| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Accelerated versus real time aging tests
|
|
|
1980
|
20 |
6 |
p. 905-
1 p.
|
artikel
|
| 2 |
Achieving high reliability in sonar power supplies
|
|
|
1980
|
20 |
6 |
p. 902-
1 p.
|
artikel
|
| 3 |
A computational technique for maximum likelihood estimation with Weibull models
|
|
|
1980
|
20 |
6 |
p. 906-
1 p.
|
artikel
|
| 4 |
Advances in c.c.d. scanners with on-chip signal processing for electronic imaging
|
|
|
1980
|
20 |
6 |
p. 912-
1 p.
|
artikel
|
| 5 |
Advances in GaAs LSI/VLSI processing technology
|
|
|
1980
|
20 |
6 |
p. 911-
1 p.
|
artikel
|
| 6 |
Advances in wafer process control
|
|
|
1980
|
20 |
6 |
p. 909-
1 p.
|
artikel
|
| 7 |
A GaAs MESFET sample and hold switch
|
|
|
1980
|
20 |
6 |
p. 910-
1 p.
|
artikel
|
| 8 |
A generalized computer program for the estimation of the optimum number of trials for establishing a systems reliability
|
|
|
1980
|
20 |
6 |
p. 902-
1 p.
|
artikel
|
| 9 |
Age replacement policies for Weibull failure times
|
|
|
1980
|
20 |
6 |
p. 900-
1 p.
|
artikel
|
| 10 |
A guidebook for software reliability assessment
|
|
|
1980
|
20 |
6 |
p. 900-
1 p.
|
artikel
|
| 11 |
A high speed 64 × 4 bit 100K-compatible ECL-RAM with 6 NS access time
|
|
|
1980
|
20 |
6 |
p. 908-
1 p.
|
artikel
|
| 12 |
A high speed multiplier using subnanosecond bipolar VLSI technologies
|
|
|
1980
|
20 |
6 |
p. 908-
1 p.
|
artikel
|
| 13 |
Alloyed thick-film gold conductor for high reliability high-yield wire bonding
|
|
|
1980
|
20 |
6 |
p. 916-
1 p.
|
artikel
|
| 14 |
Aluminium alloy as an interconnecting material in the fabrication of integrated circuits
|
|
|
1980
|
20 |
6 |
p. 911-
1 p.
|
artikel
|
| 15 |
Aluminum-silicon OHMIC contact on “shallow” n + /p junctions
|
|
|
1980
|
20 |
6 |
p. 913-
1 p.
|
artikel
|
| 16 |
Analogue sampling ICs in data acquisition systems
|
|
|
1980
|
20 |
6 |
p. 913-
1 p.
|
artikel
|
| 17 |
An analysis of MIL-STD-471 test methods
|
|
|
1980
|
20 |
6 |
p. 903-
1 p.
|
artikel
|
| 18 |
A new air film technique for low contact handling of silicon wafers
|
|
|
1980
|
20 |
6 |
p. 911-
1 p.
|
artikel
|
| 19 |
A new ultra low power ULA and its application
|
|
|
1980
|
20 |
6 |
p. 912-
1 p.
|
artikel
|
| 20 |
An influence of the rate of epitaxial growth on physical properties of gallium nitride
|
|
|
1980
|
20 |
6 |
p. 914-
1 p.
|
artikel
|
| 21 |
An integrated circuit v.h.f. radio receiver
|
|
|
1980
|
20 |
6 |
p. 912-
1 p.
|
artikel
|
| 22 |
An investigation of the interface state density in metal-silieon nitride-silicon structures
|
|
|
1980
|
20 |
6 |
p. 913-914
2 p.
|
artikel
|
| 23 |
An investigation of the valley splitting in n-channel silicon (100) inversion layers
|
|
|
1980
|
20 |
6 |
p. 913-
1 p.
|
artikel
|
| 24 |
A 500-picosecond system design capability
|
|
|
1980
|
20 |
6 |
p. 909-
1 p.
