| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Accelerated electrical testing for improved device reliability
|
|
|
1978
|
17 |
2 |
p. 253-
1 p.
|
artikel
|
| 2 |
Accelerated testing of class A CMOS integrated circuits
|
|
|
1978
|
17 |
2 |
p. 252-
1 p.
|
artikel
|
| 3 |
Accelerated test procedures for semiconductor components
|
|
|
1978
|
17 |
2 |
p. 252-
1 p.
|
artikel
|
| 4 |
AC electrical properties of magnesium and aluminium fluoride thin films
|
|
|
1978
|
17 |
2 |
p. 264-
1 p.
|
artikel
|
| 5 |
A comparison of some optical microscope measurements of photomask linewidths
|
|
|
1978
|
17 |
2 |
p. 255-
1 p.
|
artikel
|
| 6 |
A dual-gate GaAs FET RF power limiter
|
|
|
1978
|
17 |
2 |
p. 257-
1 p.
|
artikel
|
| 7 |
AES investigations of the interface between substrate and chromium films prepared by evaporation and ion plating
|
|
|
1978
|
17 |
2 |
p. 267-
1 p.
|
artikel
|
| 8 |
Ageing tests on gold layers and bonded contacts
|
|
|
1978
|
17 |
2 |
p. 264-
1 p.
|
artikel
|
| 9 |
A high voltage, high performance thick film resistor system
|
|
|
1978
|
17 |
2 |
p. 265-
1 p.
|
artikel
|
| 10 |
Analog output chips shrink a-d conversion software
|
|
|
1978
|
17 |
2 |
p. 258-
1 p.
|
artikel
|
| 11 |
An evaporation cryostat for electrical and optical measurements on ultra-thin metal film under ultra high vacuum conditions
|
|
|
1978
|
17 |
2 |
p. 262-
1 p.
|
artikel
|
| 12 |
A new approach to the calculation of tight-binding surface density of states in thin films
|
|
|
1978
|
17 |
2 |
p. 263-
1 p.
|
artikel
|
| 13 |
A new high stability resistor system
|
|
|
1978
|
17 |
2 |
p. 265-266
2 p.
|
artikel
|
| 14 |
An explicit form for system mean life
|
|
|
1978
|
17 |
2 |
p. 253-
1 p.
|
artikel
|
| 15 |
An investigation of flaws in complex CMOS devices by a scanning photoexcitation technique
|
|
|
1978
|
17 |
2 |
p. 251-
1 p.
|
artikel
|
| 16 |
A production parylene coating process for hybrid microcircuits
|
|
|
1978
|
17 |
2 |
p. 266-
1 p.
|
artikel
|
| 17 |
A reliability failure mode in dynamic MOS circuits—the unopened metal to polysilicon contact window and the floating gate transistor
|
|
|
1978
|
17 |
2 |
p. 252-
1 p.
|
artikel
|
| 18 |
Aspects of electron resist exposure
|
|
|
1978
|
17 |
2 |
p. 268-
1 p.
|
artikel
|
| 19 |
Assessment of silicone encapsulation materials: screening techniques
|
|
|
1978
|
17 |
2 |
p. 257-
1 p.
|
artikel
|
| 20 |
A statistical approach to the analysis of dielectric breakdown strength of thin insulating films
|
|
|
1978
|
17 |
2 |
p. 266-
1 p.
|
artikel
|
| 21 |
Automatic diffusion furnace system using microprocessor control
|
|
|
1978
|
17 |
2 |
p. 256-
1 p.
|
artikel
|
| 22 |
Automatic photo-composition of reticles
|
|
|
1978
|
17 |
2 |
p. 256-
1 p.
|
artikel
|
| 23 |
Automation in CVD processing
|
|
|
1978
|
17 |
2 |
p. 256-
1 p.
|
artikel
|
| 24 |
Boron-implanted silicon resistors
|
|
|
1978
|
17 |
2 |
p. 266-
1 p.
|
artikel
|
| 25 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
|
|
1978
|
17 |
2 |
p. 235-238
4 p.
|
artikel
|
| 26 |
Characterisation of real surface of silicon by ellipsometry
|
|
|
1978
|
17 |
2 |
p. 259-
1 p.
|
artikel
|
| 27 |
Characterization of reaction bonded Au and Ag thick film metallizations
|
|
|
1978
|
17 |
2 |
p. 256-
1 p.
