| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A comparison of MOS processes for VLSI. Part I
|
|
|
1985
|
25 |
2 |
p. 395-
1 p.
|
artikel
|
| 2 |
A heuristic method for optimum redundancy allocation in non-coherent systems
|
|
|
1985
|
25 |
2 |
p. 391-
1 p.
|
artikel
|
| 3 |
A life cycle costing methodology for the assessment of process heat generation by solar energy
|
|
|
1985
|
25 |
2 |
p. 389-
1 p.
|
artikel
|
| 4 |
A Monte-Carlo technique for estimating lower confidence limits on system reliability using pass-fail data
|
|
|
1985
|
25 |
2 |
p. 392-
1 p.
|
artikel
|
| 5 |
An algorithm for obtaining simplified prime implicant sets in fault-tree and event-tree analysis
|
|
|
1985
|
25 |
2 |
p. 391-
1 p.
|
artikel
|
| 6 |
Analysis of a two-unit hot standby system with three modes
|
|
|
1985
|
25 |
2 |
p. 390-
1 p.
|
artikel
|
| 7 |
Analysis of a two-unit standby system with three modes and imperfect switching device
|
|
|
1985
|
25 |
2 |
p. 391-
1 p.
|
artikel
|
| 8 |
Analysis of a 2-unit (dissimilar) repairable system subject to slow switch
|
Gopalan, M.N.
|
|
1985
|
25 |
2 |
p. 261-265
5 p.
|
artikel
|
| 9 |
Analysis of two-unit redundant system under partial failure and two types of repairs
|
|
|
1985
|
25 |
2 |
p. 388-
1 p.
|
artikel
|
| 10 |
Analyzing high via resistance
|
|
|
1985
|
25 |
2 |
p. 385-
1 p.
|
artikel
|
| 11 |
An introduction to printed circuit board technology
|
G.W.A.D.,
|
|
1985
|
25 |
2 |
p. 383-
1 p.
|
artikel
|
| 12 |
A parallel redundant complex system with two types of failure under preemptive-repeat repair discipline
|
|
|
1985
|
25 |
2 |
p. 389-
1 p.
|
artikel
|
| 13 |
A Petri net approach to enumerating all circuits of a graph
|
|
|
1985
|
25 |
2 |
p. 391-
1 p.
|
artikel
|
| 14 |
A recursive method for network reliability measures evaluation
|
|
|
1985
|
25 |
2 |
p. 389-
1 p.
|
artikel
|
| 15 |
Ashing process for dry photolithography
|
|
|
1985
|
25 |
2 |
p. 394-
1 p.
|
artikel
|
| 16 |
Assessing ATE on a cost-avoidance basis
|
|
|
1985
|
25 |
2 |
p. 392-
1 p.
|
artikel
|
| 17 |
A study of a time-dependent queueing problem with departures having random memory
|
Sharda,
|
|
1985
|
25 |
2 |
p. 295-298
4 p.
|
artikel
|
| 18 |
A survey on algortthmic aspects in preventive maintenance
|
Lau, H.T.
|
|
1985
|
25 |
2 |
p. 299-311
13 p.
|
artikel
|
| 19 |
A throttle valve for automatic pressure control in sputtering and reactive sputter etching
|
|
|
1985
|
25 |
2 |
p. 394-
1 p.
|
artikel
|
| 20 |
A two (multicomponent) unit parallel system with standby and common cause failure
|
|
|
1985
|
25 |
2 |
p. 388-
1 p.
|
artikel
|
| 21 |
A two-unit deteriorating standby system with inspection
|
|
|
1985
|
25 |
2 |
p. 387-388
2 p.
|
artikel
|
| 22 |
A two-unit parallel redundant system with three modes and bivariate exponential lifetimes
|
|
|
1985
|
25 |
2 |
p. 391-
1 p.
|
artikel
|
| 23 |
Availability analysis of a two-unit cold standby system with two switching failure modes
|
|
|
1985
|
25 |
2 |
p. 389-
1 p.
