| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Accelerated ageing and solderability testing of printed wiring boards
|
|
|
1988
|
28 |
4 |
p. 654-
1 p.
|
artikel
|
| 2 |
4719411 Addressable test matrix for measuring analog transfer characteristics of test elements used for integrated process control and device evaluation
|
Buehler, MartinG
|
|
1988
|
28 |
4 |
p. 667-668
2 p.
|
artikel
|
| 3 |
Advances in hybrid chip placement
|
|
|
1988
|
28 |
4 |
p. 662-
1 p.
|
artikel
|
| 4 |
A linear analytical model for cost vs. repair time
|
Govil, K.K.
|
|
1988
|
28 |
4 |
p. 649-
1 p.
|
artikel
|
| 5 |
A method for predicting VLSI-device reliability using series models for failure mechanisms
|
|
|
1988
|
28 |
4 |
p. 654-655
2 p.
|
artikel
|
| 6 |
A multiple-disk system for both fault tolerance and improved performance
|
|
|
1988
|
28 |
4 |
p. 656-
1 p.
|
artikel
|
| 7 |
An alternative derivation of the hazard rate
|
|
|
1988
|
28 |
4 |
p. 656-
1 p.
|
artikel
|
| 8 |
Analysis of digital integrated circuits using charge conservation principle
|
|
|
1988
|
28 |
4 |
p. 660-
1 p.
|
artikel
|
| 9 |
Analysis of human contaminants pinpoint sources of IC defects
|
|
|
1988
|
28 |
4 |
p. 654-
1 p.
|
artikel
|
| 10 |
Analysis of typical fault-tolerant architectures using HARP
|
|
|
1988
|
28 |
4 |
p. 657-
1 p.
|
artikel
|
| 11 |
Analyzing parametric test structures
|
|
|
1988
|
28 |
4 |
p. 659-
1 p.
|
artikel
|
| 12 |
An anomalous feature on the DLTS spectrum of silicon
|
|
|
1988
|
28 |
4 |
p. 661-
1 p.
|
artikel
|
| 13 |
An improved algorithm for multibridge network reduction
|
|
|
1988
|
28 |
4 |
p. 657-
1 p.
|
artikel
|
| 14 |
A polysilicon-on-oxide (POSOX) isolation structure for bipolar integrated circuits
|
|
|
1988
|
28 |
4 |
p. 661-
1 p.
|
artikel
|
| 15 |
4720034 Apparatus and method of solder coating integrated circuit leads
|
Lee, JongS
|
|
1988
|
28 |
4 |
p. 668-
1 p.
|
artikel
|
| 16 |
Application of controlled atmosphere IR furnaces to Cerdip sealing
|
|
|
1988
|
28 |
4 |
p. 659-660
2 p.
|
artikel
|
| 17 |
Applications of microfocussed ion beams in surface and thin film analysis
|
|
|
1988
|
28 |
4 |
p. 663-
1 p.
|
artikel
|
| 18 |
Approximate fault-tree analysis with prescribed accuracy
|
|
|
1988
|
28 |
4 |
p. 656-
1 p.
|
artikel
|
| 19 |
4722084 Array reconfiguration apparatus and methods particularly adapted for use with very large scale integrated circuits
|
Morton, StevenG
|
|
1988
|
28 |
4 |
p. 670-
1 p.
|
artikel
|
| 20 |
A scientific guide to surface mount technology
|
G.W.A.D.,
|
|
1988
|
28 |
4 |
p. 652-
1 p.
|
artikel
|
| 21 |
A simple expert system for a mask shop
|
|
|
1988
|
28 |
4 |
p. 660-
1 p.
|
artikel
|
| 22 |
A study of the imidization kinetics of polyimide resin curing
|
Osredkar, Radko
|
|
1988
|
28 |
4 |
p. 599-603
5 p.
|
artikel
|
| 23 |
A summary of optimum replacement policies for a parallel redundant system
|
Yasui, K.
|
|
1988
|
28 |
4 |
p. 635-641
7 p.
|
artikel
|
| 24 |
Automated defect detection on patterned wafers
|
|
|
1988
|
28 |
4 |
p. 654-
1 p.
