| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A case study approach to the reliability of shipborne electronic systems
|
Shove, P.L.
|
|
1975
|
14 |
1 |
p. 57-62
6 p.
|
artikel
|
| 2 |
Acceleration factors for plastic encapsulated semiconductor devices and their relationship to field performance
|
Reich, Bernard
|
|
1975
|
14 |
1 |
p. 63-66
4 p.
|
artikel
|
| 3 |
A detailed analysis of the metal-semiconductor contact
|
|
|
1975
|
14 |
1 |
p. 27-28
2 p.
|
artikel
|
| 4 |
A high density thick film multilayer process for LSI circuits
|
|
|
1975
|
14 |
1 |
p. 30-
1 p.
|
artikel
|
| 5 |
A hybrid integrated silicon diode array for visible earth-horizon sensing
|
|
|
1975
|
14 |
1 |
p. 33-
1 p.
|
artikel
|
| 6 |
A measurement technique of time-dependent dielectric breakdown in MOS capacitors
|
|
|
1975
|
14 |
1 |
p. 21-
1 p.
|
artikel
|
| 7 |
A method for the rapid and economical generation of hybrid LSI circuits
|
|
|
1975
|
14 |
1 |
p. 32-
1 p.
|
artikel
|
| 8 |
A new method for system reliability evaluation
|
|
|
1975
|
14 |
1 |
p. 22-
1 p.
|
artikel
|
| 9 |
A new method to determine the failure frequency of a complex system
|
|
|
1975
|
14 |
1 |
p. 22-
1 p.
|
artikel
|
| 10 |
A new projection printer
|
|
|
1975
|
14 |
1 |
p. 25-
1 p.
|
artikel
|
| 11 |
An optimal maintenance policy for a 2-unit parallel system with degraded states
|
|
|
1975
|
14 |
1 |
p. 22-
1 p.
|
artikel
|
| 12 |
A thin-film multilayering technique for hybrid microcircuits
|
|
|
1975
|
14 |
1 |
p. 33-
1 p.
|
artikel
|
| 13 |
A thyristor protected against di/dt-failure at breakover turnon
|
|
|
1975
|
14 |
1 |
p. 20-
1 p.
|
artikel
|
| 14 |
Automatic drawing of integrated circuit masks. A new layout algorithm
|
|
|
1975
|
14 |
1 |
p. 25-
1 p.
|
artikel
|
| 15 |
Bayesian confidence limits for the reliability of mixed cascade and parallel independent exponential subsystems
|
|
|
1975
|
14 |
1 |
p. 22-23
2 p.
|
artikel
|
| 16 |
Bias-dependent small-signal parameters of Schottky contact microstrip lines
|
|
|
1975
|
14 |
1 |
p. 26-
1 p.
|
artikel
|
| 17 |
Bipolar LSI takes a new direction with integrated injection logic
|
|
|
1975
|
14 |
1 |
p. 26-
1 p.
|
artikel
|
| 18 |
Building C-MOS, bipolar circuits on monolithic chip enhances IC specs
|
|
|
1975
|
14 |
1 |
p. 26-
1 p.
|
artikel
|
| 19 |
Calculation of distribution coefficients of donors in III–V Semiconductors
|
|
|
1975
|
14 |
1 |
p. 28-
1 p.
|
artikel
|
| 20 |
Calculation of the turn-on behaviour of MOST
|
|
|
1975
|
14 |
1 |
p. 29-30
2 p.
|
artikel
|
| 21 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
|
|
1975
|
14 |
1 |
p. 3-4
2 p.
|
artikel
|
| 22 |
1975 Canadian SRE reliability symposium
|
|
|
1975
|
14 |
1 |
p. 12-
1 p.
|
artikel
|
| 23 |
Capability studies—Comparative methods
|
|
|
1975
|
14 |
1 |
p. 23-
1 p.
|
artikel
|
| 24 |
Ceramic Substrate Strength Testing
|
|
|
1975
|
14 |
1 |
p. 25-26
2 p.
|
artikel
|
| 25 |
Characteristics of multi-layered metallizations consisting of tantalum and aluminium on silicon and/or SiO2
|
|
|
1975
|
14 |
1 |
p. 25-
1 p.