|
artikel
|
| 24 |
Availability-based life cycle cost model: A simulation approach
|
Ntuen, Celestine A.
|
|
1985
|
25 |
2 |
p. 331-342
12 p.
|
artikel
|
| 25 |
Bayes estimation of reliability for special k-out-of-m: G systems
|
|
|
1985
|
25 |
2 |
p. 390-
1 p.
|
artikel
|
| 26 |
Bibliography of literature on nuclear system reliability
|
|
|
1985
|
25 |
2 |
p. 385-
1 p.
|
artikel
|
| 27 |
Bipolar device packaging—electrical, thermal, and mechanical stress considerations
|
|
|
1985
|
25 |
2 |
p. 394-
1 p.
|
artikel
|
| 28 |
Boom squeezes captive chip makers
|
|
|
1985
|
25 |
2 |
p. 392-393
2 p.
|
artikel
|
| 29 |
Boundary conditions for pn heterojunctions
|
|
|
1985
|
25 |
2 |
p. 397-
1 p.
|
artikel
|
| 30 |
4471483 Branched labyrinth wafer-scale integrated circuit
|
Chamberlain, JohnT
|
|
1985
|
25 |
2 |
p. 404-
1 p.
|
artikel
|
| 31 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
|
|
1985
|
25 |
2 |
p. 207-210
4 p.
|
artikel
|
| 32 |
Chromium redistribution in ion-implanted GaAs
|
|
|
1985
|
25 |
2 |
p. 398-
1 p.
|
artikel
|
| 33 |
CLEO lights way to optical ICs
|
|
|
1985
|
25 |
2 |
p. 393-
1 p.
|
artikel
|
| 34 |
C-MOS 256-K RAM with wideband output stands by on microwatts
|
|
|
1985
|
25 |
2 |
p. 397-
1 p.
|
artikel
|
| 35 |
Comparative reliability analysis of simplex and redundant systems
|
Dhillon, Balbir S.
|
|
1985
|
25 |
2 |
p. 343-356
14 p.
|
artikel
|
| 36 |
Comparison of two unit cold standby reliability models with three types of repair facilities
|
|
|
1985
|
25 |
2 |
p. 388-
1 p.
|
artikel
|
| 37 |
Confidence limits on the failure rate and a rapid projection nomogram for the lognormal distribution
|
|
|
1985
|
25 |
2 |
p. 387-
1 p.
|
artikel
|
| 38 |
Congestion-reliability-availability relationship in packet-switching computer networks
|
|
|
1985
|
25 |
2 |
p. 390-
1 p.
|
artikel
|
| 39 |
4465972 Connection arrangement for printed circuit board testing apparatus
|
Sokolich, JamesM
|
|
1985
|
25 |
2 |
p. 401-402
2 p.
|
artikel
|
| 40 |
Contamination control of high purity water
|
|
|
1985
|
25 |
2 |
p. 394-
1 p.
|
artikel
|
| 41 |
Contamination prevention and protection for process gases
|
|
|
1985
|
25 |
2 |
p. 396-
1 p.
|
artikel
|
| 42 |
Controlling airborne particles
|
|
|
1985
|
25 |
2 |
p. 395-396
2 p.
|
artikel
|
| 43 |
Corrosion protection for semiconductor packaging
|
|
|
1985
|
25 |
2 |
p. 395-
1 p.
|
artikel
|
| 44 |
Cost analysis in a two-unit standby system with a regular repairman and patience time
|
|
|
1985
|
25 |
2 |
p. 391-
1 p.
|
artikel
|
| 45 |
Cost analysis of a system with common cause failure and two types of repair facilities
|
Garg, Rajiv
|
|
1985
|
25 |
2 |
p. 281-284
4 p.
|
artikel
|
| 46 |
Cost analysis of a three-state two-unit repairable system
|
|
|
1985
|
25 |
2 |
p. 390-
1 p.
|
artikel
|
| 47 |
Cost-benefit analysis of a one-server two-unit cold standby system with repair and preventive maintenance
|
Gopalan, M.N.
