| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A case study approach to the reliability of shipborne electronic systems
|
|
|
1976
|
15 |
1 |
p. 20-
1 p.
|
artikel
|
| 2 |
Active redundancy in analogue electronic systems
|
|
|
1976
|
15 |
1 |
p. 19-
1 p.
|
artikel
|
| 3 |
A data base management (DBMP) program for integrated logistics support (ILS)
|
|
|
1976
|
15 |
1 |
p. 19-
1 p.
|
artikel
|
| 4 |
Advances in epoxy die-attach
|
|
|
1976
|
15 |
1 |
p. 21-
1 p.
|
artikel
|
| 5 |
A method for designing non-linear thick-film potentiometric displacement transducers
|
|
|
1976
|
15 |
1 |
p. 26-
1 p.
|
artikel
|
| 6 |
A method of studying thermocompression bonding damage in GaAs using the SEM
|
|
|
1976
|
15 |
1 |
p. 14-
1 p.
|
artikel
|
| 7 |
A micro-contacting spider to test wafers for integrated circuits
|
|
|
1976
|
15 |
1 |
p. 21-
1 p.
|
artikel
|
| 8 |
A model of OHMIC contacts to semiconducts
|
|
|
1976
|
15 |
1 |
p. 25-26
2 p.
|
artikel
|
| 9 |
An approximate model for boron drive diffusions in oxidizing ambients
|
|
|
1976
|
15 |
1 |
p. 25-
1 p.
|
artikel
|
| 10 |
A new generation of displacement transducers
|
|
|
1976
|
15 |
1 |
p. 23-
1 p.
|
artikel
|
| 11 |
A new surface preparation and bevelling technique for spreading resistance measurements on N- and P-type silicon
|
|
|
1976
|
15 |
1 |
p. 24-
1 p.
|
artikel
|
| 12 |
An introduction to fault tree analysis with emphasis on failure rate evaluation
|
|
|
1976
|
15 |
1 |
p. 17-
1 p.
|
artikel
|
| 13 |
Anodizing silicon is economical way to isolate IC elements
|
|
|
1976
|
15 |
1 |
p. 22-
1 p.
|
artikel
|
| 14 |
An optimising technique for a K-out-of-N system
|
|
|
1976
|
15 |
1 |
p. 18-
1 p.
|
artikel
|
| 15 |
Application of the sequential t-test to maintainability demonstration
|
|
|
1976
|
15 |
1 |
p. 19-
1 p.
|
artikel
|
| 16 |
A reliability evaluation of plastic packaged semiconductor components
|
|
|
1976
|
15 |
1 |
p. 14-
1 p.
|
artikel
|
| 17 |
Aspects for the design of integrated MIS circuits
|
|
|
1976
|
15 |
1 |
p. 22-
1 p.
|
artikel
|
| 18 |
A study of the dielectric breakdown of thermally grown SiO2 by the self-quenching technique
|
|
|
1976
|
15 |
1 |
p. 25-
1 p.
|
artikel
|
| 19 |
Automated metal etch system for IC-manufacture
|
|
|
1976
|
15 |
1 |
p. 21-
1 p.
|
artikel
|
| 20 |
Automatic out-of-contact mask alignment
|
|
|
1976
|
15 |
1 |
p. 21-
1 p.
|
artikel
|
| 21 |
Avionics Testing
|
|
|
1976
|
15 |
1 |
p. 18-
1 p.
|
artikel
|
| 22 |
Bayesian confidence limits for the availability of systems
|
|
|
1976
|
15 |
1 |
p. 17-
1 p.
|
artikel
|
| 23 |
Bipolar LSI: 10,000 gates in sight
|
|
|
1976
|
15 |
1 |
p. 23-
1 p.
|
artikel
|
| 24 |
Boron and phosphorous diffusion through an SiO2 layer from a doped polycrystalline Si source under various drive-in ambients
|
|
|
1976
|
15 |
1 |
p. 23-
1 p.
|
artikel
|
| 25 |
Bulk leakage in avalanche diodes due to siliconmetallization reactions
|
|
|
1976
|
15 |
1 |
p. 24-
1 p.
