Digitale Bibliotheek
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                             241 gevonden resultaten
nr titel auteur tijdschrift jaar jaarg. afl. pagina('s) type
1 A Boolean algebra method for reliability calculations 1984
24 4 p. 809-
1 p.
artikel
2 A complex three-unit system Sarma, Y.V.S.
1984
24 4 p. 661-662
2 p.
artikel
3 A data-base for IC mask making 1984
24 4 p. 814-
1 p.
artikel
4 A distribution-free upper confidence bound for PR (Y < X): an application to stress-strength models 1984
24 4 p. 810-811
2 p.
artikel
5 A generalization of Freund's model for a repairable paired component based on a bivariate Geiger Muller (G.M.) counter Biswas, Suddhendu
1984
24 4 p. 671-675
5 p.
artikel
6 A graphical method for optimal reliability allocation 1984
24 4 p. 810-
1 p.
artikel
7 A k-out-of-N:G redundant system with cold standby units and common-cause failures Chung, Who Kee
1984
24 4 p. 691-695
5 p.
artikel
8 A low-leakage VLSI CMOS/SOS process with thin epilayers 1984
24 4 p. 816-
1 p.
artikel
9 Aluminum wire for thermosonic ball bonding in semiconductor devices 1984
24 4 p. 813-
1 p.
artikel
10 A modified Kolmogorov-Smirnov test for Weibull distributions with unknown location and scale parameters 1984
24 4 p. 809-
1 p.
artikel
11 Amorphous BN films produced in a double-plasma reactor for semiconductor applications 1984
24 4 p. 820-
1 p.
artikel
12 Amorphous metallic alloys in semiconductor contact metallizations 1984
24 4 p. 817-
1 p.
artikel
13 A multicomponent two-unit cold standby system with three modes 1984
24 4 p. 808-
1 p.
artikel
14 A multi-standby multi-failure mode system with repair and replacement policy 1984
24 4 p. 808-
1 p.
artikel
15 A multistate system with two repair distributions 1984
24 4 p. 810-
1 p.
artikel
16 An AES, SAM and RHEED study of InP (110) subjected to ion bombardment and annealing treatments 1984
24 4 p. 823-
1 p.
artikel
17 Analysis of a two-engine aeroplane model with two types of failure and preventive maintenance Goel, L.R.
1984
24 4 p. 663-666
4 p.
artikel
18 Analysis of a two-unit parallel redundancy with an imperfect switch 1984
24 4 p. 809-
1 p.
artikel
19 Analysis of leakage currents in CMOS/SOS devices 1984
24 4 p. 814-
1 p.
artikel
20 Analysis of surface mount thermal and thermal stress performance 1984
24 4 p. 806-
1 p.
artikel
21 An analytical method for determining intrinsic drain/source resistance of lightly doped drain (LDD) devices 1984
24 4 p. 819-
1 p.
artikel
22 A new chip carrier for high performance applications: integrated decoupling capacitor chip carrier (IDCCC) 1984
24 4 p. 812-
1 p.
artikel
23 A new frequency independent attenuator in distributed multilayer thin film microsystem 1984
24 4 p. 820-
1 p.
artikel
24 A new ion dose uniformity measurement technique 1984
24 4 p. 825-
1 p.
artikel
25 An ion milled coplanar SOS technology 1984
24 4 p. 813-
1 p.
artikel
26 A normal approximation to distributions of likelihood ratio statistics in life testing, reliability and multivariate analysis of variance Singh, N.
1984
24 4 p. 697-706
10 p.
artikel
27 A normalized analytical solution for the capacitance associated with uniformly doped semiconductors at equilibrium 1984
24 4 p. 818-
1 p.
artikel
28 A novel electroless technique for copper metallization of alumina substrates 1984
24 4 p. 821-
1 p.
artikel
29 Applications of excimer lasers in microelectronics 1984
24 4 p. 825-
1 p.
artikel
30 A process-compatible electron beam direct write system 1984
24 4 p. 823-
1 p.
artikel
31 A process for two-layer gold IC metallization 1984
24 4 p. 815-
1 p.
