| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Activation and redistribution of implants in Polysi by RTP
|
|
|
1986
|
26 |
3 |
p. 589-
1 p.
|
artikel
|
| 2 |
Advances in dry etching processes—a review
|
|
|
1986
|
26 |
3 |
p. 585-
1 p.
|
artikel
|
| 3 |
A fast algorithm to formulate Markov system equations
|
|
|
1986
|
26 |
3 |
p. 577-
1 p.
|
artikel
|
| 4 |
A flexible approach for generation of arbitrary etch profiles in multilayer films
|
|
|
1986
|
26 |
3 |
p. 588-
1 p.
|
artikel
|
| 5 |
Ageing acceleration under multiple stresses
|
|
|
1986
|
26 |
3 |
p. 581-
1 p.
|
artikel
|
| 6 |
A generalization of Freund's model for a repairable paired component based on a bivariate Geiger Muller (G.M.) counter
|
|
|
1986
|
26 |
3 |
p. 577-
1 p.
|
artikel
|
| 7 |
Algebraical algorithm for computing complex systems reliability
|
|
|
1986
|
26 |
3 |
p. 577-
1 p.
|
artikel
|
| 8 |
A low-cost concept for the testing of microprocessor-controlled assemblies
|
|
|
1986
|
26 |
3 |
p. 576-
1 p.
|
artikel
|
| 9 |
A low cost, thick film multilayer hybrid system
|
|
|
1986
|
26 |
3 |
p. 588-
1 p.
|
artikel
|
| 10 |
Alternatives to furnace annealing
|
|
|
1986
|
26 |
3 |
p. 583-
1 p.
|
artikel
|
| 11 |
A method for the automatic translation of algorithms from a high-level language into self-timed integrated circuits
|
|
|
1986
|
26 |
3 |
p. 585-
1 p.
|
artikel
|
| 12 |
A method to evaluate reliability of three-state device networks
|
Dhillon, Balbir S.
|
|
1986
|
26 |
3 |
p. 535-554
20 p.
|
artikel
|
| 13 |
An alternative index for the reliability of telecommunication networks
|
|
|
1986
|
26 |
3 |
p. 581-
1 p.
|
artikel
|
| 14 |
Analysis and testing in production of circuit boards and plated plastics
|
G.W.A.D.,
|
|
1986
|
26 |
3 |
p. 570-
1 p.
|
artikel
|
| 15 |
Analysis of incomplete data in competing risks model
|
|
|
1986
|
26 |
3 |
p. 579-
1 p.
|
artikel
|
| 16 |
Analysis of redundant systems with human errors
|
|
|
1986
|
26 |
3 |
p. 580-
1 p.
|
artikel
|
| 17 |
A new discrete Weibull distribution
|
|
|
1986
|
26 |
3 |
p. 581-
1 p.
|
artikel
|
| 18 |
Annealing and diffusion of fine geometry CMOS technologies
|
|
|
1986
|
26 |
3 |
p. 583-
1 p.
|
artikel
|
| 19 |
A normal approximation to distributions of likelihood ratio statistics in life testing, reliability and multivariate analysis of variance
|
|
|
1986
|
26 |
3 |
p. 575-
1 p.
|
artikel
|
| 20 |
A performance survey of production ion implanters
|
|
|
1986
|
26 |
3 |
p. 590-
1 p.
|
artikel
|
| 21 |
4544882 Apparatus for testing an integrated circuit chip without concern as to which of the chip's terminals are inputs or outputs
|
Flora, Laurence
|
|
1986
|
26 |
3 |
p. 598-
1 p.
|
artikel
|
| 22 |
Application of the approximate solution of Poisson's equation to derive new formulae for impurity profile determination by the C-V method
|
|
|
1986
|
26 |
3 |
p. 578-
1 p.
|
artikel
|
| 23 |
A problem with computerized systems
|
|
|
1986
|
26 |
3 |
p. 582-
1 p.
|
artikel
|
| 24 |
A review of LPCVD metallization for semiconductor devices
|
|
|
1986
|
26 |
3 |
p. 584-
1 p.
|
artikel
|
| 25 |
A review of nitrogen trifluoride for dry etching in microelectronics processing
|
|
|
1986
|
26 |
3 |
p. 582-583
2 p.
|
artikel
|
| 26 |
Arsenosilicate glass as an interlayer dielectric
|
|
|
1986
|
26 |
3 |
p. 584-
1 p.
|
artikel
|
| 27 |
A two micron metal interconnect process over severe topography
|
|
|
1986
|
26 |
3 |
p. 582-
1 p.
|
artikel
|
| 28 |
Automation of implanter equipment
|
|
|
1986
|
26 |
3 |
p. 589-
1 p.