|
artikel
|
| 26 |
Calculation of diagnostic tests for digital circuits
|
|
|
1976
|
15 |
1 |
p. 16-
1 p.
|
artikel
|
| 27 |
Calendar of International Conferences, Symposia, Lectures and Meetings of Interest
|
|
|
1976
|
15 |
1 |
p. 1-2
2 p.
|
artikel
|
| 28 |
Characteristic electron energy losses in germanium
|
|
|
1976
|
15 |
1 |
p. 23-24
2 p.
|
artikel
|
| 29 |
Component reliability. Part 1: Failure data bears watching
|
|
|
1976
|
15 |
1 |
p. 14-
1 p.
|
artikel
|
| 30 |
Component reliability. Part 2: Hearing from users and vendors
|
|
|
1976
|
15 |
1 |
p. 14-
1 p.
|
artikel
|
| 31 |
Connecting devices for electronic systems—some general design considerations
|
|
|
1976
|
15 |
1 |
p. 14-
1 p.
|
artikel
|
| 32 |
Constrained optimum test configuration for reliability acceptance tests incorporating environmental stresses
|
|
|
1976
|
15 |
1 |
p. 17-
1 p.
|
artikel
|
| 33 |
Correlative sea mist corrosion testing for electronic devices
|
|
|
1976
|
15 |
1 |
p. 15-
1 p.
|
artikel
|
| 34 |
Cost effective burn-in and replacement times
|
|
|
1976
|
15 |
1 |
p. 19-
1 p.
|
artikel
|
| 35 |
Density adds MOS-design challenge
|
|
|
1976
|
15 |
1 |
p. 22-
1 p.
|
artikel
|
| 36 |
Determination of diffusion, partition and sticking coefficients for boron, phosphorus and antimony in silicon
|
|
|
1976
|
15 |
1 |
p. 24-
1 p.
|
artikel
|
| 37 |
Determination of generation lifetime from the small-signal transient behaviour of MOS capacitors
|
|
|
1976
|
15 |
1 |
p. 24-
1 p.
|
artikel
|
| 38 |
Determination of test intervals in certain repairable standby protective systems
|
|
|
1976
|
15 |
1 |
p. 16-
1 p.
|
artikel
|
| 39 |
Development of beam-lead RF integrated circuits
|
|
|
1976
|
15 |
1 |
p. 22-
1 p.
|
artikel
|
| 40 |
Diffusion of excitons and electron-hole drops in germanium
|
|
|
1976
|
15 |
1 |
p. 24-
1 p.
|
artikel
|
| 41 |
Economical attainment of high reliability
|
|
|
1976
|
15 |
1 |
p. 17-18
2 p.
|
artikel
|
| 42 |
Editorial Board
|
|
|
1976
|
15 |
1 |
p. IFC-
1 p.
|
artikel
|
| 43 |
Effect of thermal etching on silicon epitaxial growth by vacuum sublimation
|
|
|
1976
|
15 |
1 |
p. 24-25
2 p.
|
artikel
|
| 44 |
Effects of wire quality and capillary maintenance on bonding reliability
|
|
|
1976
|
15 |
1 |
p. 13-14
2 p.
|
artikel
|
| 45 |
Electrical breakdown in very thin Al2O3 films
|
|
|
1976
|
15 |
1 |
p. 27-
1 p.
|
artikel
|
| 46 |
Elimination of fault sources, an efficient aid to quality improvement
|
|
|
1976
|
15 |
1 |
p. 20-
1 p.
|
artikel
|
| 47 |
Evaluation methods for the examination of thick-film materials
|
|
|
1976
|
15 |
1 |
p. 26-
1 p.
|
artikel
|
| 48 |
Experiments on M-I-M-I-M triode structures using SiOx/B2O3 as the insulating material
|
|
|
1976
|
15 |
1 |
p. 24-
1 p.
|
artikel
|
| 49 |
Failure analysis of a semiconductor
|
|
|
1976
|
15 |
1 |
p. 15-
1 p.