|
|
1985
|
25 |
2 |
p. 267-269
3 p.
|
artikel
|
| 48 |
Cost-benefit analysis of a two-unit system subject to random service
|
Gopalan, M.N.
|
|
1985
|
25 |
2 |
p. 313-323
11 p.
|
artikel
|
| 49 |
Cost function analysis of a three-state repairable system
|
|
|
1985
|
25 |
2 |
p. 388-
1 p.
|
artikel
|
| 50 |
Denser process gets the most out of bipolar VLSI
|
|
|
1985
|
25 |
2 |
p. 396-397
2 p.
|
artikel
|
| 51 |
Designers weigh options for 256-K dynamic-RAM processes
|
|
|
1985
|
25 |
2 |
p. 396-
1 p.
|
artikel
|
| 52 |
Designing for testability
|
|
|
1985
|
25 |
2 |
p. 393-
1 p.
|
artikel
|
| 53 |
Design of a 3-micron CMOS cell library
|
|
|
1985
|
25 |
2 |
p. 395-
1 p.
|
artikel
|
| 54 |
Design system for semi-custom VLSI circuits
|
|
|
1985
|
25 |
2 |
p. 393-
1 p.
|
artikel
|
| 55 |
Detection and accelerated testing of vibration-induced connector wear
|
|
|
1985
|
25 |
2 |
p. 387-
1 p.
|
artikel
|
| 56 |
Determination of reliability parameters of a digital multiplex frame strategy using Markov chains and a state reduction method
|
|
|
1985
|
25 |
2 |
p. 392-
1 p.
|
artikel
|
| 57 |
Direct thickness measurement in lapping process
|
|
|
1985
|
25 |
2 |
p. 394-
1 p.
|
artikel
|
| 58 |
Effects of grain-boundary trapping-state energy distribution on the activation energy of resistivity of polycrystalline-silicon films
|
|
|
1985
|
25 |
2 |
p. 397-
1 p.
|
artikel
|
| 59 |
Effects of high field stresses on threshold voltage of CMOS transistors
|
Stojadinović, N.
|
|
1985
|
25 |
2 |
p. 275-279
5 p.
|
artikel
|
| 60 |
Electrical characteristics of large scale integration (LSI) MOSFETs at very high temperatures. Part II: experiment
|
|
|
1985
|
25 |
2 |
p. 395-
1 p.
|
artikel
|
| 61 |
Electrical characteristics of large scale integration (LSI) MOSFETs at very high temperatures. Part I; theory
|
|
|
1985
|
25 |
2 |
p. 393-
1 p.
|
artikel
|
| 62 |
Electrical characteristics of large-scale integration silicon MOSFET's at very high temperatures, Part III: modeling and circuit behaviour
|
|
|
1985
|
25 |
2 |
p. 387-
1 p.
|
artikel
|
| 63 |
Epitaxial silicon for bipolar integrated circuits
|
|
|
1985
|
25 |
2 |
p. 393-394
2 p.
|
artikel
|
| 64 |
Evaporated As2S3—reproduction fidelity for microelectronics
|
|
|
1985
|
25 |
2 |
p. 394-
1 p.
|
artikel
|
| 65 |
Evaporation induced corrosion of YZ-LiNb03
|
|
|
1985
|
25 |
2 |
p. 386-
1 p.
|
artikel
|
| 66 |
Evaporation induced frequency shift in S.A.W. filter
|
|
|
1985
|
25 |
2 |
p. 385-
1 p.
|
artikel
|
| 67 |
Experience in 3-micron processing: a 10 volt n-well CMOS process
|
|
|
1985
|
25 |
2 |
p. 393-
1 p.
|
artikel
|
| 68 |
Failures induced by electromigration in ECL 100 k devices
|
|
|
1985
|
25 |
2 |
p. 385-386
2 p.
|
artikel
|
| 69 |
Fast PLA chips for computers go to market
|
|
|
1985
|
25 |
2 |
p. 397-
1 p.
