| no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
| 1 |
A Bayes procedure combining black box estimates and laboratory tests
|
|
|
1984
|
24 |
5 |
p. 994-
1 p.
|
article
|
| 2 |
A comparison of SIMS with other techniques based on ion-beam solid interactions
|
|
|
1984
|
24 |
5 |
p. 1002-
1 p.
|
article
|
| 3 |
Adhesive techniques in microelectronics
|
|
|
1984
|
24 |
5 |
p. 1002-
1 p.
|
article
|
| 4 |
A fast algorithm to formulate Markov system equations
|
Luis Roca, J.
|
|
1984
|
24 |
5 |
p. 897-898
2 p.
|
article
|
| 5 |
A gaseous detector device for an environmental SEM
|
|
|
1984
|
24 |
5 |
p. 1000-
1 p.
|
article
|
| 6 |
Alcohol modified RTV silicone encapsulation for integrated circuit device packaging
|
|
|
1984
|
24 |
5 |
p. 998-
1 p.
|
article
|
| 7 |
Algebraical algorithm for computing complex systems reliability
|
Luis Roca, J.
|
|
1984
|
24 |
5 |
p. 901-903
3 p.
|
article
|
| 8 |
A maintenance philosophy for mainframe computers
|
|
|
1984
|
24 |
5 |
p. 995-
1 p.
|
article
|
| 9 |
A management guide to reliability predictions
|
|
|
1984
|
24 |
5 |
p. 995-
1 p.
|
article
|
| 10 |
Analysis of a k-out-of-n unit system with two types of failure and preventive maintenance
|
Goel, L.R.
|
|
1984
|
24 |
5 |
p. 877-880
4 p.
|
article
|
| 11 |
Analysis of a two-unit repairable system with random inspection subject to two types of failure
|
|
|
1984
|
24 |
5 |
p. 992-993
2 p.
|
article
|
| 12 |
Analysis of a two unit standby system with partial failure and two types of repairs
|
Goel, L.R.
|
|
1984
|
24 |
5 |
p. 873-876
4 p.
|
article
|
| 13 |
Analysis of 1-out-of-n: G adjustable operating system
|
|
|
1984
|
24 |
5 |
p. 989-
1 p.
|
article
|
| 14 |
Analysis of series deviance in a parallel state transition diagram and applications to fault tolerant computing
|
|
|
1984
|
24 |
5 |
p. 989-
1 p.
|
article
|
| 15 |
Analysis of systems subject to inspection and repair: A state-of-the-art survey
|
Subramanyam Naidu, R.
|
|
1984
|
24 |
5 |
p. 939-945
7 p.
|
article
|
| 16 |
A new technique to optimize system reliability
|
|
|
1984
|
24 |
5 |
p. 991-
1 p.
|
article
|
| 17 |
A program for reliable high power μW transistors (the AN/SPS-40 solid-state transmitter)
|
|
|
1984
|
24 |
5 |
p. 988-
1 p.
|
article
|
| 18 |
A reliability physics model for parallel system
|
|
|
1984
|
24 |
5 |
p. 992-
1 p.
|
article
|
| 19 |
A review of reactive ion beam etching for production
|
|
|
1984
|
24 |
5 |
p. 1005-
1 p.
|
article
|
| 20 |
Argon and reactive ion beam etching for SAW devices
|
|
|
1984
|
24 |
5 |
p. 1005-
1 p.
|
article
|
| 21 |
Assembly-packaging technology trends
|
|
|
1984
|
24 |
5 |
p. 998-
1 p.
|
article
|
| 22 |
Assessment of reliability prior distribution
|
|
|
1984
|
24 |
5 |
p. 994-995
2 p.
|
article
|
| 23 |
Availability measures for an intermittently used repairable system
|
|
|
1984
|
24 |
5 |
p. 992-
1 p.
|
article
|
| 24 |
A variance expression for a security-of-supply model
|
|
|
1984
|
24 |
5 |
p. 990-
1 p.
|
article
|
| 25 |
Beam-induced broadening effects in sputter depth profiling
|
|
|
1984
|
24 |
5 |
p. 1003-
1 p.