|
artikel
|
| 28 |
Charge storage by irradiation with UV light in non-biased MNOS structures
|
|
|
1978
|
17 |
2 |
p. 259-
1 p.
|
artikel
|
| 29 |
Chromium thin film as a barrier to the interaction of Pd2Si with Al
|
|
|
1978
|
17 |
2 |
p. 259-
1 p.
|
artikel
|
| 30 |
CMOS reliability
|
Gallace, L.J
|
|
1978
|
17 |
2 |
p. 287-304
18 p.
|
artikel
|
| 31 |
COMCAN—A computer code for common-cause analysis
|
|
|
1978
|
17 |
2 |
p. 254-
1 p.
|
artikel
|
| 32 |
Computerized thermal analysis of hybrid circuits
|
|
|
1978
|
17 |
2 |
p. 261-
1 p.
|
artikel
|
| 33 |
Conduction processes in high value thick film resistors
|
|
|
1978
|
17 |
2 |
p. 261-
1 p.
|
artikel
|
| 34 |
Contactless nondestructive technique for the measurement of minority-carrier lifetime and diffusion length in silicon
|
|
|
1978
|
17 |
2 |
p. 260-
1 p.
|
artikel
|
| 35 |
Converters adjust to LSI, Bi-fet or amps emerge
|
|
|
1978
|
17 |
2 |
p. 257-
1 p.
|
artikel
|
| 36 |
Correlation between laboratory test and field part failure rates
|
|
|
1978
|
17 |
2 |
p. 254-
1 p.
|
artikel
|
| 37 |
Corrosion of solder-coated TiPdAu thin-film conductors in a moist chlorine atmosphere
|
|
|
1978
|
17 |
2 |
p. 263-
1 p.
|
artikel
|
| 38 |
Cost optimizing system to evaluate reliability (COSTER)
|
|
|
1978
|
17 |
2 |
p. 253-
1 p.
|
artikel
|
| 39 |
Decapsulation of epoxy devices using oxygen plasma
|
|
|
1978
|
17 |
2 |
p. 256-
1 p.
|
artikel
|
| 40 |
Designing with nitride-type EAROMs
|
|
|
1978
|
17 |
2 |
p. 258-
1 p.
|
artikel
|
| 41 |
Detection and processing of secondary electron signals for pattern re-registration in scanning electron beam exposure
|
|
|
1978
|
17 |
2 |
p. 268-
1 p.
|
artikel
|
| 42 |
Determination of optimal overhaul intervals and inspection frequencies—A case study
|
Basker, B.A.
|
|
1978
|
17 |
2 |
p. 313-315
3 p.
|
artikel
|
| 43 |
Development and production of hybrid circuits for microwave radio links
|
|
|
1978
|
17 |
2 |
p. 261-
1 p.
|
artikel
|
| 44 |
Developments likely to improve the reliability of plastic encapsulated devices
|
Jones, R.O.
|
|
1978
|
17 |
2 |
p. 273-278
6 p.
|
artikel
|
| 45 |
Dielectric dispersion and polarization effects in thin transition metal oxide films
|
|
|
1978
|
17 |
2 |
p. 264-
1 p.
|
artikel
|
| 46 |
Distribution function relaxation times in gallium arsenide
|
|
|
1978
|
17 |
2 |
p. 259-
1 p.
|
artikel
|
| 47 |
E-beam systems arrive, flexible circuits fluorish
|
|
|
1978
|
17 |
2 |
p. 267-
1 p.
|
artikel
|
| 48 |
Edge acuity and resolution in positive type photoresist systems
|
|
|
1978
|
17 |
2 |
p. 256-
1 p.
|
artikel
|
| 49 |
Edge emissions of ion-implanted CdS
|
|
|
1978
|
17 |
2 |
p. 268-
1 p.
|
artikel
|
| 50 |
Effects in Auger electron spectroscopy due to the probing electrons and sputtering
|
|
|
1978
|
17 |
2 |
p. 267-
1 p.
|
artikel
|
| 51 |
Effects of dislocations in silicon transistors with implanted bases
|
|
|
1978
|
17 |
2 |
p. 268-269
2 p.
|
artikel
|
| 52 |
Electrical properties of uncontaminated PbTe films on Mica substrates prepared by molecular beam deposition
|
|
|
1978
|
17 |
2 |
p. 262-263
2 p.