|
artikel
|
| 29 |
Avalanche breakdown in narrow gap semiconductors in crossed fields
|
|
|
1986
|
26 |
3 |
p. 586-
1 p.
|
artikel
|
| 30 |
AV-8B design for maintainability
|
|
|
1986
|
26 |
3 |
p. 576-
1 p.
|
artikel
|
| 31 |
Bibliography of literature on chemical systems reliability
|
|
|
1986
|
26 |
3 |
p. 575-
1 p.
|
artikel
|
| 32 |
Bonding of fluorine-implanted and annealed silicon
|
|
|
1986
|
26 |
3 |
p. 589-
1 p.
|
artikel
|
| 33 |
Bounds on system reliability when components are dependent
|
Lai, C.D.
|
|
1986
|
26 |
3 |
p. 455-459
5 p.
|
artikel
|
| 34 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
|
|
1986
|
26 |
3 |
p. 405-407
3 p.
|
artikel
|
| 35 |
Changes in oxygen precipitation density during wafer processing
|
|
|
1986
|
26 |
3 |
p. 584-
1 p.
|
artikel
|
| 36 |
Characterizing plasma phosphorus-doped oxides
|
|
|
1986
|
26 |
3 |
p. 586-
1 p.
|
artikel
|
| 37 |
4549101 Circuit for generating test equalization pulse
|
Sood, LalC
|
|
1986
|
26 |
3 |
p. 600-
1 p.
|
artikel
|
| 38 |
4540857 Circuit testing of telephone grids or the like
|
Parsons, DonaldF
|
|
1986
|
26 |
3 |
p. 597-
1 p.
|
artikel
|
| 39 |
8504966 CMOS spare circuit
|
Clemons, DonaldGordon
|
|
1986
|
26 |
3 |
p. 601-
1 p.
|
artikel
|
| 40 |
Codeposition vs layering of sputtered silicide films
|
|
|
1986
|
26 |
3 |
p. 587-
1 p.
|
artikel
|
| 41 |
Combined hardware/software reliability predictions
|
|
|
1986
|
26 |
3 |
p. 578-
1 p.
|
artikel
|
| 42 |
Complex system RMA and T, using Markov models
|
|
|
1986
|
26 |
3 |
p. 579-
1 p.
|
artikel
|
| 43 |
Computer aided stress analysis of digital circuits
|
|
|
1986
|
26 |
3 |
p. 578-
1 p.
|
artikel
|
| 44 |
Computer analysis of wire bond pull test data
|
|
|
1986
|
26 |
3 |
p. 575-
1 p.
|
artikel
|
| 45 |
Computer-assisted testing system for power supply units—reduce quality assurance costs
|
|
|
1986
|
26 |
3 |
p. 580-
1 p.
|
artikel
|
| 46 |
Computers that are “never” down
|
|
|
1986
|
26 |
3 |
p. 575-
1 p.
|
artikel
|
| 47 |
Correct the process, not the product
|
|
|
1986
|
26 |
3 |
p. 576-
1 p.
|
artikel
|
| 48 |
Cost analysis of an electronic repairable redundant system with critical human errors
|
Gupta, P.P.
|
|
1986
|
26 |
3 |
p. 417-421
5 p.
|
artikel
|
| 49 |
Cost-benefit analysis and joint availability measures
|
Gopalan, M.N.
|
|
1986
|
26 |
3 |
p. 483-489
7 p.
|
artikel
|
| 50 |
Cost-benefit analysis of a one out of n : G system with repair and preventive maintenance
|
Gopalan, M.N.
|
|
1986
|
26 |
3 |
p. 519-534
16 p.
|
artikel
|
| 51 |
Cost-benefit analysis of a one-server two-unit system subject to shock and degradation
|
Gopalan, M.N.
|
|
1986
|
26 |
3 |
p. 499-518
20 p.
|
artikel
|
| 52 |
Cost-benefit analysis of a two-unit cold standby system subject to slow switch
|
|
|
1986
|
26 |
3 |
p. 579-580
2 p.
|
artikel
|
| 53 |
Cost-benefit analysis of one-server two-unit hot standby system with imperfect switch subject to adjustable repair
|
Gopalan, M.N.
|
|
1986
|
26 |
3 |
p. 453-454
2 p.
|
artikel
|
| 54 |
Cost effective accelerated testing and analysis
|
|
|
1986
|
26 |
3 |
p. 579-
1 p.
|
artikel
|
| 55 |
Current status of X-ray lithography. Part II
|
|
|
1986
|
26 |
3 |
p. 584-
1 p.
|
artikel
|
| 56 |
Cutting chip-testing costs
|
|
|
1986
|
26 |
3 |
p. 575-
1 p.