|
article
|
| 26 |
BIT detectability/reliability in expendable weapons
|
|
|
1984
|
24 |
5 |
p. 993-
1 p.
|
article
|
| 27 |
Busy-period analysis of a two-unit warm standby system with inspection time
|
|
|
1984
|
24 |
5 |
p. 992-
1 p.
|
article
|
| 28 |
CAD in electronics construction effects on the designing engineer and on the construction result
|
|
|
1984
|
24 |
5 |
p. 999-
1 p.
|
article
|
| 29 |
CAD's interface between design and mask-making
|
|
|
1984
|
24 |
5 |
p. 997-
1 p.
|
article
|
| 30 |
Calendar of International Conferences, Symposia, Lectures and Meetings of Interest
|
|
|
1984
|
24 |
5 |
p. 827-829
3 p.
|
article
|
| 31 |
Capabilities of molecular beam epitaxy and materials prospects
|
|
|
1984
|
24 |
5 |
p. 1005-
1 p.
|
article
|
| 32 |
Carrier mobility in inversion layers and rf plasma induced radiation defects at the Si-SiO2 interface
|
|
|
1984
|
24 |
5 |
p. 1000-
1 p.
|
article
|
| 33 |
Choosing a practical MTTF model for ECC memory chip
|
|
|
1984
|
24 |
5 |
p. 988-
1 p.
|
article
|
| 34 |
Classifying combined hardware/software R models
|
|
|
1984
|
24 |
5 |
p. 994-
1 p.
|
article
|
| 35 |
Common errors in application of MIL-STD-781
|
|
|
1984
|
24 |
5 |
p. 995-
1 p.
|
article
|
| 36 |
Compensation-induced optical transitions within the ground state of shallow donors in Ge and Si
|
|
|
1984
|
24 |
5 |
p. 1001-
1 p.
|
article
|
| 37 |
Computer-aided design of an eight bit binary counter N-MOS chip for large scale integration (LSI)
|
Srivastava, Ashok
|
|
1984
|
24 |
5 |
p. 885-896
12 p.
|
article
|
| 38 |
Computer aided quality management in electronics and production—a challenge for the entire enterprise
|
|
|
1984
|
24 |
5 |
p. 991-
1 p.
|
article
|
| 39 |
Computer analysis on the collection of alpha-generated charge for reflecting and absorbing surface conditions around the collector
|
|
|
1984
|
24 |
5 |
p. 1000-
1 p.
|
article
|
| 40 |
Contracting for liability relief
|
|
|
1984
|
24 |
5 |
p. 987-
1 p.
|
article
|
| 41 |
Contractor experience using RADC ORACLE
|
|
|
1984
|
24 |
5 |
p. 994-
1 p.
|
article
|
| 42 |
CORDIS—an improved high-current ion source for gases
|
|
|
1984
|
24 |
5 |
p. 1004-
1 p.
|
article
|
| 43 |
Cost analysis of a two-unit standby system with two types of repairmen
|
Goyal, Vibha
|
|
1984
|
24 |
5 |
p. 849-855
7 p.
|
article
|
| 44 |
Cost limit replacement policy under minimal repair
|
|
|
1984
|
24 |
5 |
p. 992-
1 p.
|
article
|
| 45 |
Cost savings by establishing life limits
|
|
|
1984
|
24 |
5 |
p. 996-
1 p.
|
article
|
| 46 |
Credible and HPD intervals of the parameter and reliability of Rayleigh distribution
|
|
|
1984
|
24 |
5 |
p. 991-
1 p.
|
article
|
| 47 |
Critical component requirements for vapor phase soldering leadless components on circuit board assemblies for military electronics
|
|
|
1984
|
24 |
5 |
p. 1001-
1 p.
|
article
|
| 48 |
Cumulative sum control charts for the mean of an exponential distribution using extremes
|
|
|
1984
|
24 |
5 |
p. 989-
1 p.
|
article
|
| 49 |
Current transport mechanisms of electrochemically deposited CdS/CdTe heterojunction
|
|
|
1984
|
24 |
5 |
p. 1000-
1 p.