|
artikel
|
| 26 |
Characterization of a Chromium-gold deposition process for the production of thin film hybrid microcircuits
|
|
|
1975
|
14 |
1 |
p. 31-
1 p.
|
artikel
|
| 27 |
Chemical vapor deposition of titanium dioxide film in microelectronics
|
|
|
1975
|
14 |
1 |
p. 32-
1 p.
|
artikel
|
| 28 |
Computers help design reliable telephone systems
|
|
|
1975
|
14 |
1 |
p. 22-
1 p.
|
artikel
|
| 29 |
Condensation of injected electrons and holes in silicon
|
|
|
1975
|
14 |
1 |
p. 29-
1 p.
|
artikel
|
| 30 |
Contact potential measurements on thin SIO2 films
|
|
|
1975
|
14 |
1 |
p. 29-
1 p.
|
artikel
|
| 31 |
Control of stray effects in hybrid microcircuit design
|
|
|
1975
|
14 |
1 |
p. 31-
1 p.
|
artikel
|
| 32 |
Courses
|
|
|
1975
|
14 |
1 |
p. 8-
1 p.
|
artikel
|
| 33 |
Customized ICs make up d-a converter
|
|
|
1975
|
14 |
1 |
p. 27-
1 p.
|
artikel
|
| 34 |
Design considerations of hybrid integrated active RC filters
|
|
|
1975
|
14 |
1 |
p. 33-
1 p.
|
artikel
|
| 35 |
Design of planar rectangular microelectronic inductors
|
|
|
1975
|
14 |
1 |
p. 31-32
2 p.
|
artikel
|
| 36 |
Design of polymer resists for electron lithography
|
|
|
1975
|
14 |
1 |
p. 26-
1 p.
|
artikel
|
| 37 |
Design of precision thin film resistive networks
|
|
|
1975
|
14 |
1 |
p. 33-
1 p.
|
artikel
|
| 38 |
Development of COS/MOS technology
|
|
|
1975
|
14 |
1 |
p. 24-
1 p.
|
artikel
|
| 39 |
Dislocations in GaAs produced by device fabrication
|
|
|
1975
|
14 |
1 |
p. 29-
1 p.
|
artikel
|
| 40 |
Economical RGB colour decoder with three ICs
|
|
|
1975
|
14 |
1 |
p. 27-
1 p.
|
artikel
|
| 41 |
Editorial Board
|
|
|
1975
|
14 |
1 |
p. IFC-
1 p.
|
artikel
|
| 42 |
Effects of nuclear radiation on a high-reliability silicon power diode—4. Analysis of reverse bias characteristics
|
|
|
1975
|
14 |
1 |
p. 20-
1 p.
|
artikel
|
| 43 |
Electrical applications of thin-films produced by metallo-Organic Deposition
|
|
|
1975
|
14 |
1 |
p. 30-
1 p.
|
artikel
|
| 44 |
Electrical characteristics of the SiO2-Si interface near midgap and in weak inversion
|
|
|
1975
|
14 |
1 |
p. 28-29
2 p.
|
artikel
|
| 45 |
Electromigration testing—a current problem
|
|
|
1975
|
14 |
1 |
p. 24-
1 p.
|
artikel
|
| 46 |
Electron Beam Evaporated aluminium oxide gate silicon transistors
|
|
|
1975
|
14 |
1 |
p. 33-34
2 p.
|
artikel
|
| 47 |
Electron-beam microfabrication equipment for microcircuit research and production
|
|
|
1975
|
14 |
1 |
p. 34-
1 p.
|
artikel
|
| 48 |
Electronic density of states of amorphous III–V semiconductors
|
|
|
1975
|
14 |
1 |
p. 29-
1 p.
|
artikel
|
| 49 |
Electronic masking
|
|
|
1975
|
14 |
1 |
p. 25-
1 p.
|
artikel
|
| 50 |
Electronic properties of undoped polycrystalline silicon
|
|
|
1975
|
14 |
1 |
p. 28-
1 p.
|
artikel
|
| 51 |
Epitaxial growth of metal single-crystal films
|
|
|
1975
|
14 |
1 |
p. 28-
1 p.