|
artikel
|
| 57 |
CW laser annealing of boron implanted polycrystalline silicon
|
|
|
1986
|
26 |
3 |
p. 588-
1 p.
|
artikel
|
| 58 |
Damage effects in dry etching
|
|
|
1986
|
26 |
3 |
p. 583-
1 p.
|
artikel
|
| 59 |
Data analysis uses RS/1 to ease process development
|
|
|
1986
|
26 |
3 |
p. 585-
1 p.
|
artikel
|
| 60 |
Defect characterization of a silicon gate CMOS process
|
|
|
1986
|
26 |
3 |
p. 575-
1 p.
|
artikel
|
| 61 |
Defects in photomasks
|
|
|
1986
|
26 |
3 |
p. 584-
1 p.
|
artikel
|
| 62 |
Designing an advanced copper-alloy leadframe material
|
|
|
1986
|
26 |
3 |
p. 583-
1 p.
|
artikel
|
| 63 |
Determination of diffusion characteristics using two- and four-point probe measurements
|
|
|
1986
|
26 |
3 |
p. 586-
1 p.
|
artikel
|
| 64 |
Developments in thin polyoxides for non-volatile memories
|
|
|
1986
|
26 |
3 |
p. 585-
1 p.
|
artikel
|
| 65 |
Digital control of Czochralski silicon crystal growth
|
|
|
1986
|
26 |
3 |
p. 587-
1 p.
|
artikel
|
| 66 |
Disjoint Boolean products via Shannon's expansion
|
|
|
1986
|
26 |
3 |
p. 580-
1 p.
|
artikel
|
| 67 |
Economics in wafer processing automation
|
|
|
1986
|
26 |
3 |
p. 585-
1 p.
|
artikel
|
| 68 |
Economy of redundancy in telecommunication systems
|
|
|
1986
|
26 |
3 |
p. 581-
1 p.
|
artikel
|
| 69 |
Effect of atmosphere composition on metallizing Al2O3 substrates with Mo-Mn paste
|
|
|
1986
|
26 |
3 |
p. 587-
1 p.
|
artikel
|
| 70 |
Effects of planar channeling using modern ion implantation equipment
|
|
|
1986
|
26 |
3 |
p. 589-
1 p.
|
artikel
|
| 71 |
Electrochemical migration in thick-film IC-S
|
|
|
1986
|
26 |
3 |
p. 587-
1 p.
|
artikel
|
| 72 |
Electromigration testing of thin films at the wafer level
|
|
|
1986
|
26 |
3 |
p. 587-588
2 p.
|
artikel
|
| 73 |
4542341 Electronic burn-in system
|
Santomango, Anthony
|
|
1986
|
26 |
3 |
p. 593-594
2 p.
|
artikel
|
| 74 |
Electron image projection for 0.5μm geometries
|
|
|
1986
|
26 |
3 |
p. 588-
1 p.
|
artikel
|
| 75 |
Energy-gap reduction in heavily doped silicon: causes and consequences
|
|
|
1986
|
26 |
3 |
p. 586-
1 p.
|
artikel
|
| 76 |
Erratum
|
|
|
1986
|
26 |
3 |
p. 603-
1 p.
|
artikel
|
| 77 |
4545851 Etching method for semiconductor devices
|
Takada, Tadakaz
|
|
1986
|
26 |
3 |
p. 598-599
2 p.
|
artikel
|
| 78 |
Evaluating low-particulate chemicals
|
|
|
1986
|
26 |
3 |
p. 583-
1 p.
|
artikel
|
| 79 |
Evaluation of MTTF and reliability of a power plant by BF technique
|
Gupta, P.P.
|
|
1986
|
26 |
3 |
p. 423-428
6 p.
|
artikel
|
| 80 |
Excimer laser applications in contact printing
|
|
|
1986
|
26 |
3 |
p. 588-
1 p.
|
artikel
|
| 81 |
Fabrication of damage free micropatterns in silicon
|
|
|
1986
|
26 |
3 |
p. 586-587
2 p.
|
artikel
|
| 82 |
4539642 Fail-safe speed control system for motor vehicles
|
Mizuno, Yoshikazu
|
|
1986
|
26 |
3 |
p. 596-
1 p.
|
artikel
|
| 83 |
Fault isolation methodology for supportability
|
|
|
1986
|
26 |
3 |
p. 581-
1 p.
|
artikel
|
| 84 |
Field performance of a military signal processor
|
|
|
1986
|
26 |
3 |
p. 577-
1 p.
|
artikel
|
| 85 |
Formation of titanium silicide by rapid thermal annealing
|
|
|
1986
|
26 |
3 |
p. 587-
1 p.
|
artikel
|
| 86 |
4543594 Fusible link employing capacitor structure
|
Mohsen, AmrM
|
|
1986
|
26 |
3 |
p. 597-598
2 p.
