nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
A Bayes procedure combining black box estimates and laboratory tests
|
|
|
1984 |
24 |
5 |
p. 994- 1 p. |
artikel |
2 |
A comparison of SIMS with other techniques based on ion-beam solid interactions
|
|
|
1984 |
24 |
5 |
p. 1002- 1 p. |
artikel |
3 |
Adhesive techniques in microelectronics
|
|
|
1984 |
24 |
5 |
p. 1002- 1 p. |
artikel |
4 |
A fast algorithm to formulate Markov system equations
|
Luis Roca, J. |
|
1984 |
24 |
5 |
p. 897-898 2 p. |
artikel |
5 |
A gaseous detector device for an environmental SEM
|
|
|
1984 |
24 |
5 |
p. 1000- 1 p. |
artikel |
6 |
Alcohol modified RTV silicone encapsulation for integrated circuit device packaging
|
|
|
1984 |
24 |
5 |
p. 998- 1 p. |
artikel |
7 |
Algebraical algorithm for computing complex systems reliability
|
Luis Roca, J. |
|
1984 |
24 |
5 |
p. 901-903 3 p. |
artikel |
8 |
A maintenance philosophy for mainframe computers
|
|
|
1984 |
24 |
5 |
p. 995- 1 p. |
artikel |
9 |
A management guide to reliability predictions
|
|
|
1984 |
24 |
5 |
p. 995- 1 p. |
artikel |
10 |
Analysis of a k-out-of-n unit system with two types of failure and preventive maintenance
|
Goel, L.R. |
|
1984 |
24 |
5 |
p. 877-880 4 p. |
artikel |
11 |
Analysis of a two-unit repairable system with random inspection subject to two types of failure
|
|
|
1984 |
24 |
5 |
p. 992-993 2 p. |
artikel |
12 |
Analysis of a two unit standby system with partial failure and two types of repairs
|
Goel, L.R. |
|
1984 |
24 |
5 |
p. 873-876 4 p. |
artikel |
13 |
Analysis of 1-out-of-n: G adjustable operating system
|
|
|
1984 |
24 |
5 |
p. 989- 1 p. |
artikel |
14 |
Analysis of series deviance in a parallel state transition diagram and applications to fault tolerant computing
|
|
|
1984 |
24 |
5 |
p. 989- 1 p. |
artikel |
15 |
Analysis of systems subject to inspection and repair: A state-of-the-art survey
|
Subramanyam Naidu, R. |
|
1984 |
24 |
5 |
p. 939-945 7 p. |
artikel |
16 |
A new technique to optimize system reliability
|
|
|
1984 |
24 |
5 |
p. 991- 1 p. |
artikel |
17 |
A program for reliable high power μW transistors (the AN/SPS-40 solid-state transmitter)
|
|
|
1984 |
24 |
5 |
p. 988- 1 p. |
artikel |
18 |
A reliability physics model for parallel system
|
|
|
1984 |
24 |
5 |
p. 992- 1 p. |
artikel |
19 |
A review of reactive ion beam etching for production
|
|
|
1984 |
24 |
5 |
p. 1005- 1 p. |
artikel |
20 |
Argon and reactive ion beam etching for SAW devices
|
|
|
1984 |
24 |
5 |
p. 1005- 1 p. |
artikel |
21 |
Assembly-packaging technology trends
|
|
|
1984 |
24 |
5 |
p. 998- 1 p. |
artikel |
22 |
Assessment of reliability prior distribution
|
|
|
1984 |
24 |
5 |
p. 994-995 2 p. |
artikel |
23 |
Availability measures for an intermittently used repairable system
|
|
|
1984 |
24 |
5 |
p. 992- 1 p. |
artikel |
24 |
A variance expression for a security-of-supply model
|
|
|
1984 |
24 |
5 |
p. 990- 1 p. |
artikel |
25 |
Beam-induced broadening effects in sputter depth profiling
|
|
|
1984 |
24 |
5 |
p. 1003- 1 p. |
artikel |
26 |
BIT detectability/reliability in expendable weapons
|
|
|
1984 |
24 |
5 |
p. 993- 1 p. |
artikel |