|
artikel
|
| 70 |
Fault-tolerant communications for wafer-scale integration of a processor array
|
Moore, W.R.
|
|
1985
|
25 |
2 |
p. 291-294
4 p.
|
artikel
|
| 71 |
Final state effects of deep impurities in semiconductors
|
|
|
1985
|
25 |
2 |
p. 398-
1 p.
|
artikel
|
| 72 |
Fretting corrosion of solder-coated electrical contacts
|
|
|
1985
|
25 |
2 |
p. 386-387
2 p.
|
artikel
|
| 73 |
Fuzzy strategy for failure detection and safety control of complex processes
|
Vaija, P.
|
|
1985
|
25 |
2 |
p. 369-381
13 p.
|
artikel
|
| 74 |
GaAs ICs bid for commercial success
|
|
|
1985
|
25 |
2 |
p. 392-
1 p.
|
artikel
|
| 75 |
Generalised availability measures for a two-unit intermittently used repairable system
|
|
|
1985
|
25 |
2 |
p. 391-
1 p.
|
artikel
|
| 76 |
Graphic comparison of three-state device redundancies
|
|
|
1985
|
25 |
2 |
p. 387-
1 p.
|
artikel
|
| 77 |
Guidelines for publication of high resolution resist parameters
|
|
|
1985
|
25 |
2 |
p. 393-
1 p.
|
artikel
|
| 78 |
Impact of custom VLSI technology
|
|
|
1985
|
25 |
2 |
p. 392-
1 p.
|
artikel
|
| 79 |
Improved planar isolation with buried-channel MOS FET's
|
|
|
1985
|
25 |
2 |
p. 394-
1 p.
|
artikel
|
| 80 |
Integrated circuit design verification tools
|
|
|
1985
|
25 |
2 |
p. 394-395
2 p.
|
artikel
|
| 81 |
4466183 Integrated circuit packaging process
|
Burns, CarmenD
|
|
1985
|
25 |
2 |
p. 402-
1 p.
|
artikel
|
| 82 |
Investigation of fretting corrosion at dissimilar metal interfaces in socketed IC device applications
|
|
|
1985
|
25 |
2 |
p. 386-
1 p.
|
artikel
|
| 83 |
Ion beam resists
|
|
|
1985
|
25 |
2 |
p. 399-
1 p.
|
artikel
|
| 84 |
ITT's testability analysis program
|
|
|
1985
|
25 |
2 |
p. 392-
1 p.
|
artikel
|
| 85 |
4470669 Liquid crystal display device
|
Kubota, Keiichi
|
|
1985
|
25 |
2 |
p. 403-
1 p.
|
artikel
|
| 86 |
Mathematical models for marginal reliability analysis
|
|
|
1985
|
25 |
2 |
p. 390-
1 p.
|
artikel
|
| 87 |
Measurement technique of electromigration
|
|
|
1985
|
25 |
2 |
p. 398-
1 p.
|
artikel
|
| 88 |
Memory tester checks out 256-K RAMs
|
|
|
1985
|
25 |
2 |
p. 397-
1 p.
|
artikel
|
| 89 |
Methodologies for full custom VLSI design
|
|
|
1985
|
25 |
2 |
p. 395-
1 p.
|
artikel
|
| 90 |
MeV implantation for silicon device fabrication
|
|
|
1985
|
25 |
2 |
p. 398-399
2 p.
|
artikel
|
| 91 |
Microelectronic ball-bond shear test—a critical review and comprehensive guide to its uses
|
|
|
1985
|
25 |
2 |
p. 386-
1 p.
|
artikel
|
| 92 |
Microelectronics and power
|
|
|
1985
|
25 |
2 |
p. 393-
1 p.
|
artikel
|
| 93 |
Modeling of discrete semiconductor devices
|
|
|
1985
|
25 |
2 |
p. 386-
1 p.
|
artikel
|
| 94 |
Modelling digital circuits with delays by stochastic Petri nets
|
|
|
1985
|
25 |
2 |
p. 388-
1 p.
