
|
30 |
5 |
p. 1009-
1 p.
|
artikel
|
| 15 |
A robust production control policy for VLSI wafer fabrication
|
|
|
1990
|
30 |
5 |
p. 1013-
1 p.
|
artikel
|
| 16 |
A SIMNET simulation model for estimating system reliability
|
|
|
1990
|
30 |
5 |
p. 1008-
1 p.
|
artikel
|
| 17 |
A two-unit standby power plant with imperfect switching
|
Gupta, P.P.
|
|
1990
|
30 |
5 |
p. 865-867
3 p.
|
artikel
|
| 18 |
Availability calculations with exhaustible spares
|
|
|
1990
|
30 |
5 |
p. 1011-
1 p.
|
artikel
|
| 19 |
Availability of CNC machines: multiple-input transfer-function modeling
|
|
|
1990
|
30 |
5 |
p. 1010-
1 p.
|
artikel
|
| 20 |
Avoiding electrolytic and strain-induced shorting mechanisms—a review
|
|
|
1990
|
30 |
5 |
p. 1005-
1 p.
|
artikel
|
| 21 |
Benefits of real-time, in situ particle monitoring in production medium current implantation
|
|
|
1990
|
30 |
5 |
p. 1016-
1 p.
|
artikel
|
| 22 |
Bivariate mean residual life
|
|
|
1990
|
30 |
5 |
p. 1008-1009
2 p.
|
artikel
|
| 23 |
Bounds for the probability of failure resulting from stress/strength interference
|
|
|
1990
|
30 |
5 |
p. 1009-
1 p.
|
artikel
|
| 24 |
Broad-beam ion source technology and applications
|
|
|
1990
|
30 |
5 |
p. 1016-
1 p.
|
artikel
|
| 25 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
|
|
1990
|
30 |
5 |
p. 995-997
3 p.
|
artikel
|
| 26 |
Carrier multiplication and avalanche breakdown in selfaligned bipolar transistors
|
|
|
1990
|
30 |
5 |
p. 1015-
1 p.
|
artikel
|
| 27 |
Carrier transport simulator for silicon based on carrier distribution function evolutions
|
|
|
1990
|
30 |
5 |
p. 1014-
1 p.
|
artikel
|
| 28 |
Case study: reliability of the INEL-site power system
|
|
|
1990
|
30 |
5 |
p. 1010-1011
2 p.
|
artikel
|
| 29 |
Classification of fault trees and algorithms of fault tree analysis
|
Chunning, Yan
|
|
1990
|
30 |
5 |
p. 891-895
5 p.
|
artikel
|
| 30 |
Comparison of some ratio-type estimators
|
Sisodia, B.V.S.
|
|
1990
|
30 |
5 |
p. 873-876
4 p.
|
artikel
|
| 31 |
Concurrent design
|
|
|
1990
|
30 |
5 |
p. 1006-
1 p.
|
artikel
|
| 32 |
Conference report Reliability and Maintainability Symposium (RAMS 1990)
|
Jacobs, Richard M.
|
|
1990
|
30 |
5 |
p. 987-991
5 p.
|
artikel
|
| 33 |
Cracking of solder connections on paper-base-phenolic printed wiring board
|
|
|
1990
|
30 |
5 |
p. 1007-1008
2 p.
|
artikel
|
| 34 |
Desorption characteristics of isopropanol (IPA) and moisture from IPA vapor dried silicon wafers
|
|
|
1990
|
30 |
5 |
p. 1013-
1 p.
|
artikel
|
| 35 |
Determination of local stress in PECVD nitride films
|
Gspan, G.
|
|
1990
|
30 |
5 |
p. 911-913
3 p.
|
artikel
|
| 36 |
Development of a new low-stress hyperred LED encapsulant
|
|
|
1990
|
30 |
5 |
p. 1012-
1 p.
|
artikel
|
| 37 |
DoD/industry studies related to CALS R&M
|
|
|
1990
|
30 |
5 |
p. 1006-
1 p.
|
artikel
|
| 38 |
Double implant low dose technique in analog IC fabrication
|
|
|
1990
|
30 |
5 |
p. 1017-
1 p.
|
artikel
|
| 39 |
Economically based acceptance sampling plans
|
|
|
1990
|
30 |
5 |
p. 1009-
1 p.
|
artikel
|
| 40 |
Edge passivation and related electrical stability in silicon power devices
|
|
|
1990
|
30 |
5 |
p. 1008-
1 p.