27 |
Busy-period analysis of a two-unit warm standby system with inspection time
|
|
|
1984 |
24 |
5 |
p. 992- 1 p. |
artikel |
28 |
CAD in electronics construction effects on the designing engineer and on the construction result
|
|
|
1984 |
24 |
5 |
p. 999- 1 p. |
artikel |
29 |
CAD's interface between design and mask-making
|
|
|
1984 |
24 |
5 |
p. 997- 1 p. |
artikel |
30 |
Calendar of International Conferences, Symposia, Lectures and Meetings of Interest
|
|
|
1984 |
24 |
5 |
p. 827-829 3 p. |
artikel |
31 |
Capabilities of molecular beam epitaxy and materials prospects
|
|
|
1984 |
24 |
5 |
p. 1005- 1 p. |
artikel |
32 |
Carrier mobility in inversion layers and rf plasma induced radiation defects at the Si-SiO2 interface
|
|
|
1984 |
24 |
5 |
p. 1000- 1 p. |
artikel |
33 |
Choosing a practical MTTF model for ECC memory chip
|
|
|
1984 |
24 |
5 |
p. 988- 1 p. |
artikel |
34 |
Classifying combined hardware/software R models
|
|
|
1984 |
24 |
5 |
p. 994- 1 p. |
artikel |
35 |
Common errors in application of MIL-STD-781
|
|
|
1984 |
24 |
5 |
p. 995- 1 p. |
artikel |
36 |
Compensation-induced optical transitions within the ground state of shallow donors in Ge and Si
|
|
|
1984 |
24 |
5 |
p. 1001- 1 p. |
artikel |
37 |
Computer-aided design of an eight bit binary counter N-MOS chip for large scale integration (LSI)
|
Srivastava, Ashok |
|
1984 |
24 |
5 |
p. 885-896 12 p. |
artikel |
38 |
Computer aided quality management in electronics and production—a challenge for the entire enterprise
|
|
|
1984 |
24 |
5 |
p. 991- 1 p. |
artikel |
39 |
Computer analysis on the collection of alpha-generated charge for reflecting and absorbing surface conditions around the collector
|
|
|
1984 |
24 |
5 |
p. 1000- 1 p. |
artikel |
40 |
Contracting for liability relief
|
|
|
1984 |
24 |
5 |
p. 987- 1 p. |
artikel |
41 |
Contractor experience using RADC ORACLE
|
|
|
1984 |
24 |
5 |
p. 994- 1 p. |
artikel |
42 |
CORDIS—an improved high-current ion source for gases
|
|
|
1984 |
24 |
5 |
p. 1004- 1 p. |
artikel |
43 |
Cost analysis of a two-unit standby system with two types of repairmen
|
Goyal, Vibha |
|
1984 |
24 |
5 |
p. 849-855 7 p. |
artikel |
44 |
Cost limit replacement policy under minimal repair
|
|
|
1984 |
24 |
5 |
p. 992- 1 p. |
artikel |
45 |
Cost savings by establishing life limits
|
|
|
1984 |
24 |
5 |
p. 996- 1 p. |
artikel |
46 |
Credible and HPD intervals of the parameter and reliability of Rayleigh distribution
|
|
|
1984 |
24 |
5 |
p. 991- 1 p. |
artikel |
47 |
Critical component requirements for vapor phase soldering leadless components on circuit board assemblies for military electronics
|
|
|
1984 |
24 |
5 |
p. 1001- 1 p. |
artikel |
48 |
Cumulative sum control charts for the mean of an exponential distribution using extremes
|
|
|
1984 |
24 |
5 |
p. 989- 1 p. |
artikel |
49 |
Current transport mechanisms of electrochemically deposited CdS/CdTe heterojunction
|
|
|
1984 |
24 |
5 |
p. 1000- 1 p. |
artikel |
50 |
Damage effects in silicon and MNOS structures caused by beams of ionized and neutral argon atoms with energies below 5 keV
|
|
|
1984 |
24 |
5 |
p. 1004- 1 p. |
artikel |
51 |
