| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Advanced copper/polyimide hybrid technology
|
|
|
1988
|
28 |
5 |
p. 835-
1 p.
|
artikel
|
| 2 |
Advantages of a floating annular ring in three-layer tab assembly
|
|
|
1988
|
28 |
5 |
p. 832-833
2 p.
|
artikel
|
| 3 |
Air force systems command approach to R&M
|
|
|
1988
|
28 |
5 |
p. 830-
1 p.
|
artikel
|
| 4 |
A method to estimate the Weibull parameters for progressively censored tests
|
|
|
1988
|
28 |
5 |
p. 830-
1 p.
|
artikel
|
| 5 |
A modified Monte Carlo technique for confidence limits of system reliability using pass-fail data
|
|
|
1988
|
28 |
5 |
p. 828-829
2 p.
|
artikel
|
| 6 |
An algorithm for symbolic reliability computation with path-sets or cut-sets
|
|
|
1988
|
28 |
5 |
p. 829-
1 p.
|
artikel
|
| 7 |
Analysis of CMOS transistor instabilities
|
|
|
1988
|
28 |
5 |
p. 825-826
2 p.
|
artikel
|
| 8 |
A new failure mode of very thin (< 50 Å) thermal SiO2 films
|
|
|
1988
|
28 |
5 |
p. 835-
1 p.
|
artikel
|
| 9 |
A new laser hermetic sealing technique for aluminum package
|
|
|
1988
|
28 |
5 |
p. 836-
1 p.
|
artikel
|
| 10 |
A new Monte Carlo method for evaluating system-failure probability
|
|
|
1988
|
28 |
5 |
p. 831-832
2 p.
|
artikel
|
| 11 |
A new VLSI diagnosis technique: focused ion beam assisted multi-level circuit probing
|
|
|
1988
|
28 |
5 |
p. 835-
1 p.
|
artikel
|
| 12 |
An improved method of enumerating all trees and minimal paths in a graph using Petri nets
|
Kontoleon, J.M.
|
|
1988
|
28 |
5 |
p. 783-791
9 p.
|
artikel
|
| 13 |
A novel thermal expansion matched heatspreader for plastic encapsulation of silicon chips
|
|
|
1988
|
28 |
5 |
p. 826-
1 p.
|
artikel
|
| 14 |
A probabilistic model of quality control in microelectronics
|
Wojcik, Barbara E.
|
|
1988
|
28 |
5 |
p. 721-728
8 p.
|
artikel
|
| 15 |
A sequence of diagnosis and repair for a 2-state repairable system
|
|
|
1988
|
28 |
5 |
p. 829-
1 p.
|
artikel
|
| 16 |
Association of bonding-wire displacement with gas bubbles in plastic-encapsulated integrated circuits
|
|
|
1988
|
28 |
5 |
p. 826-
1 p.
|
artikel
|
| 17 |
A stable algorithm to calculate steady-state probability and frequency of a Markov system
|
|
|
1988
|
28 |
5 |
p. 829-
1 p.
|
artikel
|
| 18 |
A test to identify the uniform distribution, with applications to probability plotting and other distributions
|
|
|
1988
|
28 |
5 |
p. 832-
1 p.
|
artikel
|
| 19 |
Automation of solder joint inspection procedures utilizing laser induced infrared
|
|
|
1988
|
28 |
5 |
p. 836-
1 p.
|
artikel
|
| 20 |
Boron implantation effects on Au: GaAs Schottky barrier
|
|
|
1988
|
28 |
5 |
p. 836-
1 p.
|
artikel
|
| 21 |
Boron implantation influence on the backgating effect in GaAs MESFETs
|
|
|
1988
|
28 |
5 |
p. 836-
1 p.
|
artikel
|
| 22 |
Buried coaxial conductors for high-speed interconnections
|
|
|
1988
|
28 |
5 |
p. 834-
1 p.
|
artikel
|
| 23 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
|
|
1988
|
28 |
5 |
p. 673-675
3 p.
|
artikel
|
| 24 |
Chemical vapor deposition for microelectronics
|
G.W.A.D.,
|
|
1988
|
28 |
5 |
p. 821-
1 p.
|
artikel
|
| 25 |
Circuits intégrés logiques GaAs et leurs évaluations
|
|
|
1988
|
28 |
5 |
p. 834-
1 p.
|
artikel
|
| 26 |
Closed formulas for the failure probability of a strict-consecutive-k-out-of-n:F system
|
|
|
1988
|
28 |
5 |
p. 832-
1 p.