|
artikel
|
| 25 |
Automatic back-end enhances ceramic quad assembly
|
|
|
1988
|
28 |
4 |
p. 659-
1 p.
|
artikel
|
| 26 |
Calculation of coverage parameter
|
|
|
1988
|
28 |
4 |
p. 656-
1 p.
|
artikel
|
| 27 |
Characterization of fault recovery through fault injection on FTMP
|
|
|
1988
|
28 |
4 |
p. 657-
1 p.
|
artikel
|
| 28 |
Charge generation in thin SiO2 polysilicon-gate MOS capacitors
|
|
|
1988
|
28 |
4 |
p. 661-
1 p.
|
artikel
|
| 29 |
Chip technology for crystal units and oscillators
|
|
|
1988
|
28 |
4 |
p. 661-
1 p.
|
artikel
|
| 30 |
Chip trimmer capacitors: the latest technology and product trends
|
|
|
1988
|
28 |
4 |
p. 660-
1 p.
|
artikel
|
| 31 |
Chip trimmer potentiometer for flow/reflow soldering
|
|
|
1988
|
28 |
4 |
p. 660-
1 p.
|
artikel
|
| 32 |
Cleaning techniques for wafer surfaces
|
|
|
1988
|
28 |
4 |
p. 659-
1 p.
|
artikel
|
| 33 |
Clock distribution in application specific integrated circuits
|
|
|
1988
|
28 |
4 |
p. 660-
1 p.
|
artikel
|
| 34 |
Closed-form solution for system availability distribution
|
|
|
1988
|
28 |
4 |
p. 655-656
2 p.
|
artikel
|
| 35 |
Comparison of dry film and liquid photo-imageable solder masks for surface-mount assemblies
|
|
|
1988
|
28 |
4 |
p. 659-
1 p.
|
artikel
|
| 36 |
4709366 Computer assisted fault isolation in circuit board testing
|
Scott, Marshall
|
|
1988
|
28 |
4 |
p. 665-
1 p.
|
artikel
|
| 37 |
Computer-assisted Markov failure modeling of process control systems
|
|
|
1988
|
28 |
4 |
p. 656-
1 p.
|
artikel
|
| 38 |
Conference report The 34th reliability and maintainability symposium
|
Jacobs, R.M.
|
|
1988
|
28 |
4 |
p. 507-509
3 p.
|
artikel
|
| 39 |
Contactless probing
|
|
|
1988
|
28 |
4 |
p. 653-
1 p.
|
artikel
|
| 40 |
Contamination problems within SMT
|
|
|
1988
|
28 |
4 |
p. 653-
1 p.
|
artikel
|
| 41 |
Correlated failures in fault-tolerant computers
|
|
|
1988
|
28 |
4 |
p. 658-
1 p.
|
artikel
|
| 42 |
Critical aspects of multilayer manufacture
|
|
|
1988
|
28 |
4 |
p. 659-
1 p.
|
artikel
|
| 43 |
4719125 Cyclosilazane polymers as dielectric films in integrated circuit fabrication technology
|
Anello, Louis
|
|
1988
|
28 |
4 |
p. 667-
1 p.
|
artikel
|
| 44 |
D.C. leakage currents in 1,1,1-trichloroethane oxides
|
Bhan, R.K.
|
|
1988
|
28 |
4 |
p. 531-533
3 p.
|
artikel
|
| 45 |
Deprocessing locates IC failure causes
|
|
|
1988
|
28 |
4 |
p. 654-
1 p.
|
artikel
|
| 46 |
Design and fabrication of quartz carriers
|
|
|
1988
|
28 |
4 |
p. 659-
1 p.
|
artikel
|
| 47 |
Determination of combinational logic circuit reliability through generation of fault diagnosis tests
|
Dokouzgiannis, S.P.
|
|
1988
|
28 |
4 |
p. 541-545
5 p.
|
artikel
|
| 48 |
Developments in passive thermal management systems for electronics
|
|
|
1988
|
28 |
4 |
p. 660-
1 p.
|
artikel
|
| 49 |
Drift and diffusion of charge carriers in silicon and their empirical relation to the electronic field
|
|
|
1988
|
28 |
4 |
p. 662-
1 p.
