nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
A closed loop system for reliability improvement
|
|
|
1987 |
27 |
2 |
p. 382- 1 p. |
artikel |
2 |
A computer-aided technique for fault detection in combinational circuits
|
Rai, Suresh |
|
1987 |
27 |
2 |
p. 263-265 3 p. |
artikel |
3 |
A decomposition technique for the overall reliability evaluation of large computer communication networks
|
Mandaltsis, D. |
|
1987 |
27 |
2 |
p. 299-312 14 p. |
artikel |
4 |
ADEE grows with automation trend
|
|
|
1987 |
27 |
2 |
p. 383- 1 p. |
artikel |
5 |
4612805 Adhesion characterization test site
|
Bruce, JamesA |
|
1987 |
27 |
2 |
p. 397- 1 p. |
artikel |
6 |
Airborne particle monitoring approaches 0.1 μm
|
|
|
1987 |
27 |
2 |
p. 387- 1 p. |
artikel |
7 |
A memory-effective fast algorithm for computing the reliability of complex systems/networks
|
Rueger, W.J. |
|
1987 |
27 |
2 |
p. 273-277 5 p. |
artikel |
8 |
A modified ion source for semiconductor implantation purposes
|
|
|
1987 |
27 |
2 |
p. 391- 1 p. |
artikel |
9 |
An algorithm for automatic prober movement control for better coverage of test sites on a wafer during measurement
|
Gupta, Shobha |
|
1987 |
27 |
2 |
p. 281-282 2 p. |
artikel |
10 |
An availability prediction method for computer systems
|
|
|
1987 |
27 |
2 |
p. 381-382 2 p. |
artikel |
11 |
A new scheme for device packaging
|
|
|
1987 |
27 |
2 |
p. 385- 1 p. |
artikel |
12 |
Applications for MeV ion implantation
|
|
|
1987 |
27 |
2 |
p. 391- 1 p. |
artikel |
13 |
A self-focused multichannel electron beam source for annealing of ion-implanted semiconductors
|
|
|
1987 |
27 |
2 |
p. 391- 1 p. |
artikel |
14 |
A simple technique for failure analysis of MOS IC using liquid crystal
|
|
|
1987 |
27 |
2 |
p. 380- 1 p. |
artikel |
15 |
A study on optimal maintenance of system with exponential distribution
|
|
|
1987 |
27 |
2 |
p. 382- 1 p. |
artikel |
16 |
A Tellegen's theorem approach to the fault diagnosis of general analog circuits
|
Al-Shanuti, Sulaiman I. |
|
1987 |
27 |
2 |
p. 283-297 15 p. |
artikel |
17 |
Availability of a system with permissible repair time
|
|
|
1987 |
27 |
2 |
p. 381- 1 p. |
artikel |
18 |
A VHSIC lithography overview
|
|
|
1987 |
27 |
2 |
p. 384- 1 p. |
artikel |
19 |
Bibliography of literature on reliability in automotive industries
|
Dhillon, Balbir S. |
|
1987 |
27 |
2 |
p. 361-373 13 p. |
artikel |
20 |
Built-in-test for fail-safe design
|
|
|
1987 |
27 |
2 |
p. 383- 1 p. |
artikel |
21 |
Built-in-test verification techniques
|
|
|
1987 |
27 |
2 |
p. 383- 1 p. |
artikel |
22 |
CAFTA+: a comprehensive fault tree development work station
|
|
|
1987 |
27 |
2 |
p. 383- 1 p. |
artikel |
23 |
Calculating the S-T up and down distributions of a class of stochastic networks
|
Kiu, Sun-Wah |
|
1987 |
27 |
2 |
p. 313-326 14 p. |
artikel |
24 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
|
|
1987 |
27 |
2 |
p. 201-205 5 p. |
artikel |
25 |
Classification of macroscopic defects contained in p-type EFG ribbon silicon
|
|
|
1987 |
27 |
2 |
p. 388- 1 p. |
artikel |
26 |
4590388 CMOS spare decoder circuit