Defining the issues in wafer fab
|
|
|
1984 |
24 |
5 |
p. 999- 1 p. |
artikel |
52 |
Density of states modifications in amorphous and hydrogenated amorphous germanium and their effect on 3d core levels binding energy
|
|
|
1984 |
24 |
5 |
p. 1000- 1 p. |
artikel |
53 |
Design of a comprehensive process evaluation vehicle for development of small geometry CMOS process
|
Bandyopadhyay, A. |
|
1984 |
24 |
5 |
p. 905-909 5 p. |
artikel |
54 |
Determining operating and support costs with USAF D056 maintenance data collection system
|
|
|
1984 |
24 |
5 |
p. 993- 1 p. |
artikel |
55 |
Development of adhesive die attach technology in cerdip packages; material issues
|
|
|
1984 |
24 |
5 |
p. 999- 1 p. |
artikel |
56 |
Development of nondestructive pull test requirements for gold wires on multilayer thick-film hybrid microcircuits
|
|
|
1984 |
24 |
5 |
p. 1002- 1 p. |
artikel |
57 |
Diffusion length and surface recombination velocity measurements with the scanning electron microscope: the highly-doped emitter of a p-n junction
|
|
|
1984 |
24 |
5 |
p. 1000- 1 p. |
artikel |
58 |
Digital GaAs ICs hit gigahertz speed mark
|
|
|
1984 |
24 |
5 |
p. 999- 1 p. |
artikel |
59 |
DoD/industry—R & M case study analysis
|
|
|
1984 |
24 |
5 |
p. 995- 1 p. |
artikel |
60 |
E-beam lithography: a story of dual identities
|
|
|
1984 |
24 |
5 |
p. 1005- 1 p. |
artikel |
61 |
Environmental stress screening—lessons learned
|
|
|
1984 |
24 |
5 |
p. 997- 1 p. |
artikel |
62 |
Equivalent matrix parameter functions for two-port sub-networks of non-uniform thin-film Y-Z-KY structure
|
Ahmed, Kamal U. |
|
1984 |
24 |
5 |
p. 837-843 7 p. |
artikel |
63 |
Establishing realistic requirements for reliability, maintainability, and built-in-test
|
|
|
1984 |
24 |
5 |
p. 996- 1 p. |
artikel |
64 |
Evaporation characteristics of electron beam gun heated sources
|
|
|
1984 |
24 |
5 |
p. 1001- 1 p. |
artikel |
65 |
Event tree modeling on a small computer
|
|
|
1984 |
24 |
5 |
p. 989- 1 p. |
artikel |
66 |
Fabrication of Schottky-barrier diodes using a thick film technique
|
|
|
1984 |
24 |
5 |
p. 1002- 1 p. |
artikel |
67 |
Factors affecting fiber optics reliability
|
|
|
1984 |
24 |
5 |
p. 987- 1 p. |
artikel |
68 |
Failure analysis in semiconductor devices—rationale, methodology and practice
|
|
|
1984 |
24 |
5 |
p. 988- 1 p. |
artikel |
69 |
Failure modes and effects analysis (FMEA/FMECA)
|
|
|
1984 |
24 |
5 |
p. 832- 1 p. |
artikel |
70 |
Failure to safety in process-control systems
|
|
|
1984 |
24 |
5 |
p. 995- 1 p. |
artikel |
71 |
Fault tree synthesis from a directed graph model for a power distribution network
|
|
|
1984 |
24 |
5 |
p. 990- 1 p. |
artikel |
72 |
Field data: the final measure
|
|
|
1984 |
24 |
5 |
p. 996- 1 p. |
artikel |
73 |
Firing studies with a model thick film resistor system
|
|
|
1984 |
24 |
5 |
p. 1002- 1 p. |
artikel |
74 |
Flexible circuits offer a simple solution to chip-carrier mounting
|
|
|
1984 |
24 |
5 |
p. 999- 1 p. |
artikel |
75 |
Floating redundancy in digital systems
|
|
|
1984 |
24 |
5 |
p. 993- 1 p. |
artikel |
76 |
Folded equations for a Weibull maximum likelihood ratio test
|
|
|
