| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Accelerated life tests of ceramic capacitors
|
|
|
1990
|
30 |
1 |
p. 193-194
2 p.
|
artikel
|
| 2 |
A conception for reliability prediction and estimation of MOS integrated circuits
|
Dimitrov, Stojan
|
|
1990
|
30 |
1 |
p. 27-34
8 p.
|
artikel
|
| 3 |
A critique of Mil-Hdbk-217E reliability prediction methods
|
|
|
1990
|
30 |
1 |
p. 194-
1 p.
|
artikel
|
| 4 |
Air bridge and via hole technology for GaAs based microwave devices
|
|
|
1990
|
30 |
1 |
p. 197-
1 p.
|
artikel
|
| 5 |
An algebraic expression to count the number of chips on a wafer
|
|
|
1990
|
30 |
1 |
p. 199-
1 p.
|
artikel
|
| 6 |
Analysis of InGaAs/InP multi-quantum-well structures by ion backscattering
|
|
|
1990
|
30 |
1 |
p. 202-
1 p.
|
artikel
|
| 7 |
Analysis of latch-up neighborhood effects in VLSI CMOS input and output stages
|
Quincke, Jörg
|
|
1990
|
30 |
1 |
p. 105-122
18 p.
|
artikel
|
| 8 |
An effecient algorithm for computing global reliability of a network
|
|
|
1990
|
30 |
1 |
p. 196-
1 p.
|
artikel
|
| 9 |
An electrically excited acoustic emission test technique for screening multilayer ceramic capacitors
|
|
|
1990
|
30 |
1 |
p. 193-
1 p.
|
artikel
|
| 10 |
A new SILO process for VLSI isolation using N2 + ion implantation
|
|
|
1990
|
30 |
1 |
p. 202-
1 p.
|
artikel
|
| 11 |
Announcement
|
|
|
1990
|
30 |
1 |
p. 17-
1 p.
|
artikel
|
| 12 |
A note on microprocessor typology
|
Colin, Bernard
|
|
1990
|
30 |
1 |
p. 67-87
21 p.
|
artikel
|
| 13 |
A photo-patternable stress relief material for plastic packaged integrated circuits
|
|
|
1990
|
30 |
1 |
p. 194-
1 p.
|
artikel
|
| 14 |
Application of a two-layer planarization process to VLSI intermetal dielectric and trench isolation processes
|
|
|
1990
|
30 |
1 |
p. 197-
1 p.
|
artikel
|
| 15 |
Application of non-destructive testing to inspection of soldered joints
|
|
|
1990
|
30 |
1 |
p. 192-
1 p.
|
artikel
|
| 16 |
Application of the polysilicon edge sealed LOCOS process in scaled VLSI circuit fabrication
|
|
|
1990
|
30 |
1 |
p. 198-
1 p.
|
artikel
|
| 17 |
Application specific LSIs for specialized and short-life products enjoy an expanding market
|
|
|
1990
|
30 |
1 |
p. 196-
1 p.
|
artikel
|
| 18 |
Applying just-in-time in a wafer fab: a case study
|
|
|
1990
|
30 |
1 |
p. 199-
1 p.
|
artikel
|
| 19 |
A resistometric method to characterize electromigration at the wafer level
|
Scorzoni, A.
|
|
1990
|
30 |
1 |
p. 123-132
10 p.
|
artikel
|
| 20 |
Argon-boron double implantation in silicon
|
|
|
1990
|
30 |
1 |
p. 201-
1 p.
|
artikel
|
| 21 |
A study of electromigration in aluminum and aluminum-silicon thin film resistors using noise technique
|
|
|
1990
|
30 |
1 |
p. 200-
1 p.
|
artikel
|
| 22 |
Building circuits that test themselves
|
|
|
1990
|
30 |
1 |
p. 195-
1 p.
|
artikel
|
| 23 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
|
|
1990
|
30 |
1 |
p. 1-4
4 p.