|
artikel
|
| 25 |
A repairable system with N failure modes and one standby unit
|
Yamashiro, Mitsuo
|
|
1980
|
20 |
6 |
p. 831-835
5 p.
|
artikel
|
| 26 |
A review of microprocessor software
|
|
|
1980
|
20 |
6 |
p. 912-
1 p.
|
artikel
|
| 27 |
A study of PtSi formation
|
|
|
1980
|
20 |
6 |
p. 917-
1 p.
|
artikel
|
| 28 |
A study of three environmental reliability tests
|
|
|
1980
|
20 |
6 |
p. 903-
1 p.
|
artikel
|
| 29 |
A survey of corrosion failure mechanisms in microelectronic devices
|
|
|
1980
|
20 |
6 |
p. 899-900
2 p.
|
artikel
|
| 30 |
Asymptotic distribution of downtime for a cold-standby system
|
|
|
1980
|
20 |
6 |
p. 900-
1 p.
|
artikel
|
| 31 |
A ULA is more than silicon
|
|
|
1980
|
20 |
6 |
p. 909-
1 p.
|
artikel
|
| 32 |
Avalanche injection in MNOS gate controlled diodes
|
|
|
1980
|
20 |
6 |
p. 914-
1 p.
|
artikel
|
| 33 |
Behaviour of line contacts upon the effect of fault currents
|
|
|
1980
|
20 |
6 |
p. 898-
1 p.
|
artikel
|
| 34 |
16-bit microprocessor enters virtual memory domain
|
|
|
1980
|
20 |
6 |
p. 912-
1 p.
|
artikel
|
| 35 |
Built-in test for complex digital integrated circuits
|
|
|
1980
|
20 |
6 |
p. 907-
1 p.
|
artikel
|
| 36 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
|
|
1980
|
20 |
6 |
p. 769-770
2 p.
|
artikel
|
| 37 |
Characterization of surface states in HCL-grown oxides using MOS transient currents
|
|
|
1980
|
20 |
6 |
p. 914-
1 p.
|
artikel
|
| 38 |
Charge injection from a surface depletion region—the Al2O3-silicon system
|
|
|
1980
|
20 |
6 |
p. 914-
1 p.
|
artikel
|
| 39 |
Checking request policies for a one-unit system and their comparisons
|
Yamada, Shigeru
|
|
1980
|
20 |
6 |
p. 859-874
16 p.
|
artikel
|
| 40 |
Chip carrier packaging applications
|
|
|
1980
|
20 |
6 |
p. 911-
1 p.
|
artikel
|
| 41 |
Chips make fast math a snap for microprocessors
|
|
|
1980
|
20 |
6 |
p. 912-
1 p.
|
artikel
|
| 42 |
Circuit-board packaging considerations for optimum utilization of chip carriers
|
|
|
1980
|
20 |
6 |
p. 911-
1 p.
|
artikel
|
| 43 |
C-MOS multiplier speeds task for microprocessors
|
|
|
1980
|
20 |
6 |
p. 912-
1 p.
|
artikel
|
| 44 |
Common-cause failure analysis of a three-state device system
|
|
|
1980
|
20 |
6 |
p. 904-905
2 p.
|
artikel
|
| 45 |
Common cause failures—a dilemma in perspective
|
|
|
1980
|
20 |
6 |
p. 903-
1 p.
|
artikel
|
| 46 |
Computer aided design of LSI: an I2L case study
|
|
|
1980
|
20 |
6 |
p. 909-
1 p.
|
artikel
|
| 47 |
Computer-aided determination of tests for the detection and localisation of faults in electronic circuits and systems
|
|
|
1980
|
20 |
6 |
p. 903-
1 p.
|
artikel
|
| 48 |
Confidence intervals for comparing two life distributions
|
|
|
1980
|
20 |
6 |
p. 901-902
2 p.