|
artikel
|
| 41 |
Energy-gap change in silicon n-type inversion layers at low temperature
|
|
|
1990
|
30 |
5 |
p. 1014-1015
2 p.
|
artikel
|
| 42 |
Enhanced electrical activation of Zn and Be implants in GaAs by the co-implantation of phosphorus
|
|
|
1990
|
30 |
5 |
p. 1017-
1 p.
|
artikel
|
| 43 |
Environmental and technological risks and hazards
|
Sherif, Yosef S
|
|
1990
|
30 |
5 |
p. 915-950
36 p.
|
artikel
|
| 44 |
Evaluation of system reliability with common-cause failures, by a pseudo-environments model
|
|
|
1990
|
30 |
5 |
p. 1009-1010
2 p.
|
artikel
|
| 45 |
Feedback approach to quality monitoring of a manufacturing process
|
|
|
1990
|
30 |
5 |
p. 1008-
1 p.
|
artikel
|
| 46 |
Fluorine passivation of metal surface for self-cleaning semiconductor equipment
|
|
|
1990
|
30 |
5 |
p. 1012-
1 p.
|
artikel
|
| 47 |
4855867 Full panel electronic packaging structure
|
Gazdik, CharlesE
|
|
1990
|
30 |
5 |
p. ii-
1 p.
|
artikel
|
| 48 |
Gate oxide breakdown statistics in wearout tests of metal-oxide-semiconductor structures
|
|
|
1990
|
30 |
5 |
p. 1007-
1 p.
|
artikel
|
| 49 |
Gate width effects on deep-level spectra in implanted GaAs MESFETs on LEC substrates
|
|
|
1990
|
30 |
5 |
p. 1016-
1 p.
|
artikel
|
| 50 |
4857835 Global event qualification system
|
Whetsel, Lee
|
|
1990
|
30 |
5 |
p. ii-
1 p.
|
artikel
|
| 51 |
Growth and characterisation of high-quality GaAs/Ga0.49In0.51P heterostructures grown by LP-MOCVD
|
|
|
1990
|
30 |
5 |
p. 1015-
1 p.
|
artikel
|
| 52 |
Growth and characterization of high-quality InP/Ga0.25In0.75As0.5P0.5 and InP/Ga0.17In0.83As0.35P0.65 grown by the LP-MOCVD technique
|
|
|
1990
|
30 |
5 |
p. 1015-
1 p.
|
artikel
|
| 53 |
Half-pitch, SMT-compatible products highlighted
|
|
|
1990
|
30 |
5 |
p. 1011-
1 p.
|
artikel
|
| 54 |
Hidden dependence in human errors
|
|
|
1990
|
30 |
5 |
p. 1006-
1 p.
|
artikel
|
| 55 |
Highly reliable die attachment on polished GaAs surfaces using gold-tin eutectic alloy
|
|
|
1990
|
30 |
5 |
p. 1012-
1 p.
|
artikel
|
| 56 |
High-speed automatic test equipment enhances audio/video production lines
|
|
|
1990
|
30 |
5 |
p. 1008-
1 p.
|
artikel
|
| 57 |
Human error data banks
|
Dhillon, B.S.
|
|
1990
|
30 |
5 |
p. 963-971
9 p.
|
artikel
|
| 58 |
Hybrid IC technology leads to miniaturization
|
|
|
1990
|
30 |
5 |
p. 1015-
1 p.
|
artikel
|
| 59 |
IC card/memory technology moves forward with standardization
|
|
|
1990
|
30 |
5 |
p. 1011-
1 p.
|
artikel
|
| 60 |
IC sockets shifting to 25 mil lead pitch PQFPs
|
|
|
1990
|
30 |
5 |
p. 1011-
1 p.
|
artikel
|
| 61 |
Inhomogeneous structures of multilayer overlayers
|
|
|
1990
|
30 |
5 |
p. 1013-
1 p.
|
artikel
|
| 62 |
Inspection and data measurements for solder quality process control
|
|
|
1990
|
30 |
5 |
p. 1008-
1 p.
|
artikel
|
| 63 |
Integration of R&M into CAE for product excellence
|
|
|
1990
|
30 |
5 |
p. 1005-
1 p.
|
artikel
|
| 64 |
4858072 Interconnection system for integrated circuit chips
|
Chall, LouisE
|
|
1990
|
30 |
5 |
p. iii-
1 p.
|
artikel
|
| 65 |
Investigation of gate oxide breakdown in CMOS integrated circuits
|
|
|
1990
|
30 |
5 |
p. 1007-
1 p.