1984 |
24 |
5 |
p. 991- 1 p. |
artikel |
77 |
For hybrids: a way to higher chip yields
|
|
|
1984 |
24 |
5 |
p. 1002- 1 p. |
artikel |
78 |
Fuzzy-network planning—FNET
|
|
|
1984 |
24 |
5 |
p. 990- 1 p. |
artikel |
79 |
Generalized acceleration factor in reliability
|
|
|
1984 |
24 |
5 |
p. 995- 1 p. |
artikel |
80 |
Guidelines for establishing an effective ESD program
|
|
|
1984 |
24 |
5 |
p. 987- 1 p. |
artikel |
81 |
Hot spots caused by voids and cracks in the chip mount-down medium in power semiconductor packaging
|
|
|
1984 |
24 |
5 |
p. 998-999 2 p. |
artikel |
82 |
IC failure rate estimates from field data
|
|
|
1984 |
24 |
5 |
p. 988- 1 p. |
artikel |
83 |
Incoming inspection and delivery quality of integrated circuits
|
Wurnik, F.M. |
|
1984 |
24 |
5 |
p. 925-933 9 p. |
artikel |
84 |
Influence of DC bias sputtering during aluminum metallization
|
|
|
1984 |
24 |
5 |
p. 999- 1 p. |
artikel |
85 |
Influence of the chip temperature on the moisture-induced failure rate of plastic-encapsulated devices
|
|
|
1984 |
24 |
5 |
p. 988- 1 p. |
artikel |
86 |
Injection-coupled logic leads bipolar RAMs to VLSI
|
|
|
1984 |
24 |
5 |
p. 999- 1 p. |
artikel |
87 |
Interconnecting and packaging VLSI chips
|
|
|
1984 |
24 |
5 |
p. 998- 1 p. |
artikel |
88 |
Interval reliability for initiating and enabling events
|
|
|
1984 |
24 |
5 |
p. 990- 1 p. |
artikel |
89 |
Ion beam etching GaAs for integrated optical applications
|
|
|
1984 |
24 |
5 |
p. 1004- 1 p. |
artikel |
90 |
Ion-beam system resolves patterns of 0.5 micrometer
|
|
|
1984 |
24 |
5 |
p. 1004- 1 p. |
artikel |
91 |
ITAD—A CAD system for environmental reliability design
|
|
|
1984 |
24 |
5 |
p. 995- 1 p. |
artikel |
92 |
Landau theory of phase transitions in thick films
|
|
|
1984 |
24 |
5 |
p. 1001- 1 p. |
artikel |
93 |
Low energy electron microscopy utilized in dynamic circuit analysis and failure detection on LSI-VLSI internal circuits
|
|
|
1984 |
24 |
5 |
p. 994- 1 p. |
artikel |
94 |
Low firing temperature multilayer glass—ceramic substrate
|
|
|
1984 |
24 |
5 |
p. 988- 1 p. |
artikel |
95 |
Maintenance processors for mainframe computers
|
|
|
1984 |
24 |
5 |
p. 989- 1 p. |
artikel |
96 |
Management of logistic support costs in the equipment acquisition phase
|
|
|
1984 |
24 |
5 |
p. 996-997 2 p. |
artikel |
97 |
Managerial decision-making in establishing R & M design goals
|
|
|
1984 |
24 |
5 |
p. 997- 1 p. |
artikel |
98 |
Managing test-procedures to achieve reliable software
|
|
|
1984 |
24 |
5 |
p. 989-990 2 p. |
artikel |
99 |
Matrix parameters of non-uniform distributed parameter thin film C-R-KC micro-systems of circular geometry
|
Ahmed, Kamal U. |
|
1984 |
24 |
5 |
p. 845-848 4 p. |
artikel |
100 |
Measurement of the tunneling and hopping parameters in RuO2 thick films
|
|
|
1984 |
24 |
5 |
p. 1001- 1 p. |
artikel |
101 |
Microwave ion source for high current metal beams
|
|
|
1984 |
24 |
5 |
p. 1003- 1 p. |
artikel |
102 |
Mid-film interconnects for multilayer microcircuit packages
|
|
|
1984 |
24 |
5 |
p. 1001-1002 2 p. |
artikel |
103 |
Model for reliability prediction of thick film resistors
|
|
|
1984 |
24 |
5 |