|
artikel
|
| 49 |
Control chip handles error checking and character-hased protocols easily
|
|
|
1980
|
20 |
6 |
p. 913-
1 p.
|
artikel
|
| 50 |
Cost analyses for avionics acquisition
|
|
|
1980
|
20 |
6 |
p. 903-
1 p.
|
artikel
|
| 51 |
Cost effective semiconductor memory testing
|
|
|
1980
|
20 |
6 |
p. 907-
1 p.
|
artikel
|
| 52 |
Current aspects of CAD for integrated circuits
|
|
|
1980
|
20 |
6 |
p. 908-
1 p.
|
artikel
|
| 53 |
Custom ECL chips boost performance in smaller mainframes
|
|
|
1980
|
20 |
6 |
p. 913-
1 p.
|
artikel
|
| 54 |
Data needs for software reliability modelling
|
|
|
1980
|
20 |
6 |
p. 906-
1 p.
|
artikel
|
| 55 |
Decoding scheme smooths 18-bit converter's nonlinearity
|
|
|
1980
|
20 |
6 |
p. 911-
1 p.
|
artikel
|
| 56 |
Degradation of thermocompression bonds to Ti-Cu-Au and Ti-Cu thin films by thermal aging
|
|
|
1980
|
20 |
6 |
p. 898-
1 p.
|
artikel
|
| 57 |
Design aspects and reliability of a synchronizer made in MOS technology
|
|
|
1980
|
20 |
6 |
p. 908-
1 p.
|
artikel
|
| 58 |
Development of the thick-film capacitor and its application for hybrid circuit modules
|
|
|
1980
|
20 |
6 |
p. 915-
1 p.
|
artikel
|
| 59 |
Difficulties in fault-tree synthesis for process plant
|
|
|
1980
|
20 |
6 |
p. 902-903
2 p.
|
artikel
|
| 60 |
Digital filter analysis with personal computer
|
Bozic, S.M.
|
|
1980
|
20 |
6 |
p. 836-845
10 p.
|
artikel
|
| 61 |
Digital system diagnostics-design/evaluation
|
|
|
1980
|
20 |
6 |
p. 905-
1 p.
|
artikel
|
| 62 |
Digraphs and their applications in fault tree analysis
|
|
|
1980
|
20 |
6 |
p. 904-
1 p.
|
artikel
|
| 63 |
Distributed computer network takes charge in IC faeility
|
|
|
1980
|
20 |
6 |
p. 913-
1 p.
|
artikel
|
| 64 |
Draft DoD directive 5000.xx, Reliability and Maintainability
|
|
|
1980
|
20 |
6 |
p. 897-
1 p.
|
artikel
|
| 65 |
Effect of shunt capacitance on tapered distributed RC network characteristics
|
Au, K.D.
|
|
1980
|
20 |
6 |
p. 847-852
6 p.
|
artikel
|
| 66 |
Effect of switch failure on 2 redundant systems
|
|
|
1980
|
20 |
6 |
p. 900-
1 p.
|
artikel
|
| 67 |
Electromigration mechanism in aluminium conductors
|
|
|
1980
|
20 |
6 |
p. 898-
1 p.
|
artikel
|
| 68 |
Electrothermal effects in integrated circuits
|
|
|
1980
|
20 |
6 |
p. 910-
1 p.
|
artikel
|
| 69 |
Estimation of the guarantee time in an exponential failure model
|
|
|
1980
|
20 |
6 |
p. 901-
1 p.
|
artikel
|
| 70 |
Experimental characterization of most's scaled down to the 1 μm level
|
Sunami, Hideo
|
|
1980
|
20 |
6 |
p. 803-822
20 p.
|
artikel
|
| 71 |
Experimental investigation of mounting thermal resistance of flatpacks on circuit boards
|
|
|
1980
|
20 |
6 |
p. 909-
1 p.
|
artikel
|
| 72 |
Extension of high-temperature electronics
|
|
|
1980
|
20 |
6 |
p. 916-
1 p.
