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                             135 results found
no title author magazine year volume issue page(s) type
1 A 2048-bit n-channel fully decoded electrically writable/erasable nonvolatile read only memory 1976
15 3 p. 183-
1 p.
article
2 A burn-in program for wearout unaffected equipments Gironi, G.
1976
15 3 p. 227-232
6 p.
article
3 Accelerated vibration fatigue life testing of leads and soldered joints Blanks, H.S.
1976
15 3 p. 213-219
7 p.
article
4 A fast thick-film amplifier 1976
15 3 p. 186-
1 p.
article
5 A fully ion-implanted integrated circuit process 1976
15 3 p. 189-
1 p.
article
6 A high accuracy differentiator using integrated circuits 1976
15 3 p. 184-
1 p.
article
7 A high density static master slave shiftregister in I2L 1976
15 3 p. 184-
1 p.
article
8 A hybrid thin-film multichannel biotelemetry transmitter 1976
15 3 p. 186-
1 p.
article
9 A large-scale integrated circuit for low power communication receivers 1976
15 3 p. 183-
1 p.
article
10 A monolithic digital frequency synthesizer for PLL systems 1976
15 3 p. 184-
1 p.
article
11 Analysis of a three-state system with two types of components Dhillon, Balbir S.
1976
15 3 p. 245-246
2 p.
article
12 An integrated bandgap-reference 1976
15 3 p. 181-
1 p.
article
13 An integrated injection logic (IIL) realization of phase locked loop 1976
15 3 p. 184-
1 p.
article
14 An integrated wide-tunable sine oscillator 1976
15 3 p. 184-
1 p.
article
15 Anodizing silicon is economical way to isolate IC elements 1976
15 3 p. 182-
1 p.
article
16 An optimal inspection and replacement policy 1976
15 3 p. 179-
1 p.
article
17 A physical analysis of the operating temperature limits of complementary MOS transistor integrated circuits 1976
15 3 p. 183-
1 p.
article
18 Applications of the sojourn-time problem to reliability 1976
15 3 p. 179-
1 p.
article
19 A range of automatic finishing machines for thin-film hybrid circuits 1976
15 3 p. 187-
1 p.
article
20 A review of random access MOS memories 1976
15 3 p. 183-
1 p.
article
21 A selected bibliography on ion implantation in solid state technology 1976
15 3 p. 189-
1 p.
article
22 A simple hybrid thick-film band pass filter 1976
15 3 p. 186-
1 p.
article
23 A study of Pd2Si films on silicon using Auger electron spectroscopy 1976
15 3 p. 188-
1 p.
article
24 A study of the layer and junction properties of boron implantation in silicon 1976
15 3 p. 189-
1 p.
article
25 A technique for the testing of unassembled multilayer hybrid substrates 1976
15 3 p. 188-
1 p.
article
26 A technology for high speed computer systems 1976
15 3 p. 187-188
2 p.
article
27 A thick-film humidity sensor 1976
15 3 p. 187-
1 p.
article
28 A thick-film wide band amplifier 1976
15 3 p. 186-
1 p.
article
29 Automatic manufacture of custom hybrid microelectronic circuits 1976
15 3 p. 187-
1 p.
article
30 Availability allocation using a family of hyperbolic cost functions 1976
15 3 p. 180-
1 p.
article
31 Bond strength of metal layers on strip line substrates 1976
15 3 p. 182-
1 p.
article
32 Bright future for laser trimming 1976
15 3 p. 183-
1 p.
article
33 Calendar of international conferences, symposia, lectures and meetings of interest 1976
15 3 p. 171-172
2 p.
article
34 Characterization of CCD technology on 64 × 128 element photosensor 1976
15 3 p. 183-
1 p.
article
35 CHIL and I2L with passive isolation 1976
15 3 p. 181-
1 p.
article
36 Comparative investigation of thick-film and thin-film components and MIC's up to 16 GHz 1976
15 3 p. 187-
1 p.
article
37 Comparative studies of photoresist processing of microelectronics regarding chemical pollution, shortage and cost 1976
15 3 p. 182-
1 p.
article
38 Conduction theory applied to thick-film resistors 1976
15 3 p. 187-
1 p.
article
39 Current Developments in digital integrated circuits 1976
15 3 p. 180-
1 p.
article
40 Density of states determination of mixed semiconductors by neutron diffraction 1976
15 3 p. 185-
1 p.
article
41 Designing reliability into power circuits. Part 2 1976
15 3 p. 178-
1 p.
article
42 Discharge of MNOS structures at elevated temperatures 1976
15 3 p. 185-186
2 p.
article
43 Does parts screening really pay off 1976
15 3 p. 178-
1 p.
article
44 Easier custom design using uncommitted arrays 1976
15 3 p. 181-
1 p.
article
45 Electroless NiP processing for hybrid integrated circuits van Nie, A.G.
1976
15 3 p. 221-226
6 p.
article
46 Electron spin resonance of ion-implanted Si:Pi system 1976
15 3 p. 189-
1 p.