|
artikel
|
| 27 |
Comments on “Stochastic analysis of a two unit cold standby system with preparation time for repair”
|
De, Guo Tong
|
|
1988
|
28 |
5 |
p. 687-
1 p.
|
artikel
|
| 28 |
Comparison of wafer scale integration with VLSI packaging approaches
|
|
|
1988
|
28 |
5 |
p. 832-
1 p.
|
artikel
|
| 29 |
Computer guided logic IC fault location
|
|
|
1988
|
28 |
5 |
p. 826-
1 p.
|
artikel
|
| 30 |
Controlled electromigration for field failure acceleration
|
|
|
1988
|
28 |
5 |
p. 828-
1 p.
|
artikel
|
| 31 |
Cost-density analysis of interconnections
|
|
|
1988
|
28 |
5 |
p. 827-
1 p.
|
artikel
|
| 32 |
4726023 Determination of testability of combined logic end memory by ignoring memory
|
Carter, JohnL
|
|
1988
|
28 |
5 |
p. 838-
1 p.
|
artikel
|
| 33 |
4724965 Device for conveying components, particularly integrated chips, from an input magazine to an output magazine
|
Willberg, Hans-Heinrich
|
|
1988
|
28 |
5 |
p. 837-
1 p.
|
artikel
|
| 34 |
4727317 Device orientation test method suitable for automatic test equipment
|
Oliver, MartinJ
|
|
1988
|
28 |
5 |
p. 838-
1 p.
|
artikel
|
| 35 |
‘Double-R/half-M’, a reasonable design objective?
|
|
|
1988
|
28 |
5 |
p. 832-
1 p.
|
artikel
|
| 36 |
Effects of the atmosphere on the resistance of ITO thin films
|
|
|
1988
|
28 |
5 |
p. 834-
1 p.
|
artikel
|
| 37 |
Elastoplastic analysis of surface-mount solder joints
|
|
|
1988
|
28 |
5 |
p. 827-
1 p.
|
artikel
|
| 38 |
Electrical conduction mechanisms of barium-titanate-based thick-film capacitors
|
|
|
1988
|
28 |
5 |
p. 827-828
2 p.
|
artikel
|
| 39 |
Electrical modeling of interconnections in multilayer packaging structures
|
|
|
1988
|
28 |
5 |
p. 833-
1 p.
|
artikel
|
| 40 |
Electrical performances of devices made in SiO films obtained by lamp ZMR
|
|
|
1988
|
28 |
5 |
p. 832-
1 p.
|
artikel
|
| 41 |
Electromigration testing of Ti/Al-Si metallization for integrated circuits
|
|
|
1988
|
28 |
5 |
p. 826-
1 p.
|
artikel
|
| 42 |
Epitaxial growth of in situ doped silicon by LPCVD
|
|
|
1988
|
28 |
5 |
p. 834-
1 p.
|
artikel
|
| 43 |
Estimation of the Weibull renewal function
|
Card, Jill
|
|
1988
|
28 |
5 |
p. 751-756
6 p.
|
artikel
|
| 44 |
Fabrication of 16-bit DAC using infrared fired thick-film process
|
|
|
1988
|
28 |
5 |
p. 835-
1 p.
|
artikel
|
| 45 |
4726024 Fail safe architecture for a computer system
|
Guziak, Robert
|
|
1988
|
28 |
5 |
p. 838-
1 p.
|
artikel
|
| 46 |
Fast recursive algorithm to evaluate the reliability of a circular consecutive-k-out-of-n:F system
|
|
|
1988
|
28 |
5 |
p. 829-
1 p.
|
artikel
|
| 47 |
FIST—Ein symbolisches VLSI-design-system (FIST—a symbolic VLSI design-system)
|
|
|
1988
|
28 |
5 |
p. 834-
1 p.
|
artikel
|
| 48 |
Gas purity requirements for titanium silicide metalization
|
|
|
1988
|
28 |
5 |
p. 833-
1 p.
|
artikel
|
| 49 |
Half-maintainability — a formidable goal
|
|
|
1988
|
28 |
5 |
p. 831-
1 p.
|
artikel
|
| 50 |
High-frequency performance of TAB
|
|
|
1988
|
28 |
5 |
p. 834-
1 p.
|
artikel
|
| 51 |
Highly reliable trench capacitor with SiO2/Si3N4/SiO2 stacked film
|
|
|
1988
|
28 |
5 |
p. 827-
1 p.