artikel
32 A pruned tree approach to reliability computation 1984
24 4 p. 810-
1 p.
artikel
33 A re-examination of practical performance limits of scaled n-channel and p-channel MOS devices for VLSI 1984
24 4 p. 814-
1 p.
artikel
34 A simple method of photomask yield optimization by defect inspection Gupta, S.N.
1984
24 4 p. 625-627
3 p.
artikel
35 A single unit multicomponent system subject to various types of failures 1984
24 4 p. 808-
1 p.
artikel
36 Aspects of European and Japanese quality management 1984
24 4 p. 805-
1 p.
artikel
37 A strategy for rule verification shrinks LSI layouts 1984
24 4 p. 812-
1 p.
artikel
38 A study of grown-in impurities in silicon by deep-level transient spectroscopy 1984
24 4 p. 818-
1 p.
artikel
39 Automated measurement system for the investigation of surface state distribution 1984
24 4 p. 815-
1 p.
artikel
40 Availability analysis of transit systems Dhillon, Balbir S.
1984
24 4 p. 761-768
8 p.
artikel
41 Band structure, impurity levels and Stark effects in superlattices 1984
24 4 p. 818-
1 p.
artikel
42 Beam-recrystallized silicon-on-insulator films: can devices live with grain boundaries? 1984
24 4 p. 824-
1 p.
artikel
43 Behind the “bathtub”-curve a new model and its consequences 1984
24 4 p. 810-
1 p.
artikel
44 Bipolar silicon power is crucial to communications systems 1984
24 4 p. 816-
1 p.
artikel
45 Calculations of systems unreliability by algebraic manipulation of failure event Hasanuddin Ahmad, S.
1984
24 4 p. 793-799
7 p.
artikel
46 Calendar of international conferences, symposia, lectures and meetings of interest 1984
24 4 p. 599-603
5 p.
artikel
47 Carrier lifetime in (Al, Ga)As epilayers and double heterostructure lasers grown with metal-organic vapour-phase epitaxy and liquid-phase epitaxy 1984
24 4 p. 817-
1 p.
artikel
48 Characteristics and analysis of instability induced by secondary slow trapping in scaled CMOS devices 1984
24 4 p. 817-
1 p.
artikel
49 Characterization of ion implanted silicon—applications for IC process control 1984
24 4 p. 823-
1 p.
artikel
50 Characterization of Se implanted layers for GaAs FETS 1984
24 4 p. 824-
1 p.
artikel
51 CHMOS improves system efficiency 1984
24 4 p. 814-
1 p.
artikel
52 Clustering VAX superminicomputers into large multiprocessor systems 1984
24 4 p. 815-
1 p.
artikel
53 C-MOS process reduces chip size as much as a third 1984
24 4 p. 814-
1 p.
artikel
54 CMOS regenerative logic circuits 1984
24 4 p. 815-
1 p.
artikel
55 Conference Report The IEEE reliability and maintainability symposium 1984 Jacobs, Richard M.
1984
24 4 p. 613-616
4 p.
artikel
56 Cost based reliability growth apportionment 1984
24 4 p. 809-
1 p.
artikel
57 Cost-benefit analysis of a one-server two-unit system subject to two types of failure 1984
24 4 p. 809-810
2 p.
artikel
58 Cost-benefit analysis of a 1-server n-unit system subject to general repair and inspection 1984
24 4 p. 810-
1 p.
artikel
59 Cost-effective reliable software engineering and development Reddi, Arumalla V.
1984
24 4 p. 677-682
6 p.
artikel
60 Current methods for silicon wafer characterization 1984
24 4 p. 816-
1 p.
artikel
61 Debugging station is easily reconfigured for emulation tasks 1984
24 4 p. 815-
1 p.
artikel
62 Defect analysis system speeds test and repair of redundant memories 1984
24 4 p. 806-
1 p.
artikel
63 Defect-free silicon sought by Pentagon for VHSIC program 1984
24 4 p. 815-
1 p.
artikel
64 Deposition equipment 1984
24 4 p. 813-
1 p.
artikel
65 Designing solder paste materials to attach surface mounted devices 1984
24 4 p. 815-
1 p.