article
47 ESFI SOS MOS Circuits with both complementary and enhancement/depletion-mode load devices 1976
15 3 p. 180-
1 p.
article
48 Evaluation of the noise index in laser-trimmed thick-film resistors 1976
15 3 p. 188-
1 p.
article
49 Exact capacitance of a lossless MOS capacitor 1976
15 3 p. 183-
1 p.
article
50 Experimental study of the properties of the contact between semiconductor and liquid crystal layers 1976
15 3 p. 182-
1 p.
article
51 Experiments with Operation Amplifiers 1976
15 3 p. 176-
1 p.
article
52 Fabrication and characteristics of MOS-FET's incorporating anodic aluminum oxide in the gate structure 1976
15 3 p. 186-
1 p.
article
53 Frozen-in native defects in semiconductor compounds 1976
15 3 p. 185-
1 p.
article
54 Gold in semiconductor technology 1976
15 3 p. 180-
1 p.
article
55 High-field transport in NiO and Ni 1−x Li x O thin films 1976
15 3 p. 188-
1 p.
article
56 High frequency characteristics of meandering line-resistors with regard to the design of thin-film circuits 1976
15 3 p. 186-
1 p.
article
57 High speed I2L 1976
15 3 p. 182-
1 p.
article
58 High tensile strength thick-film silver-palladium metallizations 1976
15 3 p. 186-187
2 p.
article
59 I2L getting a second look 1976
15 3 p. 180-
1 p.
article
60 Implantation of boron in silicon 1976
15 3 p. 189-
1 p.
article
61 Impurity bands in moderately doped semiconductors and their effect of the MOS C-V freeze-out characteristics 1976
15 3 p. 184-185
2 p.
article
62 Increased yield by early-stage production-line testing 1976
15 3 p. 177-189
13 p.
article
63 Injection of electrons from the surface breakdown region of a p-n junction into thermal SiO2 1976
15 3 p. 184-
1 p.
article
64 Integrated circuits for thermal imaging applications 1976
15 3 p. 184-
1 p.
article
65 Integrated circuits with leads on flexible tape 1976
15 3 p. 182-
1 p.
article
66 Irradiation-induced compensation of n-type germanium-electrical measurements 1976
15 3 p. 185-
1 p.
article
67 Microcircuit accelerated testing using high temperature operating tests 1976
15 3 p. 177-
1 p.
article
68 Microcircuit thermal design tables and computer program for two-dimensional layouts 1976
15 3 p. 188-
1 p.
article
69 Minority-carrier injection and transient response of a MOS capacitor 1976
15 3 p. 184-
1 p.
article
70 MNOS non-volatile quad latch 1976
15 3 p. 183-
1 p.
article
71 Monolithic crosspoint arrays in MOS and bipolar technologies 1976
15 3 p. 181-
1 p.
article
72 Noise and control problems. Designing reliability into equipment having power semiconductors. Part 1 1976
15 3 p. 178-
1 p.
article
73 Non-parabolicity and transverse mass of electron carriers in silicon 1976
15 3 p. 185-
1 p.
article
74 Nonsaturated integrated injection logic in circuit design 1976
15 3 p. 182-
1 p.
article
75 Observed failure rates of electronic components in computer systems Lucas, Peter
1976
15 3 p. 239-243
5 p.
article
76 On the damage to metallized film capacitors caused by electrical discharges 1976
15 3 p. 178-
1 p.
article
77 Operation of single-channel MOS LSI at low supply voltages 1976
15 3 p. 180-181
2 p.
article
78 Optimum accelerated life-tests for the Weibull and extreme value distributions 1976
15 3 p. 180-
1 p.
article
79 Optimum censored accelerated life tests for normal and lognormal life distributions 1976
15 3 p. 179-
1 p.
article
80 Parametric tests meet the challenge of high-density ICs 1976
15 3 p. 177-
1 p.
article
81 Parasitar-effekte bei bipolaren integrierten Schaltungen 1976
15 3 p. 182-
1 p.
article
82 Partners in nuclear power 1976
15 3 p. 179-
1 p.
article
83 Polarizabilities of shallow donors in silicon—a comment 1976
15 3 p. 184-
1 p.
article
84 Problems relevant to quality conformance inspection of semiconductor electronic parts Becker, P
1976
15 3 p. 191-211
21 p.
article
85 Publications, notices, calls for papers, etc. 1976
15 3 p. 173-175
3 p.
article
86 Relation between the potential-barrier shape and capacitance-voltage characteristics of MIS structures 1976
15 3 p. 183-
1 p.
article
87 Relays and logis ICs can be working partners 1976
15 3 p. 183-
1 p.
article
88 Reliability analyses of systems by means of ALGOL programmes 1976
15 3 p. 179-
1 p.
article
89 Reliability modeling and analysis of general modular redundant systems 1976
15 3 p. 179-
1 p.
article
90 Reliability of complementary MOS integrated circuits 1976
15 3 p. 177-
1 p.
article
91 Reliability of space systems 1976
15 3 p. 178-
1 p.