|
artikel
|
| 50 |
Effectiveness of planar diffusion sources
|
|
|
1988
|
28 |
4 |
p. 661-
1 p.
|
artikel
|
| 51 |
Effect of maintenance on the dependability and performance of multiprocessor systems
|
|
|
1988
|
28 |
4 |
p. 658-
1 p.
|
artikel
|
| 52 |
Effects of oxygen in silicon on device processing
|
|
|
1988
|
28 |
4 |
p. 662-
1 p.
|
artikel
|
| 53 |
Electrical and radiation characterization of three SOI material technologies
|
|
|
1988
|
28 |
4 |
p. 659-
1 p.
|
artikel
|
| 54 |
Endurance of EEPROMs with on-chip error correction
|
|
|
1988
|
28 |
4 |
p. 660-
1 p.
|
artikel
|
| 55 |
Errata
|
|
|
1988
|
28 |
4 |
p. 671-
1 p.
|
artikel
|
| 56 |
Estimating the mean life time when new is better than used in expectation
|
Ebrahimi, Nader
|
|
1988
|
28 |
4 |
p. 569-571
3 p.
|
artikel
|
| 57 |
Etching process byproducts challenge vacuum pumps
|
|
|
1988
|
28 |
4 |
p. 659-
1 p.
|
artikel
|
| 58 |
Evaluation of mean time to system failure of a system of relays under testing conditions
|
|
|
1988
|
28 |
4 |
p. 655-
1 p.
|
artikel
|
| 59 |
Experimental technique for resist process evaluation
|
|
|
1988
|
28 |
4 |
p. 659-
1 p.
|
artikel
|
| 60 |
Fabrication and characteristics of tin-doped n-layers into gallium arsenide by an open-tube diffusion process
|
|
|
1988
|
28 |
4 |
p. 661-
1 p.
|
artikel
|
| 61 |
Fault-tolerant system using 3-value logic circuits
|
|
|
1988
|
28 |
4 |
p. 657-
1 p.
|
artikel
|
| 62 |
4717347 Flatpack burn-in socket
|
Babow, DavidA
|
|
1988
|
28 |
4 |
p. 666-
1 p.
|
artikel
|
| 63 |
Fowler-Nordheim tunneling in implanted MOS devices
|
|
|
1988
|
28 |
4 |
p. 662-663
2 p.
|
artikel
|
| 64 |
Fretting corrosion of tin-coated electrical contacts
|
|
|
1988
|
28 |
4 |
p. 654-
1 p.
|
artikel
|
| 65 |
Fuzzy apportionment of system reliability
|
|
|
1988
|
28 |
4 |
p. 657-
1 p.
|
artikel
|
| 66 |
‘Hands-off’ furnace systems
|
|
|
1988
|
28 |
4 |
p. 659-
1 p.
|
artikel
|
| 67 |
High energy ion implantation
|
|
|
1988
|
28 |
4 |
p. 663-
1 p.
|
artikel
|
| 68 |
Human performance reliability modelling
|
Dhillon, Balbir S.
|
|
1988
|
28 |
4 |
p. 573-580
8 p.
|
artikel
|
| 69 |
Hybrid ICs changing fast in a fast-changing world
|
|
|
1988
|
28 |
4 |
p. 662-
1 p.
|
artikel
|
| 70 |
4710704 IC test equipment
|
Ando, Masakaz
|
|
1988
|
28 |
4 |
p. 666-
1 p.
|
artikel
|
| 71 |
4715501 IC test equipment
|
Sato, Hirosh
|
|
1988
|
28 |
4 |
p. 666-
1 p.
|
artikel
|
| 72 |
Illumination for visual photomask inspection
|
|
|
1988
|
28 |
4 |
p. 659-
1 p.
|
artikel
|
| 73 |
Information requirements of the quality assurance system
|
|
|
1988
|
28 |
4 |
p. 655-
1 p.
|
artikel
|
| 74 |
In situ examination of segregation and wear processes of precious metal electrical contact alloys
|
|
|
1988
|
28 |
4 |
p. 653-
1 p.