|
artikel
|
| 53 |
Electrical testing of bare silicon chips prior to hybrid fabrication
|
|
|
1978
|
17 |
2 |
p. 263-
1 p.
|
artikel
|
| 54 |
Electron beam—now a practical LSI production tool
|
|
|
1978
|
17 |
2 |
p. 266-
1 p.
|
artikel
|
| 55 |
Electron trapping noise in SOS MOS field-effect transistors operated in the linear region
|
|
|
1978
|
17 |
2 |
p. 258-
1 p.
|
artikel
|
| 56 |
Equipment availability and logistic principles
|
|
|
1978
|
17 |
2 |
p. 254-
1 p.
|
artikel
|
| 57 |
Fabrication and electrical properties of epitaxial layers of GaAs doped with manganese
|
|
|
1978
|
17 |
2 |
p. 260-
1 p.
|
artikel
|
| 58 |
Failure analysis of digital system using simulation
|
|
|
1978
|
17 |
2 |
p. 253-254
2 p.
|
artikel
|
| 59 |
Failure analysis of thin-film conductors stressed with high current density by application of Matthiessen's rule
|
|
|
1978
|
17 |
2 |
p. 264-
1 p.
|
artikel
|
| 60 |
Far infrared resonant magnetoabsorption in low density Si inversion layers
|
|
|
1978
|
17 |
2 |
p. 260-
1 p.
|
artikel
|
| 61 |
Fault tree analysis using bit manipulation
|
|
|
1978
|
17 |
2 |
p. 254-
1 p.
|
artikel
|
| 62 |
Fleet reliability assessment program (FRAP)
|
|
|
1978
|
17 |
2 |
p. 254-
1 p.
|
artikel
|
| 63 |
Flex life in cables
|
|
|
1978
|
17 |
2 |
p. 251-
1 p.
|
artikel
|
| 64 |
Gap tolerant bubble propagation circuit
|
|
|
1978
|
17 |
2 |
p. 257-258
2 p.
|
artikel
|
| 65 |
Gold- and silver-based thick-film conductors
|
|
|
1978
|
17 |
2 |
p. 266-
1 p.
|
artikel
|
| 66 |
Grain size dependence of the gauge factor of thin metallic films
|
|
|
1978
|
17 |
2 |
p. 265-
1 p.
|
artikel
|
| 67 |
Hot carrier injection in the dual polysilicon gate structure and its related reliability effects on dynamic RAM refresh time
|
|
|
1978
|
17 |
2 |
p. 252-
1 p.
|
artikel
|
| 68 |
Hot electron diffusivity in silicon
|
|
|
1978
|
17 |
2 |
p. 259-
1 p.
|
artikel
|
| 69 |
Hot electron reliability effects in lateral PNP transistors
|
|
|
1978
|
17 |
2 |
p. 252-
1 p.
|
artikel
|
| 70 |
Hybrid microcircuitry for 300°C operation
|
|
|
1978
|
17 |
2 |
p. 262-
1 p.
|
artikel
|
| 71 |
Identification of failure mechanisms and activation energies of OPTO devices
|
|
|
1978
|
17 |
2 |
p. 251-
1 p.
|
artikel
|
| 72 |
Improvement of uniformity of sputtered film sheet resistance
|
|
|
1978
|
17 |
2 |
p. 263-264
2 p.
|
artikel
|
| 73 |
Initial approximations for the numerical solution of the transport equations in semiconductors
|
|
|
1978
|
17 |
2 |
p. 258-
1 p.
|
artikel
|
| 74 |
Ionizing radiation effects on NMOS microprocessors
|
|
|
1978
|
17 |
2 |
p. 258-
1 p.
|
artikel
|
| 75 |
Ion microprobe analysis of integrated circuit structures
|
|
|
1978
|
17 |
2 |
p. 251-252
2 p.
|
artikel
|
| 76 |
Is MIL-STD-781B A good reliability test specification—Part II
|
|
|
1978
|
17 |
2 |
p. 251-
1 p.
|
artikel
|
| 77 |
Leakage-induced hot carrier instability in phosphorus-doped SiO2 gate IGFET devices
|
|
|
1978
|
17 |
2 |
p. 252-
1 p.
|
artikel
|
| 78 |
Liquid crystal technique for field detection in microwave integrated circuitry
|
|
|
1978
|
17 |
2 |
p. 258-
1 p.