artikel
66 Design of a high performance DIP-like pin array package for logic devices 1984
24 4 p. 813-814
2 p.
artikel
67 Design of an accurate production E-beam system 1984
24 4 p. 822-823
2 p.
artikel
68 Design of testable logic circuits G.W.A.D.,
1984
24 4 p. 801-
1 p.
artikel
69 Design parameters of four-terminal distributed thin film integrated band-reject filter 1984
24 4 p. 820-
1 p.
artikel
70 Detroit unveils sophisticated electronics 1984
24 4 p. 811-
1 p.
artikel
71 Development of a reliability strategy for new IC component family and process 1984
24 4 p. 805-
1 p.
artikel
72 Die bonding and package sealing materials 1984
24 4 p. 814-815
2 p.
artikel
73 Diffusion, ion implantation and annealing 1984
24 4 p. 824-
1 p.
artikel
74 Direct attachment of leadless chip carriers to organic matrix printed wiring boards 1984
24 4 p. 812-
1 p.
artikel
75 Direct-write electron beam system 1984
24 4 p. 822-
1 p.
artikel
76 E-beam system metrology 1984
24 4 p. 822-
1 p.
artikel
77 EBIC and LBIC techniques for characterization of reverse biased power devices 1984
24 4 p. 824-
1 p.
artikel
78 Economics of multiple site testing of PCBs 1984
24 4 p. 807-
1 p.
artikel
79 Editorial G.W.A.D.,
1984
24 4 p. 607-612
6 p.
artikel
80 EE-PROM adds on-chip flexibility 1984
24 4 p. 816-
1 p.
artikel
81 Effect of HCl and Cl2 on Pd inlay coupons and Pd connector contacts 1984
24 4 p. 806-807
2 p.
artikel
82 Effect of pad capacitance on the notch frequency of the MOS distributed RC (MOS-RC) notch network 1984
24 4 p. 815-
1 p.
artikel
83 Effects of accelerated temperature testing on the low-frequency noise of planar NPN transistors 1984
24 4 p. 806-
1 p.
artikel
84 Electrical characterization of insulator-semiconductor interface states 1984
24 4 p. 817-
1 p.
artikel
85 Electrical characterization of ion-implanted silicon-on-sapphire 1984
24 4 p. 825-
1 p.
artikel
86 Electrical design of a high speed computer packaging system 1984
24 4 p. 814-
1 p.
artikel
87 Electrical properties of gallium arsenide ingots 1984
24 4 p. 818-
1 p.
artikel
88 Electron-beam recrystallized polysilicon on silicon dioxide 1984
24 4 p. 825-
1 p.
artikel
89 Electronic structure calculations of V2 + O2 complexes in silicon 1984
24 4 p. 818-
1 p.
artikel
90 EL systems: high throughput electron beam lithography tools 1984
24 4 p. 823-
1 p.
artikel
91 Enumeration of all 2-trees in a graph through petri nets 1984
24 4 p. 807-
1 p.
artikel
92 Etching systems 1984
24 4 p. 813-
1 p.
artikel
93 Fabrication of damage free micropatterns in silicon Gupta, R.P.
1984
24 4 p. 623-624
2 p.
artikel
94 Facing the headaches of early failures: a state-of-the-art review of burn-in decisions 1984
24 4 p. 808-
1 p.
artikel
95 Failure physics of integrated circuits—a review 1984
24 4 p. 807-
1 p.
artikel
96 Fatigue life of leadless chip carrier solder joints during power cycling 1984
24 4 p. 806-
1 p.
artikel
97 Fault tree analysis method of a system having components of multiple failure modes 1984
24 4 p. 809-
1 p.
artikel
98 Focused ion beams in microelectronic fabrication 1984
24 4 p. 824-
1 p.
artikel
99 Full-wafer memory for colour displays has 1.5-Mb capacity 1984
24 4 p. 816-
1 p.
artikel
100 Generalised availability measures for a multi-unit repairable system with standby failure Kapur, P.K.
1984
24 4 p. 637-646
10 p.