p. 1002- 1 p. |
artikel |
104 |
Modified periodic preventive maintenance policies
|
|
|
1984 |
24 |
5 |
p. 989- 1 p. |
artikel |
105 |
Monitored burn-in of MOS 64K dynamic RAMs
|
|
|
1984 |
24 |
5 |
p. 999- 1 p. |
artikel |
106 |
Nanometre structures in semiconductors formed by low energy ion implantation
|
|
|
1984 |
24 |
5 |
p. 1003- 1 p. |
artikel |
107 |
New Information Technology
|
G.W.A.D., |
|
1984 |
24 |
5 |
p. 985-986 2 p. |
artikel |
108 |
Nework topology for maximizing the terminal reliability in a Computer Communication Network
|
Chopra, Y.C. |
|
1984 |
24 |
5 |
p. 911-913 3 p. |
artikel |
109 |
New sputtering techniques for semiconductor metallization
|
|
|
1984 |
24 |
5 |
p. 998- 1 p. |
artikel |
110 |
Nondestructive screening for low voltage failure in multilayer ceramic capacitors
|
|
|
1984 |
24 |
5 |
p. 988- 1 p. |
artikel |
111 |
Nonparametric tests for testing the homogeneity of k(>2) exponential, Gamma and Weibull populations using censored data
|
|
|
1984 |
24 |
5 |
p. 989- 1 p. |
artikel |
112 |
On criterion of comparison of reliabilities
|
|
|
1984 |
24 |
5 |
p. 994- 1 p. |
artikel |
113 |
On profit evaluation in a modular system with two types of failures
|
|
|
1984 |
24 |
5 |
p. 991- 1 p. |
artikel |
114 |
On speeding-up of iteration convergence in semiconductor problems
|
|
|
1984 |
24 |
5 |
p. 1000- 1 p. |
artikel |
115 |
On the determination of all tie sets and minimal cut sets between any two nodes of a graph through Petri nets
|
|
|
1984 |
24 |
5 |
p. 991- 1 p. |
artikel |
116 |
On the fabrication of thin film MICs from substrate cleaning to pattern delineation
|
Nahar, R.K. |
|
1984 |
24 |
5 |
p. 833-836 4 p. |
artikel |
117 |
Optimal inspection when the system is repaired upon detection of failure
|
Aven, Terje |
|
1984 |
24 |
5 |
p. 961-963 3 p. |
artikel |
118 |
Optimal policies in a two-unit standby system with two types of repairmen
|
Goyal, Vibha |
|
1984 |
24 |
5 |
p. 857-864 8 p. |
artikel |
119 |
Optimization of spares in a maintenance scenario
|
|
|
1984 |
24 |
5 |
p. 994- 1 p. |
artikel |
120 |
Optimum warranty policies for nonreparable items
|
|
|
1984 |
24 |
5 |
p. 997- 1 p. |
artikel |
121 |
Oxygen distributions in synthesized SiO2 layers formed by high dose O+ implantation into silicon
|
|
|
1984 |
24 |
5 |
p. 1004- 1 p. |
artikel |
122 |
Parallel/series dependency and equivalence in generalized Markov's chains
|
|
|
1984 |
24 |
5 |
p. 990- 1 p. |
artikel |
123 |
Parasitic MOSFETs in an oxide-isolated bipolar technology: process-control measurements
|
|
|
1984 |
24 |
5 |
p. 999- 1 p. |
artikel |
124 |
Planning of production reliability stress-screening programs
|
|
|
1984 |
24 |
5 |
p. 997-998 2 p. |
artikel |
125 |
Plasma enhanced deposition of “silicon nitride” for use as an encapsulant for silicon ion-implanted gallium arsenide
|
|
|
1984 |
24 |
5 |
p. 1003- 1 p. |
artikel |
126 |
Power GaAs MESFET: Reliability aspects and failure mechanisms
|
Canali, C. |
|
1984 |
24 |
5 |
p. 947-955 9 p. |
artikel |
127 |
Power-system reliability in perspective
|
|
|
1984 |
24 |
5 |
p. 994- 1 p. |
artikel |
128 |
Predicted vs test MTBF's… why the disparity?