|
artikel
|
| 50 |
Failure mechanism of metal-polysilicon-doped silicon butting contacts
|
|
|
1976
|
15 |
1 |
p. 15-
1 p.
|
artikel
|
| 51 |
Fermi energy and band-tail parameters in heavily doped semiconductors
|
|
|
1976
|
15 |
1 |
p. 23-
1 p.
|
artikel
|
| 52 |
Field Data Analysis via Markov Renewal Life Models
|
|
|
1976
|
15 |
1 |
p. 17-
1 p.
|
artikel
|
| 53 |
Flight quality nickel-chromium films with sheet resistances up to 420 ohms per square
|
|
|
1976
|
15 |
1 |
p. 26-27
2 p.
|
artikel
|
| 54 |
Graphical estimation methods for Weibull distributions
|
Cran, G.W.
|
|
1976
|
15 |
1 |
p. 47-52
6 p.
|
artikel
|
| 55 |
Guide to the statistical analysis of technological processes in the semiconductor component industry
|
|
|
1976
|
15 |
1 |
p. 15-
1 p.
|
artikel
|
| 56 |
Higher-order breakdown in epitaxial P+N/N+ junctions
|
|
|
1976
|
15 |
1 |
p. 15-16
2 p.
|
artikel
|
| 57 |
High pulse power failure of discrete resistors
|
|
|
1976
|
15 |
1 |
p. 13-
1 p.
|
artikel
|
| 58 |
Hole cyclotron masses in silicon MOS devices
|
|
|
1976
|
15 |
1 |
p. 26-
1 p.
|
artikel
|
| 59 |
How many should you check. Chances are, there's money to be saved in your sampling program
|
|
|
1976
|
15 |
1 |
p. 19-20
2 p.
|
artikel
|
| 60 |
How to hand-calculate system reliability and safety characteristics
|
|
|
1976
|
15 |
1 |
p. 16-
1 p.
|
artikel
|
| 61 |
IC compresses, expands analog signals
|
|
|
1976
|
15 |
1 |
p. 23-
1 p.
|
artikel
|
| 62 |
IC converts voltage to frequency
|
|
|
1976
|
15 |
1 |
p. 23-
1 p.
|
artikel
|
| 63 |
ICs interface keyboard to microprocessor
|
|
|
1976
|
15 |
1 |
p. 23-
1 p.
|
artikel
|
| 64 |
IC testing economics—in-house versus external testing services
|
|
|
1976
|
15 |
1 |
p. 17-
1 p.
|
artikel
|
| 65 |
Improved techniques for proximity mask alignment
|
|
|
1976
|
15 |
1 |
p. 21-
1 p.
|
artikel
|
| 66 |
Improved triple diffusion means densest ICs yet
|
|
|
1976
|
15 |
1 |
p. 22-
1 p.
|
artikel
|
| 67 |
In-built failure environments
|
Jowett, C.E.
|
|
1976
|
15 |
1 |
p. 57-60
4 p.
|
artikel
|
| 68 |
In-circuit testing pins down defects in pc boards early
|
|
|
1976
|
15 |
1 |
p. 13-
1 p.
|
artikel
|
| 69 |
Injection current flow through thin insulator films
|
|
|
1976
|
15 |
1 |
p. 23-
1 p.
|
artikel
|
| 70 |
Is MIL-STD-781B a good reliability test specification
|
|
|
1976
|
15 |
1 |
p. 17-
1 p.
|
artikel
|
| 71 |
1-kilobit C-MOS RAM offers low price, power
|
|
|
1976
|
15 |
1 |
p. 23-
1 p.
|
artikel
|
| 72 |
LCC—Commercial Application. Ten years of life cycle costing
|
|
|
1976
|
15 |
1 |
p. 18-
1 p.
|
artikel
|
| 73 |
Logic network synthesis using digital-summation threshold-logic gates
|
|
|
1976
|
15 |
1 |
p. 20-
1 p.