|
artikel
|
| 79 |
Localized plastic deformation of GaAs produced by thermo-compression bonding
|
|
|
1978
|
17 |
2 |
p. 256-
1 p.
|
artikel
|
| 80 |
Localized vibrational modes of isolated impurities in germanium
|
|
|
1978
|
17 |
2 |
p. 259-
1 p.
|
artikel
|
| 81 |
Low cost ICs convert light to current
|
|
|
1978
|
17 |
2 |
p. 267-
1 p.
|
artikel
|
| 82 |
Low frequency characteristics of TiO2 (rutile)-glass thick films
|
|
|
1978
|
17 |
2 |
p. 265-
1 p.
|
artikel
|
| 83 |
Manifestation of electron-hole exchange effects in magneto-optical spectra of free excitons in III–V semiconductors
|
|
|
1978
|
17 |
2 |
p. 259-260
2 p.
|
artikel
|
| 84 |
Manufacture of super fine finish beryllia
|
|
|
1978
|
17 |
2 |
p. 262-
1 p.
|
artikel
|
| 85 |
Maximization of system reliability by accelerated random search algorithm
|
Bharathi Devi, B.
|
|
1978
|
17 |
2 |
p. 309-312
4 p.
|
artikel
|
| 86 |
Mechanisation of wire bonding for semiconductor devices
|
|
|
1978
|
17 |
2 |
p. 257-
1 p.
|
artikel
|
| 87 |
Microcircuit accelerated testing reveals life limiting failure modes
|
|
|
1978
|
17 |
2 |
p. 255-
1 p.
|
artikel
|
| 88 |
Microelectronics—yesterday, today and tomorrow
|
|
|
1978
|
17 |
2 |
p. 255-
1 p.
|
artikel
|
| 89 |
Micropower consumption handy LSI TV color camera for ENG system
|
|
|
1978
|
17 |
2 |
p. 257-
1 p.
|
artikel
|
| 90 |
Moisture induced failure mode in a plastic encapsulated dynamic timing circuit
|
|
|
1978
|
17 |
2 |
p. 252-
1 p.
|
artikel
|
| 91 |
Near-minimal test sets for the detection of single gate faults
|
|
|
1978
|
17 |
2 |
p. 253-
1 p.
|
artikel
|
| 92 |
New metallization process for tantalum RC hybrid integrated circuits
|
|
|
1978
|
17 |
2 |
p. 265-
1 p.
|
artikel
|
| 93 |
Nichrome passivation coating—help or hindrance
|
|
|
1978
|
17 |
2 |
p. 263-
1 p.
|
artikel
|
| 94 |
Nonlinearity measurements of thin films
|
|
|
1978
|
17 |
2 |
p. 264-
1 p.
|
artikel
|
| 95 |
Numerical estimation of the doping profile and threshold voltage of the boron isolation region in MOS devices
|
|
|
1978
|
17 |
2 |
p. 258-259
2 p.
|
artikel
|
| 96 |
N-unit parallel redundant system with correlated failure and single repair facility
|
Itoi, Takashi
|
|
1978
|
17 |
2 |
p. 279-285
7 p.
|
artikel
|
| 97 |
On the design of ion implanted buried channel charge coupled devices (BCCDs)
|
|
|
1978
|
17 |
2 |
p. 267-268
2 p.
|
artikel
|
| 98 |
On the penetration of gases and water vapour into packages with cavities and on maximum allowable leak rates
|
|
|
1978
|
17 |
2 |
p. 255-
1 p.
|
artikel
|
| 99 |
Optical projection printing
|
|
|
1978
|
17 |
2 |
p. 255-256
2 p.
|
artikel
|
| 100 |
Polychip DIPSs: quick-turnaround custom circuit designs
|
|
|
1978
|
17 |
2 |
p. 258-
1 p.
|
artikel
|
| 101 |
Polycrystalline semiconductor thin films
|
|
|
1978
|
17 |
2 |
p. 266-
1 p.
|
artikel
|
| 102 |
Predict contact performance with film measurements
|
|
|
1978
|
17 |
2 |
p. 261-262
2 p.
|
artikel
|
| 103 |
Predicting the confidence of passing life tests
|
|
|
1978
|
17 |
2 |
p. 253-
1 p.