|
|
|
1984 |
24 |
5 |
p. 995- 1 p. |
artikel |
129 |
Prediction intervals using exceedances for an additional thirdstage sample
|
|
|
1984 |
24 |
5 |
p. 990-991 2 p. |
artikel |
130 |
Probabilistic delay evaluation in combinational digital circuits by Petri Nets
|
|
|
1984 |
24 |
5 |
p. 992- 1 p. |
artikel |
131 |
Procedures and tables for construction and selection of multiple deferred state (MDS-1) (c1, c2)) plans
|
|
|
1984 |
24 |
5 |
p. 997- 1 p. |
artikel |
132 |
Process and film characterization of PECVD borophos-phosilicate films for VLSI applications
|
|
|
1984 |
24 |
5 |
p. 1004- 1 p. |
artikel |
133 |
Processing linear devices for performance and reliability
|
|
|
1984 |
24 |
5 |
p. 999- 1 p. |
artikel |
134 |
Production of a dense low energy positive hydrogen ion beam
|
|
|
1984 |
24 |
5 |
p. 1003- 1 p. |
artikel |
135 |
Publication, Notice, Call for Papers, etc.
|
|
|
1984 |
24 |
5 |
p. 831- 1 p. |
artikel |
136 |
Pulse propagation properties of multilayer ceramic multichip modules for VLSI circuits
|
|
|
1984 |
24 |
5 |
p. 987-988 2 p. |
artikel |
137 |
Quality circles—an experience in Jyoti Limited
|
|
|
1984 |
24 |
5 |
p. 996- 1 p. |
artikel |
138 |
Quality control techniques for “Zero Defects”
|
|
|
1984 |
24 |
5 |
p. 991-992 2 p. |
artikel |
139 |
Raman scattering from gas-evaporated silicon small particles
|
|
|
1984 |
24 |
5 |
p. 1000- 1 p. |
artikel |
140 |
Recoil profiles produced by ion implantation through dielectric layers
|
|
|
1984 |
24 |
5 |
p. 1004- 1 p. |
artikel |
141 |
Reliability analysis of two special three-state devices
|
Luis Roca, J. |
|
1984 |
24 |
5 |
p. 899-900 2 p. |
artikel |
142 |
Reliability and availability analysis of systems operating in multiple environments
|
|
|
1984 |
24 |
5 |
p. 989- 1 p. |
artikel |
143 |
Reliability and maintainability acquisition handbook
|
|
|
1984 |
24 |
5 |
p. 993- 1 p. |
artikel |
144 |
Reliability cost estimation: managerial perspectives
|
|
|
1984 |
24 |
5 |
p. 997- 1 p. |
artikel |
145 |
Reliability evaluation of protective system with scheduled and unscheduled maintenance
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Kohda, Takehisa |
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1984 |
24 |
5 |
p. 957-960 4 p. |
artikel |
146 |
Reliability-growth programmes for undersea communication systems
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1984 |
24 |
5 |
p. 996- 1 p. |
artikel |
147 |
Reliability investment and life-cycle cost
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1984 |
24 |
5 |
p. 996- 1 p. |
artikel |
148 |
Reliability of optoelectronic semiconductor components
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1984 |
24 |
5 |
p. 987- 1 p. |
artikel |
149 |
Reliability prediction: improving the crystal ball
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1984 |
24 |
5 |
p. 993- 1 p. |
artikel |
150 |
Reliability programs for commercial communication satellites
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1984 |
24 |
5 |
p. 992- 1 p. |
artikel |
151 |
Review: dry etching of silicon oxide
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1984 |
24 |
5 |
p. 998- 1 p. |
artikel |
152 |
R/M design for long term dormant storage
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1984 |
24 |
5 |
p. 995-996 2 p. |
artikel |
153 |
Shallow ion implantation in gallium arsenide
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1984 |
24 |
5 |
p. 1003- 1 p. |
artikel |
154 |
Shifting shape-parameter in life tests: a Bayes analysis
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1984 |
24 |
5 |
p. 990- 1 p. |
artikel |
155 |
Shrunken estimators of Weibull shape parameter in censored samples