|
artikel
|
| 95 |
Modelling human performance reliability in a two stage combined manual and decision task
|
|
|
1985
|
25 |
2 |
p. 390-
1 p.
|
artikel
|
| 96 |
Monolithic 10-bit d-a converter avoids postprocess trimming
|
|
|
1985
|
25 |
2 |
p. 396-
1 p.
|
artikel
|
| 97 |
MOS technology for VLSI
|
|
|
1985
|
25 |
2 |
p. 396-
1 p.
|
artikel
|
| 98 |
Multilayer resists for fine line optical lithography
|
|
|
1985
|
25 |
2 |
p. 393-
1 p.
|
artikel
|
| 99 |
Multilevel metallization device structures and process options
|
|
|
1985
|
25 |
2 |
p. 396-
1 p.
|
artikel
|
| 100 |
Multivariate sampling plans in quality control: a numerical example
|
|
|
1985
|
25 |
2 |
p. 391-392
2 p.
|
artikel
|
| 101 |
New analytical models for logistics support cost and life cycle cost vs reliability function
|
|
|
1985
|
25 |
2 |
p. 389-
1 p.
|
artikel
|
| 102 |
Novolac resins used in positive resist systems
|
|
|
1985
|
25 |
2 |
p. 395-
1 p.
|
artikel
|
| 103 |
On a compound redundant system with the particular switching devices
|
|
|
1985
|
25 |
2 |
p. 388-
1 p.
|
artikel
|
| 104 |
On the design of reliable distributed databases
|
Soi, Inder M.
|
|
1985
|
25 |
2 |
p. 229-233
5 p.
|
artikel
|
| 105 |
On the development of a successive damage shock model based on Palm probability
|
Biswas, Suddhendu
|
|
1985
|
25 |
2 |
p. 271-274
4 p.
|
artikel
|
| 106 |
On the injection level dependence of the minority carrier lifetime in defected silicon substrates
|
|
|
1985
|
25 |
2 |
p. 398-
1 p.
|
artikel
|
| 107 |
On the stochastic behaviour of a 1-server 2-unit system subject to arbitrary failure, random inspection and two failure modes
|
|
|
1985
|
25 |
2 |
p. 389-
1 p.
|
artikel
|
| 108 |
Optimum design of reliable systems for specified life cycle cost
|
Govil, K.K.
|
|
1985
|
25 |
2 |
p. 239-241
3 p.
|
artikel
|
| 109 |
Overall reliability evaluation for large computer communication networks: An MHC approach
|
Soi, Inder M.
|
|
1985
|
25 |
2 |
p. 215-222
8 p.
|
artikel
|
| 110 |
4465973 Pad for accelerated memory test
|
Countryman, RogerS
|
|
1985
|
25 |
2 |
p. 402-
1 p.
|
artikel
|
| 111 |
Performance model of software systems using Petri nets
|
|
|
1985
|
25 |
2 |
p. 391-
1 p.
|
artikel
|
| 112 |
Philosophy of a new structure of software reliability modelling
|
|
|
1985
|
25 |
2 |
p. 389-
1 p.
|
artikel
|
| 113 |
Planning of aging experiments for semiconductor devices by means of the assurance test matrix
|
|
|
1985
|
25 |
2 |
p. 385-
1 p.
|
artikel
|
| 114 |
Plasma etching of polysilicon: overview
|
|
|
1985
|
25 |
2 |
p. 394-
1 p.
|
artikel
|
| 115 |
Plasma etching using SF6 and chlorine gases
|
|
|
1985
|
25 |
2 |
p. 394-
1 p.
|
artikel
|
| 116 |
Power bipolar devices
|
|
|
1985
|
25 |
2 |
p. 387-
1 p.
|
artikel
|
| 117 |
Power M.O.S. devices
|
|
|
1985
|
25 |
2 |
p. 387-
1 p.