|
artikel
|
| 73 |
Fabrication of passive components for high-temperature instrumentation
|
|
|
1980
|
20 |
6 |
p. 915-
1 p.
|
artikel
|
| 74 |
Failure analysis on a 65 K MOS RAM with a new type of memory display
|
|
|
1980
|
20 |
6 |
p. 904-
1 p.
|
artikel
|
| 75 |
Fault-tolerant system optimization
|
|
|
1980
|
20 |
6 |
p. 900-
1 p.
|
artikel
|
| 76 |
Field maintenance organization analysis models
|
|
|
1980
|
20 |
6 |
p. 900-
1 p.
|
artikel
|
| 77 |
First uptime and disappointment time joint distribution of an intermittently used system
|
Kapoor, K.R.
|
|
1980
|
20 |
6 |
p. 891-893
3 p.
|
artikel
|
| 78 |
Fully automated integrated circuit wire bonding system
|
|
|
1980
|
20 |
6 |
p. 910-
1 p.
|
artikel
|
| 79 |
General failure model applied to preventive maintenance policies
|
|
|
1980
|
20 |
6 |
p. 901-
1 p.
|
artikel
|
| 80 |
Gold/chromium metallizations for electronics devices
|
|
|
1980
|
20 |
6 |
p. 909-
1 p.
|
artikel
|
| 81 |
Ground-hypotheses for beta distribution as Bayesian prior
|
|
|
1980
|
20 |
6 |
p. 902-
1 p.
|
artikel
|
| 82 |
Hardening RAMs against soft errors
|
|
|
1980
|
20 |
6 |
p. 899-
1 p.
|
artikel
|
| 83 |
Hardware and software: an analytical approach
|
|
|
1980
|
20 |
6 |
p. 903-904
2 p.
|
artikel
|
| 84 |
Hardware vs software reliability—A comparative study
|
Soi, Inder M.
|
|
1980
|
20 |
6 |
p. 881-885
5 p.
|
artikel
|
| 85 |
High density uncommitted arrays using an advanced CMOS technology
|
|
|
1980
|
20 |
6 |
p. 910-
1 p.
|
artikel
|
| 86 |
IBM multichip multilayer ceramic modules for LSI chips—design for performance and density
|
|
|
1980
|
20 |
6 |
p. 910-
1 p.
|
artikel
|
| 87 |
I. C. layout—the automatic approach
|
|
|
1980
|
20 |
6 |
p. 907-908
2 p.
|
artikel
|
| 88 |
Implementation constraints in self-checking integrated circuits
|
|
|
1980
|
20 |
6 |
p. 904-
1 p.
|
artikel
|
| 89 |
Influence of the substrate on the electrical properties of thick-film resistors
|
|
|
1980
|
20 |
6 |
p. 916-
1 p.
|
artikel
|
| 90 |
Integrated circuit characteristics at 260°C for aircraft engine-control applications
|
|
|
1980
|
20 |
6 |
p. 912-
1 p.
|
artikel
|
| 91 |
Intelligent memories and the silicon chip
|
|
|
1980
|
20 |
6 |
p. 912-
1 p.
|
artikel
|
| 92 |
INTELSAT system reliability
|
|
|
1980
|
20 |
6 |
p. 906-
1 p.
|
artikel
|
| 93 |
Interdiffusion processes and oxidation phenomena in NiCr/Au films
|
|
|
1980
|
20 |
6 |
p. 915-916
2 p.
|
artikel
|
| 94 |
Ion beams promise practical systems for submicrometer wafer lithography
|
|
|
1980
|
20 |
6 |
p. 917-
1 p.
|
artikel
|
| 95 |
Ionization assisted annealing of boron implanted silicon
|
|
|
1980
|
20 |
6 |
p. 917-
1 p.
|
artikel
|
| 96 |
Japanese make quality-control pitch
|
|
|
1980
|
20 |
6 |
p. 897-
1 p.