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1984 |
24 |
5 |
p. 990- 1 p. |
artikel |
156 |
Simplified algorithm for optimum availability allocation and redundancy optimization subject to cost constraint
|
Govil, K.K. |
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1984 |
24 |
5 |
p. 935-938 4 p. |
artikel |
157 |
Slection of Weibull shape parameter, based on adaptive estimation
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1984 |
24 |
5 |
p. 990- 1 p. |
artikel |
158 |
Software configuration management and its contribution to reliability program management
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1984 |
24 |
5 |
p. 993- 1 p. |
artikel |
159 |
Software reliability analysis based on a nonhomogeneous error detection rate model
|
Yamada, Shigeru |
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1984 |
24 |
5 |
p. 915-920 6 p. |
artikel |
160 |
Software reliability models: a review
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1984 |
24 |
5 |
p. 991- 1 p. |
artikel |
161 |
Solder side up—the move to surface mounting
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1984 |
24 |
5 |
p. 999- 1 p. |
artikel |
162 |
Some applications of semi-regenerative processes to two-unit warm standby system
|
Uematsu, Kouya |
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1984 |
24 |
5 |
p. 965-977 13 p. |
artikel |
163 |
Some mechanisms of sputtered negative ion production
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1984 |
24 |
5 |
p. 1004- 1 p. |
artikel |
164 |
Spacecraft anomalies and lifetimes
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1984 |
24 |
5 |
p. 994- 1 p. |
artikel |
165 |
Spatially resolved optical spectroscopy of plasma etching systems
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1984 |
24 |
5 |
p. 1001- 1 p. |
artikel |
166 |
Sputter etched molybdenum-oxidation technique for fine patterns
|
Singh, Awatar |
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1984 |
24 |
5 |
p. 979- 1 p. |
artikel |
167 |
State space representation of Petri nets
|
Hura, G.S. |
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1984 |
24 |
5 |
p. 865-868 4 p. |
artikel |
168 |
Status report on the JLC panel on automatic testing
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1984 |
24 |
5 |
p. 998- 1 p. |
artikel |
169 |
Steiner trees in probabilistic networks
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1984 |
24 |
5 |
p. 991- 1 p. |
artikel |
170 |
Stochastic analysis of a two-unit parallel system with partial and catastrophic failures and preventive maintenance
|
Goel, L.R. |
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1984 |
24 |
5 |
p. 881-883 3 p. |
artikel |
171 |
Stochastic behaviour of a maintained system with protection system
|
Kumar, Ashok |
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1984 |
24 |
5 |
p. 869-872 4 p. |
artikel |
172 |
Stochastic behaviour of a standby redundant system with three modes
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1984 |
24 |
5 |
p. 989- 1 p. |
artikel |
173 |
Stochastic behaviour of a two-unit cold standby system with three modes and allowed down time
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1984 |
24 |
5 |
p. 992- 1 p. |
artikel |
174 |
Stochastic models for evaluating probability of system failure due to human error
|
Dhillon, Balbir S. |
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1984 |
24 |
5 |
p. 921-924 4 p. |
artikel |
175 |
Storage reliability with periodic test
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1984 |
24 |
5 |
p. 994- 1 p. |
artikel |
176 |
Structured copper: a pliable high conductance material for bonding to silicon power devices
