| no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
| 1 |
A Bayesian estimate of reliability in the Weibull distribution
|
Jayaram, Y.G.
|
|
1974
|
13 |
1 |
p. 29-32
4 p.
|
article
|
| 2 |
A bilevel thin film hybrid circuit containing crossovers, resistors, capacitors, and integrated circuits
|
|
|
1974
|
13 |
1 |
p. 19-
1 p.
|
article
|
| 3 |
A broad-band thin-film lumped-element circulator for 1·7 GHz band
|
|
|
1974
|
13 |
1 |
p. 19-
1 p.
|
article
|
| 4 |
A critical review of human performance reliability predictive methods
|
|
|
1974
|
13 |
1 |
p. 9-
1 p.
|
article
|
| 5 |
A fast method for redundancy allocation
|
|
|
1974
|
13 |
1 |
p. 13-
1 p.
|
article
|
| 6 |
A method of redundancy allocation
|
|
|
1974
|
13 |
1 |
p. 13-
1 p.
|
article
|
| 7 |
Analysis can take the heat off power semiconductors
|
|
|
1974
|
13 |
1 |
p. 15-
1 p.
|
article
|
| 8 |
Analytic study of a stand-by redundant equipment with switching and shelf life failures
|
|
|
1974
|
13 |
1 |
p. 13-
1 p.
|
article
|
| 9 |
A new approach to high temperature crystal growth from the melt
|
|
|
1974
|
13 |
1 |
p. 18-
1 p.
|
article
|
| 10 |
A note on the statistics of reliability assessment
|
Lukis, L.W.F.
|
|
1974
|
13 |
1 |
p. 51-54
4 p.
|
article
|
| 11 |
An SiO2-Ta2O5 thin film capacitor
|
|
|
1974
|
13 |
1 |
p. 20-
1 p.
|
article
|
| 12 |
An ultrasonic bond, monometallic, gold interconnection technique for integrated packages
|
|
|
1974
|
13 |
1 |
p. 15-
1 p.
|
article
|
| 13 |
Application of the optimal control model for the human operator to reliability assessment
|
|
|
1974
|
13 |
1 |
p. 11-
1 p.
|
article
|
| 14 |
A reliability model for stress vs strength problem
|
|
|
1974
|
13 |
1 |
p. 9-
1 p.
|
article
|
| 15 |
A review of new methods and attitudes in reliability engineering
|
|
|
1974
|
13 |
1 |
p. 9-10
2 p.
|
article
|
| 16 |
A simplified approach to hybrid thermal design
|
|
|
1974
|
13 |
1 |
p. 19-
1 p.
|
article
|
| 17 |
A study of metal-insulator transitions
|
|
|
1974
|
13 |
1 |
p. 16-
1 p.
|
article
|
| 18 |
A test for lateral nonuniformities in mos devices using only capacitanse curves
|
|
|
1974
|
13 |
1 |
p. 17-
1 p.
|
article
|
| 19 |
A thin-film high sheet resistivity material
|
|
|
1974
|
13 |
1 |
p. 18-
1 p.
|
article
|
| 20 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
|
|
1974
|
13 |
1 |
p. 1-2
2 p.
|
article
|
| 21 |
Characteristics and origin of emitter-collector shorts, or “Pipes”, in Multi-emitter power transistors
|
|
|
1974
|
13 |
1 |
p. 10-
1 p.
|
article
|
| 22 |
Chopper-stabilized op amp combines MOS and bipolar elements on one chip
|
|
|
1974
|
13 |
1 |
p. 15-
1 p.
|
article
|
| 23 |
C-MOS teams with liquid crystals to make a reliable digital VOM
|
|
|
1974
|
13 |
1 |
p. 15-
1 p.
|
article
|
| 24 |
Cognitive reliability in manned systems
|
|
|
1974
|
13 |
1 |
p. 11-
1 p.
|
article
|
| 25 |
Comparison of models for redistribution of dopants in silicon during thermal oxidation
|
|
|
1974
|
13 |
1 |
p. 16-
1 p.
|
article
|
| 26 |
Complex system reliability with exponential repair time distributions under head-of-line-repair-discipline
|
|
|
1974
|
13 |
1 |
p. 11-
1 p.
|
article
|
| 27 |
Complex system reliability with general repair time distributions under preemptive repeat repair discipline
|
|
|
1974
|
13 |
1 |
p. 11-
1 p.
|
article
|
| 28 |
Complex system reliability with general repair time distributions under preemptive resume repair discipline
|
|
|
1974
|
13 |
1 |
p. 13-
1 p.
|
article
|
| 29 |
Controlling heat transport during crystal pulling
|
|
|
1974
|
13 |
1 |
p. 16-
1 p.
|
article
|
| 30 |
Correction to a paper by Srivastava, Garg and Govil
|
Kapur, P.K.
|
|
1974
|
13 |
1 |
p. 57-58
2 p.
|
article
|
| 31 |
Courses
|
|
|
1974
|
13 |
1 |
p. 5-6
2 p.
|
article
|
| 32 |
Design of precision thin film resistive networks
|
Bredenkamp, G.L.