|
article
|
| 50 |
Damage effects in silicon and MNOS structures caused by beams of ionized and neutral argon atoms with energies below 5 keV
|
|
|
1984
|
24 |
5 |
p. 1004-
1 p.
|
article
|
| 51 |
Defining the issues in wafer fab
|
|
|
1984
|
24 |
5 |
p. 999-
1 p.
|
article
|
| 52 |
Density of states modifications in amorphous and hydrogenated amorphous germanium and their effect on 3d core levels binding energy
|
|
|
1984
|
24 |
5 |
p. 1000-
1 p.
|
article
|
| 53 |
Design of a comprehensive process evaluation vehicle for development of small geometry CMOS process
|
Bandyopadhyay, A.
|
|
1984
|
24 |
5 |
p. 905-909
5 p.
|
article
|
| 54 |
Determining operating and support costs with USAF D056 maintenance data collection system
|
|
|
1984
|
24 |
5 |
p. 993-
1 p.
|
article
|
| 55 |
Development of adhesive die attach technology in cerdip packages; material issues
|
|
|
1984
|
24 |
5 |
p. 999-
1 p.
|
article
|
| 56 |
Development of nondestructive pull test requirements for gold wires on multilayer thick-film hybrid microcircuits
|
|
|
1984
|
24 |
5 |
p. 1002-
1 p.
|
article
|
| 57 |
Diffusion length and surface recombination velocity measurements with the scanning electron microscope: the highly-doped emitter of a p-n junction
|
|
|
1984
|
24 |
5 |
p. 1000-
1 p.
|
article
|
| 58 |
Digital GaAs ICs hit gigahertz speed mark
|
|
|
1984
|
24 |
5 |
p. 999-
1 p.
|
article
|
| 59 |
DoD/industry—R & M case study analysis
|
|
|
1984
|
24 |
5 |
p. 995-
1 p.
|
article
|
| 60 |
E-beam lithography: a story of dual identities
|
|
|
1984
|
24 |
5 |
p. 1005-
1 p.
|
article
|
| 61 |
Environmental stress screening—lessons learned
|
|
|
1984
|
24 |
5 |
p. 997-
1 p.
|
article
|
| 62 |
Equivalent matrix parameter functions for two-port sub-networks of non-uniform thin-film Y-Z-KY structure
|
Ahmed, Kamal U.
|
|
1984
|
24 |
5 |
p. 837-843
7 p.
|
article
|
| 63 |
Establishing realistic requirements for reliability, maintainability, and built-in-test
|
|
|
1984
|
24 |
5 |
p. 996-
1 p.
|
article
|
| 64 |
Evaporation characteristics of electron beam gun heated sources
|
|
|
1984
|
24 |
5 |
p. 1001-
1 p.
|
article
|
| 65 |
Event tree modeling on a small computer
|
|
|
1984
|
24 |
5 |
p. 989-
1 p.
|
article
|
| 66 |
Fabrication of Schottky-barrier diodes using a thick film technique
|
|
|
1984
|
24 |
5 |
p. 1002-
1 p.
|
article
|
| 67 |
Factors affecting fiber optics reliability
|
|
|
1984
|
24 |
5 |
p. 987-
1 p.
|
article
|
| 68 |
Failure analysis in semiconductor devices—rationale, methodology and practice
|
|
|
1984
|
24 |
5 |
p. 988-
1 p.
|
article
|
| 69 |
Failure modes and effects analysis (FMEA/FMECA)
|
|
|
1984
|
24 |
5 |
p. 832-
1 p.
|
article
|
| 70 |
Failure to safety in process-control systems
|
|
|
1984
|
24 |
5 |
p. 995-
1 p.
|
article
|
| 71 |
Fault tree synthesis from a directed graph model for a power distribution network
|
|
|
1984
|
24 |
5 |
p. 990-
1 p.
|
article
|
| 72 |
Field data: the final measure
|
|
|
1984
|
24 |
5 |
p. 996-
1 p.
|
article
|
| 73 |
Firing studies with a model thick film resistor system
|
|
|
1984
|
24 |
5 |
p. 1002-
1 p.
|
article
|
| 74 |
Flexible circuits offer a simple solution to chip-carrier mounting
|
|
|
1984
|
24 |
5 |
p. 999-
1 p.