|
artikel
|
| 75 |
4707654 Integrated circuit having input and output terminals for testing
|
Suzuki, Toshir
|
|
1988
|
28 |
4 |
p. 665-
1 p.
|
artikel
|
| 76 |
4721995 Integrated circuit semiconductor device formed on a wafer
|
Tanizawa, Tetsu
|
|
1988
|
28 |
4 |
p. 669-
1 p.
|
artikel
|
| 77 |
Interfacial properties of metal overlayers on III–V compounds
|
|
|
1988
|
28 |
4 |
p. 662-
1 p.
|
artikel
|
| 78 |
Investigation of numerical algorithms in semiconductor device simulation
|
|
|
1988
|
28 |
4 |
p. 661-
1 p.
|
artikel
|
| 79 |
Issues in wire bonding quality control
|
|
|
1988
|
28 |
4 |
p. 654-
1 p.
|
artikel
|
| 80 |
Lead mapping in automatic wire bonding
|
|
|
1988
|
28 |
4 |
p. 659-
1 p.
|
artikel
|
| 81 |
Materials and process characterization using ICP and AES
|
|
|
1988
|
28 |
4 |
p. 659-
1 p.
|
artikel
|
| 82 |
Mechanization and automation in assembly
|
|
|
1988
|
28 |
4 |
p. 659-
1 p.
|
artikel
|
| 83 |
4717602 Method for producing silicon nitride layers
|
Yamazaki, Shunpei
|
|
1988
|
28 |
4 |
p. 667-
1 p.
|
artikel
|
| 84 |
4716564 Method for test generation
|
Hung, AngeloCJ
|
|
1988
|
28 |
4 |
p. 666-
1 p.
|
artikel
|
| 85 |
Methodology development for safety and reliability analysis for electrical mine monitoring systems
|
Iskander, Wafik H.
|
|
1988
|
28 |
4 |
p. 581-597
17 p.
|
artikel
|
| 86 |
Microcontamination reduction in PECVD systems—part 1
|
|
|
1988
|
28 |
4 |
p. 659-
1 p.
|
artikel
|
| 87 |
Microcontamination reduction in PECVD systems—Part 2
|
|
|
1988
|
28 |
4 |
p. 661-
1 p.
|
artikel
|
| 88 |
Monitoring, controlling, and resolving connector-related concerns
|
|
|
1988
|
28 |
4 |
p. 654-
1 p.
|
artikel
|
| 89 |
4719417 Multi-level test probe assembly for IC chips
|
Evans, Arthur
|
|
1988
|
28 |
4 |
p. 668-
1 p.
|
artikel
|
| 90 |
Numerical verification of substrate current model in silicon IGFETS
|
|
|
1988
|
28 |
4 |
p. 661-
1 p.
|
artikel
|
| 91 |
On a class of optimal preventive replacement policies of systems subject to shocks
|
Rangan, A.
|
|
1988
|
28 |
4 |
p. 563-568
6 p.
|
artikel
|
| 92 |
4720670 On chip performance predictor circuit
|
Boyle, DavidH
|
|
1988
|
28 |
4 |
p. 668-669
2 p.
|
artikel
|
| 93 |
On optimal redundancy of multivalue-output systems
|
|
|
1988
|
28 |
4 |
p. 656-
1 p.
|
artikel
|
| 94 |
On the choice of appropriate ionization coefficients for breakdown voltage calculations
|
|
|
1988
|
28 |
4 |
p. 661-
1 p.
|
artikel
|
| 95 |
Operational behaviour of a complex system operating under different weather conditions
|
Gupta, P.P.
|
|
1988
|
28 |
4 |
p. 525-529
5 p.
|
artikel
|
| 96 |
Optical second-harmonic generation of modulation doped Ga0.8Al0.2As film grown by molecular beam epitaxy
|
|
|
1988
|
28 |
4 |
p. 663-
1 p.
|
artikel
|
| 97 |
Optimal replacement policy for induced draft fans
|
Das, K.K.
|
|
1988
|
28 |
4 |
p. 519-523
5 p.
|
artikel
|
| 98 |
Optimal software release policies using SLUMT
|
Cǎtuneanu, V.M.