|
artikel
|
| 52 |
How to identify a bathtub hazard rate
|
|
|
1988
|
28 |
5 |
p. 829-
1 p.
|
artikel
|
| 53 |
Hybrid ICs make the most of limited space
|
|
|
1988
|
28 |
5 |
p. 835-
1 p.
|
artikel
|
| 54 |
Hybrid ICs vital to high density mounting
|
|
|
1988
|
28 |
5 |
p. 834-
1 p.
|
artikel
|
| 55 |
Hypermedia and network reliability
|
Page, Lavon B.
|
|
1988
|
28 |
5 |
p. 793-800
8 p.
|
artikel
|
| 56 |
In-process voltage stressing to increase reliability of MOS integrated circuits
|
Schnable, George L.
|
|
1988
|
28 |
5 |
p. 757-781
25 p.
|
artikel
|
| 57 |
Introduction to microelectronic fabrication
|
G.W.A.D.,
|
|
1988
|
28 |
5 |
p. 823-
1 p.
|
artikel
|
| 58 |
Investigation of aluminum ball bonding mechanism
|
|
|
1988
|
28 |
5 |
p. 833-834
2 p.
|
artikel
|
| 59 |
Investigations of large PLCC package cracking during surface mount exposure
|
|
|
1988
|
28 |
5 |
p. 828-
1 p.
|
artikel
|
| 60 |
Ion implantation
|
|
|
1988
|
28 |
5 |
p. 836-
1 p.
|
artikel
|
| 61 |
Is the incoming physical inspection of microelectronic components really necessary?
|
|
|
1988
|
28 |
5 |
p. 827-
1 p.
|
artikel
|
| 62 |
Les circuits intégrés GaAs
|
|
|
1988
|
28 |
5 |
p. 834-
1 p.
|
artikel
|
| 63 |
Life expectancy of communication satellites
|
|
|
1988
|
28 |
5 |
p. 828-
1 p.
|
artikel
|
| 64 |
Mean time to failure for a consecutive-k-out-of-n:F system
|
|
|
1988
|
28 |
5 |
p. 829-
1 p.
|
artikel
|
| 65 |
Measurement of silicon strength as affected by wafer back processing
|
|
|
1988
|
28 |
5 |
p. 826-
1 p.
|
artikel
|
| 66 |
4728885 Method and apparatus for duplicating electrical environmental conditions
|
DeSanto, JosephJ
|
|
1988
|
28 |
5 |
p. 839-
1 p.
|
artikel
|
| 67 |
4729126 Method and apparatus for supervising the accessing and testing of communication systems
|
Okek, DavidJ
|
|
1988
|
28 |
5 |
p. 839-
1 p.
|
artikel
|
| 68 |
Micro-corrosion of Al-Cu bonding pads
|
|
|
1988
|
28 |
5 |
p. 827-
1 p.
|
artikel
|
| 69 |
Modern techniques of surface science
|
G.W.A.D.,
|
|
1988
|
28 |
5 |
p. 822-
1 p.
|
artikel
|
| 70 |
New process for automated IC assembly manufacturing
|
|
|
1988
|
28 |
5 |
p. 833-
1 p.
|
artikel
|
| 71 |
Novel failure mechanism and anomalous acceleration factor on a beam-lead IC
|
|
|
1988
|
28 |
5 |
p. 827-
1 p.
|
artikel
|
| 72 |
On reliability of a large consecutive-k-out-of-n:F system with (k-l)-step Markov dependence
|
|
|
1988
|
28 |
5 |
p. 829-
1 p.
|
artikel
|
| 73 |
On the implications of R&M 2000 environmental stress screening
|
|
|
1988
|
28 |
5 |
p. 830-
1 p.
|
artikel
|
| 74 |
On the relationship between component failure rate and stress-strength distributional characteristics
|
Shen, Kecheng
|
|
1988
|
28 |
5 |
p. 801-812
12 p.
|
artikel
|
| 75 |
Optical properties of reactively sputtered silicon nitride films
|
|
|
1988
|
28 |
5 |
p. 834-835
2 p.
|
artikel
|
| 76 |
Optimal logic for multi-channel protective systems duing online maintenance
|
|
|
1988
|
28 |
5 |
p. 831-
1 p.
|
artikel
|
| 77 |
Optimizing the wire-bonding process for copper ball bonding, using classic experimental designs
|
|
|
1988
|
28 |
5 |
p. 833-
1 p.