|
Clemons, DonaldG |
|
1987 |
27 |
2 |
p. 393- 1 p. |
artikel |
27 |
CMOS—the emerging VLSI technology
|
|
|
1987 |
27 |
2 |
p. 384- 1 p. |
artikel |
28 |
Combined in-circuit and functional tests: Model and application
|
Sultan, Torky I. |
|
1987 |
27 |
2 |
p. 279-280 2 p. |
artikel |
29 |
Corrosion failure modes in a TAB200 test vehicle
|
|
|
1987 |
27 |
2 |
p. 382- 1 p. |
artikel |
30 |
Current-leakage kinetics across tinned Cr/Cu lands having epoxy overlay
|
|
|
1987 |
27 |
2 |
p. 379- 1 p. |
artikel |
31 |
Custom v.l.s.i. circuits for man-machine interaction: an automatic design method
|
|
|
1987 |
27 |
2 |
p. 387- 1 p. |
artikel |
32 |
Designing and manufacturing surface mount assemblies
|
|
|
1987 |
27 |
2 |
p. 386- 1 p. |
artikel |
33 |
Designing for reliability in the automatic washing machine with a micro-computer
|
|
|
1987 |
27 |
2 |
p. 382- 1 p. |
artikel |
34 |
Designing sequential life test with type I censoring
|
|
|
1987 |
27 |
2 |
p. 381- 1 p. |
artikel |
35 |
Determination of all hamiltonian paths and circuits and the minimal feedback set in a graph through Petri nets
|
Hura, G.S. |
|
1987 |
27 |
2 |
p. 223-227 5 p. |
artikel |
36 |
4604572 Device for testing semiconductor devices at a high temperature
|
Horiuchi, Akinor |
|
1987 |
27 |
2 |
p. 395- 1 p. |
artikel |
37 |
Direct-write pyrolytic laser deposition
|
|
|
1987 |
27 |
2 |
p. 392- 1 p. |
artikel |
38 |
Dominating the maximum likelihood estimator in predicting reliability
|
Jaisingh, Lloyd R. |
|
1987 |
27 |
2 |
p. 345-350 6 p. |
artikel |
39 |
4598308 Easily repairable, low cost, high speed electromechanical assembly of integrated circuit die
|
James, ChristopherD |
|
1987 |
27 |
2 |
p. 395- 1 p. |
artikel |
40 |
Effect of planarization on VLSI processing
|
|
|
1987 |
27 |
2 |
p. 386- 1 p. |
artikel |
41 |
Efficient silicon compilation of digital control specifications
|
|
|
1987 |
27 |
2 |
p. 387- 1 p. |
artikel |
42 |
Electrical and thermal stability of AuGeNi OHMIC contacts to GaAs fabricated with in situ RF sputter cleaning
|
|
|
1987 |
27 |
2 |
p. 388- 1 p. |
artikel |
43 |
Electrical characterization of packages for high-speed integrated circuits
|
|
|
1987 |
27 |
2 |
p. 387- 1 p. |
artikel |
44 |
Environmental stress screening (ESS) demonstrate its value in the field
|
|
|
1987 |
27 |
2 |
p. 383- 1 p. |
artikel |
45 |
EPIC: a cost-effective plastic chip carrier for VLSI packaging
|
|
|
1987 |
27 |
2 |
p. 385- 1 p. |
artikel |
46 |
4612640 Error checking and correction circuitry for use with an electrically-programmable and electrically-erasable memory array
|
Mehrotra, Sanja |
|
1987 |
27 |
2 |
p. 396-397 2 p. |
artikel |
47 |
Estimation of reliability for silicon devices irradiated with electrons
|
|
|
1987 |
27 |
2 |
p. 392- 1 p. |
artikel |
48 |
Estimation of storage of spare replacement/maintainance equipment
|
|
|
1987 |
27 |
2 |
p. 382- 1 p. |
artikel |
49 |
Evaluating ion implanter options
|
|
|
1987 |
27 |
2 |
p. 391- 1 p. |
artikel |
50 |
Field data on electronic components for industrial measuring instruments and their problems