|
artikel
|
| 87 |
Gallium arsenide digital IC processing—a manufacturing perspective
|
|
|
1986
|
26 |
3 |
p. 583-
1 p.
|
artikel
|
| 88 |
Generalised availability measures for a multi-unit repairable system with standby failure
|
|
|
1986
|
26 |
3 |
p. 577-
1 p.
|
artikel
|
| 89 |
Generic qualification of semi-custom IC product families
|
Radojcic, R.
|
|
1986
|
26 |
3 |
p. 471-479
9 p.
|
artikel
|
| 90 |
Gettering in processed silicon
|
|
|
1986
|
26 |
3 |
p. 586-
1 p.
|
artikel
|
| 91 |
Grain boundary scattering and thermopower of thin films
|
|
|
1986
|
26 |
3 |
p. 588-
1 p.
|
artikel
|
| 92 |
Guest editorial
|
Jowett, Charles E.
|
|
1986
|
26 |
3 |
p. 415-
1 p.
|
artikel
|
| 93 |
Heavy doping effects on bandgaps, effective intrinsic carrier concentrations and carrier mobilities and lifetimes
|
|
|
1986
|
26 |
3 |
p. 586-
1 p.
|
artikel
|
| 94 |
Higher moments in cost-benefit analysis
|
Gopalan, M.N.
|
|
1986
|
26 |
3 |
p. 491-497
7 p.
|
artikel
|
| 95 |
Highly excited states of donor centres in silicon
|
|
|
1986
|
26 |
3 |
p. 586-
1 p.
|
artikel
|
| 96 |
High-voltage semicustom component arrays
|
|
|
1986
|
26 |
3 |
p. 585-
1 p.
|
artikel
|
| 97 |
Hybrid alignment: 5:1 stepper with 1:1 scanner
|
|
|
1986
|
26 |
3 |
p. 588-
1 p.
|
artikel
|
| 98 |
4539622 Hybrid integrated circuit device
|
Akasaki, Hidehik
|
|
1986
|
26 |
3 |
p. 595-
1 p.
|
artikel
|
| 99 |
4532423 IC tester using an electron beam capable of easily setting a probe card unit for wafers & packaged IC's to be tested
|
Tojo, Toru
|
|
1986
|
26 |
3 |
p. 591-592
2 p.
|
artikel
|
| 100 |
Improved DUV multilayer resist process
|
|
|
1986
|
26 |
3 |
p. 587-
1 p.
|
artikel
|
| 101 |
Improved schedules by using data collected under preventive maintenance
|
|
|
1986
|
26 |
3 |
p. 579-
1 p.
|
artikel
|
| 102 |
Influence of the dopant density profile on minority-carrier current in shallow, heavily doped emitters of silicon bipolar devices
|
|
|
1986
|
26 |
3 |
p. 587-
1 p.
|
artikel
|
| 103 |
Information, communication, and control in flexible wafer fabrication automation
|
|
|
1986
|
26 |
3 |
p. 585-
1 p.
|
artikel
|
| 104 |
Inspection intervals for fail-safe structure
|
|
|
1986
|
26 |
3 |
p. 579-
1 p.
|
artikel
|
| 105 |
Inspection strategies for IX-reticles
|
|
|
1986
|
26 |
3 |
p. 583-
1 p.
|
artikel
|
| 106 |
4533192 Integrated circuit test socket
|
Kelley, LewisJ
|
|
1986
|
26 |
3 |
p. 592-
1 p.
|
artikel
|
| 107 |
Ion milling cures wet-etchant woes
|
|
|
1986
|
26 |
3 |
p. 584-
1 p.
|
artikel
|
| 108 |
KWIRE: a multiple-technology, user-reconfigurable wiring tool for VLSI
|
|
|
1986
|
26 |
3 |
p. 584-
1 p.
|
artikel
|
| 109 |
Laser-assisted dry etching
|
|
|
1986
|
26 |
3 |
p. 589-
1 p.
|
artikel
|
| 110 |
Layer to layer interconnections: impact on VLSI circuits
|
|
|
1986
|
26 |
3 |
p. 583-
1 p.
|
artikel
|
| 111 |
Linewidth measurement aids process control
|
|
|
1986
|
26 |
3 |
p. 582-
1 p.
|
artikel
|
| 112 |
4547028 Low profile test clip
|
Morgan, Thomas
|
|
1986
|
26 |
3 |
p. 599-
1 p.
|
artikel
|
| 113 |
LPCVD process equipment evaluation using statistical methods
|
|
|
1986
|
26 |
3 |
p. 584-
1 p.
|
artikel
|
| 114 |
Maintenance system computer modeling. A logistic tool to influence system front end designs
|
|
|
1986
|
26 |
3 |
p. 580-
1 p.