|
artikel
|
| 24 |
Change your surfactant formula and use etch baths for a week
|
|
|
1990
|
30 |
1 |
p. 197-
1 p.
|
artikel
|
| 25 |
4829237 Circuit device having a self-testing function and a testing method thereof
|
Segawa, Hirosh
|
|
1990
|
30 |
1 |
p. i-
1 p.
|
artikel
|
| 26 |
Comparison of I-V, CV, and chemical data for quality control studies of SiO x N y films on Si
|
|
|
1990
|
30 |
1 |
p. 190-
1 p.
|
artikel
|
| 27 |
Computer-aided circuit analysis using S P I C E
|
G.W.A.D.,
|
|
1990
|
30 |
1 |
p. 184-
1 p.
|
artikel
|
| 28 |
Computer architecture and design
|
G.W.A.D.,
|
|
1990
|
30 |
1 |
p. 182-183
2 p.
|
artikel
|
| 29 |
Computer simulated and channelling studies of damage distributions in phosphorus implanted silicon
|
|
|
1990
|
30 |
1 |
p. 201-
1 p.
|
artikel
|
| 30 |
Controlling hybrid quality
|
|
|
1990
|
30 |
1 |
p. 200-
1 p.
|
artikel
|
| 31 |
Correlation of silver migration with temperature-humiditybias (THB) failures in multilayer ceramic capacitors
|
|
|
1990
|
30 |
1 |
p. 191-192
2 p.
|
artikel
|
| 32 |
Creep and tensile behaviour of lead-rich lead-tin solder alloys
|
|
|
1990
|
30 |
1 |
p. 191-
1 p.
|
artikel
|
| 33 |
Critical relationships between particle size, composition, and microstructure in thick-film resistors
|
|
|
1990
|
30 |
1 |
p. 200-
1 p.
|
artikel
|
| 34 |
Design of highly reliable tree architectures
|
|
|
1990
|
30 |
1 |
p. 195-
1 p.
|
artikel
|
| 35 |
Differential thermal expansion in microelectronic systems
|
|
|
1990
|
30 |
1 |
p. 198-
1 p.
|
artikel
|
| 36 |
Diffusion length measurements of thin amorphous silicon layers
|
|
|
1990
|
30 |
1 |
p. 199-200
2 p.
|
artikel
|
| 37 |
Distribution of residual system-life after partial failures
|
|
|
1990
|
30 |
1 |
p. 196-
1 p.
|
artikel
|
| 38 |
Dry etch development for silicon processing within a teaching institution
|
|
|
1990
|
30 |
1 |
p. 197-
1 p.
|
artikel
|
| 39 |
Editorial Board
|
|
|
1990
|
30 |
1 |
p. IFC-
1 p.
|
artikel
|
| 40 |
Effect of electron band structure on energy distribution of secondaries in silicon
|
|
|
1990
|
30 |
1 |
p. 200-
1 p.
|
artikel
|
| 41 |
Efficient simulation of impurity redistribution in VLSI fabrication processes
|
|
|
1990
|
30 |
1 |
p. 190-
1 p.
|
artikel
|
| 42 |
4829243 Electron beam testing of electronic components
|
Woodard, OllieC
|
|
1990
|
30 |
1 |
p. i-
1 p.
|
artikel
|
| 43 |
Enhanced failure mechanism in a titanium based contact to silicon
|
|
|
1990
|
30 |
1 |
p. 189-
1 p.
|
artikel
|
| 44 |
Enumeration of minimal cutsets of an undirected graph
|
Ahmad, S.Hasanuddin
|
|
1990
|
30 |
1 |
p. 23-26
4 p.
|
artikel
|
| 45 |
Error analysis in analytic reliability modeling
|
Smotherman, Mark
|
|
1990
|
30 |
1 |
p. 141-149
9 p.
|
artikel
|
| 46 |
Exact reliability analysis of combinational logic circuits
|
|
|
1990
|
30 |
1 |
p. 195-
1 p.