|
artikel
|
| 74 |
Maintainability analyses and prototype operations
|
|
|
1976
|
15 |
1 |
p. 19-
1 p.
|
artikel
|
| 75 |
Maintainability payoffs during weapon-system test: the value of appropriate testing
|
|
|
1976
|
15 |
1 |
p. 17-
1 p.
|
artikel
|
| 76 |
Materials in thick-film applications
|
|
|
1976
|
15 |
1 |
p. 26-
1 p.
|
artikel
|
| 77 |
Microcircuit accelerated testing using high temperature operating tests
|
|
|
1976
|
15 |
1 |
p. 14-
1 p.
|
artikel
|
| 78 |
Microprocessor controls fully automatic wafer prober
|
|
|
1976
|
15 |
1 |
p. 21-
1 p.
|
artikel
|
| 79 |
Microwave transistor and monolithic integrated circuit technology
|
|
|
1976
|
15 |
1 |
p. 22-23
2 p.
|
artikel
|
| 80 |
Monolithics mature, passives improve
|
|
|
1976
|
15 |
1 |
p. 20-
1 p.
|
artikel
|
| 81 |
Multiple comparison for Weibull Parameters
|
|
|
1976
|
15 |
1 |
p. 13-
1 p.
|
artikel
|
| 82 |
Needed for logic testing: a new breed of instruments
|
|
|
1976
|
15 |
1 |
p. 17-
1 p.
|
artikel
|
| 83 |
New maintainability demonstration tests
|
|
|
1976
|
15 |
1 |
p. 19-
1 p.
|
artikel
|
| 84 |
On the analysis of fault trees
|
|
|
1976
|
15 |
1 |
p. 13-
1 p.
|
artikel
|
| 85 |
On the direct currents through interface states in metalsemiconductor contacts
|
|
|
1976
|
15 |
1 |
p. 25-
1 p.
|
artikel
|
| 86 |
Optimal maintenance policy for systems that experience state degradations
|
|
|
1976
|
15 |
1 |
p. 18-
1 p.
|
artikel
|
| 87 |
Optimization of a K-on-N configuration
|
|
|
1976
|
15 |
1 |
p. 18-
1 p.
|
artikel
|
| 88 |
PBX maintenance comes wrapped in a new package
|
|
|
1976
|
15 |
1 |
p. 18-
1 p.
|
artikel
|
| 89 |
P-Channel rewritable avalanche injection device (raid) operation and degradation mechanisms
|
|
|
1976
|
15 |
1 |
p. 25-
1 p.
|
artikel
|
| 90 |
Photolithography in integrated circuit mask metrology
|
|
|
1976
|
15 |
1 |
p. 22-
1 p.
|
artikel
|
| 91 |
Practical method of computing product conformance quality cost
|
|
|
1976
|
15 |
1 |
p. 18-
1 p.
|
artikel
|
| 92 |
Principles of thick-film materials formulation
|
|
|
1976
|
15 |
1 |
p. 26-
1 p.
|
artikel
|
| 93 |
Printed thick-film capacitors
|
|
|
1976
|
15 |
1 |
p. 27-
1 p.
|
artikel
|
| 94 |
Proforma on preforms
|
|
|
1976
|
15 |
1 |
p. 21-
1 p.
|
artikel
|
| 95 |
Publications, notices, calls for papers, etc
|
|
|
1976
|
15 |
1 |
p. 3-12
10 p.
|
artikel
|
| 96 |
Publisher's announcement
|
|
|
1976
|
15 |
1 |
p. 67-
1 p.
|
artikel
|
| 97 |
Quality assurance for measuring and testing facilities
|
|
|
1976
|
15 |
1 |
p. 16-
1 p.
|
artikel
|
| 98 |
RAM, ROM, PROM circuits for simple image processing
|
|
|
1976
|
15 |
1 |
p. 20-21
2 p.
|
artikel
|
| 99 |
Reactively bonded thin-film conductors, a new component for combination thin- and thick-film technology
|
|
|
1976
|
15 |
1 |
p. 26-
1 p.