|
artikel
|
| 97 |
k-out-of-n:G system with simultaneous failure and three repair policies
|
|
|
1980
|
20 |
6 |
p. 904-
1 p.
|
artikel
|
| 98 |
L'aide à la maintenance des systèmes: le moniteur MOSTAM
|
|
|
1980
|
20 |
6 |
p. 904-
1 p.
|
artikel
|
| 99 |
Large scale digital hybrid microcircuits for new military systems
|
|
|
1980
|
20 |
6 |
p. 916-
1 p.
|
artikel
|
| 100 |
Large-scale integration latches onto the phone system
|
|
|
1980
|
20 |
6 |
p. 907-
1 p.
|
artikel
|
| 101 |
Loading effect and temperature dependence of etch rate of silicon materials in CF4 plasma
|
|
|
1980
|
20 |
6 |
p. 911-
1 p.
|
artikel
|
| 102 |
Log-rank vs x test for exponentiality
|
|
|
1980
|
20 |
6 |
p. 902-
1 p.
|
artikel
|
| 103 |
Mainframe builders making more ICs
|
|
|
1980
|
20 |
6 |
p. 913-
1 p.
|
artikel
|
| 104 |
Management benefits and burdens in regulatory legalisms
|
|
|
1980
|
20 |
6 |
p. 897-
1 p.
|
artikel
|
| 105 |
Maximum likelihood estimation of linear failure rate
|
|
|
1980
|
20 |
6 |
p. 901-
1 p.
|
artikel
|
| 106 |
Methods, equipment and materials for the wire contacting of semiconductor chips
|
|
|
1980
|
20 |
6 |
p. 908-
1 p.
|
artikel
|
| 107 |
Microelectronics—the revolution in consumer equipment
|
|
|
1980
|
20 |
6 |
p. 906-
1 p.
|
artikel
|
| 108 |
Minicomputer fills mainframe's shows
|
|
|
1980
|
20 |
6 |
p. 913-
1 p.
|
artikel
|
| 109 |
Model for failure rate curves
|
|
|
1980
|
20 |
6 |
p. 900-
1 p.
|
artikel
|
| 110 |
Molecular beam epitaxy
|
|
|
1980
|
20 |
6 |
p. 917-
1 p.
|
artikel
|
| 111 |
Multiple-drain MOS packs in very fast logic gates
|
|
|
1980
|
20 |
6 |
p. 911-
1 p.
|
artikel
|
| 112 |
Multi-state homogeneous Markov models in reliability analysis
|
Bobbio, Andrea
|
|
1980
|
20 |
6 |
p. 875-880
6 p.
|
artikel
|
| 113 |
No. 4 ESS—Reliability and maintainability experience
|
|
|
1980
|
20 |
6 |
p. 903-
1 p.
|
artikel
|
| 114 |
Observation of valley splitting in (111) n-type silicon inversion layers
|
|
|
1980
|
20 |
6 |
p. 913-
1 p.
|
artikel
|
| 115 |
Observed reliability of FLIR common modules and systems
|
|
|
1980
|
20 |
6 |
p. 905-906
2 p.
|
artikel
|
| 116 |
On a basic equation of reliability theory
|
|
|
1980
|
20 |
6 |
p. 905-
1 p.
|
artikel
|
| 117 |
On human reliability trends in digital communication systems
|
Soi, Inder M.
|
|
1980
|
20 |
6 |
p. 823-830
8 p.
|
artikel
|
| 118 |
On reliability of a computer network
|
|
|
1980
|
20 |
6 |
p. 905-
1 p.
|
artikel
|
| 119 |
On the decision to replace a unit early or late—A graphical solution
|
Bergman, Bo
|
|
1980
|
20 |
6 |
p. 895-896
2 p.
|
artikel
|
| 120 |
On the mobility of polycrystalline semiconductors
|
|
|
1980
|
20 |
6 |
p. 913-
1 p.