|
artikel
|
| 47 |
Excimer laser-induced etching of semiconductors and metals
|
|
|
1990
|
30 |
1 |
p. 203-
1 p.
|
artikel
|
| 48 |
Experimental and statistical analyses of surface-mount technology PLCC solder-joint reliability
|
|
|
1990
|
30 |
1 |
p. 192-
1 p.
|
artikel
|
| 49 |
Experimental verification of a novel electrical test structure for measuring contact size
|
|
|
1990
|
30 |
1 |
p. 193-
1 p.
|
artikel
|
| 50 |
Fast ion induced defects in silicon and semiconductor applications
|
|
|
1990
|
30 |
1 |
p. 202-
1 p.
|
artikel
|
| 51 |
Fiabilité des fibres optiques
|
|
|
1990
|
30 |
1 |
p. 192-193
2 p.
|
artikel
|
| 52 |
Fiber optic component design, fabrication, testing, operation, reliability and maintainability
|
G.W.A.D.,
|
|
1990
|
30 |
1 |
p. 187-188
2 p.
|
artikel
|
| 53 |
Finding board faults with thermal imaging
|
|
|
1990
|
30 |
1 |
p. 193-
1 p.
|
artikel
|
| 54 |
Fine structure of angle-resolved secondary electron emission spectra in silicon
|
|
|
1990
|
30 |
1 |
p. 199-
1 p.
|
artikel
|
| 55 |
Fluxless and virtually voidless soldering for semiconductor chips
|
|
|
1990
|
30 |
1 |
p. 198-
1 p.
|
artikel
|
| 56 |
1/f noise in GaAs ion-implanted resistance structures
|
|
|
1990
|
30 |
1 |
p. 201-
1 p.
|
artikel
|
| 57 |
Formation mechanisms of amorphous clusters in Mn+ implanted thin Al films
|
|
|
1990
|
30 |
1 |
p. 202-
1 p.
|
artikel
|
| 58 |
GaAs ICs hold tremendous potential even as shortcomings are worked out
|
|
|
1990
|
30 |
1 |
p. 199-
1 p.
|
artikel
|
| 59 |
Gallium arsenide digital integrated circuits a systems perspective
|
G.W.A.D.,
|
|
1990
|
30 |
1 |
p. 183-184
2 p.
|
artikel
|
| 60 |
Hazardous waste control: reducing, recycling and reacting
|
|
|
1990
|
30 |
1 |
p. 196-
1 p.
|
artikel
|
| 61 |
High energy ion implantation into silicon—an application in CMOS technology
|
|
|
1990
|
30 |
1 |
p. 202-
1 p.
|
artikel
|
| 62 |
Highly accelerated life testing (HALT) for multilayer ceramic capacitor qualification
|
|
|
1990
|
30 |
1 |
p. 192-
1 p.
|
artikel
|
| 63 |
High temperature failure of protective layers on silicon substrates in vacuum
|
|
|
1990
|
30 |
1 |
p. 190-
1 p.
|
artikel
|
| 64 |
Hot-electron resistant device processing and design: a review
|
|
|
1990
|
30 |
1 |
p. 200-
1 p.
|
artikel
|
| 65 |
Impact ionization current in semi-insulating GaAs
|
|
|
1990
|
30 |
1 |
p. 199-
1 p.
|
artikel
|
| 66 |
Implementation of a factoring algorithm for reliability evaluation of undirected networks
|
|
|
1990
|
30 |
1 |
p. 194-
1 p.
|
artikel
|
| 67 |
Inner layer or post cracking on multilayer printed circuit boards
|
|
|
1990
|
30 |
1 |
p. 190-191
2 p.
|
artikel
|
| 68 |
4829520 In-place diagnosable electronic circuit board
|
Toth, William
|
|
1990
|
30 |
1 |
p. i-ii
nvt p.
|
artikel
|
| 69 |
4830622 Integrated circuit socket and board
|
Erickson, George
|
|
1990
|
30 |
1 |
p. ii-
1 p.