|
article
|
| 75 |
Floating redundancy in digital systems
|
|
|
1984
|
24 |
5 |
p. 993-
1 p.
|
article
|
| 76 |
Folded equations for a Weibull maximum likelihood ratio test
|
|
|
1984
|
24 |
5 |
p. 991-
1 p.
|
article
|
| 77 |
For hybrids: a way to higher chip yields
|
|
|
1984
|
24 |
5 |
p. 1002-
1 p.
|
article
|
| 78 |
Fuzzy-network planning—FNET
|
|
|
1984
|
24 |
5 |
p. 990-
1 p.
|
article
|
| 79 |
Generalized acceleration factor in reliability
|
|
|
1984
|
24 |
5 |
p. 995-
1 p.
|
article
|
| 80 |
Guidelines for establishing an effective ESD program
|
|
|
1984
|
24 |
5 |
p. 987-
1 p.
|
article
|
| 81 |
Hot spots caused by voids and cracks in the chip mount-down medium in power semiconductor packaging
|
|
|
1984
|
24 |
5 |
p. 998-999
2 p.
|
article
|
| 82 |
IC failure rate estimates from field data
|
|
|
1984
|
24 |
5 |
p. 988-
1 p.
|
article
|
| 83 |
Incoming inspection and delivery quality of integrated circuits
|
Wurnik, F.M.
|
|
1984
|
24 |
5 |
p. 925-933
9 p.
|
article
|
| 84 |
Influence of DC bias sputtering during aluminum metallization
|
|
|
1984
|
24 |
5 |
p. 999-
1 p.
|
article
|
| 85 |
Influence of the chip temperature on the moisture-induced failure rate of plastic-encapsulated devices
|
|
|
1984
|
24 |
5 |
p. 988-
1 p.
|
article
|
| 86 |
Injection-coupled logic leads bipolar RAMs to VLSI
|
|
|
1984
|
24 |
5 |
p. 999-
1 p.
|
article
|
| 87 |
Interconnecting and packaging VLSI chips
|
|
|
1984
|
24 |
5 |
p. 998-
1 p.
|
article
|
| 88 |
Interval reliability for initiating and enabling events
|
|
|
1984
|
24 |
5 |
p. 990-
1 p.
|
article
|
| 89 |
Ion beam etching GaAs for integrated optical applications
|
|
|
1984
|
24 |
5 |
p. 1004-
1 p.
|
article
|
| 90 |
Ion-beam system resolves patterns of 0.5 micrometer
|
|
|
1984
|
24 |
5 |
p. 1004-
1 p.
|
article
|
| 91 |
ITAD—A CAD system for environmental reliability design
|
|
|
1984
|
24 |
5 |
p. 995-
1 p.
|
article
|
| 92 |
Landau theory of phase transitions in thick films
|
|
|
1984
|
24 |
5 |
p. 1001-
1 p.
|
article
|
| 93 |
Low energy electron microscopy utilized in dynamic circuit analysis and failure detection on LSI-VLSI internal circuits
|
|
|
1984
|
24 |
5 |
p. 994-
1 p.
|
article
|
| 94 |
Low firing temperature multilayer glass—ceramic substrate
|
|
|
1984
|
24 |
5 |
p. 988-
1 p.
|
article
|
| 95 |
Maintenance processors for mainframe computers
|
|
|
1984
|
24 |
5 |
p. 989-
1 p.
|
article
|
| 96 |
Management of logistic support costs in the equipment acquisition phase
|
|
|
1984
|
24 |
5 |
p. 996-997
2 p.
|
article
|
| 97 |
Managerial decision-making in establishing R & M design goals
|
|
|
1984
|
24 |
5 |
p. 997-
1 p.
|
article
|
| 98 |
Managing test-procedures to achieve reliable software
|
|
|
1984
|
24 |
5 |
p. 989-990
2 p.
|
article
|
| 99 |
Matrix parameters of non-uniform distributed parameter thin film C-R-KC micro-systems of circular geometry
|
Ahmed, Kamal U.
|
|
1984
|
24 |
5 |
p. 845-848
4 p.