|
artikel
|
| 115 |
Manufacturing one micron
|
|
|
1986
|
26 |
3 |
p. 583-
1 p.
|
artikel
|
| 116 |
Manufacturing technology for GaAs monolithic microwave integrated circuits
|
|
|
1986
|
26 |
3 |
p. 583-584
2 p.
|
artikel
|
| 117 |
Materials measurements: present abilities and future needs
|
|
|
1986
|
26 |
3 |
p. 582-
1 p.
|
artikel
|
| 118 |
4532402 Method and apparatus for positioning a focused beam on an integrated circuit
|
Overbeck, JamesW
|
|
1986
|
26 |
3 |
p. 591-
1 p.
|
artikel
|
| 119 |
4539878 Method and apparatus for trimming the leads of electronic components
|
Linker, Frank
|
|
1986
|
26 |
3 |
p. 596-
1 p.
|
artikel
|
| 120 |
4541169 Method for making studs for interconnecting metallization layers at different levels in a semiconductor chip
|
Bartush, Thomas
|
|
1986
|
26 |
3 |
p. 593-
1 p.
|
artikel
|
| 121 |
4539517 Method for testing an integrated circuit chip without concern as to which of the chip's terminals are inputs or outputs
|
Flora, LaurenceP
|
|
1986
|
26 |
3 |
p. 595-
1 p.
|
artikel
|
| 122 |
MIL-STD-781D and MIL-HDBK-781—A final report
|
|
|
1986
|
26 |
3 |
p. 580-
1 p.
|
artikel
|
| 123 |
Minimum distance estimation of the three parameters of the Gamma distribution
|
|
|
1986
|
26 |
3 |
p. 577-
1 p.
|
artikel
|
| 124 |
Mission effectiveness model for a system with several mission types
|
|
|
1986
|
26 |
3 |
p. 580-581
2 p.
|
artikel
|
| 125 |
Models for the reliability of memory with ECC
|
|
|
1986
|
26 |
3 |
p. 576-
1 p.
|
artikel
|
| 126 |
Modular implementation of interconnecting networks in VLSI
|
|
|
1986
|
26 |
3 |
p. 584-
1 p.
|
artikel
|
| 127 |
Molding compounds: meeting the needs
|
|
|
1986
|
26 |
3 |
p. 584-
1 p.
|
artikel
|
| 128 |
More accurate maintainability predictions
|
|
|
1986
|
26 |
3 |
p. 576-
1 p.
|
artikel
|
| 129 |
MOS meets radiation challenge
|
|
|
1986
|
26 |
3 |
p. 582-
1 p.
|
artikel
|
| 130 |
Network topology for maximizing the terminal reliability in a computer communication network
|
|
|
1986
|
26 |
3 |
p. 581-582
2 p.
|
artikel
|
| 131 |
New maintainability prediction technique
|
|
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1986
|
26 |
3 |
p. 581-
1 p.
|
artikel
|
| 132 |
Nonlinear integer goal programming applied to optimal system reliability
|
|
|
1986
|
26 |
3 |
p. 576-
1 p.
|
artikel
|
| 133 |
Normal probability plotting—a tool for trouble shooting
|
|
|
1986
|
26 |
3 |
p. 576-
1 p.
|
artikel
|
| 134 |
Numerical simulation of optical etch rate monitoring of VLSI circuits by personal computer
|
|
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1986
|
26 |
3 |
p. 584-
1 p.
|
artikel
|
| 135 |
On closure of the IFR class under formation of cohenrent systems
|
|
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1986
|
26 |
3 |
p. 575-576
2 p.
|
artikel
|
| 136 |
One method for interval estimation of Weibull shape parameter
|
|
|
1986
|
26 |
3 |
p. 581-
1 p.
|
artikel
|
| 137 |
On experimental data of the TCR of TFRs and their relation to theoretical models of conduction mechanism
|
|
|
1986
|
26 |
3 |
p. 586-
1 p.
|
artikel
|
| 138 |
On Markov maintenance problems
|
|
|
1986
|
26 |
3 |
p. 578-
1 p.
|
artikel
|
| 139 |
On the analysis of accelerated life test data
|
|
|
1986
|
26 |
3 |
p. 581-
1 p.
|
artikel
|
| 140 |
On the applications of phase type distribution to a complex two-unit standby redundant system
|
Gururajan, M.
|
|
1986
|
26 |
3 |
p. 443-446
4 p.
|
artikel
|
| 141 |
On the use of power function in the life-time analysis
|
|
|
1986
|
26 |
3 |
p. 579-
1 p.