|
|
|
1987 |
27 |
2 |
p. 380- 1 p. |
artikel |
51 |
Future requirements of pure water analysis
|
|
|
1987 |
27 |
2 |
p. 387- 1 p. |
artikel |
52 |
G/G/G two-unit standby redundant systems
|
Subramanian, R. |
|
1987 |
27 |
2 |
p. 249-261 13 p. |
artikel |
53 |
Guidance in the use of MIL-STD-781D and MIL-HDBK-781
|
|
|
1987 |
27 |
2 |
p. 384- 1 p. |
artikel |
54 |
Hazardous production gases. Part 1: storage and control
|
|
|
1987 |
27 |
2 |
p. 387- 1 p. |
artikel |
55 |
High-accuracy die-bonding technology for LED array
|
|
|
1987 |
27 |
2 |
p. 385- 1 p. |
artikel |
56 |
High-adhesion thick-film gold without glass or metal-oxide powder additives
|
|
|
1987 |
27 |
2 |
p. 389- 1 p. |
artikel |
57 |
8603632 High reliability complementary logic
|
Kirsch, HowardClayton |
|
1987 |
27 |
2 |
p. 398- 1 p. |
artikel |
58 |
High reliable package designing of the surface mount device; PLCC
|
|
|
1987 |
27 |
2 |
p. 386- 1 p. |
artikel |
59 |
How to calculate the true permissible leak rate and how to raise it by four orders of magnitude
|
|
|
1987 |
27 |
2 |
p. 385-386 2 p. |
artikel |
60 |
Human performance reliability modeling
|
|
|
1987 |
27 |
2 |
p. 379- 1 p. |
artikel |
61 |
Human reliability analysis, prediction, and prevention of human errors
|
G.W.A.D., |
|
1987 |
27 |
2 |
p. 375-376 2 p. |
artikel |
62 |
IC interface for electronic displays: the way forward
|
|
|
1987 |
27 |
2 |
p. 383-384 2 p. |
artikel |
63 |
Imaging latch-up sites in CMOS integrated circuits using laser scanning
|
|
|
1987 |
27 |
2 |
p. 391- 1 p. |
artikel |
64 |
Improving thermosonic gold ball bond reliability
|
|
|
1987 |
27 |
2 |
p. 385- 1 p. |
artikel |
65 |
Insuring reliability in the desing process
|
|
|
1987 |
27 |
2 |
p. 383- 1 p. |
artikel |
66 |
4613970 Integrated circuit device and method of diagnosing the same
|
Masuda, Ikuro |
|
1987 |
27 |
2 |
p. 397- 1 p. |
artikel |
67 |
International Conference ICOREM '86
|
|
|
1987 |
27 |
2 |
p. 221- 1 p. |
artikel |
68 |
Investigation and interpretation of adsorption on silicon surfaces
|
|
|
1987 |
27 |
2 |
p. 388- 1 p. |
artikel |
69 |
Investigation of the Si-SiO2 interface by surface inversion currents
|
|
|
1987 |
27 |
2 |
p. 388- 1 p. |
artikel |
70 |
Ion and plasma assisted etching of holographic gratings
|
|
|
1987 |
27 |
2 |
p. 390-391 2 p. |
artikel |
71 |
Ion implanters: major 1986 trends
|
|
|
1987 |
27 |
2 |
p. 391- 1 p. |
artikel |
72 |
Ionized cluster beam technique
|
|
|
1987 |
27 |
2 |
p. 391- 1 p. |
artikel |
73 |
Laser-based structure studies of silicon and gallium arsenide
|
|
|
1987 |
27 |
2 |
p. 391-392 2 p. |
artikel |
74 |
Laser-enhanced plating and etching for microelectronic applications
|
|
|
1987 |
27 |
2 |
p. 390- 1 p. |
artikel |
75 |
Laser planarization
|
|
|
1987 |
27 |
2 |
p. 391- 1 p. |
artikel |
76 |
Low-stress resin encapsulants for semiconductor devices
|
|
|
1987 |
27 |
2 |
p. 385- 1 p. |
artikel |
77 |
LSI failure analysis using an electron-beam tester directly combined to an LSI tester
|
|
|
1987 |
27 |
2 |
p. 390- 1 p. |
artikel |
78 |