|
article
|
| 100 |
Measurement of the tunneling and hopping parameters in RuO2 thick films
|
|
|
1984
|
24 |
5 |
p. 1001-
1 p.
|
article
|
| 101 |
Microwave ion source for high current metal beams
|
|
|
1984
|
24 |
5 |
p. 1003-
1 p.
|
article
|
| 102 |
Mid-film interconnects for multilayer microcircuit packages
|
|
|
1984
|
24 |
5 |
p. 1001-1002
2 p.
|
article
|
| 103 |
Model for reliability prediction of thick film resistors
|
|
|
1984
|
24 |
5 |
p. 1002-
1 p.
|
article
|
| 104 |
Modified periodic preventive maintenance policies
|
|
|
1984
|
24 |
5 |
p. 989-
1 p.
|
article
|
| 105 |
Monitored burn-in of MOS 64K dynamic RAMs
|
|
|
1984
|
24 |
5 |
p. 999-
1 p.
|
article
|
| 106 |
Nanometre structures in semiconductors formed by low energy ion implantation
|
|
|
1984
|
24 |
5 |
p. 1003-
1 p.
|
article
|
| 107 |
New Information Technology
|
G.W.A.D.,
|
|
1984
|
24 |
5 |
p. 985-986
2 p.
|
article
|
| 108 |
Nework topology for maximizing the terminal reliability in a Computer Communication Network
|
Chopra, Y.C.
|
|
1984
|
24 |
5 |
p. 911-913
3 p.
|
article
|
| 109 |
New sputtering techniques for semiconductor metallization
|
|
|
1984
|
24 |
5 |
p. 998-
1 p.
|
article
|
| 110 |
Nondestructive screening for low voltage failure in multilayer ceramic capacitors
|
|
|
1984
|
24 |
5 |
p. 988-
1 p.
|
article
|
| 111 |
Nonparametric tests for testing the homogeneity of k(>2) exponential, Gamma and Weibull populations using censored data
|
|
|
1984
|
24 |
5 |
p. 989-
1 p.
|
article
|
| 112 |
On criterion of comparison of reliabilities
|
|
|
1984
|
24 |
5 |
p. 994-
1 p.
|
article
|
| 113 |
On profit evaluation in a modular system with two types of failures
|
|
|
1984
|
24 |
5 |
p. 991-
1 p.
|
article
|
| 114 |
On speeding-up of iteration convergence in semiconductor problems
|
|
|
1984
|
24 |
5 |
p. 1000-
1 p.
|
article
|
| 115 |
On the determination of all tie sets and minimal cut sets between any two nodes of a graph through Petri nets
|
|
|
1984
|
24 |
5 |
p. 991-
1 p.
|
article
|
| 116 |
On the fabrication of thin film MICs from substrate cleaning to pattern delineation
|
Nahar, R.K.
|
|
1984
|
24 |
5 |
p. 833-836
4 p.
|
article
|
| 117 |
Optimal inspection when the system is repaired upon detection of failure
|
Aven, Terje
|
|
1984
|
24 |
5 |
p. 961-963
3 p.
|
article
|
| 118 |
Optimal policies in a two-unit standby system with two types of repairmen
|
Goyal, Vibha
|
|
1984
|
24 |
5 |
p. 857-864
8 p.
|
article
|
| 119 |
Optimization of spares in a maintenance scenario
|
|
|
1984
|
24 |
5 |
p. 994-
1 p.
|
article
|
| 120 |
Optimum warranty policies for nonreparable items
|
|
|
1984
|
24 |
5 |
p. 997-
1 p.
|
article
|
| 121 |
Oxygen distributions in synthesized SiO2 layers formed by high dose O+ implantation into silicon
|
|
|
1984
|
24 |
5 |
p. 1004-
1 p.
|
article
|
| 122 |
Parallel/series dependency and equivalence in generalized Markov's chains
|
|
|
1984
|
24 |
5 |
p. 990-
1 p.
|
article
|
| 123 |
Parasitic MOSFETs in an oxide-isolated bipolar technology: process-control measurements
|
|
|
1984
|
24 |
5 |
p. 999-
1 p.