|
artikel
|
| 104 |
Present and foreseeable electronic masking machines
|
|
|
1978
|
17 |
2 |
p. 267-
1 p.
|
artikel
|
| 105 |
Properties, advantages and limitations of electronic mask duplication, results achieved
|
|
|
1978
|
17 |
2 |
p. 257-
1 p.
|
artikel
|
| 106 |
Publications, notices, calls for papers, etc.
|
|
|
1978
|
17 |
2 |
p. 239-
1 p.
|
artikel
|
| 107 |
Pulsed photovoltaic effect in thin film MIS devices
|
|
|
1978
|
17 |
2 |
p. 261-
1 p.
|
artikel
|
| 108 |
Pulse evaluation of integrated circuit metallization as an alternative to SEM
|
|
|
1978
|
17 |
2 |
p. 255-
1 p.
|
artikel
|
| 109 |
Recent patents on microelectronics
|
|
|
1978
|
17 |
2 |
p. 243-249
7 p.
|
artikel
|
| 110 |
Reliability analysis of complex electronic systems
|
|
|
1978
|
17 |
2 |
p. 254-
1 p.
|
artikel
|
| 111 |
Reliability evaluation of ECL integrated circuits
|
|
|
1978
|
17 |
2 |
p. 252-
1 p.
|
artikel
|
| 112 |
Reliability evaluation of trimetal integrated circuits in plastic packages
|
|
|
1978
|
17 |
2 |
p. 251-
1 p.
|
artikel
|
| 113 |
Reliability growth and improvement
|
|
|
1978
|
17 |
2 |
p. 253-
1 p.
|
artikel
|
| 114 |
Reliability in electronics
|
|
|
1978
|
17 |
2 |
p. 254-
1 p.
|
artikel
|
| 115 |
Reliability study of a high precision thick film resistor network
|
|
|
1978
|
17 |
2 |
p. 263-
1 p.
|
artikel
|
| 116 |
Resistor geometry comparison with respect to current noise and trim sensitivity
|
|
|
1978
|
17 |
2 |
p. 261-
1 p.
|
artikel
|
| 117 |
Resolved fine structure of exciton complexes bound to phosphorus impurities in silicon
|
|
|
1978
|
17 |
2 |
p. 259-
1 p.
|
artikel
|
| 118 |
Semiconductor memories packaged in hybrid microcircuits
|
|
|
1978
|
17 |
2 |
p. 263-
1 p.
|
artikel
|
| 119 |
Silicon for solar cells
|
|
|
1978
|
17 |
2 |
p. 260-
1 p.
|
artikel
|
| 120 |
Size effects in thin films of cadmium arsenide
|
|
|
1978
|
17 |
2 |
p. 264-
1 p.
|
artikel
|
| 121 |
Solder dissolution rates of evaporated and sputtered Ti, Pd, Au and NiCr-Au thin films
|
|
|
1978
|
17 |
2 |
p. 265-
1 p.
|
artikel
|
| 122 |
Spin-dependent photoconductivity in n-type and p-type amorphous silicon
|
|
|
1978
|
17 |
2 |
p. 260-
1 p.
|
artikel
|
| 123 |
Strain dependence of electronic bands of silicon
|
|
|
1978
|
17 |
2 |
p. 259-
1 p.
|
artikel
|
| 124 |
Stroboscopic observation of bubble dynamics
|
|
|
1978
|
17 |
2 |
p. 258-
1 p.
|
artikel
|
| 125 |
Structures for photocells: homojunctions, heterostructures or heterojunctions
|
|
|
1978
|
17 |
2 |
p. 260-
1 p.
|
artikel
|
| 126 |
Study of a three dimensional model of the mechanisms of exposure and development of a positive photoresin
|
|
|
1978
|
17 |
2 |
p. 256-257
2 p.
|
artikel
|
| 127 |
Surface segregation of non-bonding impurities in gold-silicon preforms
|
|
|
1978
|
17 |
2 |
p. 256-
1 p.
|
artikel
|
| 128 |
System reliability modelling and evaluation
|
|
|
1978
|
17 |
2 |
p. 271-
1 p.
|
artikel
|
| 129 |
Tantalum thin film applications—a new approach for capacitors
|
|
|
1978
|
17 |
2 |
p. 265-
1 p.