|
artikel
|
| 118 |
Pragmatic testing protocols to measure software reliability
|
|
|
1985
|
25 |
2 |
p. 392-
1 p.
|
artikel
|
| 119 |
Prediction of substrate temperature in dc ion-plating systems
|
|
|
1985
|
25 |
2 |
p. 399-
1 p.
|
artikel
|
| 120 |
Pressure control in LPCVD system
|
|
|
1985
|
25 |
2 |
p. 394-
1 p.
|
artikel
|
| 121 |
Process and device modeling for VLSI
|
|
|
1985
|
25 |
2 |
p. 396-
1 p.
|
artikel
|
| 122 |
Production test and repair of 256K DRAMs with redundancy
|
|
|
1985
|
25 |
2 |
p. 387-
1 p.
|
artikel
|
| 123 |
Profile control in plasma etching of SiO2
|
|
|
1985
|
25 |
2 |
p. 396-
1 p.
|
artikel
|
| 124 |
Profile formation in CAIBE
|
|
|
1985
|
25 |
2 |
p. 399-
1 p.
|
artikel
|
| 125 |
Properties of nickel oxide films grown by sputter oxidation
|
|
|
1985
|
25 |
2 |
p. 398-
1 p.
|
artikel
|
| 126 |
Publications, notices, calls for papers, etc.
|
|
|
1985
|
25 |
2 |
p. 211-214
4 p.
|
artikel
|
| 127 |
Reactive ion etching: its basis and future. Part I
|
|
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1985
|
25 |
2 |
p. 399-
1 p.
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artikel
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| 128 |
Reactive ion etching: its basis and future. Part II
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1985
|
25 |
2 |
p. 399-
1 p.
|
artikel
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| 129 |
Recent developments in electron resists
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1985
|
25 |
2 |
p. 393-
1 p.
|
artikel
|
| 130 |
Reliability analysis of fault tolerant pipeline ring networks
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1985
|
25 |
2 |
p. 388-
1 p.
|
artikel
|
| 131 |
Reliability analysis of multi-unit cold standby system with two operating modes
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1985
|
25 |
2 |
p. 390-
1 p.
|
artikel
|
| 132 |
Reliability and maintainability of a multicomponent series-parallel system with simultaneous failure and repair priorities
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1985
|
25 |
2 |
p. 388-389
2 p.
|
artikel
|
| 133 |
Reliability calculations for electrical transmission systems on the basis of mean failure indices
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1985
|
25 |
2 |
p. 390-
1 p.
|
artikel
|
| 134 |
Reliability evaluation of logic circuits
|
Luis Roca, J.
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1985
|
25 |
2 |
p. 257-260
4 p.
|
artikel
|
| 135 |
Reliability of a 3-unit cold redundant system with Weibull failure
|
Hasanuddin Ahmad, S.
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1985
|
25 |
2 |
p. 325-330
6 p.
|
artikel
|
| 136 |
Reliability problems with VLSI
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1985
|
25 |
2 |
p. 396-
1 p.
|
artikel
|
| 137 |
Reliability system with two types of repair facilities
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|
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1985
|
25 |
2 |
p. 389-390
2 p.
|
artikel
|
| 138 |
Relvec—a tool for control system reliability analysis
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|
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1985
|
25 |
2 |
p. 389-
1 p.
|
artikel
|
| 139 |
Selection factor algorithm for reliability and maintainability tradeoff to optimize availability allocation subject to cost constraint
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|
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1985
|
25 |
2 |
p. 387-
1 p.
|
artikel
|
| 140 |
4471484 Self verifying logic system
|
Sedmak, Richard
|
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1985
|
25 |
2 |
p. 404-405
2 p.
|
artikel
|
| 141 |
SEM-EDAX analysis of interaction of photoresist with thick films
|
Singh, Awatar
|
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1985
|
25 |
2 |
p. 243-255
13 p.
|
artikel
|
| 142 |
4467345 Semiconductor integrated circuit device
|
Ozawa, Masahid
|
|
1985
|
25 |
2 |
p. 402-
1 p.