artikel
101 Gold on palladium connector contacts 1984
24 4 p. 807-
1 p.
artikel
102 Government systems incorporate GaAs monolithics 1984
24 4 p. 811-
1 p.
artikel
103 Grain-boundary scattering and surface plasmon attenuation in noble metal films 1984
24 4 p. 821-
1 p.
artikel
104 Gunn-effect oscillators have historically had superior spectral purity compared to other solid-state microwave sources 1984
24 4 p. 816-
1 p.
artikel
105 High performance thick film gold conductors 1984
24 4 p. 821-
1 p.
artikel
106 High pinout IC packaging and the density advantage of surface mounting 1984
24 4 p. 812-
1 p.
artikel
107 High slew rate CMOS operational amplifier employing internal transistor compensation 1984
24 4 p. 815-
1 p.
artikel
108 High-speed reactive ion etching of silicon by the application of a confined DC bias 1984
24 4 p. 825-
1 p.
artikel
109 High-speed testing equipment essential to AMRAAM development program success 1984
24 4 p. 808-
1 p.
artikel
110 High technology: the key to growth 1984
24 4 p. 811-
1 p.
artikel
111 High thermal conduction package technology for flip chip devices 1984
24 4 p. 812-813
2 p.
artikel
112 High throughput variable shaped electron beam lithography 1984
24 4 p. 823-
1 p.
artikel
113 Hole and electron mobilities in heavily doped silicon: comparison of theory and experiment 1984
24 4 p. 819-
1 p.
artikel
114 IC wafer fab economics and lithography equipment selection: the inextricable link 1984
24 4 p. 814-
1 p.
artikel
115 Improved electrical performance required for future MOS packaging 1984
24 4 p. 812-
1 p.
artikel
116 Improving the reverse recovery of power MOSFET integral diodes by electron irradiation 1984
24 4 p. 823-824
2 p.
artikel
117 Influence of anneal temperature on the mobile ion concentration in MOS structures 1984
24 4 p. 817-
1 p.
artikel
118 Inspection frequency and availability of emergency equipment Anders, George J.
1984
24 4 p. 683-690
8 p.
artikel
119 Inspection, measuring, and testing equipment 1984
24 4 p. 807-
1 p.
artikel
120 Insulation displacement connector reliability 1984
24 4 p. 807-
1 p.
artikel
121 Integrated non-uniform thin-film micro-systems of circular geometry Ahmed, Kamal U.
1984
24 4 p. 667-669
3 p.
artikel
122 Investigation of information loss mechanisms in EPROMs 1984
24 4 p. 806-
1 p.
artikel
123 Ion implantation and rapid annealing of 125mm wafers 1984
24 4 p. 823-
1 p.
artikel
124 Laser induced backside damage gettering 1984
24 4 p. 825-
1 p.
artikel
125 LEED evaluation of three models of the Si(100) surface 1984
24 4 p. 819-
1 p.
artikel
126 Lifetime and drift velocity analysis for electromigration in sputtered Al films, multilayers and alloys 1984
24 4 p. 820-
1 p.
artikel
127 Low temperature processed MOSFET's using laser recrystallized polycrystalline silicon films 1984
24 4 p. 823-
1 p.
artikel
128 Magnetron-enhanced plasma etching of silicon and silicon dioxide 1984
24 4 p. 822-
1 p.
artikel
129 Maintainability and availability calculations for series, parallel and r-out-of-n configurations 1984
24 4 p. 808-
1 p.
artikel
130 Manifestations of deep levels point defects in GaAs 1984
24 4 p. 816-
1 p.
artikel
131 Modelling of integrated circuit defect sensitivities 1984
24 4 p. 807-
1 p.
artikel
132 Modification to the reduction technique of Thomas Case for obtaining a simplified reliability expression 1984
24 4 p. 808-
1 p.
artikel
133 Molecular beam epitaxy for research and production 1984
24 4 p. 823-
1 p.
artikel
134 More than a decade of the non-saturating autoclave as a highly accelerated stress technique for evaluating the reliability of nonhermetic microelectronic components 1984
24 4 p. 806-
1 p.