Machine vision automates inspection of thick-film hybrids
|
|
|
1987 |
27 |
2 |
p. 389- 1 p. |
artikel |
79 |
4601034 Method and apparatus for testing very large scale integrated memory circuits
|
Sridhar, Thirumalai |
|
1987 |
27 |
2 |
p. 394- 1 p. |
artikel |
80 |
4600597 Method and device for determining the contour of spin-coated thin films of material on substrate topography
|
White, Lawrence |
|
1987 |
27 |
2 |
p. 393-394 2 p. |
artikel |
81 |
4599241 Method for inspecting defects of thin material film
|
Nakaboh, Hiroshi |
|
1987 |
27 |
2 |
p. 393- 1 p. |
artikel |
82 |
Miniature microwave hybrid circuits—alternative to monolithic circuits
|
|
|
1987 |
27 |
2 |
p. 389- 1 p. |
artikel |
83 |
Miniline: research applied to manufacturing
|
|
|
1987 |
27 |
2 |
p. 384-385 2 p. |
artikel |
84 |
4603405 Monolithically integrated semiconductor circuit
|
Michael, Ewald |
|
1987 |
27 |
2 |
p. 394- 1 p. |
artikel |
85 |
4602210 Multiplexed-access scan testable integrated circuit
|
Fasang, PatrickP |
|
1987 |
27 |
2 |
p. 394- 1 p. |
artikel |
86 |
New oxygen related shallow thermal donor centres in Czochralski-grown silicon
|
|
|
1987 |
27 |
2 |
p. 388- 1 p. |
artikel |
87 |
New plastic molded power devices for high reliability
|
|
|
1987 |
27 |
2 |
p. 381- 1 p. |
artikel |
88 |
Non-mass analysed ion implantation using microwave ion source
|
|
|
1987 |
27 |
2 |
p. 391- 1 p. |
artikel |
89 |
One micron lithography using a dyed resist on highly reflective topography
|
|
|
1987 |
27 |
2 |
p. 386- 1 p. |
artikel |
90 |
Packaging technology for the NEC SX supercomputer
|
|
|
1987 |
27 |
2 |
p. 385- 1 p. |
artikel |
91 |
PAFT F77, programme for the analysis of fault trees
|
|
|
1987 |
27 |
2 |
p. 382- 1 p. |
artikel |
92 |
Photomask and reticle materials review
|
|
|
1987 |
27 |
2 |
p. 387- 1 p. |
artikel |
93 |
Plasma deposition of metal oxide films for integrated optics
|
|
|
1987 |
27 |
2 |
p. 390- 1 p. |
artikel |
94 |
Plasma filament ion source
|
|
|
1987 |
27 |
2 |
p. 390- 1 p. |
artikel |
95 |
4591891 Post-metal electron beam programmable MOS read only memory
|
Chatterjee, PallabK |
|
1987 |
27 |
2 |
p. 393- 1 p. |
artikel |
96 |
Power-temperature dependence of elements in hybrid circuits
|
|
|
1987 |
27 |
2 |
p. 389- 1 p. |
artikel |
97 |
Probabilistic analysis of a two-unit system with a warm standby subject to preventive maintenance and a single service facility
|
Mokaddis, G.S. |
|
1987 |
27 |
2 |
p. 327-343 17 p. |
artikel |
98 |
Process physics: implications for manufacturing of submicron silicon devices
|
|
|
1987 |
27 |
2 |
p. 387- 1 p. |
artikel |
99 |
Products liability: the problem of the non-designing manufacturer
|
|
|
1987 |
27 |
2 |
p. 383- 1 p. |
artikel |
100 |
4605872 Programmable CMOS circuit for use in connecting and disconnecting a semiconductor device in a redundant electrical circuit
|
Rung, Robert |
|
1987 |
27 |
2 |
p. 396- 1 p. |
artikel |
101 |
4611320 Programmable testing analyzer
|
Southard, Gar |
|
1987 |
27 |
2 |
p. 396- 1 p. |
artikel |
102 |
Properties of reactive sputtered TiW
|
|
|
1987 |
27 |
2 |