|
artikel
|
| 130 |
Techniques for the examination of thick film resistor microstructures by TEM
|
|
|
1978
|
17 |
2 |
p. 264-265
2 p.
|
artikel
|
| 131 |
Temperature dependence of the magnetoconductivity in the ground Landau level in silicon inversion layers
|
|
|
1978
|
17 |
2 |
p. 259-
1 p.
|
artikel
|
| 132 |
Temperature dependence of the radius of electron-hole drops in Ge
|
|
|
1978
|
17 |
2 |
p. 259-
1 p.
|
artikel
|
| 133 |
Testing of thick film technology in ionizing radiation environments
|
|
|
1978
|
17 |
2 |
p. 263-
1 p.
|
artikel
|
| 134 |
The application of magnetically enhanced sputtering in a production cylindrical sputtering system
|
|
|
1978
|
17 |
2 |
p. 265-
1 p.
|
artikel
|
| 135 |
The design of highly reliable computer systems to control telephone exchanges
|
|
|
1978
|
17 |
2 |
p. 253-
1 p.
|
artikel
|
| 136 |
The effect of argon implantation on the conductivity of boron implanted silicon
|
|
|
1978
|
17 |
2 |
p. 268-
1 p.
|
artikel
|
| 137 |
The effect of oxygen on the electrical properties of silicon
|
|
|
1978
|
17 |
2 |
p. 260-
1 p.
|
artikel
|
| 138 |
The electrocomposer, a high speed integrated circuit mask tracer using an electron beam
|
|
|
1978
|
17 |
2 |
p. 268-
1 p.
|
artikel
|
| 139 |
The first of the Third Generation Microcomputers
|
|
|
1978
|
17 |
2 |
p. 255-
1 p.
|
artikel
|
| 140 |
The future of silicon technology
|
|
|
1978
|
17 |
2 |
p. 255-
1 p.
|
artikel
|
| 141 |
The luminescence measurements of ZnTe implanted by Li, Cl, Al and In ions
|
|
|
1978
|
17 |
2 |
p. 267-
1 p.
|
artikel
|
| 142 |
Theoretical effects of surface diffused region lifetime models on silicon solar cells
|
|
|
1978
|
17 |
2 |
p. 260-
1 p.
|
artikel
|
| 143 |
The performance and application of thick film chip resistors on PC boards
|
|
|
1978
|
17 |
2 |
p. 263-
1 p.
|
artikel
|
| 144 |
The reliability of soldered or epoxy bonded chip capacitor interconnections on hybrids
|
|
|
1978
|
17 |
2 |
p. 262-
1 p.
|
artikel
|
| 145 |
Thermal characterization of epoxy and alloy attachment of hybrid components
|
|
|
1978
|
17 |
2 |
p. 261-
1 p.
|
artikel
|
| 146 |
The role of hybrid construction techniques on sealed moisture levels
|
|
|
1978
|
17 |
2 |
p. 257-
1 p.
|
artikel
|
| 147 |
The sensitivity of threshold voltage of ion-implanted MOSFET's to substrate doping and oxide thickness fluctuations
|
|
|
1978
|
17 |
2 |
p. 267-
1 p.
|
artikel
|
| 148 |
Thick film hybrid circuits for telecommunications equipment
|
|
|
1978
|
17 |
2 |
p. 262-
1 p.
|
artikel
|
| 149 |
Thick photoresist patterns for selective electroplating
|
Maes, J.J.
|
|
1978
|
17 |
2 |
p. 325-332
8 p.
|
artikel
|
| 150 |
Threshold voltage instability of MOS field effect transistors
|
Shankar, Sesha R.
|
|
1978
|
17 |
2 |
p. 305-308
4 p.
|
artikel
|
| 151 |
UHV-deposited amorphous tantalum and tantalum-nickel films
|
|
|
1978
|
17 |
2 |
p. 264-
1 p.
|
artikel
|
| 152 |
Utilization of quality data for cost cutting
|
Ryerson, C.M.
|
|
1978
|
17 |
2 |
p. 317-323
7 p.
|
artikel
|
| 153 |
Vapor condensation soldering of external leads to thin-film hybrid integrated circuits
|
|
|
1978
|
17 |
2 |
p. 263-
1 p.
|
artikel
|
| 154 |
Windingless hybrid repeating coil using photo-coupler
|
|
|
1978
|
17 |
2 |
p. 258-
1 p.
|
artikel
|
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