|
article
|
| 124 |
Planning of production reliability stress-screening programs
|
|
|
1984
|
24 |
5 |
p. 997-998
2 p.
|
article
|
| 125 |
Plasma enhanced deposition of “silicon nitride” for use as an encapsulant for silicon ion-implanted gallium arsenide
|
|
|
1984
|
24 |
5 |
p. 1003-
1 p.
|
article
|
| 126 |
Power GaAs MESFET: Reliability aspects and failure mechanisms
|
Canali, C.
|
|
1984
|
24 |
5 |
p. 947-955
9 p.
|
article
|
| 127 |
Power-system reliability in perspective
|
|
|
1984
|
24 |
5 |
p. 994-
1 p.
|
article
|
| 128 |
Predicted vs test MTBF's… why the disparity?
|
|
|
1984
|
24 |
5 |
p. 995-
1 p.
|
article
|
| 129 |
Prediction intervals using exceedances for an additional thirdstage sample
|
|
|
1984
|
24 |
5 |
p. 990-991
2 p.
|
article
|
| 130 |
Probabilistic delay evaluation in combinational digital circuits by Petri Nets
|
|
|
1984
|
24 |
5 |
p. 992-
1 p.
|
article
|
| 131 |
Procedures and tables for construction and selection of multiple deferred state (MDS-1) (c1, c2)) plans
|
|
|
1984
|
24 |
5 |
p. 997-
1 p.
|
article
|
| 132 |
Process and film characterization of PECVD borophos-phosilicate films for VLSI applications
|
|
|
1984
|
24 |
5 |
p. 1004-
1 p.
|
article
|
| 133 |
Processing linear devices for performance and reliability
|
|
|
1984
|
24 |
5 |
p. 999-
1 p.
|
article
|
| 134 |
Production of a dense low energy positive hydrogen ion beam
|
|
|
1984
|
24 |
5 |
p. 1003-
1 p.
|
article
|
| 135 |
Publication, Notice, Call for Papers, etc.
|
|
|
1984
|
24 |
5 |
p. 831-
1 p.
|
article
|
| 136 |
Pulse propagation properties of multilayer ceramic multichip modules for VLSI circuits
|
|
|
1984
|
24 |
5 |
p. 987-988
2 p.
|
article
|
| 137 |
Quality circles—an experience in Jyoti Limited
|
|
|
1984
|
24 |
5 |
p. 996-
1 p.
|
article
|
| 138 |
Quality control techniques for “Zero Defects”
|
|
|
1984
|
24 |
5 |
p. 991-992
2 p.
|
article
|
| 139 |
Raman scattering from gas-evaporated silicon small particles
|
|
|
1984
|
24 |
5 |
p. 1000-
1 p.
|
article
|
| 140 |
Recoil profiles produced by ion implantation through dielectric layers
|
|
|
1984
|
24 |
5 |
p. 1004-
1 p.
|
article
|
| 141 |
Reliability analysis of two special three-state devices
|
Luis Roca, J.
|
|
1984
|
24 |
5 |
p. 899-900
2 p.
|
article
|
| 142 |
Reliability and availability analysis of systems operating in multiple environments
|
|
|
1984
|
24 |
5 |
p. 989-
1 p.
|
article
|
| 143 |
Reliability and maintainability acquisition handbook
|
|
|
1984
|
24 |
5 |
p. 993-
1 p.
|
article
|
| 144 |
Reliability cost estimation: managerial perspectives
|
|
|
1984
|
24 |
5 |
p. 997-
1 p.
|
article
|
| 145 |
Reliability evaluation of protective system with scheduled and unscheduled maintenance
|
Kohda, Takehisa
|
|
1984
|
24 |
5 |
p. 957-960
4 p.
|
article
|
| 146 |
Reliability-growth programmes for undersea communication systems
|
|
|
1984
|
24 |
5 |
p. 996-
1 p.
|
article
|
| 147 |
Reliability investment and life-cycle cost
|
|
|
1984
|
24 |
5 |
p. 996-
1 p.
|
article
|
| 148 |
Reliability of optoelectronic semiconductor components
|
|
|
1984
|
24 |
5 |
p. 987-
1 p.