|
artikel
|
| 100 |
Recent advances in LIC processing and packaging technology
|
Avery, Les
|
|
1976
|
15 |
1 |
p. 75-83
9 p.
|
artikel
|
| 101 |
Recent SOS technology, advances and applications
|
|
|
1976
|
15 |
1 |
p. 20-
1 p.
|
artikel
|
| 102 |
Reliability analysis of intermittently used systems when failures are detected only during a usage period
|
Nakagawa, T.
|
|
1976
|
15 |
1 |
p. 35-38
4 p.
|
artikel
|
| 103 |
Reliability bounds in probabilistic design
|
|
|
1976
|
15 |
1 |
p. 17-
1 p.
|
artikel
|
| 104 |
Reliability criteria for experimental programs
|
|
|
1976
|
15 |
1 |
p. 20-
1 p.
|
artikel
|
| 105 |
Reliability estimation and sensitivity testing
|
|
|
1976
|
15 |
1 |
p. 18-
1 p.
|
artikel
|
| 106 |
Reliability Growth Analysis
|
|
|
1976
|
15 |
1 |
p. 13-
1 p.
|
artikel
|
| 107 |
Reliability life cycle of a complex electronic airborne equipment
|
|
|
1976
|
15 |
1 |
p. 19-
1 p.
|
artikel
|
| 108 |
Reliability models of NMR systems
|
|
|
1976
|
15 |
1 |
p. 19-
1 p.
|
artikel
|
| 109 |
Reliability of complementary MOS integrated circuits
|
|
|
1976
|
15 |
1 |
p. 14-
1 p.
|
artikel
|
| 110 |
Reliability of silicon power transistors
|
Marmann, Alfred
|
|
1976
|
15 |
1 |
p. 69-74
6 p.
|
artikel
|
| 111 |
Reliability of statically controlled drives
|
|
|
1976
|
15 |
1 |
p. 16-
1 p.
|
artikel
|
| 112 |
Reliability optimization by 0-1 programming for a system with several failure modes
|
|
|
1976
|
15 |
1 |
p. 17-
1 p.
|
artikel
|
| 113 |
Resistivity decrease due to electron spin resonance in the metallic region of heavily phosphorous-doped silicon
|
|
|
1976
|
15 |
1 |
p. 24-
1 p.
|
artikel
|
| 114 |
Resistivity minima in quench-condensed films of palladium
|
|
|
1976
|
15 |
1 |
p. 27-
1 p.
|
artikel
|
| 115 |
Resistors and diodes produced by Al-implantation in silicon
|
|
|
1976
|
15 |
1 |
p. 27-
1 p.
|
artikel
|
| 116 |
Scanning electron microscopy: the instrument and its application to semiconductor assessment
|
|
|
1976
|
15 |
1 |
p. 27-
1 p.
|
artikel
|
| 117 |
Small field effect transistor production technology
|
|
|
1976
|
15 |
1 |
p. 27-
1 p.
|
artikel
|
| 118 |
SOAR—the basis for reliable power circuit design
|
|
|
1976
|
15 |
1 |
p. 16-
1 p.
|
artikel
|
| 119 |
Sodium ions at defect sites at SiO2/Si interfaces as determined by X-ray photoelectron spectroscopy
|
|
|
1976
|
15 |
1 |
p. 25-
1 p.
|
artikel
|
| 120 |
Software reliability, how it affects system reliability
|
|
|
1976
|
15 |
1 |
p. 18-
1 p.
|
artikel
|
| 121 |
Some advancements in the analysis of two-unit parallel redundant systems
|
Linton, Darrell G.
|
|
1976
|
15 |
1 |
p. 39-46
8 p.
|
artikel
|
| 122 |
Some problems of reliability in instrument design
|
|
|
1976
|
15 |
1 |
p. 16-
1 p.
|
artikel
|
| 123 |
Specifying AQLs and LQs in procurement documents. Some basic Guidelines for adapting MIL-STD-105D to the QA provisions of part specifications
|
|
|
1976
|
15 |
1 |
p. 18-
1 p.