|
artikel
|
| 66 |
Ion beam deposition of β-SiC layers onto α-SiC substrates
|
|
|
1990
|
30 |
5 |
p. 1017-
1 p.
|
artikel
|
| 67 |
Irregularity of film resistivity in a contact interface and contact conductance
|
|
|
1990
|
30 |
5 |
p. 1014-
1 p.
|
artikel
|
| 68 |
Japanese measuring instruments: a prospective on the future
|
|
|
1990
|
30 |
5 |
p. 1011-
1 p.
|
artikel
|
| 69 |
Lattice locations of erbium implants in silicon
|
|
|
1990
|
30 |
5 |
p. 1017-
1 p.
|
artikel
|
| 70 |
LCD technology allows panels to move closer to CRT quality
|
|
|
1990
|
30 |
5 |
p. 1014-
1 p.
|
artikel
|
| 71 |
Limitations in the current R&M-CAE viewpoint
|
|
|
1990
|
30 |
5 |
p. 1006-
1 p.
|
artikel
|
| 72 |
Low temperature formation of silicon nitride and oxide films by the simultaneous use of a microwave ion source and an ICB source
|
|
|
1990
|
30 |
5 |
p. 1016-
1 p.
|
artikel
|
| 73 |
Maintenance philosophy using queueing multilevel stochastic service system
|
Cátuneanu, V.M.
|
|
1990
|
30 |
5 |
p. 897-901
5 p.
|
artikel
|
| 74 |
Materials for optoelectronics and photonic integrated circuits
|
|
|
1990
|
30 |
5 |
p. 1011-
1 p.
|
artikel
|
| 75 |
Mechanical-reliability prediction
|
|
|
1990
|
30 |
5 |
p. 1006-
1 p.
|
artikel
|
| 76 |
4855672 Method and process for testing the reliability of integrated circuit (IC) chips and novel IC circuitry for accomplishing same
|
Shreeve, RobertW
|
|
1990
|
30 |
5 |
p. i-ii
nvt p.
|
artikel
|
| 77 |
4851359 Method of producing an electrical resistor by implanting a semiconductor material with rare gas
|
Boudou, Alain
|
|
1990
|
30 |
5 |
p. i-
1 p.
|
artikel
|
| 78 |
Modelling of thermal fatigue failure in soft-soldered semiconductor devices using the internal variable method
|
Chen, A.
|
|
1990
|
30 |
5 |
p. 839-843
5 p.
|
artikel
|
| 79 |
Models and experiments on degradation of oxidized silicon
|
|
|
1990
|
30 |
5 |
p. 1015-
1 p.
|
artikel
|
| 80 |
Multilayer bonding guide
|
G.W.A.D.,
|
|
1990
|
30 |
5 |
p. 993-
1 p.
|
artikel
|
| 81 |
New device concepts: the implications for MOVPE
|
|
|
1990
|
30 |
5 |
p. 1011-
1 p.
|
artikel
|
| 82 |
New rules of resistance in small resistors
|
|
|
1990
|
30 |
5 |
p. 1015-
1 p.
|
artikel
|
| 83 |
New thick-film copper paste for ultra-fine line circuits
|
|
|
1990
|
30 |
5 |
p. 1016-
1 p.
|
artikel
|
| 84 |
Non-existent CAE capabilities
|
|
|
1990
|
30 |
5 |
p. 1006-
1 p.
|
artikel
|
| 85 |
Novel applications of ion implantation
|
|
|
1990
|
30 |
5 |
p. 1016-
1 p.
|
artikel
|
| 86 |
Objective and subjective estimates of human error
|
|
|
1990
|
30 |
5 |
p. 1006-
1 p.
|
artikel
|
| 87 |
On a common error in open and short circuit reliability computation
|
|
|
1990
|
30 |
5 |
p. 1009-
1 p.
|
artikel
|
| 88 |
On estimating parameters in a discrete Weibull distribution
|
|
|
1990
|
30 |
5 |
p. 1010-
1 p.
|
artikel
|
| 89 |
On estimating the mean time to failure with unknown censoring
|
|
|
1990
|
30 |
5 |
p. 1009-
1 p.
|
artikel
|
| 90 |
On the evaluation of ferroelectric nonlinear capacitors for application in power circuits
|
|
|
1990
|
30 |
5 |
p. 1007-
1 p.
|
artikel
|
| 91 |
On the mechanism of sputtering of SiO2 by Ar at ion energies near the sputtering threshold
|
|
|
1990
|
30 |
5 |
p. 1014-
1 p.