artikel
135 M.S.C. centralized maintenance for transmission networks 1984
24 4 p. 810-
1 p.
artikel
136 Multi-standby system with repair and replacement policy 1984
24 4 p. 809-
1 p.
artikel
137 NASA eyes crystal processing in space 1984
24 4 p. 811-
1 p.
artikel
138 Network quality tester 1984
24 4 p. 808-
1 p.
artikel
139 New stencil screen developments for thick film printing 1984
24 4 p. 821-
1 p.
artikel
140 Novel IC metallization test structures for drop-in process monitors 1984
24 4 p. 814-
1 p.
artikel
141 Nucleation and growth of thin films: recent progress 1984
24 4 p. 822-
1 p.
artikel
142 On a two-unit standby redundant system with two types of failures and preventive maintenance 1984
24 4 p. 810-
1 p.
artikel
143 One method for interval estimation of Weibull shape parameter Brkich, D.M.
1984
24 4 p. 659-660
2 p.
artikel
144 On optimal maintenance of a series system 1984
24 4 p. 807-808
2 p.
artikel
145 On power line carrier communication (PLC) Sherif, Yosef S.
1984
24 4 p. 781-791
11 p.
artikel
146 On standby redundant system with repair, post repair and preventive maintenance 1984
24 4 p. 808-
1 p.
artikel
147 Optimal allocation of cost to detectors in a two-unit series system Kumar, Ashok
1984
24 4 p. 633-636
4 p.
artikel
148 Optimal scheduling of multiple preventive maintenance activities 1984
24 4 p. 810-
1 p.
artikel
149 Optimum component switching for systems that operate and idle Pirie, K.
1984
24 4 p. 769-780
12 p.
artikel
150 Parallel processing interactively simulates complex VSLI logic 1984
24 4 p. 816-
1 p.
artikel
151 Parametric test system update 1984
24 4 p. 812-
1 p.
artikel
152 Performance-related dependability evaluation of supercomputer systems Arlat, J.
1984
24 4 p. 717-742
26 p.
artikel
153 Photoionization of impurity atoms in semiconductors in the presence of an applied electric field 1984
24 4 p. 819-
1 p.
artikel
154 Pinhole array capacitor for oxide integrity analysis 1984
24 4 p. 818-
1 p.
artikel
155 Precision fineness of grind measurement—techniques and instrumentation—for thick film pastes 1984
24 4 p. 820-
1 p.
artikel
156 Precision voltage references outgrow temperature-stabilizing ovens 1984
24 4 p. 816-
1 p.
artikel
157 Principles of laser scanning for defect and contamination detection in microfabrication 1984
24 4 p. 825-
1 p.
artikel
158 Printed board assembly cleanliness—standards, practice and reliability considerations 1984
24 4 p. 806-
1 p.
artikel
159 Printed-circuit-board assembly picks up on automation 1984
24 4 p. 806-
1 p.
artikel
160 Production of hybrid circuits and quality assurance 1984
24 4 p. 821-
1 p.
artikel
161 Protocols and network-control chips: a symbiotic relationship 1984
24 4 p. 816-
1 p.
artikel
162 Publications, notices, calls for papers, etc. 1984
24 4 p. 605-
1 p.
artikel
163 Quality assurance system and reliability testing of LSI circuits 1984
24 4 p. 807-
1 p.
artikel
164 Quality assurance with laser light and microprocessors on moving workpieces 1984
24 4 p. 823-
1 p.
artikel
165 Quality solder paste systems for use in microelectronic applications 1984
24 4 p. 816-
1 p.
artikel
166 Radiation annealing of epitaxial silver films 1984
24 4 p. 822-
1 p.
artikel
167 Rapid wafer heating: status 1983 1984
24 4 p. 814-
1 p.
artikel
168 Reactive ion beam etching of tantalum silicide for VLSI applications 1984
24 4 p. 822-
1 p.
artikel
169 Reactive-ion etching eases restrictions on materials and feature sizes 1984
24 4 p. 823-
1 p.
artikel
170 Reactive sputtering 1984
24 4 p. 820-
1 p.