|
artikel
|
| 142 |
4549249 Overhead lighting system for one or more visual display terminals
|
Shemitz, SylvanR
|
|
1986
|
26 |
3 |
p. 600-601
2 p.
|
artikel
|
| 143 |
4544983 Overvoltage protection device
|
Anderson, James
|
|
1986
|
26 |
3 |
p. 598-
1 p.
|
artikel
|
| 144 |
Pellicles 1985: an update
|
|
|
1986
|
26 |
3 |
p. 583-
1 p.
|
artikel
|
| 145 |
Performance/reliability measures for fault-tolerant computing systems
|
|
|
1986
|
26 |
3 |
p. 580-
1 p.
|
artikel
|
| 146 |
Photomask and reticle defect detection
|
|
|
1986
|
26 |
3 |
p. 575-
1 p.
|
artikel
|
| 147 |
4548451 Pinless connector interposer and method for making the same
|
Benarr, GarryM
|
|
1986
|
26 |
3 |
p. 600-
1 p.
|
artikel
|
| 148 |
Policies for system-level diagnosis in a non-hierarchic distributed system
|
|
|
1986
|
26 |
3 |
p. 582-
1 p.
|
artikel
|
| 149 |
Polyimide discoloration—a failure analysis study
|
|
|
1986
|
26 |
3 |
p. 576-
1 p.
|
artikel
|
| 150 |
4538170 Power chip package
|
Yerman, AlexanderJ
|
|
1986
|
26 |
3 |
p. 594-
1 p.
|
artikel
|
| 151 |
Present worth of service cost for consumer product warranty
|
|
|
1986
|
26 |
3 |
p. 576-
1 p.
|
artikel
|
| 152 |
Preventing maintenance induced failures
|
|
|
1986
|
26 |
3 |
p. 582-
1 p.
|
artikel
|
| 153 |
Profit analysis of a two-unit standby system with two types of repair and preventive maintenance
|
Goel, L.R.
|
|
1986
|
26 |
3 |
p. 435-441
7 p.
|
artikel
|
| 154 |
4539632 Programmable maintenance timer system
|
Hansen, JohnC
|
|
1986
|
26 |
3 |
p. 595-596
2 p.
|
artikel
|
| 155 |
Protective thin film coatings by plasma polymerization
|
|
|
1986
|
26 |
3 |
p. 586-
1 p.
|
artikel
|
| 156 |
Publications, notices, calls for papers, etc.
|
|
|
1986
|
26 |
3 |
p. 409-413
5 p.
|
artikel
|
| 157 |
Purification of deionized water by oxidation with ozone
|
|
|
1986
|
26 |
3 |
p. 583-
1 p.
|
artikel
|
| 158 |
Quality control, reliability, and engineering design
|
G.W.A.D.,
|
|
1986
|
26 |
3 |
p. 572-
1 p.
|
artikel
|
| 159 |
Quantile estimates in complete and censored samples from extreme-value and Weibull distributions
|
|
|
1986
|
26 |
3 |
p. 576-
1 p.
|
artikel
|
| 160 |
RAM analysis of a navigational system by Markov technique: A case study
|
Kamaleswara Rao, P.
|
|
1986
|
26 |
3 |
p. 447-451
5 p.
|
artikel
|
| 161 |
Raman micro-analysis of integrated circuit contamination
|
|
|
1986
|
26 |
3 |
p. 575-
1 p.
|
artikel
|
| 162 |
Raman scattering and short range order in amorphous germanium
|
|
|
1986
|
26 |
3 |
p. 585-
1 p.
|
artikel
|
| 163 |
Raman scattering studies in phosphorus implanted and laser annealed boron doped Si
|
|
|
1986
|
26 |
3 |
p. 588-589
2 p.
|
artikel
|
| 164 |
Random tendencies and event dependencies
|
|
|
1986
|
26 |
3 |
p. 577-
1 p.
|
artikel
|
| 165 |
Rapid determination of ionic contaminants
|
|
|
1986
|
26 |
3 |
p. 589-
1 p.
|
artikel
|
| 166 |
Rapid evaluation of submicron laser spots
|
|
|
1986
|
26 |
3 |
p. 589-
1 p.
|
artikel
|
| 167 |
Rapid thermal processing of gate dielectrics
|
|
|
1986
|
26 |
3 |
p. 587-
1 p.
|
artikel
|
| 168 |
Recovering precious metal from scrap generated by the hybrid manufacturing process
|
|
|
1986
|
26 |
3 |
p. 587-
1 p.
|
artikel
|
| 169 |
Reduction lenses for submicron lithography
|
|
|
1986
|
26 |
3 |
p. 583-
1 p.
|
artikel
|
| 170 |
4532611 Redundant memory circuit
|
Countryman, Roger
|
|
1986
|
26 |
3 |
p. 592-
1 p.