|
artikel
|
| 78 |
Oxide thickness determination in Cr-SiO2-Si structures by dc current-voltage pairs
|
|
|
1988
|
28 |
5 |
p. 834-
1 p.
|
artikel
|
| 79 |
Planarization of sputtered aluminum
|
|
|
1988
|
28 |
5 |
p. 836-
1 p.
|
artikel
|
| 80 |
Probabilistic analysis of K-out-of-N:F three state-unit redundant system with common-cause failure and replacements
|
Mahmoud, M.
|
|
1988
|
28 |
5 |
p. 729-742
14 p.
|
artikel
|
| 81 |
Publications, notices, calls for papers, etc.
|
|
|
1988
|
28 |
5 |
p. 677-685
9 p.
|
artikel
|
| 82 |
QC/QA for hybrid circuit manufacturing: a broader role
|
|
|
1988
|
28 |
5 |
p. 835-
1 p.
|
artikel
|
| 83 |
Recursive technique for computing system reliability
|
|
|
1988
|
28 |
5 |
p. 829-
1 p.
|
artikel
|
| 84 |
Reliability and key-protection for computer-security systems
|
|
|
1988
|
28 |
5 |
p. 829-
1 p.
|
artikel
|
| 85 |
Reliability of a consecutive-k-out-of-n:F system for Markov-dependent components
|
|
|
1988
|
28 |
5 |
p. 830-
1 p.
|
artikel
|
| 86 |
Reliability of high frequency high power GaAs MESFETs
|
|
|
1988
|
28 |
5 |
p. 826-
1 p.
|
artikel
|
| 87 |
Reliability of nano-meter thick multi-layer dielectric films on poly-crystalline silicon
|
|
|
1988
|
28 |
5 |
p. 826-
1 p.
|
artikel
|
| 88 |
Reliability of standby equipment with periodic testing
|
|
|
1988
|
28 |
5 |
p. 829-
1 p.
|
artikel
|
| 89 |
Reliability physics and a new discipline
|
Gao, Guang-Bo
|
|
1988
|
28 |
5 |
p. 713-720
8 p.
|
artikel
|
| 90 |
Resist image reversal for next-generation VLSI circuit fabrication
|
|
|
1988
|
28 |
5 |
p. 833-
1 p.
|
artikel
|
| 91 |
4725775 Resistor isolated burn-in socket board
|
McMinn, Tommy
|
|
1988
|
28 |
5 |
p. 837-
1 p.
|
artikel
|
| 92 |
R&M 2000. An Air Force Logistics Command challenge do it now
|
|
|
1988
|
28 |
5 |
p. 830-
1 p.
|
artikel
|
| 93 |
R&M 2000 and environmental stress screening
|
|
|
1988
|
28 |
5 |
p. 825-
1 p.
|
artikel
|
| 94 |
R&M 2000 and the Air Force acquisition process
|
|
|
1988
|
28 |
5 |
p. 831-
1 p.
|
artikel
|
| 95 |
R&M 2000—coequality between R&M, cost, performance, and schedule
|
|
|
1988
|
28 |
5 |
p. 832-
1 p.
|
artikel
|
| 96 |
R&M 2000: cutting the tether
|
|
|
1988
|
28 |
5 |
p. 830-
1 p.
|
artikel
|
| 97 |
R&M 2000 environmental stress screening
|
|
|
1988
|
28 |
5 |
p. 831-
1 p.
|
artikel
|
| 98 |
R&M 2000. The engineering connection
|
|
|
1988
|
28 |
5 |
p. 831-
1 p.
|
artikel
|
| 99 |
R&M 2000. The Strategic Air Command perspective
|
|
|
1988
|
28 |
5 |
p. 831-
1 p.
|
artikel
|
| 100 |
R&M 2000. The Tactical Air Command approach
|
|
|
1988
|
28 |
5 |
p. 831-
1 p.
|
artikel
|
| 101 |
Scanning electron microscopy for production
|
|
|
1988
|
28 |
5 |
p. 835-
1 p.
|
artikel
|
| 102 |
4727516 Semiconductor memory device having redundancy means
|
Yoshida, Masahiro
|
|
1988
|
28 |
5 |
p. 838-839
2 p.
|
artikel
|
| 103 |
4726021 Semiconductor memory having error correcting means
|
Horiguchi, Masashi
|
|
1988
|
28 |
5 |
p. 837-
1 p.