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1984 |
24 |
5 |
p. 999- 1 p. |
artikel |
177 |
Surface mounting alters the PC-board scene
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1984 |
24 |
5 |
p. 999- 1 p. |
artikel |
178 |
System comparisons can simplify selection of parametric tester
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1984 |
24 |
5 |
p. 990- 1 p. |
artikel |
179 |
Ta-SiC thin film resistors for highly reliable thermal printing heads
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1984 |
24 |
5 |
p. 1002- 1 p. |
artikel |
180 |
Testing—a major concern for VLSI
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1984 |
24 |
5 |
p. 998- 1 p. |
artikel |
181 |
Test structure methodology of IC package material characterization
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1984 |
24 |
5 |
p. 998- 1 p. |
artikel |
182 |
The effect of ion species on bombardment induced topography during ion etching of silicon
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1984 |
24 |
5 |
p. 1004- 1 p. |
artikel |
183 |
The effect of preventive maintenance on a system with imperfect switchover
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1984 |
24 |
5 |
p. 990- 1 p. |
artikel |
184 |
The effect of preventive maintenance on a two-dissimilar unit standby system
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1984 |
24 |
5 |
p. 990- 1 p. |
artikel |
185 |
The effects of plasma and ion beam processing on the propertives of n-GaAs Schottky diodes
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1984 |
24 |
5 |
p. 1003- 1 p. |
artikel |
186 |
The influence of fast infrared firing on thick film materials
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1984 |
24 |
5 |
p. 1001- 1 p. |
artikel |
187 |
The ion optics of low-energy ion beams
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1984 |
24 |
5 |
p. 1002-1003 2 p. |
artikel |
188 |
The operational readiness: the reliability and maintainability connection
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1984 |
24 |
5 |
p. 995- 1 p. |
artikel |
189 |
Theory of the surface depletion region for semiconductors with linearly graded impurity profiles
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1984 |
24 |
5 |
p. 1000- 1 p. |
artikel |
190 |
The quality of die-attachment and its relationship to stresses and vertical die-cracking
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1984 |
24 |
5 |
p. 999- 1 p. |
artikel |
191 |
The structure of molten germanium
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1984 |
24 |
5 |
p. 1001- 1 p. |
artikel |
192 |
Thick-film non-reciprocal ferrite elements and gunn hybrid oscillators in modified thick-film technology
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1984 |
24 |
5 |
p. 1001- 1 p. |
artikel |
193 |
Thick film polyester screen on glass as photomask
|
Singh, Awatar |
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1984 |
24 |
5 |
p. 981-983 3 p. |
artikel |
194 |
Time-resolved scanned electron beam annealing of ion-implanted polycrystalline silicon
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1984 |
24 |
5 |
p. 1005- 1 p. |
artikel |
195 |
Trends in LSI/VLSI testing
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1984 |
24 |
5 |
p. 998- 1 p. |
artikel |
196 |
VLSI packaging reliability
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1984 |
24 |
5 |
p. 993- 1 p. |
artikel |
197 |
VLSI test systems: facing the challenge of tomorrow
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1984 |
24 |
5 |
p. 998- 1 p. |
artikel |
198 |
Worst case reliability bounds
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1984 |
24 |
5 |
p. 990- 1 p. |
artikel |