|
artikel
|
| 70 |
Interaction effects between arsenic and boron ions implanted in silicon during furnace annealing and RTA
|
|
|
1990
|
30 |
1 |
p. 202-
1 p.
|
artikel
|
| 71 |
Interconnection reliability
|
|
|
1990
|
30 |
1 |
p. 193-
1 p.
|
artikel
|
| 72 |
Interface defects and induced voltage contrast in SEM studies of bare SiO2-Si systems
|
|
|
1990
|
30 |
1 |
p. 189-
1 p.
|
artikel
|
| 73 |
Interpretation of capacitance-voltage characteristics on silicon-on-insulator (SOI) capacitors
|
|
|
1990
|
30 |
1 |
p. 190-
1 p.
|
artikel
|
| 74 |
Interval estimation of the parameters β and η of the two-parameter Weibull distribution
|
Brkić, D.M.
|
|
1990
|
30 |
1 |
p. 39-42
4 p.
|
artikel
|
| 75 |
Introduction to implantable biomedical IC design
|
|
|
1990
|
30 |
1 |
p. 202-
1 p.
|
artikel
|
| 76 |
Ion assisted selective deposition of thin films
|
|
|
1990
|
30 |
1 |
p. 201-
1 p.
|
artikel
|
| 77 |
Ion beam profiling of small objects using resonant nuclear reactions
|
|
|
1990
|
30 |
1 |
p. 202-
1 p.
|
artikel
|
| 78 |
Low current and refresh free 1M-bit serial register enabling reduction in size and cost
|
|
|
1990
|
30 |
1 |
p. 199-
1 p.
|
artikel
|
| 79 |
Low-voltage failures in multilayer ceramic capacitors: a new accelerated stress screen
|
|
|
1990
|
30 |
1 |
p. 190-
1 p.
|
artikel
|
| 80 |
Lubricant testing for electronic connectors
|
|
|
1990
|
30 |
1 |
p. 190-
1 p.
|
artikel
|
| 81 |
Matching properties of linear MOS capacitors
|
|
|
1990
|
30 |
1 |
p. 193-
1 p.
|
artikel
|
| 82 |
Materials modification by MeV ion implantation
|
|
|
1990
|
30 |
1 |
p. 203-
1 p.
|
artikel
|
| 83 |
Mathematical model of a plated-through hole under a load induced by thermal mismatch
|
|
|
1990
|
30 |
1 |
p. 192-
1 p.
|
artikel
|
| 84 |
Maximum likelihood analysis of component reliability using masked system life-test data
|
|
|
1990
|
30 |
1 |
p. 191-
1 p.
|
artikel
|
| 85 |
4M-bit DRAMS: 80 ns high-speed accessing accomplished using 0.8 μm P/N CMOS microfabrication technology
|
|
|
1990
|
30 |
1 |
p. 199-
1 p.
|
artikel
|
| 86 |
Measures of testability for automatic diagnostic systems
|
|
|
1990
|
30 |
1 |
p. 196-
1 p.
|
artikel
|
| 87 |
Metal electromigration induced by solder flux residue in hybrid microcircuits
|
|
|
1990
|
30 |
1 |
p. 200-201
2 p.
|
artikel
|
| 88 |
MeV He microbeam analysis of a semiconductor integrated circuit
|
|
|
1990
|
30 |
1 |
p. 199-
1 p.
|
artikel
|
| 89 |
Microcircuit Engineering '88. A report on the 14th International Conference on microlithography and related sectors, held from September 20 to 22, 1988 in Vienna
|
|
|
1990
|
30 |
1 |
p. 196-197
2 p.
|
artikel
|
| 90 |
Modeling discrete bathtub and upside-down bathtub mean residual-life functions
|
|
|
1990
|
30 |
1 |
p. 195-196
2 p.
|
artikel
|
| 91 |
Monitor particles in real time to sleuth contamination sources
|
|
|
1990
|
30 |
1 |
p. 189-
1 p.