|
article
|
| 149 |
Reliability prediction: improving the crystal ball
|
|
|
1984
|
24 |
5 |
p. 993-
1 p.
|
article
|
| 150 |
Reliability programs for commercial communication satellites
|
|
|
1984
|
24 |
5 |
p. 992-
1 p.
|
article
|
| 151 |
Review: dry etching of silicon oxide
|
|
|
1984
|
24 |
5 |
p. 998-
1 p.
|
article
|
| 152 |
R/M design for long term dormant storage
|
|
|
1984
|
24 |
5 |
p. 995-996
2 p.
|
article
|
| 153 |
Shallow ion implantation in gallium arsenide
|
|
|
1984
|
24 |
5 |
p. 1003-
1 p.
|
article
|
| 154 |
Shifting shape-parameter in life tests: a Bayes analysis
|
|
|
1984
|
24 |
5 |
p. 990-
1 p.
|
article
|
| 155 |
Shrunken estimators of Weibull shape parameter in censored samples
|
|
|
1984
|
24 |
5 |
p. 990-
1 p.
|
article
|
| 156 |
Simplified algorithm for optimum availability allocation and redundancy optimization subject to cost constraint
|
Govil, K.K.
|
|
1984
|
24 |
5 |
p. 935-938
4 p.
|
article
|
| 157 |
Slection of Weibull shape parameter, based on adaptive estimation
|
|
|
1984
|
24 |
5 |
p. 990-
1 p.
|
article
|
| 158 |
Software configuration management and its contribution to reliability program management
|
|
|
1984
|
24 |
5 |
p. 993-
1 p.
|
article
|
| 159 |
Software reliability analysis based on a nonhomogeneous error detection rate model
|
Yamada, Shigeru
|
|
1984
|
24 |
5 |
p. 915-920
6 p.
|
article
|
| 160 |
Software reliability models: a review
|
|
|
1984
|
24 |
5 |
p. 991-
1 p.
|
article
|
| 161 |
Solder side up—the move to surface mounting
|
|
|
1984
|
24 |
5 |
p. 999-
1 p.
|
article
|
| 162 |
Some applications of semi-regenerative processes to two-unit warm standby system
|
Uematsu, Kouya
|
|
1984
|
24 |
5 |
p. 965-977
13 p.
|
article
|
| 163 |
Some mechanisms of sputtered negative ion production
|
|
|
1984
|
24 |
5 |
p. 1004-
1 p.
|
article
|
| 164 |
Spacecraft anomalies and lifetimes
|
|
|
1984
|
24 |
5 |
p. 994-
1 p.
|
article
|
| 165 |
Spatially resolved optical spectroscopy of plasma etching systems
|
|
|
1984
|
24 |
5 |
p. 1001-
1 p.
|
article
|
| 166 |
Sputter etched molybdenum-oxidation technique for fine patterns
|
Singh, Awatar
|
|
1984
|
24 |
5 |
p. 979-
1 p.
|
article
|
| 167 |
State space representation of Petri nets
|
Hura, G.S.
|
|
1984
|
24 |
5 |
p. 865-868
4 p.
|
article
|
| 168 |
Status report on the JLC panel on automatic testing
|
|
|
1984
|
24 |
5 |
p. 998-
1 p.
|
article
|
| 169 |
Steiner trees in probabilistic networks
|
|
|
1984
|
24 |
5 |
p. 991-
1 p.
|
article
|
| 170 |
Stochastic analysis of a two-unit parallel system with partial and catastrophic failures and preventive maintenance
|
Goel, L.R.
|
|
1984
|
24 |
5 |
p. 881-883
3 p.
|
article
|
| 171 |
Stochastic behaviour of a maintained system with protection system
|
Kumar, Ashok
|
|
1984
|
24 |
5 |
p. 869-872
4 p.
|
article
|
| 172 |
Stochastic behaviour of a standby redundant system with three modes
|
|
|
1984
|
24 |
5 |
p. 989-
1 p.
|
article
|
| 173 |
Stochastic behaviour of a two-unit cold standby system with three modes and allowed down time
|
|
|
1984
|
24 |
5 |
p. 992-
1 p.