|
artikel
|
| 104 |
Simulation of resist profiles in single and triple layer electron beam lithography
|
|
|
1988
|
28 |
5 |
p. 835-836
2 p.
|
artikel
|
| 105 |
Smell identification using a thick-film hybrid gas sensor
|
|
|
1988
|
28 |
5 |
p. 835-
1 p.
|
artikel
|
| 106 |
Software metrics: Measuring the progress of software development
|
Tran, Tuyet-Lan
|
|
1988
|
28 |
5 |
p. 693-702
10 p.
|
artikel
|
| 107 |
Some criteria for reliability growth
|
Baxter, Laurence A.
|
|
1988
|
28 |
5 |
p. 743-750
8 p.
|
artikel
|
| 108 |
Some techniques of minimum mean square error estimation
|
Shah, M.C.
|
|
1988
|
28 |
5 |
p. 689-691
3 p.
|
artikel
|
| 109 |
Stress analysis of partially yielded soldered joint for surface mount connectors
|
|
|
1988
|
28 |
5 |
p. 828-
1 p.
|
artikel
|
| 110 |
Stress related failures causing open metallization
|
|
|
1988
|
28 |
5 |
p. 827-
1 p.
|
artikel
|
| 111 |
Study of acceleration factor on moisture resistance test of plastic encapsulated semiconductor devices
|
Wada, T.
|
|
1988
|
28 |
5 |
p. 813-820
8 p.
|
artikel
|
| 112 |
Surface attach chip carriers for conventional and high-performance applications
|
|
|
1988
|
28 |
5 |
p. 833-
1 p.
|
artikel
|
| 113 |
Test et encapsulation des circuits intégrés logiques GaAs
|
|
|
1988
|
28 |
5 |
p. 828-
1 p.
|
artikel
|
| 114 |
Testing whether F is “more IFRA than is G”
|
Tiwari, Ram C.
|
|
1988
|
28 |
5 |
p. 703-712
10 p.
|
artikel
|
| 115 |
The clean module: advanced technology for processing silicon wafers
|
|
|
1988
|
28 |
5 |
p. 833-
1 p.
|
artikel
|
| 116 |
The effect of Cu addition to Al-Si interconnects on stress induced open-circuit failures
|
|
|
1988
|
28 |
5 |
p. 827-
1 p.
|
artikel
|
| 117 |
The effects of processing of EEPROM reliability
|
|
|
1988
|
28 |
5 |
p. 828-
1 p.
|
artikel
|
| 118 |
The fundamental limits for electronic packaging and systems
|
|
|
1988
|
28 |
5 |
p. 833-
1 p.
|
artikel
|
| 119 |
The impact of R&M 2000 on MCAIR integrated logistic support
|
|
|
1988
|
28 |
5 |
p. 828-
1 p.
|
artikel
|
| 120 |
The microstructure of ball bond corrosion failures
|
|
|
1988
|
28 |
5 |
p. 826-
1 p.
|
artikel
|
| 121 |
The Navy's best practices approach to reliability and quality
|
|
|
1988
|
28 |
5 |
p. 832-
1 p.
|
artikel
|
| 122 |
Theoretical and experimental study of subsurface burnout and ESD in GaAs FETs and HEMTs
|
|
|
1988
|
28 |
5 |
p. 825-
1 p.
|
artikel
|
| 123 |
Thermal fatigue reliability of SMT packages and interconnections
|
|
|
1988
|
28 |
5 |
p. 826-
1 p.
|
artikel
|
| 124 |
Thermal management of air- and liquid-cooled multichip modules
|
|
|
1988
|
28 |
5 |
p. 833-
1 p.
|
artikel
|
| 125 |
The R&M 2000 initiative Air Force R&M policy letters
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|
|
1988
|
28 |
5 |
p. 831-
1 p.
|
artikel
|
| 126 |
Trends in parametric test systems
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|
|
1988
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28 |
5 |
p. 825-
1 p.
|
artikel
|
| 127 |
Uncertainty propagation in fault tree analyses using lognormal distributions
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|
1988
|
28 |
5 |
p. 829-
1 p.
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artikel
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| 128 |
US Army reliability initiatives—in concert with Air Force R&M 2000
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|
1988
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28 |
5 |
p. 830-831
2 p.
|
artikel
|
| 129 |
Wet bench fire suppression
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|
|
1988
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28 |
5 |
p. 833-
1 p.
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artikel
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