article
92 Reliability revisited: failure-rate comparisons are given a second look 1976
15 3 p. 179-
1 p.
article
93 Reliability study checks moisture levels in ICs 1976
15 3 p. 178-
1 p.
article
94 Resistive-insulated-gate arrays and their applications: an exploratory study 1976
15 3 p. 183-184
2 p.
article
95 Resonant interaction of acceptor states and optical phonons in silicon 1976
15 3 p. 185-
1 p.
article
96 Small-sample estimation for the lognormal distribution with unit shape parameter 1976
15 3 p. 177-
1 p.
article
97 Some applications of regenerative stochastic processes to reliability theory—Part Two: Reliability and Availability of 2-item redundant systems 1976
15 3 p. 180-
1 p.
article
98 Space-charge effect on excess carrier transport in semiconductors. Part II. Time evolution of the space-charge of excess carriers 1976
15 3 p. 185-
1 p.
article
99 Special report: film carriers star in high-volume IC production 1976
15 3 p. 181-
1 p.
article
100 Stability and forward diode voltage characteristics of conductive epoxy resin bonded devices 1976
15 3 p. 188-
1 p.
article
101 Sub-nanosecond bipolar LSI 1976
15 3 p. 181-
1 p.
article
102 Substrate bowing in thick-film multilayered circuits 1976
15 3 p. 187-
1 p.
article
103 Substrate FED logic—a novel form of injection logic 1976
15 3 p. 180-
1 p.
article
104 Supervision and maintenance of an integrated digital network 1976
15 3 p. 179-
1 p.
article
105 Supply lines for rapid integrated circuits on multilayer boards 1976
15 3 p. 182-
1 p.
article
106 Systems analysis by sequential fault trees Henley, Ernest J.
1976
15 3 p. 247-248
2 p.
article
107 Taking the heat out of switching power supplies 1976
15 3 p. 181-
1 p.
article
108 Technological teaching of hybrid microelectronics (thick-film) 1976
15 3 p. 187-
1 p.
article
109 The assessment of thick-film resistor performance by high voltage pulsing 1976
15 3 p. 188-
1 p.
article
110 The bidirectional operation of lines with TTL circuits 1976
15 3 p. 178-
1 p.
article
111 The determination of the energy distribution of interface traps in metal-nitride-oxide-silicon (memory) devices using non-steady-state techniques 1976
15 3 p. 184-
1 p.
article
112 The discrete Weibull distribution 1976
15 3 p. 177-
1 p.
article
113 The effect of electron irradiation on CdS-PbTe and CdS-Te thin-film diodes 1976
15 3 p. 189-
1 p.
article
114 The effect of series resistance and distributed parasitic diode action on multicollector I2L structures 1976
15 3 p. 182-
1 p.
article
115 The electron-hole drop and the impurity-induced semiconductor-metal transition 1976
15 3 p. 185-
1 p.
article
116 The electronic properties of epitaxial layers 1976
15 3 p. 185-
1 p.
article
117 The electronic properties of epitaxial layers. Part 1 1976
15 3 p. 181-
1 p.
article
118 The hybrid microelectronics explosion in Finland 1976
15 3 p. 187-
1 p.
article
119 The making of an integrated circuit 1976
15 3 p. 180-
1 p.
article
120 Theoretical and experimental study of MOS transistors nonuniformly doped by SILOX technique 1976
15 3 p. 186-
1 p.
article
121 Theoretical model for calculation of breakdown voltage of implanted p-n junctions 1976
15 3 p. 189-
1 p.
article
122 The problem of testing to MIL-STD-781B 1976
15 3 p. 178-179
2 p.
article
123 Thermal design considerations in CMOS circuits 1976
15 3 p. 178-
1 p.
article
124 The structure of incomplete destructive breakdown spots in thin polymer films 1976
15 3 p. 178-
1 p.
article
125 Thick-film advances simplify complex hybrid module design 1976
15 3 p. 186-
1 p.
article
126 Thick-film directional coupler design—a comparison of theories 1976
15 3 p. 186-
1 p.
article
127 Thick-film research in a university environment 1976
15 3 p. 187-
1 p.
article
128 Thin-film deposition techniques and design of thin-film passive components Singh, Awatar
1976
15 3 p. 233-238
6 p.
article
129 Time-dependent MOS breakdown 1976
15 3 p. 178-
1 p.
article
130 Transient isothermal generation at the silicon-silicon oxide interface and the direct determination of interface trap distribution 1976
15 3 p. 185-
1 p.
article
131 Trimming of thin-film resistors by spark machining 1976
15 3 p. 188-
1 p.
article
132 Turning up system faults with gated-noise testing 1976
15 3 p. 179-
1 p.
article
133 Two new approaches simplify testing of microprocessors 1976
15 3 p. 179-
1 p.
article
134 User's tests, not data sheets, assure IC performance 1976
15 3 p. 177-
1 p.
article
135 Weighing the real cost of a board tester 1976
15 3 p. 179-
1 p.
article
                             135 results found
 
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