p. 389- 1 p. |
artikel |
103 |
Publications, notices, calls for papers, Etc
|
|
|
1987 |
27 |
2 |
p. 207-219 13 p. |
artikel |
104 |
4616178 Pulsed linear integrated circuit tester
|
Thornton, MaxC |
|
1987 |
27 |
2 |
p. 397- 1 p. |
artikel |
105 |
Rapid evaluation methods for thick-film multilayer conductor systems for hybrid microcircuits
|
|
|
1987 |
27 |
2 |
p. 389- 1 p. |
artikel |
106 |
Recent IC assembly technology and reliability Ag paste glue die bonding
|
|
|
1987 |
27 |
2 |
p. 386- 1 p. |
artikel |
107 |
4606013 Redundancy-secured semiconductor memory
|
Yoshimoto, Masahiko |
|
1987 |
27 |
2 |
p. 396- 1 p. |
artikel |
108 |
Reliability analysis of a repairable parallel system with standby involving human error and common-cause failures
|
Who Kee Chung, |
|
1987 |
27 |
2 |
p. 269-271 3 p. |
artikel |
109 |
Reliability analysis of multiple-state devices
|
Who Kee Chung, |
|
1987 |
27 |
2 |
p. 267-268 2 p. |
artikel |
110 |
Reliability considerations for communications satellites
|
|
|
1987 |
27 |
2 |
p. 383- 1 p. |
artikel |
111 |
Reliability evaluation for optimally operated, large, electric power systems
|
|
|
1987 |
27 |
2 |
p. 382- 1 p. |
artikel |
112 |
Reliability growth by stress screening and more
|
|
|
1987 |
27 |
2 |
p. 383- 1 p. |
artikel |
113 |
Reliability of CRT. The life-span of CRT and the accelerated evaluation method
|
|
|
1987 |
27 |
2 |
p. 381- 1 p. |
artikel |
114 |
Reliability of GaAs FET
|
|
|
1987 |
27 |
2 |
p. 380- 1 p. |
artikel |
115 |
Reliability of high-voltage LSI's made using the dielectric isolation process
|
|
|
1987 |
27 |
2 |
p. 380- 1 p. |
artikel |
116 |
Semiconductor industry tries to move to single sourcing
|
|
|
1987 |
27 |
2 |
p. 384- 1 p. |
artikel |
117 |
4598388 Semiconductor memory with redundant column circuitry
|
Anderson, DanielF |
|
1987 |
27 |
2 |
p. 395- 1 p. |
artikel |
118 |
Sizing hybrid packages for optimum reliability
|
|
|
1987 |
27 |
2 |
p. 388-389 2 p. |
artikel |
119 |
Solder pad geometry studies for surface mount of chip capacitors
|
|
|
1987 |
27 |
2 |
p. 380- 1 p. |
artikel |
120 |
Specifying maintainability—a new approach
|
|
|
1987 |
27 |
2 |
p. 379- 1 p. |
artikel |
121 |
Steady-state computer simulations of package sealing methods
|
|
|
1987 |
27 |
2 |
p. 384- 1 p. |
artikel |
122 |
Stochastic model of multiple unit system
|
Subramanian, R. |
|
1987 |
27 |
2 |
p. 351-359 9 p. |
artikel |
123 |
Stress-induced deformation of aluminum metallization in plastic molded semiconductor devices
|
|
|
1987 |
27 |
2 |
p. 379-380 2 p. |
artikel |
124 |
Supply and failure data reliability analysis system
|
|
|
1987 |
27 |
2 |
p. 382- 1 p. |
artikel |
125 |
Surface mount digital package reliability
|
|
|
1987 |
27 |
2 |
p. 381- 1 p. |
artikel |
126 |
Surface mounted assemblies
|
G.W.A.D., |
|
1987 |
27 |
2 |
p. 376-377 2 p. |
artikel |
127 |
Surface mount technology experience: problems and solutions
|
|
|
1987 |
27 |
2 |
p. 387- 1 p. |
artikel |
128 |
Surface mount technology for high reliability telecoms applications
|
|
|
1987 |
27 |
2 |
p. 386- 1 p. |
artikel |