|
artikel
|
| 92 |
Optimal replacement policy (N∗, n∗) for a parallel system with common cause failure and geometric repair time
|
Lai, Min-Tsai
|
|
1990
|
30 |
5 |
p. 973-982
10 p.
|
artikel
|
| 93 |
Overview of tape automated bonding technology
|
|
|
1990
|
30 |
5 |
p. 1013-
1 p.
|
artikel
|
| 94 |
Oxidation behaviour of AIN in the presence of oxide and glass for thick film applications
|
|
|
1990
|
30 |
5 |
p. 1016-
1 p.
|
artikel
|
| 95 |
Parasitic capacitance effects of planar resistors
|
|
|
1990
|
30 |
5 |
p. 1016-
1 p.
|
artikel
|
| 96 |
PARSEC—process analysis with recipe support for etcher control
|
|
|
1990
|
30 |
5 |
p. 1013-
1 p.
|
artikel
|
| 97 |
PCB plated through hole optimisation: a case study in SPC
|
|
|
1990
|
30 |
5 |
p. 1007-
1 p.
|
artikel
|
| 98 |
Process uniformity and slip dislocation patterns in linearly ramped-temperature transient rapid thermal processing of silicon
|
|
|
1990
|
30 |
5 |
p. 1014-
1 p.
|
artikel
|
| 99 |
Properties of continuous analog estimators for a discrete reliability-growth model
|
|
|
1990
|
30 |
5 |
p. 1009-
1 p.
|
artikel
|
| 100 |
Publications, notices, calls for papers, etc.
|
|
|
1990
|
30 |
5 |
p. 999-1003
5 p.
|
artikel
|
| 101 |
Quality function deployment (QFD) processes in an integrated quality information system
|
|
|
1990
|
30 |
5 |
p. 1008-
1 p.
|
artikel
|
| 102 |
Quo Vadis printed (circuit) board? Seeking the most cost-effective interconnect solution for electronic equipment
|
|
|
1990
|
30 |
5 |
p. 1007-
1 p.
|
artikel
|
| 103 |
RADC initiatives in CAE for reliability and maintainability
|
|
|
1990
|
30 |
5 |
p. 1008-
1 p.
|
artikel
|
| 104 |
Reliability analysis of a class of fault-tolerant systems
|
|
|
1990
|
30 |
5 |
p. 1009-
1 p.
|
artikel
|
| 105 |
Reliability analysis of a k-out-of-N : G redundant system with multiple critical errors
|
Who Kee Chung,
|
|
1990
|
30 |
5 |
p. 907-910
4 p.
|
artikel
|
| 106 |
Reliability and MTTF analysis of a three-state multi-component parallel redundant system under overloading effect and waiting
|
Gupta, P.P.
|
|
1990
|
30 |
5 |
p. 861-864
4 p.
|
artikel
|
| 107 |
Resistance modeling of periodically perforated mesh planes in multilayer packaging structures
|
|
|
1990
|
30 |
5 |
p. 1012-
1 p.
|
artikel
|
| 108 |
R&M-CAE implementation issues in electronics development
|
|
|
1990
|
30 |
5 |
p. 1005-
1 p.
|
artikel
|
| 109 |
R&M-CAE in a joint venture
|
|
|
1990
|
30 |
5 |
p. 1006-
1 p.
|
artikel
|
| 110 |
Safety and environmental problems of cleaning printed circuit assemblies
|
|
|
1990
|
30 |
5 |
p. 1007-
1 p.
|
artikel
|
| 111 |
Secondary ion mass spectrometry (SIMS) of silicon
|
|
|
1990
|
30 |
5 |
p. 1016-
1 p.
|
artikel
|
| 112 |
4858192 Semiconductor memory device with redundancy circuit
|
Tatsumi, Yuuichi
|
|
1990
|
30 |
5 |
p. iii-
1 p.
|
artikel
|
| 113 |
Smaller sums of disjoint products by subproduct inversion
|
|
|
1990
|
30 |
5 |
p. 1010-
1 p.
|
artikel
|
| 114 |
“Smart” integrated circuit processing
|
|
|
1990
|
30 |
5 |
p. 1013-
1 p.
|
artikel
|
| 115 |
Society of reliability engineers bulletin
|
Reiche, Hans
|
|
1990
|
30 |
5 |
p. 983-
1 p.
|
artikel
|
| 116 |
Stochastic analysis of a multi-unit cold standby system working in orbit form
|
Goel, L.R.