|
artikel
|
| 121 |
On the specification of repair time requirements
|
|
|
1980
|
20 |
6 |
p. 902-
1 p.
|
artikel
|
| 122 |
Optical end-point detection for the plasma etching of aluminum
|
|
|
1980
|
20 |
6 |
p. 911-
1 p.
|
artikel
|
| 123 |
Optimization of maintained systems
|
|
|
1980
|
20 |
6 |
p. 902-
1 p.
|
artikel
|
| 124 |
Optimization system reliability via redundancy and/or design considerations
|
|
|
1980
|
20 |
6 |
p. 901-
1 p.
|
artikel
|
| 125 |
Optimum preventive maintenance policies for a 2-unit redundant system with repair and post-repair
|
Sinha, S.M.
|
|
1980
|
20 |
6 |
p. 887-890
4 p.
|
artikel
|
| 126 |
Paraconductivity of Ge-covered tin films
|
|
|
1980
|
20 |
6 |
p. 914-
1 p.
|
artikel
|
| 127 |
Path enumeration using flow graphs
|
|
|
1980
|
20 |
6 |
p. 905-
1 p.
|
artikel
|
| 128 |
Performance/availability model of shared resource multiprocessors
|
|
|
1980
|
20 |
6 |
p. 901-
1 p.
|
artikel
|
| 129 |
Performance of the porcelain-metal substrate at microwaves
|
|
|
1980
|
20 |
6 |
p. 915-
1 p.
|
artikel
|
| 130 |
Photoexcitation effects during laser trimming of thin-film resistors on silicon
|
|
|
1980
|
20 |
6 |
p. 917-
1 p.
|
artikel
|
| 131 |
Piezoresistance tensor coefficients of phosphorus implanted silicon thin films
|
|
|
1980
|
20 |
6 |
p. 917-
1 p.
|
artikel
|
| 132 |
Plasma deposited polycrystalline silicon films
|
|
|
1980
|
20 |
6 |
p. 911-912
2 p.
|
artikel
|
| 133 |
Plasma etching for SiO2 profile control
|
|
|
1980
|
20 |
6 |
p. 911-
1 p.
|
artikel
|
| 134 |
Polysilicon self-aligned technology—A new approach for bipolar LSIs
|
|
|
1980
|
20 |
6 |
p. 910-911
2 p.
|
artikel
|
| 135 |
Preliminary evaluation of DIP/socket connection reliability
|
|
|
1980
|
20 |
6 |
p. 897-898
2 p.
|
artikel
|
| 136 |
Preoxidation gettering of oxidation-induced stacking faults in silicon by the phosphorus diffusion process
|
|
|
1980
|
20 |
6 |
p. 914-
1 p.
|
artikel
|
| 137 |
Probability plots for life test data based on optimum spacing method
|
|
|
1980
|
20 |
6 |
p. 901-
1 p.
|
artikel
|
| 138 |
Procurement specification requirements for protection against electromigration failures in aluminium metallizations
|
|
|
1980
|
20 |
6 |
p. 899-
1 p.
|
artikel
|
| 139 |
Product liability prevention—an engineer's viewpoint
|
|
|
1980
|
20 |
6 |
p. 897-
1 p.
|
artikel
|
| 140 |
Products liability: defective conditions
|
|
|
1980
|
20 |
6 |
p. 897-
1 p.
|
artikel
|
| 141 |
Programmable components: the shape of VLSI to come
|
|
|
1980
|
20 |
6 |
p. 907-
1 p.
|
artikel
|
| 142 |
Properties of plasma enhanced CVD silicon nitride: measurements and interpretations
|
|
|
1980
|
20 |
6 |
p. 914-
1 p.
|
artikel
|
| 143 |
Publications, notices, calls forpapers, etc.
|
|
|
1980
|
20 |
6 |
p. 771-786
16 p.