129 |
TAB versus wire bond—relative thermal performance
|
|
|
1987 |
27 |
2 |
p. 384- 1 p. |
artikel |
130 |
4612499 Test input demultiplexing circuit
|
Andresen, BernhardH |
|
1987 |
27 |
2 |
p. 396- 1 p. |
artikel |
131 |
8604686 Test pattern generator
|
Kawaguchi, Ikuo |
|
1987 |
27 |
2 |
p. 398- 1 p. |
artikel |
132 |
The development and application of an ion implanter based on ion thruster technology
|
|
|
1987 |
27 |
2 |
p. 390- 1 p. |
artikel |
133 |
The effect of joint design on the thermal fatigue life of leadless chip carrier solder joints
|
|
|
1987 |
27 |
2 |
p. 380- 1 p. |
artikel |
134 |
The highs and lows of reliability predictions
|
|
|
1987 |
27 |
2 |
p. 380-381 2 p. |
artikel |
135 |
The impact of surface mount technology on electronics manufacturing
|
|
|
1987 |
27 |
2 |
p. 386- 1 p. |
artikel |
136 |
The modeling of plasma etching processes using response surface methodology
|
|
|
1987 |
27 |
2 |
p. 387- 1 p. |
artikel |
137 |
Theoretical study of thermal properties for Si-Ge system
|
|
|
1987 |
27 |
2 |
p. 388- 1 p. |
artikel |
138 |
The PCB connector as a surface mounted device
|
|
|
1987 |
27 |
2 |
p. 385- 1 p. |
artikel |
139 |
The physical limitations of integration and size reduction in semiconductors
|
|
|
1987 |
27 |
2 |
p. 384- 1 p. |
artikel |
140 |
The reliability of surface mounted solder joints under PWB cyclic mechanical stresses
|
|
|
1987 |
27 |
2 |
p. 380- 1 p. |
artikel |
141 |
The technology of computer-aided design
|
|
|
1987 |
27 |
2 |
p. 386-387 2 p. |
artikel |
142 |
Thick film pressure transducers
|
|
|
1987 |
27 |
2 |
p. 389-390 2 p. |
artikel |
143 |
Throughput modeling for ion implantation
|
|
|
1987 |
27 |
2 |
p. 391- 1 p. |
artikel |
144 |
Trends and targets of high reliability test techniques for computer system
|
|
|
1987 |
27 |
2 |
p. 381- 1 p. |
artikel |
145 |
Étude et réalisation d'une colonne ionique pour faisceaux d'ions de dimensions submicroniques. Applications á l'écriture ionique localisée
|
|
|
1987 |
27 |
2 |
p. 390- 1 p. |
artikel |
146 |
Two-unit standby systems with non-instantaneous switchover and imperfect switch
|
Subramanian, R. |
|
1987 |
27 |
2 |
p. 237-247 11 p. |
artikel |
147 |
Ultradense chips: the drive quickens
|
|
|
1987 |
27 |
2 |
p. 386- 1 p. |
artikel |
148 |
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Anneberg, Lisa |
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1987 |
27 |
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149 |
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1987 |
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150 |
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1987 |
27 |
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151 |
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1987 |
27 |
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152 |
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1987 |
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153 |
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1987 |
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