|
artikel
|
| 92 |
Multistate Markov models for systems with dependent units
|
|
|
1990
|
30 |
1 |
p. 195-
1 p.
|
artikel
|
| 93 |
New Mullite ceramic packages and substrates
|
|
|
1990
|
30 |
1 |
p. 197-198
2 p.
|
artikel
|
| 94 |
New testing devices are responding to higher performance in megabit age
|
|
|
1990
|
30 |
1 |
p. 196-
1 p.
|
artikel
|
| 95 |
NMOS process simulator using Monte Carlo methods
|
Venkatapathi Naidu, R.
|
|
1990
|
30 |
1 |
p. 19-22
4 p.
|
artikel
|
| 96 |
Nonparametric Bayes estimation of a distribution under nomination sampling
|
|
|
1990
|
30 |
1 |
p. 194-
1 p.
|
artikel
|
| 97 |
Numerical methods with FORTRAN 77 a practical introduction
|
G.W.A.D.,
|
|
1990
|
30 |
1 |
p. 177-
1 p.
|
artikel
|
| 98 |
On the Monte Carlo simulation program ‘RESIS’ for electron exposure of resists
|
|
|
1990
|
30 |
1 |
p. 198-
1 p.
|
artikel
|
| 99 |
On the scaling of an ion-implanted silicon MESFET
|
|
|
1990
|
30 |
1 |
p. 203-
1 p.
|
artikel
|
| 100 |
On US Mil-Hdbk-217 and reliability prediction
|
|
|
1990
|
30 |
1 |
p. 189-
1 p.
|
artikel
|
| 101 |
Optics and electronics are living together
|
|
|
1990
|
30 |
1 |
p. 196-
1 p.
|
artikel
|
| 102 |
Optimal inspection policy for a parallel redundant system
|
Teramoto, K.
|
|
1990
|
30 |
1 |
p. 151-155
5 p.
|
artikel
|
| 103 |
Optimization of CCNs: Exact and heuristic approaches
|
Sharma, Usha
|
|
1990
|
30 |
1 |
p. 43-50
8 p.
|
artikel
|
| 104 |
4830497 Pattern inspection system
|
Iwata, Satoshi
|
|
1990
|
30 |
1 |
p. ii-
1 p.
|
artikel
|
| 105 |
Polyimide enables high lead count TAB
|
|
|
1990
|
30 |
1 |
p. 197-
1 p.
|
artikel
|
| 106 |
Polymers in microelectronics fundamentals and applications
|
G.W.A.D.,
|
|
1990
|
30 |
1 |
p. 181-182
2 p.
|
artikel
|
| 107 |
Probability and random processes for electrical engineering
|
G.W.A.D.,
|
|
1990
|
30 |
1 |
p. 177-178
2 p.
|
artikel
|
| 108 |
Probability approach for investigation of MOST threshold voltage dependence on gate electrode length
|
Simeonov, D.
|
|
1990
|
30 |
1 |
p. 51-53
3 p.
|
artikel
|
| 109 |
Properties of high-resistivity Cr-Si-O thin-film resistor
|
|
|
1990
|
30 |
1 |
p. 200-
1 p.
|
artikel
|
| 110 |
Publications, notices, calls for papers, etc.
|
|
|
1990
|
30 |
1 |
p. 5-
1 p.
|
artikel
|
| 111 |
Qualitative properties of profit-making k-out-of-n systems subject to two kinds of failures
|
|
|
1990
|
30 |
1 |
p. 196-
1 p.
|
artikel
|
| 112 |
Quality and reliability—relevance and assessment for electronic assemblies
|
|
|
1990
|
30 |
1 |
p. 194-
1 p.
|
artikel
|
| 113 |
Rapid nondestructive testing of ceramic multilayer capacitors
|
|
|
1990
|
30 |
1 |
p. 191-
1 p.
|
artikel
|
| 114 |
Reactive ion etching of crystalline quartz for SAW devices
|
|
|
1990
|
30 |
1 |
p. 201-202
2 p.