artikel
171 Real time sputter deposition monitoring using glow discharge mass spectroscopy 1984
24 4 p. 814-
1 p.
artikel
172 Recent developments in the characterisation of semiconductors by transport measurements 1984
24 4 p. 817-
1 p.
artikel
173 Reinterpretation of the silicon-hydrogen stretch frequencies in amorphous silicon 1984
24 4 p. 818-
1 p.
artikel
174 Reliability analysis of an intermittently used system 1984
24 4 p. 809-
1 p.
artikel
175 Reliability analysis of optical fibre communication systems 1984
24 4 p. 811-
1 p.
artikel
176 Reliability and maintainability data for industrial plants Reiche, H.
1984
24 4 p. 802-
1 p.
artikel
177 Reliability effects of fluorine contamination of aluminum bonding pads on semiconductor chips 1984
24 4 p. 805-806
2 p.
artikel
178 Reliability evaluation of systems with critical human error Dhillon, Balbir S.
1984
24 4 p. 743-759
17 p.
artikel
179 Reliability prediction of microcircuits 1984
24 4 p. 809-
1 p.
artikel
180 Reliability study of a microwave Ga As field-effect transistor, by means of factorial analysis and automatic classification methods 1984
24 4 p. 805-
1 p.
artikel
181 Residual stress in thick films 1984
24 4 p. 820-821
2 p.
artikel
182 Scanning electron microscopes 1984
24 4 p. 811-
1 p.
artikel
183 Seeded bug volume for software validation 1984
24 4 p. 808-
1 p.
artikel
184 Semiconductor manufacturing in Central Europe 1984
24 4 p. 812-
1 p.
artikel
185 Semiconductor manufacturing in Thailand 1984
24 4 p. 811-
1 p.
artikel
186 Semiconductor materials and devices characterization by noise measurements 1984
24 4 p. 817-
1 p.
artikel
187 Semiconductor processing with excimer lasers 1984
24 4 p. 825-
1 p.
artikel
188 Semiconductor surface reconstruction 1984
24 4 p. 818-819
2 p.
artikel
189 Semiconductor surfaces and interfaces 1984
24 4 p. 819-
1 p.
artikel
190 s-expected number of inspections and repairs of a one-server two-unit system subject to arbitrary failure Subramanyam Naidu, R.
1984
24 4 p. 647-649
3 p.
artikel
191 s-expected number of inspections and repairs of a single server n-unit system subject to arbitrary failure Subramanyam Naidu, R.
1984
24 4 p. 651-658
8 p.
artikel
192 Shallow doping in silicon 1984
24 4 p. 819-
1 p.
artikel
193 Silicon epitaxy: a 1983 perspective 1984
24 4 p. 811-
1 p.
artikel
194 Silicon film recrystallization using e-beam line source 1984
24 4 p. 824-
1 p.
artikel
195 Silicon-on-insulator structures using high dose oxygen implantation to form buried oxide films 1984
24 4 p. 824-825
2 p.
artikel
196 Simplification of Boolean functions through petri nets 1984
24 4 p. 808-
1 p.
artikel
197 Size effect on different impurity levels in semiconductors 1984
24 4 p. 818-
1 p.
artikel
198 Software performance modelling and management 1984
24 4 p. 811-
1 p.
artikel
199 Soldering in electronics G.W.A.D.,
1984
24 4 p. 802-803
2 p.
artikel
200 Some aspects of placement optimization of thermal significant components in thick film high-power hybrid integrated circuits 1984
24 4 p. 820-
1 p.
artikel
201 Some present and future applications of laser processing—an overview 1984
24 4 p. 823-
1 p.
artikel
202 Spatial yield analysis in integrated circuit manufacturing 1984
24 4 p. 807-
1 p.
artikel
203 Steady-state availability of k-out-of-n: G system with single repair 1984
24 4 p. 809-
1 p.
artikel
204 Step coverage by vapor deposited thin aluminum films 1984
24 4 p. 815-
1 p.
artikel
205 Stochastic analysis of outdoor power systems in fluctuating environment 1984
24 4 p. 808-
1 p.
artikel
206 Stochastic behaviour of a two-unit repairable system subject to two types of failure and inspection 1984
24 4 p. 809-
1 p.