|
artikel
|
| 124 |
Stability analysis of laser trimmed thin-film resistors
|
|
|
1976
|
15 |
1 |
p. 26-
1 p.
|
artikel
|
| 125 |
Static characteristics of metal-insulator-semiconductor-insulator-metal (MISIM) structures—I. Electric field and potential distributions
|
|
|
1976
|
15 |
1 |
p. 25-
1 p.
|
artikel
|
| 126 |
Static characteristics of the metal-insulator-semiconductor-insulator-metal (MISIM) structure—II. Low frequency capacitance
|
|
|
1976
|
15 |
1 |
p. 25-
1 p.
|
artikel
|
| 127 |
Strength of gold-plated copper leads on thin-film circuits under accelerated aging
|
|
|
1976
|
15 |
1 |
p. 27-
1 p.
|
artikel
|
| 128 |
System reliability: exact Bayesian intervals compared with fiducial intervals
|
|
|
1976
|
15 |
1 |
p. 17-
1 p.
|
artikel
|
| 129 |
Technological implications in the photomasking process
|
|
|
1976
|
15 |
1 |
p. 22-
1 p.
|
artikel
|
| 130 |
The analysis of a four-state system
|
Proctor, C.L.
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1976
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15 |
1 |
p. 53-55
3 p.
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artikel
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| 131 |
The applicability of approximate and exact transient heat transfer analyses to heating processes used to solder multilayer circuit boards
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1976
|
15 |
1 |
p. 14-15
2 p.
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artikel
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| 132 |
The bipolar LSI breakthrough, Part 2: Extending the limits
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1976
|
15 |
1 |
p. 20-
1 p.
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artikel
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| 133 |
The bipolar LSI breakthrough, Part 1: Rethinking the problem
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1976
|
15 |
1 |
p. 20-
1 p.
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artikel
|
| 134 |
The closed boat: A new approach for semiconductor batch processing
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Hearn, E.W.
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1976
|
15 |
1 |
p. 61-62
2 p.
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artikel
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| 135 |
The design error contribution to failure
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1976
|
15 |
1 |
p. 18-
1 p.
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artikel
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| 136 |
The evolution of COS/MOS into MSI and LSI components
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Tarrant, R
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1976
|
15 |
1 |
p. 85-92
8 p.
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artikel
|
| 137 |
The mechanisms of current-induced degradation in a GaAs light-emitting diode
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1976
|
15 |
1 |
p. 14-
1 p.
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artikel
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| 138 |
The reliability parameter and its importance for life cycle management
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1976
|
15 |
1 |
p. 19-
1 p.
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artikel
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| 139 |
The robustness of reliability predictions for parallel systems of identical components
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1976
|
15 |
1 |
p. 15-
1 p.
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artikel
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| 140 |
The thermal resistance of integrated MOS transistors
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1976
|
15 |
1 |
p. 22-
1 p.
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artikel
|
| 141 |
The use of reliable plastic semiconductors in military equipment
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Reich, Bernard
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1976
|
15 |
1 |
p. 29-33
5 p.
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artikel
|
| 142 |
The variation of impurity ionization with doping in heavily doped germanium
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1976
|
15 |
1 |
p. 27-
1 p.
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artikel
|
| 143 |
Throwaway maintenance—fact or fiction
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1976
|
15 |
1 |
p. 19-
1 p.
|
artikel
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| 144 |
Two-electron band-to-band transitions in silicon
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1976
|
15 |
1 |
p. 24-
1 p.
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artikel
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| 145 |
Ultrasonic mean free path in a granular aluminium film
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1976
|
15 |
1 |
p. 23-
1 p.
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artikel
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| 146 |
Void reduction in large-area bonding of IC components
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1976
|
15 |
1 |
p. 21-
1 p.
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artikel
|
| 147 |
Wafer Testing
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1976
|
15 |
1 |
p. 21-
1 p.
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artikel
|
| 148 |
Why plan your inspection. Basic advice on how inspection plans should be made, who should make them, when, for what parts and why
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1976
|
15 |
1 |
p. 16-
1 p.
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artikel
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