|
artikel
|
| 143 |
4464750 Semiconductor memory device
|
Tatematsu, Take
|
|
1985
|
25 |
2 |
p. 401-
1 p.
|
artikel
|
| 144 |
4471472 Semiconductor memory utilizing an improved redundant circuitry configuration
|
Young, Elvan
|
|
1985
|
25 |
2 |
p. 404-
1 p.
|
artikel
|
| 145 |
Semiconductors race to best year ever worldwide; markets zoom across the board
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|
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1985
|
25 |
2 |
p. 392-
1 p.
|
artikel
|
| 146 |
s-expected number of inspections and repairs of a one-server n-unit system subject to random inspection
|
|
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1985
|
25 |
2 |
p. 391-
1 p.
|
artikel
|
| 147 |
Short-term and long-term performance studies of light emitting diodes
|
Bora, J.S.
|
|
1985
|
25 |
2 |
p. 235-237
3 p.
|
artikel
|
| 148 |
Simultaneous exposure and development technique for S.A.W. device fabrication
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1985
|
25 |
2 |
p. 394-
1 p.
|
artikel
|
| 149 |
Smart-power process puts overvoltage protection on chip
|
|
|
1985
|
25 |
2 |
p. 397-
1 p.
|
artikel
|
| 150 |
Software complexity: An aid to software maintainability
|
Soi, Inder M.
|
|
1985
|
25 |
2 |
p. 223-228
6 p.
|
artikel
|
| 151 |
Software reliability as an application of martingale and filtering theory
|
|
|
1985
|
25 |
2 |
p. 390-
1 p.
|
artikel
|
| 152 |
Sources of failures and yield improvement for VLSI and restructurable interconnects for RVLSI and WSI: Part I—sources of failures and yield improvements for VLSI
|
|
|
1985
|
25 |
2 |
p. 395-
1 p.
|
artikel
|
| 153 |
Square 25—thou Posts/Receptacles dominate US interconnection market
|
|
|
1985
|
25 |
2 |
p. 396-
1 p.
|
artikel
|
| 154 |
Status and prospects for gallium arsenide technology
|
|
|
1985
|
25 |
2 |
p. 392-
1 p.
|
artikel
|
| 155 |
Stochastic analysis of a deteriorating standby system with three modes and inspection
|
Goel, L.R.
|
|
1985
|
25 |
2 |
p. 285-289
5 p.
|
artikel
|
| 156 |
Stochastic analysis of two-unit outdoor electric power systems in changing weather
|
Dhillon, Balbir S.
|
|
1985
|
25 |
2 |
p. 357-367
11 p.
|
artikel
|
| 157 |
Stochastic behaviour of a two-unit (dissimilar) hot standby system with three modes
|
|
|
1985
|
25 |
2 |
p. 388-
1 p.
|
artikel
|
| 158 |
Stochastic behaviour of a two-unit standby system with better utilization of units
|
|
|
1985
|
25 |
2 |
p. 388-
1 p.
|
artikel
|
| 159 |
Switch failure in a two-unit standby system with better utilization of units
|
|
|
1985
|
25 |
2 |
p. 387-
1 p.
|
artikel
|
| 160 |
System effectiveness criteria for the analysis of MX basing modes
|
|
|
1985
|
25 |
2 |
p. 390-
1 p.
|
artikel
|
| 161 |
Tactical air war: a simscript model
|
|
|
1985
|
25 |
2 |
p. 385-
1 p.
|
artikel
|
| 162 |
4468759 Testing method and apparatus for dram
|
Kung, RogerI
|
|
1985
|
25 |
2 |
p. 403-
1 p.
|
artikel
|
| 163 |
Test or verification? The ultimate decision
|
|
|
1985
|
25 |
2 |
p. 389-
1 p.
|
artikel
|
| 164 |
The density of platinum and palladium powders for thick film pastes
|
|
|
1985
|
25 |
2 |
p. 398-
1 p.