|
artikel
|
| 171 |
4538247 Redundant rows in integrated circuit memories
|
Venkateswaran, Kalyanasundaram
|
|
1986
|
26 |
3 |
p. 594-
1 p.
|
artikel
|
| 172 |
Relating factory and field reliability and maintainability measures
|
|
|
1986
|
26 |
3 |
p. 576-
1 p.
|
artikel
|
| 173 |
Reliability analysis of a system with preventive maintenance, inspection and two types of repair
|
Goel, L.R.
|
|
1986
|
26 |
3 |
p. 429-433
5 p.
|
artikel
|
| 174 |
Reliability analysis of two special three-state devices
|
|
|
1986
|
26 |
3 |
p. 581-
1 p.
|
artikel
|
| 175 |
Reliability and availability analysis of an n-unit outdoor power system subject to adjustable repair facility
|
|
|
1986
|
26 |
3 |
p. 577-578
2 p.
|
artikel
|
| 176 |
Reliability and maintainability management
|
G.W.A.D.,
|
|
1986
|
26 |
3 |
p. 571-
1 p.
|
artikel
|
| 177 |
Reliability evaluation of systems with crtitical human error
|
|
|
1986
|
26 |
3 |
p. 582-
1 p.
|
artikel
|
| 178 |
Reliability in communications satellites
|
|
|
1986
|
26 |
3 |
p. 579-
1 p.
|
artikel
|
| 179 |
Reliability testing and the bottom like
|
|
|
1986
|
26 |
3 |
p. 577-
1 p.
|
artikel
|
| 180 |
4549200 Repairable multi-level overlay system for semiconductor device
|
Ecker, MarioE
|
|
1986
|
26 |
3 |
p. 600-
1 p.
|
artikel
|
| 181 |
Reproducibility of properties of SnO x thin films prepared by reactive sputtering
|
|
|
1986
|
26 |
3 |
p. 585-586
2 p.
|
artikel
|
| 182 |
4550289 Semiconductor integrated circuit device
|
Kabashima, Katsuhik
|
|
1986
|
26 |
3 |
p. 601-
1 p.
|
artikel
|
| 183 |
4543592 Semiconductor integrated circuits and manufacturing process thereof
|
Itsumi, Manabu
|
|
1986
|
26 |
3 |
p. 597-
1 p.
|
artikel
|
| 184 |
Semiconductor research: an industry-university venture
|
|
|
1986
|
26 |
3 |
p. 582-
1 p.
|
artikel
|
| 185 |
s-Expected number of inspections and repairs of a single server n-unit system subject to arbitrary failure
|
|
|
1986
|
26 |
3 |
p. 580-
1 p.
|
artikel
|
| 186 |
Silicon-containing polymer: its plasma deposition and photolithographic processing
|
|
|
1986
|
26 |
3 |
p. 587-
1 p.
|
artikel
|
| 187 |
Silicon material criteria for VLSI electronics
|
|
|
1986
|
26 |
3 |
p. 585-
1 p.
|
artikel
|
| 188 |
Simplified algorithm for optimum availability allocation and redundancy optimization subject to cost constraint
|
|
|
1986
|
26 |
3 |
p. 582-
1 p.
|
artikel
|
| 189 |
Simulation properties of the Bayesian and maximum likelihood estimators of availability
|
|
|
1986
|
26 |
3 |
p. 577-
1 p.
|
artikel
|
| 190 |
Single wafer high rate RIE employing magnetron discharge
|
|
|
1986
|
26 |
3 |
p. 589-
1 p.
|
artikel
|
| 191 |
SMIF technology reduces clean room requirements
|
|
|
1986
|
26 |
3 |
p. 583-
1 p.
|
artikel
|
| 192 |
Software reliability analysis based on a nonhomogeneous error detection rate model
|
|
|
1986
|
26 |
3 |
p. 578-
1 p.
|
artikel
|
| 193 |
Some remarks on optimum inspection policies
|
|
|
1986
|
26 |
3 |
p. 579-
1 p.
|
artikel
|
| 194 |
Spectroscopy of excitons bound to isoelectronic defect complexes in silicon
|
|
|
1986
|
26 |
3 |
p. 586-
1 p.
|
artikel
|
| 195 |
Stability observations and surface analysis of air fired nickel thick film conductors
|
|
|
1986
|
26 |
3 |
p. 588-
1 p.
|
artikel
|
| 196 |
Stochastic analysis of a complex two-unit system with non-instantaneous switchover and imperfect repair
|
Srinivasan, Bala
|
|
1986
|
26 |
3 |
p. 461-469
9 p.
|
artikel
|
| 197 |
Stochastic behaviour of a repairable system operating under fluctuating weather
|
Agarwal, Manju
|
|
1986
|
26 |
3 |
p. 555-567
13 p.