|
|
1990
|
30 |
5 |
p. 845-850
6 p.
|
artikel
|
| 117 |
Stochastic behaviour of a cold standby system with partial failure and slow switching device
|
Sharma, G.C.
|
|
1990
|
30 |
5 |
p. 869-872
4 p.
|
artikel
|
| 118 |
Study of low-energy hydrogen implantation in silicon
|
|
|
1990
|
30 |
5 |
p. 1016-
1 p.
|
artikel
|
| 119 |
Subthreshold behaviour of silicon MESFETs on SOS and bulk silicon substrates
|
|
|
1990
|
30 |
5 |
p. 1014-
1 p.
|
artikel
|
| 120 |
Temperature and electric field dependence of hopping transport in ion-implanted Si:As
|
|
|
1990
|
30 |
5 |
p. 1017-
1 p.
|
artikel
|
| 121 |
TEM techniques for two dimensional junction delineation in integrated circuits
|
|
|
1990
|
30 |
5 |
p. 1012-
1 p.
|
artikel
|
| 122 |
Test chip based approach to automated diagnosis of CMOS yield problems
|
|
|
1990
|
30 |
5 |
p. 1008-
1 p.
|
artikel
|
| 123 |
4857826 Tester system for electrical power circuits terminated at an outlet plug receptacle
|
Graham, George
|
|
1990
|
30 |
5 |
p. ii-
1 p.
|
artikel
|
| 124 |
4855253 Test method for random defects in electronic microstructures
|
Weber, CharlesM
|
|
1990
|
30 |
5 |
p. i-
1 p.
|
artikel
|
| 125 |
The Bayes predictive approach in reliability theory
|
|
|
1990
|
30 |
5 |
p. 1010-
1 p.
|
artikel
|
| 126 |
The definition of two-phase repair member capacity of complex radioelectronic systems
|
Martynenko, Oleg
|
|
1990
|
30 |
5 |
p. 851-854
4 p.
|
artikel
|
| 127 |
The development of ion implanter technology
|
|
|
1990
|
30 |
5 |
p. 1017-
1 p.
|
artikel
|
| 128 |
The high-frequency characteristics of tape automated bonding (TAB) interconnects
|
|
|
1990
|
30 |
5 |
p. 1013-
1 p.
|
artikel
|
| 129 |
The influence of moisture on surface properties and insulation characteristics of AIN substrates
|
|
|
1990
|
30 |
5 |
p. 1012-
1 p.
|
artikel
|
| 130 |
The limit conditions of five failure counting models of software reliability
|
Xizi, Huang
|
|
1990
|
30 |
5 |
p. 855-859
5 p.
|
artikel
|
| 131 |
The model of growth kinetics of very thin thermal silicon oxide layer
|
|
|
1990
|
30 |
5 |
p. 1015-
1 p.
|
artikel
|
| 132 |
The number of failed components in a consecutive-k-out-of-n:F system
|
|
|
1990
|
30 |
5 |
p. 1011-
1 p.
|
artikel
|
| 133 |
Thermally induced parasitic ungated FET in power MESFETs
|
Canali, C.
|
|
1990
|
30 |
5 |
p. 903-905
3 p.
|
artikel
|
| 134 |
The role of inspection in automated manufacturing
|
|
|
1990
|
30 |
5 |
p. 1009-
1 p.
|
artikel
|
| 135 |
The Romanian Reliability Society
|
Popentiu, Florin
|
|
1990
|
30 |
5 |
p. 985-
1 p.
|
artikel
|
| 136 |
The scaled-down circuit yield improvement by technological centering
|
Patyra, Marek J.
|
|
1990
|
30 |
5 |
p. 951-962
12 p.
|
artikel
|
| 137 |
The use of Hall effect profiling to monitor the reactivation of silicon implants after oxygen implantation in gallium arsenide
|
|
|
1990
|
30 |
5 |
p. 1016-1017
2 p.
|
artikel
|
| 138 |
VLSI semiconductor random access memory functional testing
|
Naidu Rayapati, Venkatapathi
|
|
1990
|
30 |
5 |
p. 877-889
13 p.
|
artikel
|
| 139 |
Wafer-level system integration: a review
|
|
|
1990
|
30 |
5 |
p. 1014-
1 p.
|
artikel
|
| 140 |
Water sorption in epoxy thin films
|
|
|
1990
|
30 |
5 |
p. 1012-1013
2 p.
|
artikel
|
Tijdschrift beschrijving