|
artikel
|
| 144 |
Quantitative comparison of electronic component/solder joint stress relief in encapsulated assemblies
|
|
|
1980
|
20 |
6 |
p. 907-
1 p.
|
artikel
|
| 145 |
Realization of frequency dependent negative resistance
|
Salawu, R.I.
|
|
1980
|
20 |
6 |
p. 853-857
5 p.
|
artikel
|
| 146 |
Real-time monitoring of semiconductor process uniformity
|
|
|
1980
|
20 |
6 |
p. 899-
1 p.
|
artikel
|
| 147 |
Reliability assurance programs to meet regulatory requirements in the electric power and process industries
|
|
|
1980
|
20 |
6 |
p. 905-
1 p.
|
artikel
|
| 148 |
Reliability bounds for decomposable multi-component systems
|
|
|
1980
|
20 |
6 |
p. 902-
1 p.
|
artikel
|
| 149 |
Reliability design and quality assurance system for solid tantalum capacitor
|
|
|
1980
|
20 |
6 |
p. 898-
1 p.
|
artikel
|
| 150 |
Reliability evaluation of a flow network
|
|
|
1980
|
20 |
6 |
p. 901-
1 p.
|
artikel
|
| 151 |
Reliability improvement of multiterminal networks
|
|
|
1980
|
20 |
6 |
p. 900-901
2 p.
|
artikel
|
| 152 |
Reliability problems with the store switching circuit U 253
|
|
|
1980
|
20 |
6 |
p. 903-
1 p.
|
artikel
|
| 153 |
Reliability study of high-power microwave GaAs MESFETs
|
|
|
1980
|
20 |
6 |
p. 898-
1 p.
|
artikel
|
| 154 |
Reliable Multiwire circuits with small gauge wires
|
|
|
1980
|
20 |
6 |
p. 908-
1 p.
|
artikel
|
| 155 |
Repairable systems with one standby unit
|
|
|
1980
|
20 |
6 |
p. 905-
1 p.
|
artikel
|
| 156 |
Research and development of IC technology in Japan
|
|
|
1980
|
20 |
6 |
p. 906-
1 p.
|
artikel
|
| 157 |
Reversible breakdown voltage collapse in silicon gate-controlled diodes
|
|
|
1980
|
20 |
6 |
p. 899-
1 p.
|
artikel
|
| 158 |
Semi-empirical APW calculation of the band structure of silicon
|
|
|
1980
|
20 |
6 |
p. 914-
1 p.
|
artikel
|
| 159 |
Sequential destruction method for Monte Carlo evaluation of system reliability
|
|
|
1980
|
20 |
6 |
p. 901-
1 p.
|
artikel
|
| 160 |
Simple process propels bipolar PROMs to 16-K density and beyond
|
|
|
1980
|
20 |
6 |
p. 912-
1 p.
|
artikel
|
| 161 |
Simulation comparisons of point estimation methods in the 2-parameter Weibull distribution
|
|
|
1980
|
20 |
6 |
p. 905-
1 p.
|
artikel
|
| 162 |
Soft errors in VLSI: present and future
|
|
|
1980
|
20 |
6 |
p. 907-
1 p.
|
artikel
|
| 163 |
Software and hardware R & M: What are the differences
|
|
|
1980
|
20 |
6 |
p. 904-
1 p.
|
artikel
|
| 164 |
Some aspects of reliable software packages
|
|
|
1980
|
20 |
6 |
p. 905-
1 p.
|
artikel
|
| 165 |
Some facts about environmental stress screening
|
|
|
1980
|
20 |
6 |
p. 903-
1 p.
|
artikel
|
| 166 |
Some fundamental properties of aluminum-aluminum electrical contacts
|
|
|
1980
|
20 |
6 |
p. 899-
1 p.
|
artikel
|
| 167 |
TCR control of Ni/Cr resistors
|
|
|
1980
|
20 |
6 |
p. 915-
1 p.