|
|
1988
|
28 |
4 |
p. 547-549
3 p.
|
artikel
|
| 99 |
Optimizing clean room efficiency
|
|
|
1988
|
28 |
4 |
p. 659-
1 p.
|
artikel
|
| 100 |
Order-clustering of secant tips into edges for positioning of semiconductor structures
|
Wojcik, Zbigniew M.
|
|
1988
|
28 |
4 |
p. 551-561
11 p.
|
artikel
|
| 101 |
Parallel algorithms for chip placement by simulated annealing
|
|
|
1988
|
28 |
4 |
p. 659-
1 p.
|
artikel
|
| 102 |
Parametric point estimation for a doubly-truncated Weibull distribution
|
Wingo, Dallas R.
|
|
1988
|
28 |
4 |
p. 613-617
5 p.
|
artikel
|
| 103 |
Pb-Sn alloy microstructure: potential reliability indicator for interconnects
|
|
|
1988
|
28 |
4 |
p. 653-654
2 p.
|
artikel
|
| 104 |
Performance analysis of sub-micron gate GaAs MESFETS
|
|
|
1988
|
28 |
4 |
p. 662-
1 p.
|
artikel
|
| 105 |
Polymer thick film systems and surface mount techniques
|
|
|
1988
|
28 |
4 |
p. 662-
1 p.
|
artikel
|
| 106 |
Problems associated with quality control sampling in modern IC manufacturing
|
|
|
1988
|
28 |
4 |
p. 654-
1 p.
|
artikel
|
| 107 |
Producing maintainable software
|
|
|
1988
|
28 |
4 |
p. 656-657
2 p.
|
artikel
|
| 108 |
Profiling generation lifetime in an MOS capacitor using a multistep constant-capacitance technique
|
|
|
1988
|
28 |
4 |
p. 653-
1 p.
|
artikel
|
| 109 |
Publications, notices, calls for papers, etc.
|
|
|
1988
|
28 |
4 |
p. 501-506
6 p.
|
artikel
|
| 110 |
Punchthrough limits in MOS devices
|
|
|
1988
|
28 |
4 |
p. 660-
1 p.
|
artikel
|
| 111 |
4719410 Redundancy-secured semiconductor device
|
Nishimura, Yasumasa
|
|
1988
|
28 |
4 |
p. 667-
1 p.
|
artikel
|
| 112 |
Reliability analysis of a k-out-of-N: F repairable system with dependent units
|
Mokhles, N.A.
|
|
1988
|
28 |
4 |
p. 535-539
5 p.
|
artikel
|
| 113 |
Reliability analysis of a multipath switching network
|
Pullum, G.G.
|
|
1988
|
28 |
4 |
p. 619-633
15 p.
|
artikel
|
| 114 |
Reliability measures for a regenerative system viewed over a random horizon
|
|
|
1988
|
28 |
4 |
p. 656-
1 p.
|
artikel
|
| 115 |
Reliability modeling using SHARPE
|
|
|
1988
|
28 |
4 |
p. 656-
1 p.
|
artikel
|
| 116 |
Reliability of CMOS ICs with gate oxide shorts
|
|
|
1988
|
28 |
4 |
p. 654-
1 p.
|
artikel
|
| 117 |
Reliability of primary batteries: a case history
|
|
|
1988
|
28 |
4 |
p. 655-
1 p.
|
artikel
|
| 118 |
Reliability of systems with limited repairs
|
|
|
1988
|
28 |
4 |
p. 657-658
2 p.
|
artikel
|
| 119 |
Reliability optimization of complex systems using random search technique
|
Mohan, C.
|
|
1988
|
28 |
4 |
p. 513-518
6 p.
|
artikel
|
| 120 |
Reliability study of loss of off-site power supply
|
|
|
1988
|
28 |
4 |
p. 656-
1 p.
|
artikel
|
| 121 |
Reliable distributed database management
|
|
|
1988
|
28 |
4 |
p. 655-
1 p.
|
artikel
|
| 122 |
RIE of multilayer metal interconnects for VLSI
|
|
|
1988
|
28 |
4 |
p. 659-
1 p.