artikel
207 Structural characterization of processed silicon wafers 1984
24 4 p. 813-
1 p.
artikel
208 Surface roughness and the thermopower of thin films 1984
24 4 p. 821-822
2 p.
artikel
209 Symbolic reliability analysis with the aid of variable-entered Karnaugh maps 1984
24 4 p. 810-
1 p.
artikel
210 Technical data package for procurement 1984
24 4 p. 811-
1 p.
artikel
211 Technique for measuring the moisture content of sealed IC packages 1984
24 4 p. 814-
1 p.
artikel
212 Test bar checks reliability of STL semicustom logic arrays 1984
24 4 p. 806-
1 p.
artikel
213 The case for CMOS 1984
24 4 p. 811-
1 p.
artikel
214 The design and performace of near micron SOS MOSFETs 1984
24 4 p. 816-
1 p.
artikel
215 The effect of high dissipation components on the solder joints of ceramic chip carriers attached to thick film alumina substrates 1984
24 4 p. 806-
1 p.
artikel
216 The effects of hydrogen ambients on electromigration kinetics in Al-2% Cu thin film conductors 1984
24 4 p. 821-
1 p.
artikel
217 The electrical properties of zinc implanted GaAs 1984
24 4 p. 825-
1 p.
artikel
218 The forces behind epitaxial-silicon trends 1984
24 4 p. 811-812
2 p.
artikel
219 The generic method of the multistate fault tree analysis Huang, Xizhi
1984
24 4 p. 617-622
6 p.
artikel
220 Theory of the growth of SiO2 in an oxygen plasma 1984
24 4 p. 819-
1 p.
artikel
221 Thermal management of electronic packages 1984
24 4 p. 813-
1 p.
artikel
222 Thermal nitridation of silicon and silicon dioxide for thin gate insulators. Part II 1984
24 4 p. 818-
1 p.
artikel
223 Thermal studies on pin grid array packages for high density LSI and VLSI logic circuits 1984
24 4 p. 813-
1 p.
artikel
224 The role of surface treatment on the anodic oxidation of n-GaAs Kochhar, Madhu
1984
24 4 p. 629-631
3 p.
artikel
225 The time resolved electron beam induced current method applied to P-N junctions 1984
24 4 p. 824-
1 p.
artikel
226 The top-event's failure frequency for non-coherent multi-state fault trees Bossche, A.
1984
24 4 p. 707-715
9 p.
artikel
227 The width of the non-steady state transition region in deep level impurity measurements 1984
24 4 p. 817-818
2 p.
artikel
228 Thin film processing of hybrid ICs 1984
24 4 p. 820-
1 p.
artikel
229 Thin film studies of oxides by the organometallic-CVD technique 1984
24 4 p. 820-
1 p.
artikel
230 Three-chip set offers universal cost-effective SLIC 1984
24 4 p. 816-
1 p.
artikel
231 Top-edge imaging in E-beam lithography 1984
24 4 p. 822-
1 p.
artikel
232 Trends in medical electronics using surface mounted components and hybrids 1984
24 4 p. 821-
1 p.
artikel
233 Tunnelling of holes from acceptor levels in an applied field 1984
24 4 p. 819-820
2 p.
artikel
234 Updating of CMOS reliability 1984
24 4 p. 806-
1 p.
artikel
235 VLSI, computer designers swap ideas 1984
24 4 p. 816-
1 p.
artikel
236 VLSI: the challenge of one million transistors 1984
24 4 p. 811-
1 p.
artikel
237 Voltage—testing of thin-film capacitors 1984
24 4 p. 821-
1 p.
artikel
238 Wafer and mask imaging systems 1984
24 4 p. 815-
1 p.
artikel
239 Waveguides become integrated circuits in new space- and cost-saving method 1984
24 4 p. 816-
1 p.
artikel
240 X-ray lithography: optical's heir 1984
24 4 p. 815-
1 p.
artikel
241 X-ray source technology for microlithography 1984
24 4 p. 815-
1 p.
artikel
                             241 gevonden resultaten
 
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