|
article
|
| 174 |
Stochastic models for evaluating probability of system failure due to human error
|
Dhillon, Balbir S.
|
|
1984
|
24 |
5 |
p. 921-924
4 p.
|
article
|
| 175 |
Storage reliability with periodic test
|
|
|
1984
|
24 |
5 |
p. 994-
1 p.
|
article
|
| 176 |
Structured copper: a pliable high conductance material for bonding to silicon power devices
|
|
|
1984
|
24 |
5 |
p. 999-
1 p.
|
article
|
| 177 |
Surface mounting alters the PC-board scene
|
|
|
1984
|
24 |
5 |
p. 999-
1 p.
|
article
|
| 178 |
System comparisons can simplify selection of parametric tester
|
|
|
1984
|
24 |
5 |
p. 990-
1 p.
|
article
|
| 179 |
Ta-SiC thin film resistors for highly reliable thermal printing heads
|
|
|
1984
|
24 |
5 |
p. 1002-
1 p.
|
article
|
| 180 |
Testing—a major concern for VLSI
|
|
|
1984
|
24 |
5 |
p. 998-
1 p.
|
article
|
| 181 |
Test structure methodology of IC package material characterization
|
|
|
1984
|
24 |
5 |
p. 998-
1 p.
|
article
|
| 182 |
The effect of ion species on bombardment induced topography during ion etching of silicon
|
|
|
1984
|
24 |
5 |
p. 1004-
1 p.
|
article
|
| 183 |
The effect of preventive maintenance on a system with imperfect switchover
|
|
|
1984
|
24 |
5 |
p. 990-
1 p.
|
article
|
| 184 |
The effect of preventive maintenance on a two-dissimilar unit standby system
|
|
|
1984
|
24 |
5 |
p. 990-
1 p.
|
article
|
| 185 |
The effects of plasma and ion beam processing on the propertives of n-GaAs Schottky diodes
|
|
|
1984
|
24 |
5 |
p. 1003-
1 p.
|
article
|
| 186 |
The influence of fast infrared firing on thick film materials
|
|
|
1984
|
24 |
5 |
p. 1001-
1 p.
|
article
|
| 187 |
The ion optics of low-energy ion beams
|
|
|
1984
|
24 |
5 |
p. 1002-1003
2 p.
|
article
|
| 188 |
The operational readiness: the reliability and maintainability connection
|
|
|
1984
|
24 |
5 |
p. 995-
1 p.
|
article
|
| 189 |
Theory of the surface depletion region for semiconductors with linearly graded impurity profiles
|
|
|
1984
|
24 |
5 |
p. 1000-
1 p.
|
article
|
| 190 |
The quality of die-attachment and its relationship to stresses and vertical die-cracking
|
|
|
1984
|
24 |
5 |
p. 999-
1 p.
|
article
|
| 191 |
The structure of molten germanium
|
|
|
1984
|
24 |
5 |
p. 1001-
1 p.
|
article
|
| 192 |
Thick-film non-reciprocal ferrite elements and gunn hybrid oscillators in modified thick-film technology
|
|
|
1984
|
24 |
5 |
p. 1001-
1 p.
|
article
|
| 193 |
Thick film polyester screen on glass as photomask
|
Singh, Awatar
|
|
1984
|
24 |
5 |
p. 981-983
3 p.
|
article
|
| 194 |
Time-resolved scanned electron beam annealing of ion-implanted polycrystalline silicon
|
|
|
1984
|
24 |
5 |
p. 1005-
1 p.
|
article
|
| 195 |
Trends in LSI/VLSI testing
|
|
|
1984
|
24 |
5 |
p. 998-
1 p.
|
article
|
| 196 |
VLSI packaging reliability
|
|
|
1984
|
24 |
5 |
p. 993-
1 p.
|
article
|
| 197 |
VLSI test systems: facing the challenge of tomorrow
|
|
|
1984
|
24 |
5 |
p. 998-
1 p.
|
article
|
| 198 |
Worst case reliability bounds
|
|
|
1984
|
24 |
5 |
p. 990-
1 p.
|
article
|
Journal description