|
artikel
|
| 115 |
Reactive ion etching of keep trenches in silicon with CF2 Cl2 and O2
|
|
|
1990
|
30 |
1 |
p. 201-
1 p.
|
artikel
|
| 116 |
Real-time thermal design of integrated circuit devices
|
|
|
1990
|
30 |
1 |
p. 198-
1 p.
|
artikel
|
| 117 |
Relayed consecutive-k-out-of-n:F lines
|
|
|
1990
|
30 |
1 |
p. 194-
1 p.
|
artikel
|
| 118 |
Reliability modelling of redundant computer systems with common-cause failures
|
|
|
1990
|
30 |
1 |
p. 195-
1 p.
|
artikel
|
| 119 |
Reliability optimization of computer-communication networks
|
|
|
1990
|
30 |
1 |
p. 194-195
2 p.
|
artikel
|
| 120 |
Repairing damaged PCB assemblies
|
|
|
1990
|
30 |
1 |
p. 191-
1 p.
|
artikel
|
| 121 |
Research and technology in microelectronics
|
|
|
1990
|
30 |
1 |
p. 197-
1 p.
|
artikel
|
| 122 |
Research reveals differences in coating effects on die stress
|
|
|
1990
|
30 |
1 |
p. 197-
1 p.
|
artikel
|
| 123 |
Robotic systems enhance manufacturing efficiency
|
|
|
1990
|
30 |
1 |
p. 197-
1 p.
|
artikel
|
| 124 |
Sampling analysis in the dpm range
|
Wurnik, Franz
|
|
1990
|
30 |
1 |
p. 35-38
4 p.
|
artikel
|
| 125 |
Scanning tunnelling microscopy of ion etched silicon
|
|
|
1990
|
30 |
1 |
p. 201-
1 p.
|
artikel
|
| 126 |
Screening effects in highly concentrated bound excitons in semiconductors
|
|
|
1990
|
30 |
1 |
p. 200-
1 p.
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artikel
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| 127 |
Selective etching technology for 94 GHz GaAs IMPATT diodes on diamond heat sinks
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1990
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30 |
1 |
p. 198-
1 p.
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artikel
|
| 128 |
Self-aligned V-groove etched devices
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1990
|
30 |
1 |
p. 198-199
2 p.
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artikel
|
| 129 |
4829361 Semiconductor device
|
Sagara, Kazuhiko
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1990
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30 |
1 |
p. i-
1 p.
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artikel
|
| 130 |
Simple enumeration of minimal cutsets of acyclic directed graph
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1990
|
30 |
1 |
p. 195-
1 p.
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artikel
|
| 131 |
Software development with Modula-2
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G.W.A.D.,
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1990
|
30 |
1 |
p. 178-179
2 p.
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artikel
|
| 132 |
Sputtering under ultrahigh vacuum environment
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1990
|
30 |
1 |
p. 197-
1 p.
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artikel
|
| 133 |
Statistical significance of error-corrupted IC measurements
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1990
|
30 |
1 |
p. 194-
1 p.
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artikel
|
| 134 |
Stochastic analysis of a two unit warm standby system with fault detection and inspection
|
Goel, L.R.
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1990
|
30 |
1 |
p. 61-65
5 p.
|
artikel
|
| 135 |
Stochastic modeling of human-performance reliability
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1990
|
30 |
1 |
p. 189-
1 p.
|
artikel
|
| 136 |
Surface mount and related technologies
|
G.W.A.D.,
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1990
|
30 |
1 |
p. 185-
1 p.
|
artikel
|
| 137 |
Tailored coefficient of thermal expansion printed wiring boards to improve the solder joint life of leadless ceramic chip carriers
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1990
|
30 |
1 |
p. 191-
1 p.
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artikel
|
| 138 |
Tailoring IC test to fit the real world
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1990
|
30 |
1 |
p. 191-
1 p.
|
artikel
|
| 139 |
Temperature distribution in IC plastic packages in the reflow soldering process
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|
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1990
|
30 |
1 |
p. 192-
1 p.