|
artikel
|
| 165 |
The density of states at GaAs/native oxide interfaces
|
|
|
1985
|
25 |
2 |
p. 397-
1 p.
|
artikel
|
| 166 |
The fundamentals of eutectic die attach
|
|
|
1985
|
25 |
2 |
p. 394-
1 p.
|
artikel
|
| 167 |
The gold donor and acceptor level in p-type silicon
|
|
|
1985
|
25 |
2 |
p. 397-
1 p.
|
artikel
|
| 168 |
The hypergeometric distribution model for predicting the reliability of softwares
|
|
|
1985
|
25 |
2 |
p. 388-
1 p.
|
artikel
|
| 169 |
The influence of corrosion inhibitor and surface abrasion on the failure of aluminum-wired twist-on connections
|
|
|
1985
|
25 |
2 |
p. 386-
1 p.
|
artikel
|
| 170 |
The manufacture and reliability of the EPIC chip carrier
|
|
|
1985
|
25 |
2 |
p. 395-
1 p.
|
artikel
|
| 171 |
The Meniscograph as a quality control tool—a case study in solderability testing
|
|
|
1985
|
25 |
2 |
p. 386-
1 p.
|
artikel
|
| 172 |
The reliability of weather forecasting
|
|
|
1985
|
25 |
2 |
p. 385-
1 p.
|
artikel
|
| 173 |
The role of intercarrier scattering in excited silicon
|
|
|
1985
|
25 |
2 |
p. 397-
1 p.
|
artikel
|
| 174 |
The state of chemisorption of H2O on silicon surfaces at room temperature
|
|
|
1985
|
25 |
2 |
p. 397-398
2 p.
|
artikel
|
| 175 |
The technology of clean room design
|
|
|
1985
|
25 |
2 |
p. 393-
1 p.
|
artikel
|
| 176 |
The Wheatstone bridge reduction in network reliability computations
|
|
|
1985
|
25 |
2 |
p. 392-
1 p.
|
artikel
|
| 177 |
Transition to one micro technology: Part 2
|
|
|
1985
|
25 |
2 |
p. 395-
1 p.
|
artikel
|
| 178 |
Trends in high voltage integrated circuit technology
|
|
|
1985
|
25 |
2 |
p. 392-
1 p.
|
artikel
|
| 179 |
Troubleshooting wave soldering problems with statistical quality control (SQC)
|
|
|
1985
|
25 |
2 |
p. 395-
1 p.
|
artikel
|
| 180 |
Unit ties together the VLSI design pieces
|
|
|
1985
|
25 |
2 |
p. 396-
1 p.
|
artikel
|
| 181 |
Video codec for broadband communication
|
|
|
1985
|
25 |
2 |
p. 397-
1 p.
|
artikel
|
| 182 |
VLSI for the ISDN line termination
|
|
|
1985
|
25 |
2 |
p. 393-
1 p.
|
artikel
|
| 183 |
VLSI 1-micron MOS processing
|
|
|
1985
|
25 |
2 |
p. 393-
1 p.
|
artikel
|
| 184 |
VLSI packaging
|
|
|
1985
|
25 |
2 |
p. 394-
1 p.
|
artikel
|
| 185 |
4467400 Wafer scale integrated circuit
|
Stopper, Herbert
|
|
1985
|
25 |
2 |
p. 403-
1 p.
|
artikel
|
| 186 |
Work function measurements during a growth of ultra thin films of SiO2 on characterized silicon surfaces
|
|
|
1985
|
25 |
2 |
p. 397-
1 p.
|
artikel
|
| 187 |
XPS analysis of (100) GaAs surfaces after applying a variety of technology-etchants
|
|
|
1985
|
25 |
2 |
p. 398-
1 p.
|
artikel
|
| 188 |
X-ray resist trends
|
|
|
1985
|
25 |
2 |
p. 394-
1 p.
|
artikel
|
| 189 |
Yield-enhancement of a large systolic array chip
|
|
|
1985
|
25 |
2 |
p. 394-
1 p.
|
artikel
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