|
artikel
|
| 52 |
Errata
|
|
|
1975
|
14 |
1 |
p. 71-
1 p.
|
artikel
|
| 53 |
Exciton condensation in doped germanium
|
|
|
1975
|
14 |
1 |
p. 29-
1 p.
|
artikel
|
| 54 |
Factors affecting the reliability of field instruments
|
|
|
1975
|
14 |
1 |
p. 23-24
2 p.
|
artikel
|
| 55 |
Flight quality nickel-chromium films with sheet resistances up to 420 ohms per square
|
Faith, T.J.
|
|
1975
|
14 |
1 |
p. 41-42
2 p.
|
artikel
|
| 56 |
Functional memory testing. A review of fault detection and location
|
|
|
1975
|
14 |
1 |
p. 24-
1 p.
|
artikel
|
| 57 |
Fundamentals of COS/MOS Integrated Circuits
|
|
|
1975
|
14 |
1 |
p. 27-
1 p.
|
artikel
|
| 58 |
Hall mobility in dielectrically isolated single-crystal silicon films defined by electrochemical etching
|
|
|
1975
|
14 |
1 |
p. 28-
1 p.
|
artikel
|
| 59 |
Handbook of thick film hybrid microelectronics
|
G.W.A.D.,
|
|
1975
|
14 |
1 |
p. 36-
1 p.
|
artikel
|
| 60 |
High density thin film hybrid IC utilizing Ta-Al-N resistor and Ta2O5MnO2 Capacitor
|
|
|
1975
|
14 |
1 |
p. 32-
1 p.
|
artikel
|
| 61 |
High-temperature stability of Au/Pt/n-GaAs Schottky barrier diodes
|
|
|
1975
|
14 |
1 |
p. 29-
1 p.
|
artikel
|
| 62 |
How can we assure reliable connections in electronic systems
|
|
|
1975
|
14 |
1 |
p. 19-20
2 p.
|
artikel
|
| 63 |
Hybrid microelectronics in military applications
|
|
|
1975
|
14 |
1 |
p. 33-
1 p.
|
artikel
|
| 64 |
Hybrid packages by the direct bonded copper process
|
|
|
1975
|
14 |
1 |
p. 31-
1 p.
|
artikel
|
| 65 |
IC output in 1973 climbs 55% above previous year
|
|
|
1975
|
14 |
1 |
p. 24-
1 p.
|
artikel
|
| 66 |
IC timer and voltage doubler form a dc-dc converter
|
|
|
1975
|
14 |
1 |
p. 27-
1 p.
|
artikel
|
| 67 |
Improved linear processing packs a-d converter onto two IC chips
|
|
|
1975
|
14 |
1 |
p. 27-
1 p.
|
artikel
|
| 68 |
In-circuit IC tester checks TTL and C-MOS
|
|
|
1975
|
14 |
1 |
p. 27-
1 p.
|
artikel
|
| 69 |
Indefinite admittance matrix of a 5-layer thin-film integrated structure
|
|
|
1975
|
14 |
1 |
p. 33-
1 p.
|
artikel
|
| 70 |
Integrated circuits form the heart of comprehensive control systems
|
|
|
1975
|
14 |
1 |
p. 24-
1 p.
|
artikel
|
| 71 |
Integrated circuits for radio and TV sets
|
|
|
1975
|
14 |
1 |
p. 24-
1 p.
|
artikel
|
| 72 |
Integration increased by 10 times over printed circuit boards (Toshiba-GE IC Technique)
|
|
|
1975
|
14 |
1 |
p. 25-
1 p.
|
artikel
|
| 73 |
1975 International reliability physics symposium
|
|
|
1975
|
14 |
1 |
p. 10-11
2 p.
|
artikel
|
| 74 |
International reliability physics symposium
|
|
|
1975
|
14 |
1 |
p. 13-18
6 p.
|
artikel
|
| 75 |
Ion implanted silicon diodes with steep C-V dependence
|
|
|
1975
|
14 |
1 |
p. 34-
1 p.
|
artikel
|
| 76 |
Laser cut microwave thin-film circuits
|
|
|
1975
|
14 |
1 |
p. 34-
1 p.