|
artikel
|
| 168 |
Technical and practical considerations of incorporating microprocessors in OEM products—a management view
|
|
|
1980
|
20 |
6 |
p. 913-
1 p.
|
artikel
|
| 169 |
The BCML circuit and packaging system
|
|
|
1980
|
20 |
6 |
p. 911-
1 p.
|
artikel
|
| 170 |
The decision to replace a unit early or late in an age replacement problem
|
|
|
1980
|
20 |
6 |
p. 904-
1 p.
|
artikel
|
| 171 |
The effect of alpha-particle-induced soft errors on memory systems with error correction
|
|
|
1980
|
20 |
6 |
p. 905-
1 p.
|
artikel
|
| 172 |
The effects of phosphorus diffusion cooling rate on I2L gain
|
|
|
1980
|
20 |
6 |
p. 914-
1 p.
|
artikel
|
| 173 |
The fail-safe feature of the Lapp & Powers fault tree
|
|
|
1980
|
20 |
6 |
p. 906-
1 p.
|
artikel
|
| 174 |
The failure rate function estimated from parameter drift measurements
|
Møltoft, Jørgen
|
|
1980
|
20 |
6 |
p. 787-802
16 p.
|
artikel
|
| 175 |
The MOM 400 single-chip microcomputer
|
|
|
1980
|
20 |
6 |
p. 908-
1 p.
|
artikel
|
| 176 |
The performance of plastic-encapsulated CMOS microcircuits in a humid environment
|
|
|
1980
|
20 |
6 |
p. 909-
1 p.
|
artikel
|
| 177 |
The promotion of VLSI and microlithography in Germany
|
|
|
1980
|
20 |
6 |
p. 907-
1 p.
|
artikel
|
| 178 |
The responsibility of the consumer. The pendulum has swung too far
|
|
|
1980
|
20 |
6 |
p. 897-
1 p.
|
artikel
|
| 179 |
Thermal studies of a plastic dual-in-line package
|
|
|
1980
|
20 |
6 |
p. 909-
1 p.
|
artikel
|
| 180 |
The role of hybrids in LSI systems
|
|
|
1980
|
20 |
6 |
p. 915-
1 p.
|
artikel
|
| 181 |
The steady-state distribution of signal charge in charge-coupled devices
|
|
|
1980
|
20 |
6 |
p. 912-
1 p.
|
artikel
|
| 182 |
The use of an industrial X-ray source for electronic component radiation effects work
|
|
|
1980
|
20 |
6 |
p. 899-
1 p.
|
artikel
|
| 183 |
Thick-film fine pattern formation by a photolithographic process
|
|
|
1980
|
20 |
6 |
p. 915-
1 p.
|
artikel
|
| 184 |
Thin layer high-voltage devices (resurf devices)
|
|
|
1980
|
20 |
6 |
p. 917-
1 p.
|
artikel
|
| 185 |
Transient damage resulting in failure of a component exposed to ionizing radiation environment
|
|
|
1980
|
20 |
6 |
p. 900-
1 p.
|
artikel
|
| 186 |
Two-chip radio link pilots toys and models
|
|
|
1980
|
20 |
6 |
p. 913-
1 p.
|
artikel
|
| 187 |
Ultrasonic in-line inspection technique for contact materials
|
|
|
1980
|
20 |
6 |
p. 899-
1 p.
|
artikel
|
| 188 |
Universal logic gates for custom-design I.C. requiremeats
|
|
|
1980
|
20 |
6 |
p. 910-
1 p.
|
artikel
|
| 189 |
VLSI—directions and impact
|
|
|
1980
|
20 |
6 |
p. 907-
1 p.
|
artikel
|
| 190 |
VLSI/LSI circuit functions: their challenges, rewards and problems
|
|
|
1980
|
20 |
6 |
p. 906-
1 p.
|
artikel
|
| 191 |
VLSI with a vengeneance
|
|
|
1980
|
20 |
6 |
p. 906-
1 p.
|
artikel
|
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