|
artikel
|
| 123 |
Scanned electron beam alloyed OHMIC contacts to n-GaAs
|
|
|
1988
|
28 |
4 |
p. 662-
1 p.
|
artikel
|
| 124 |
4720671 Semiconductor device testing device
|
Tada, Tetsuo
|
|
1988
|
28 |
4 |
p. 669-
1 p.
|
artikel
|
| 125 |
4719634 Semiconductor laser array with fault tolerant coupling
|
Streifer, William
|
|
1988
|
28 |
4 |
p. 668-
1 p.
|
artikel
|
| 126 |
Semicustom LSIs: new technology leads to larger market
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1988
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28 |
4 |
p. 658-
1 p.
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artikel
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| 127 |
SIMOX SOI for integrated circuit fabrication
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1988
|
28 |
4 |
p. 659-
1 p.
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artikel
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| 128 |
Sliding studies of new connector contact lubricants
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1988
|
28 |
4 |
p. 654-
1 p.
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artikel
|
| 129 |
4718855 Socket for integrated circuit component
|
Billman, TimothyB
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1988
|
28 |
4 |
p. 667-
1 p.
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artikel
|
| 130 |
4720778 Software debugging analyzer
|
Hall, Kevin
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1988
|
28 |
4 |
p. 669-
1 p.
|
artikel
|
| 131 |
Some aspects of accelerated life testing by progressive stress
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1988
|
28 |
4 |
p. 657-
1 p.
|
artikel
|
| 132 |
Some aspects of reliability growth
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1988
|
28 |
4 |
p. 653-
1 p.
|
artikel
|
| 133 |
State of the art of wafer scale integration
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1988
|
28 |
4 |
p. 658-
1 p.
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artikel
|
| 134 |
Statistical process control in photolithography
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1988
|
28 |
4 |
p. 658-
1 p.
|
artikel
|
| 135 |
Sudden failures associated with the gate oxide of CMOS transistors
|
Pešić, B.
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|
1988
|
28 |
4 |
p. 643-648
6 p.
|
artikel
|
| 136 |
Testbed-based validation of design techniques for reliable distributed real-time systems
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1988
|
28 |
4 |
p. 655-
1 p.
|
artikel
|
| 137 |
Testing hypotheses on correctness software estimation
|
Roca, Jose Luis
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|
1988
|
28 |
4 |
p. 511-512
2 p.
|
artikel
|
| 138 |
4710440 Test mask for determining alignment of an automatic IC mask testing apparatus
|
Del, PriorePaulJ
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|
1988
|
28 |
4 |
p. 665-
1 p.
|
artikel
|
| 139 |
Theory of defect complexes at semiconductor surfaces
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1988
|
28 |
4 |
p. 662-
1 p.
|
artikel
|
| 140 |
The test connection: plugging ATE into CAE
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1988
|
28 |
4 |
p. 660-
1 p.
|
artikel
|
| 141 |
The versatility of digital signal processing chips
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1988
|
28 |
4 |
p. 659-
1 p.
|
artikel
|
| 142 |
To date: integration reduces size and lowers yield
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1988
|
28 |
4 |
p. 658-
1 p.
|
artikel
|
| 143 |
Transferring wafer processing to production
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1988
|
28 |
4 |
p. 659-
1 p.
|
artikel
|
| 144 |
Transient electron beam annealing of arsenic implanted silicon
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|
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1988
|
28 |
4 |
p. 663-
1 p.
|
artikel
|
| 145 |
Treatise on clean surface technology (volume 1)
|
G.W.A.D.,
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|
1988
|
28 |
4 |
p. 651-
1 p.
|
artikel
|
| 146 |
Tunneling and thermal noise as limiting factors in microelectronics
|
Goser, Karl
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|
1988
|
28 |
4 |
p. 605-611
7 p.
|
artikel
|
| 147 |
Upgraded signal source with improved performance and reliability
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1988
|
28 |
4 |
p. 660-
1 p.
|
artikel
|
| 148 |
Zone-melting recrystallization silicon-on-insulator technology
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1988
|
28 |
4 |
p. 658-
1 p.
|
artikel
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