|
artikel
|
| 77 |
Letter to the editor
|
Young, K.J.
|
|
1975
|
14 |
1 |
p. 1-
1 p.
|
artikel
|
| 78 |
Life tests of SSI integrated circuits
|
|
|
1975
|
14 |
1 |
p. 20-
1 p.
|
artikel
|
| 79 |
Linear ICs in instrumentation
|
|
|
1975
|
14 |
1 |
p. 26-27
2 p.
|
artikel
|
| 80 |
Line-shapes of localized impurity phonon modes of boron acceptors in silicon
|
|
|
1975
|
14 |
1 |
p. 28-
1 p.
|
artikel
|
| 81 |
Logic scopes speed diagnosis of faults in digital circuits
|
|
|
1975
|
14 |
1 |
p. 23-
1 p.
|
artikel
|
| 82 |
LSI testing: a three-way street
|
|
|
1975
|
14 |
1 |
p. 26-
1 p.
|
artikel
|
| 83 |
Manufacturing X-Ray lithography inches closer
|
|
|
1975
|
14 |
1 |
p. 26-
1 p.
|
artikel
|
| 84 |
Material and device properties of heteroepitaxial GaAs on BeO
|
|
|
1975
|
14 |
1 |
p. 29-
1 p.
|
artikel
|
| 85 |
Matsushita designs bucket-brigade IC for audio gear
|
|
|
1975
|
14 |
1 |
p. 27-
1 p.
|
artikel
|
| 86 |
Microcircuit device malfunction report
|
G.W.A.D.,
|
|
1975
|
14 |
1 |
p. 35-
1 p.
|
artikel
|
| 87 |
Microelectronic test patterns: An overview
|
|
|
1975
|
14 |
1 |
p. 35-
1 p.
|
artikel
|
| 88 |
Minority-carrier lifetime in dielectrically isolated single-crystal silicon films defined by electrochemical etching
|
|
|
1975
|
14 |
1 |
p. 28-
1 p.
|
artikel
|
| 89 |
Module makers go vertical
|
|
|
1975
|
14 |
1 |
p. 25-
1 p.
|
artikel
|
| 90 |
Mounting techniques for metal packaged power semiconductors
|
|
|
1975
|
14 |
1 |
p. 25-
1 p.
|
artikel
|
| 91 |
Multilayer interconnection techniques applied to high speed computer systems
|
|
|
1975
|
14 |
1 |
p. 25-
1 p.
|
artikel
|
| 92 |
NELC Designers Guide for LSI. Volume I. Technical document
|
|
|
1975
|
14 |
1 |
p. 24-
1 p.
|
artikel
|
| 93 |
New alumina substrate for hybrid integrated circuits
|
|
|
1975
|
14 |
1 |
p. 31-
1 p.
|
artikel
|
| 94 |
Notice National centre of systems realiability
|
|
|
1975
|
14 |
1 |
p. 9-
1 p.
|
artikel
|
| 95 |
Notices, publications, calls for papers, etc.
|
|
|
1975
|
14 |
1 |
p. 5-
1 p.
|
artikel
|
| 96 |
Numerical method in the static characteristics analysis of the non-linear logic circuits on the basis of the physical parameters of an integrated structure
|
|
|
1975
|
14 |
1 |
p. 26-
1 p.
|
artikel
|
| 97 |
Optimal reliability design of process systems
|
|
|
1975
|
14 |
1 |
p. 22-
1 p.
|
artikel
|
| 98 |
Optimization of a reliability growth problem
|
|
|
1975
|
14 |
1 |
p. 23-
1 p.
|
artikel
|
| 99 |
Optimum preventive maintenance policies for a 2-unit redundant system
|
|
|
1975
|
14 |
1 |
p. 23-
1 p.
|
artikel
|
| 100 |
Peak temperature during turnover and the volumetric degradation of switching transistors and ICs
|
|
|
1975
|
14 |
1 |
p. 21-
1 p.
|
artikel
|
| 101 |
Photoprintable materials and processing equipment for thick-film microcircuitry
|
|
|
1975
|
14 |
1 |
p. 33-
1 p.
|
artikel
|
| 102 |
Playback control speeds or slows taped speech without distortion
|
|
|
1975
|
14 |
1 |
p. 27-
1 p.