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artikel
|
| 140 |
Test results can improve your IC process
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|
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1990
|
30 |
1 |
p. 191-
1 p.
|
artikel
|
| 141 |
The effect of ion implantation on polymer mask resistance to ion beam etching
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|
|
1990
|
30 |
1 |
p. 201-
1 p.
|
artikel
|
| 142 |
The effect of temperature on ion beam mixing of Mo films on Si substrates
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|
|
1990
|
30 |
1 |
p. 202-
1 p.
|
artikel
|
| 143 |
The influence of electron beam energy on defect density in MOS device quality oxides
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|
|
1990
|
30 |
1 |
p. 190-
1 p.
|
artikel
|
| 144 |
The logarithmic series distribution as a failure model from the Bayesian point of view
|
Kyriakoussis, A.
|
|
1990
|
30 |
1 |
p. 133-139
7 p.
|
artikel
|
| 145 |
The mechanism of oxidation of thin Ni-Cr films
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|
|
1990
|
30 |
1 |
p. 203-
1 p.
|
artikel
|
| 146 |
The phoenix of functional test
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|
|
1990
|
30 |
1 |
p. 196-
1 p.
|
artikel
|
| 147 |
Thermal characterization of a 149-lead VLSI package with heatsink
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|
|
1990
|
30 |
1 |
p. 197-
1 p.
|
artikel
|
| 148 |
Thermal characterization of plastic and ceramic surfacemount components
|
|
|
1990
|
30 |
1 |
p. 193-
1 p.
|
artikel
|
| 149 |
Thermally conditioned placement optimization of elements in hybrid microcircuits
|
Wisz, Bogusklaw
|
|
1990
|
30 |
1 |
p. 89-103
15 p.
|
artikel
|
| 150 |
Thermal stability of various ball-limited-metal systems under solder bumps
|
|
|
1990
|
30 |
1 |
p. 198-
1 p.
|
artikel
|
| 151 |
Thermal-stress analysis of SOIC packages and interconnections
|
|
|
1990
|
30 |
1 |
p. 191-
1 p.
|
artikel
|
| 152 |
The use of Petri nets to analyze coherent fault trees
|
|
|
1990
|
30 |
1 |
p. 195-
1 p.
|
artikel
|
| 153 |
Thin film systems for low TCR resistors
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|
|
1990
|
30 |
1 |
p. 200-
1 p.
|
artikel
|
| 154 |
Tools for measuring software reliability
|
|
|
1990
|
30 |
1 |
p. 194-
1 p.
|
artikel
|
| 155 |
Two-unit standby reliability system subject to effective and non-effective random shocks
|
Murari, K.
|
|
1990
|
30 |
1 |
p. 55-60
6 p.
|
artikel
|
| 156 |
Uncertainty analysis of fault trees with statistically correlated failure data
|
Kafrawy, Kamel F.
|
|
1990
|
30 |
1 |
p. 157-175
19 p.
|
artikel
|
| 157 |
Unusual electron beam effects in the GaAs (100)/Ci2 system
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|
|
1990
|
30 |
1 |
p. 197-
1 p.
|
artikel
|
| 158 |
UPS testing turns to ATE
|
|
|
1990
|
30 |
1 |
p. 189-
1 p.
|
artikel
|
| 159 |
User-programmable gate arrays
|
|
|
1990
|
30 |
1 |
p. 199-
1 p.
|
artikel
|
| 160 |
VLSI electronics microstructure science 15 VLSI metallization
|
G.W.A.D.,
|
|
1990
|
30 |
1 |
p. 179-180
2 p.
|
artikel
|
| 161 |
VLSI: linking design and manufacturing
|
|
|
1990
|
30 |
1 |
p. 197-
1 p.
|
artikel
|
| 162 |
VLSI RISC architecture and organization
|
G.W.A.D.,
|
|
1990
|
30 |
1 |
p. 186-
1 p.
|
artikel
|
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