|
artikel
|
| 198 |
Stochastic models for evaluating probability of system failure due to human error
|
|
|
1986
|
26 |
3 |
p. 582-
1 p.
|
artikel
|
| 199 |
4546404 Storage unit for an integrated circuit tester
|
Cedrone, NicholasJ
|
|
1986
|
26 |
3 |
p. 599-
1 p.
|
artikel
|
| 200 |
Submicron optical lithography: 1-line wafer stepper and photoresist technology
|
|
|
1986
|
26 |
3 |
p. 589-
1 p.
|
artikel
|
| 201 |
Superfine IC geometries
|
|
|
1986
|
26 |
3 |
p. 589-
1 p.
|
artikel
|
| 202 |
Surface mount pcb interconnection system doubles track density
|
|
|
1986
|
26 |
3 |
p. 584-
1 p.
|
artikel
|
| 203 |
Surrogate constraints algorithm for reliability optimization problems with multiple constraints
|
|
|
1986
|
26 |
3 |
p. 578-
1 p.
|
artikel
|
| 204 |
4534605 Symmetrical, single point drive for contacts of an integrated circuit tester
|
Cedrone, NicolasJ
|
|
1986
|
26 |
3 |
p. 592-
1 p.
|
artikel
|
| 205 |
SYSREL: reliability of complex redundant systems
|
|
|
1986
|
26 |
3 |
p. 578-
1 p.
|
artikel
|
| 206 |
Techniques for ultratrace metals analyses in dopant materials
|
|
|
1986
|
26 |
3 |
p. 585-
1 p.
|
artikel
|
| 207 |
4538923 Test circuit for watch LSI
|
Yoshida, Yosuk
|
|
1986
|
26 |
3 |
p. 594-595
2 p.
|
artikel
|
| 208 |
4540227 Test equipment interconnection system
|
Faraci, Arthu
|
|
1986
|
26 |
3 |
p. 596-597
2 p.
|
artikel
|
| 209 |
4542340 Testing method and structure for leakage current characterization in the manufacture of dynamic RAM cells
|
Chakravarti, Satya
|
|
1986
|
26 |
3 |
p. 593-
1 p.
|
artikel
|
| 210 |
The convergent effect of the annealing temperatures of electron irradiated defects in FZ silicon grown in hydrogen
|
|
|
1986
|
26 |
3 |
p. 589-
1 p.
|
artikel
|
| 211 |
Thermal design of electronic circuit boards and packages
|
G.W.A.D.,
|
|
1986
|
26 |
3 |
p. 573-
1 p.
|
artikel
|
| 212 |
The team approach to products liability prevention and defense
|
|
|
1986
|
26 |
3 |
p. 580-
1 p.
|
artikel
|
| 213 |
The top-event's failure frequency for non-coherent multi-state fault trees
|
|
|
1986
|
26 |
3 |
p. 581-
1 p.
|
artikel
|
| 214 |
The work center works for wafer fab
|
|
|
1986
|
26 |
3 |
p. 583-
1 p.
|
artikel
|
| 215 |
Thick, multilayer elements widen antenna bandwidths
|
|
|
1986
|
26 |
3 |
p. 588-
1 p.
|
artikel
|
| 216 |
Top-frequency calculation of multi-state fault trees including interstate frequencies
|
Bossche, A.
|
|
1986
|
26 |
3 |
p. 481-482
2 p.
|
artikel
|
| 217 |
Trends in automated diffusion furnace systems for large wafers
|
|
|
1986
|
26 |
3 |
p. 583-
1 p.
|
artikel
|
| 218 |
Unavailability analysis of periodically tested components of dormant systems
|
|
|
1986
|
26 |
3 |
p. 575-
1 p.
|
artikel
|
| 219 |
Vibration control wafer manufacturing facilities
|
|
|
1986
|
26 |
3 |
p. 584-
1 p.
|
artikel
|
| 220 |
VLSI signal processing: A bit-serial approach
|
G.W.A.D.,
|
|
1986
|
26 |
3 |
p. 569-
1 p.
|
artikel
|
| 221 |
VLSI system design by the numbers
|
|
|
1986
|
26 |
3 |
p. 584-
1 p.
|
artikel
|
| 222 |
Wafer characterization with laser microprobe mass spectroscopy
|
|
|
1986
|
26 |
3 |
p. 589-590
2 p.
|
artikel
|
| 223 |
Water purification criteria for semiconductor manufacturing
|
|
|
1986
|
26 |
3 |
p. 584-
1 p.
|
artikel
|
| 224 |
X-ray lithography and mask technology
|
|
|
1986
|
26 |
3 |
p. 583-
1 p.
|
artikel
|
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