|
artikel
|
| 103 |
Practical automation for photolithographic wafer processing
|
|
|
1975
|
14 |
1 |
p. 26-
1 p.
|
artikel
|
| 104 |
Preparation of large-area electron-transparent samples from silicon devices
|
|
|
1975
|
14 |
1 |
p. 26-
1 p.
|
artikel
|
| 105 |
Preventive replacement of a 1-unit system with a wearout state
|
|
|
1975
|
14 |
1 |
p. 22-
1 p.
|
artikel
|
| 106 |
Projection-type aligning and exposure device for micron patterns JUBPM50
|
|
|
1975
|
14 |
1 |
p. 25-
1 p.
|
artikel
|
| 107 |
Properties of multilayer ceramic green sheets
|
|
|
1975
|
14 |
1 |
p. 26-
1 p.
|
artikel
|
| 108 |
Quality control for a guaranteed product
|
|
|
1975
|
14 |
1 |
p. 19-
1 p.
|
artikel
|
| 109 |
Radiation-stimulated failure mechanism in a dielectrically isolated integrated circuit
|
|
|
1975
|
14 |
1 |
p. 21-
1 p.
|
artikel
|
| 110 |
Real time detection of microcracks in brittle materials using stress wave emission (SWE)
|
|
|
1975
|
14 |
1 |
p. 32-
1 p.
|
artikel
|
| 111 |
Reliability analyses of combined voting and standby redundancies
|
|
|
1975
|
14 |
1 |
p. 23-
1 p.
|
artikel
|
| 112 |
Reliability analysis of regular distributed chain structures
|
|
|
1975
|
14 |
1 |
p. 21-
1 p.
|
artikel
|
| 113 |
Reliability analysis of the k-out-of-n: F system
|
|
|
1975
|
14 |
1 |
p. 23-
1 p.
|
artikel
|
| 114 |
Reliability block diagram analysis
|
|
|
1975
|
14 |
1 |
p. 22-
1 p.
|
artikel
|
| 115 |
Reliability considerations for a 2-Unit redundant system with Erlang-failure and general repair distributions
|
|
|
1975
|
14 |
1 |
p. 22-
1 p.
|
artikel
|
| 116 |
Reliability evaluation A comparative study of different techniques
|
Aggarwal, K.K.
|
|
1975
|
14 |
1 |
p. 49-56
8 p.
|
artikel
|
| 117 |
Reliability of a laser communication system
|
|
|
1975
|
14 |
1 |
p. 24-
1 p.
|
artikel
|
| 118 |
Reliability of tantalum thin film capacitor with MnO2 layer
|
|
|
1975
|
14 |
1 |
p. 20-
1 p.
|
artikel
|
| 119 |
Reliability optimization with integer constraint coefficients
|
|
|
1975
|
14 |
1 |
p. 23-
1 p.
|
artikel
|
| 120 |
Reliability prediction and growth studies—how accurate and useful?
|
|
|
1975
|
14 |
1 |
p. 19-
1 p.
|
artikel
|
| 121 |
Review of high-reliability procurement practices in the semiconductor industry
|
|
|
1975
|
14 |
1 |
p. 20-
1 p.
|
artikel
|
| 122 |
Ripple current and silver migration in CLR65 capacitors
|
|
|
1975
|
14 |
1 |
p. 20-
1 p.
|
artikel
|
| 123 |
Safe Operating ARea for power transistors
|
|
|
1975
|
14 |
1 |
p. 20-
1 p.
|
artikel
|
| 124 |
Scheduling an IC tester for maximum throughput
|
|
|
1975
|
14 |
1 |
p. 24-
1 p.
|
artikel
|
| 125 |
Screens for screen printing of electronic circuits
|
|
|
1975
|
14 |
1 |
p. 26-
1 p.
|
artikel
|
| 126 |
Second indirect band gap in silicon
|
|
|
1975
|
14 |
1 |
p. 29-
1 p.
|
artikel
|
| 127 |
Semiconductor random-access memories
|
|
|
1975
|
14 |
1 |
p. 27-
1 p.
|
artikel
|
| 128 |
Simple cable tester spots faults, identifies repairs
|
|
|
1975
|
14 |
1 |
p. 21-
1 p.
|
artikel
|
| 129 |
Small thin-film transducers point to fast, dense storage systems
|
|
|
1975
|
14 |
1 |
p. 32-
1 p.
|
artikel
|
| 130 |
Spiral inductors for hybrid and microwave applications
|
|
|
1975
|
14 |
1 |
p. 32-
1 p.
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artikel
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| 131 |
Sputtered thin film research, Semi-annual technical Rept. No. 3
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1975
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14 |
1 |
p. 32-
1 p.
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artikel
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| 132 |
Step-stress testing of thin film transistors
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1975
|
14 |
1 |
p. 31-
1 p.
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artikel
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| 133 |
Telecommunication testing philosophy of test and maintenance equipment
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1975
|
14 |
1 |
p. 23-
1 p.
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artikel
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| 134 |
Test patterns for integrated circuits subject of Scottsdale conference
|
Smith, Harry A.
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1975
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14 |
1 |
p. 6-7
2 p.
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artikel
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| 135 |
The application of lumped element techniques to high frequency hybrid integrated circuits
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1975
|
14 |
1 |
p. 33-
1 p.
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artikel
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| 136 |
The built-in voltage and space charge layer capacitance of p-n junctions
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1975
|
14 |
1 |
p. 28-
1 p.
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artikel
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| 137 |
The problems of reliability growth and demonstrations with military electronics
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1975
|
14 |
1 |
p. 21-
1 p.
|
artikel
|
| 138 |
The reliability of laser-trimmed screen-printed metal film resistors
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1975
|
14 |
1 |
p. 34-
1 p.
|
artikel
|
| 139 |
Thermal triggering of shock; crystallization in sputtered Ge films
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1975
|
14 |
1 |
p. 33-
1 p.
|
artikel
|
| 140 |
The role of radiation damage on the current-voltage characteristics of p-n junctions
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1975
|
14 |
1 |
p. 20-
1 p.
|
artikel
|
| 141 |
The thermal resistance of integrated MOS transistors
|
Kirschner, Nikolaus
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1975
|
14 |
1 |
p. 37-39
3 p.
|
artikel
|
| 142 |
The work function difference of the MOS-system with aluminium field plates and polycrystalline silicon field plates
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1975
|
14 |
1 |
p. 30-
1 p.
|
artikel
|
| 143 |
Thick film techniques for microwave integrated circuits
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1975
|
14 |
1 |
p. 31-
1 p.
|
artikel
|
| 144 |
Thick film temperature-compensating capacitor dielectrics
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|
|
1975
|
14 |
1 |
p. 30-31
2 p.
|
artikel
|
| 145 |
Thin film patterns with sloping edges
|
Philips Research Lab.,
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|
1975
|
14 |
1 |
p. 69-70
2 p.
|
artikel
|
| 146 |
TTL level tester identifies logic levels by audible tone
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1975
|
14 |
1 |
p. 27-
1 p.
|
artikel
|
| 147 |
Unpowered to powered failure rate ratio—a key reliability parameter
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1975
|
14 |
1 |
p. 21-22
2 p.
|
artikel
|
| 148 |
Unreliability of a standby system with repair and imperfect switching
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1975
|
14 |
1 |
p. 22-
1 p.
|
artikel
|
| 149 |
Very low resistance Ni-AuGe-Ni contacts to n-GaAs
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|
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1975
|
14 |
1 |
p. 30-
1 p.
|
artikel
|
| 150 |
VMOS—a new MOS integrated circuit technology
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|
1975
|
14 |
1 |
p. 30-
1 p.
|
artikel
|
| 151 |
X-ray Kβ and L2,3-Emission bands of pure silicon and silicon in Zr-Si compounds
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1975
|
14 |
1 |
p. 30-
1 p.
|
artikel
|
| 152 |
Yield values in thick-film rheology
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|
|
1975
|
14 |
1 |
p. 32-
1 p.
|
artikel
|
| 153 |
Zirconium boride resistors for hybrid integrated circuits
|
Philips Research Lab.,
|
|
1975
|
14 |
1 |
p. 67-
1 p.
|
artikel
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