|
|
1974
|
13 |
1 |
p. 49-50
2 p.
|
article
|
| 33 |
Determination of the capture cross-section of hole-trapping centres in SiO2
|
|
|
1974
|
13 |
1 |
p. 17-18
2 p.
|
article
|
| 34 |
Development of generalized theory of floating-emitter potential based on studies of germanium and silicon transistors
|
|
|
1974
|
13 |
1 |
p. 15-
1 p.
|
article
|
| 35 |
Digital-IC models for computer-aided design—1. TTL NAND gates
|
|
|
1974
|
13 |
1 |
p. 14-
1 p.
|
article
|
| 36 |
Diodes for Hybrid Integrated Circuits
|
|
|
1974
|
13 |
1 |
p. 18-
1 p.
|
article
|
| 37 |
Distribution of time to non-availability of a reliability system
|
|
|
1974
|
13 |
1 |
p. 12-
1 p.
|
article
|
| 38 |
Drift of the breakdown voltage in highly doped planar junctions
|
|
|
1974
|
13 |
1 |
p. 16-
1 p.
|
article
|
| 39 |
Dynamic malfunction limits in high-speed TTL and ECL integrated digital gates
|
|
|
1974
|
13 |
1 |
p. 14-
1 p.
|
article
|
| 40 |
Editorial Board
|
|
|
1974
|
13 |
1 |
p. IFC-
1 p.
|
article
|
| 41 |
Effective recombination levels in N- and P-Type silicon irradiated by 4·5 MeV Electrons
|
|
|
1974
|
13 |
1 |
p. 17-
1 p.
|
article
|
| 42 |
Epoxy device bonding and die handling techniques for hybrid microcircuits
|
|
|
1974
|
13 |
1 |
p. 20-
1 p.
|
article
|
| 43 |
Erratum
|
|
|
1974
|
13 |
1 |
p. 59-
1 p.
|
article
|
| 44 |
Failure diagnosis using quadratic programming
|
|
|
1974
|
13 |
1 |
p. 13-
1 p.
|
article
|
| 45 |
Fault diagnosis using time domain measurements
|
|
|
1974
|
13 |
1 |
p. 12-
1 p.
|
article
|
| 46 |
High capacity liquid phase epitaxy apparatus utilizing thin melts
|
|
|
1974
|
13 |
1 |
p. 17-
1 p.
|
article
|
| 47 |
Human reliability in computer-based business information systems
|
|
|
1974
|
13 |
1 |
p. 12-
1 p.
|
article
|
| 48 |
Industry standardization of silicon substrates
|
|
|
1974
|
13 |
1 |
p. 13-14
2 p.
|
article
|
| 49 |
Integrated MOS distributed RC networks for frequency selective circuits
|
|
|
1974
|
13 |
1 |
p. 19-20
2 p.
|
article
|
| 50 |
Integrated multiplier simplifies wattmeter design
|
|
|
1974
|
13 |
1 |
p. 15-
1 p.
|
article
|
| 51 |
Large IC chip impact analysis and handling protection
|
|
|
1974
|
13 |
1 |
p. 14-15
2 p.
|
article
|
| 52 |
Laser trimming of thick-film resistors
|
|
|
1974
|
13 |
1 |
p. 20-
1 p.
|
article
|
| 53 |
Lead frame bonding
|
|
|
1974
|
13 |
1 |
p. 15-
1 p.
|
article
|
| 54 |
Liquid immersion cooling of small electronic devices
|
|
|
1974
|
13 |
1 |
p. 14-
1 p.
|
article
|
| 55 |
Localized and nonlocalized impurity states in amorphous germanium
|
|
|
1974
|
13 |
1 |
p. 18-
1 p.
|
article
|
| 56 |
Metallurgical behaviour of gold wire thermal compression bonding
|
|
|
1974
|
13 |
1 |
p. 15-
1 p.
|
article
|
| 57 |
Microdefects in dislocaion-free silicon and germanium crystals
|
|
|
1974
|
13 |
1 |
p. 10-11
2 p.
|
article
|
| 58 |
Molecular beam epitaxy
|
|
|
1974
|
13 |
1 |
p. 16-
1 p.
|
article
|
| 59 |
MOS threshold shifting by ion implantation
|
|
|
1974
|
13 |
1 |
p. 20-
1 p.
|
article
|
| 60 |
Nickel-chromium resistor failure modes and their identification
|
|
|
1974
|
13 |
1 |
p. 18-
1 p.
|
article
|
| 61 |
Non-polarized memory-switching characteristics of ZnTe thin films
|
|
|
1974
|
13 |
1 |
p. 19-
1 p.
|
article
|
| 62 |
Note to “Failure modes of integrated circuits and their relationship to reliability”
|
Kemény, A.P.
|
|
1974
|
13 |
1 |
p. 55-
1 p.
|
article
|
| 63 |
Notice
|
|
|
1974
|
13 |
1 |
p. 3-
1 p.
|
article
|
| 64 |
Notices and calls for papers
|
|
|
1974
|
13 |
1 |
p. 7-
1 p.
|
article
|
| 65 |
On sputtered thin-films of chrome, nitrided chrome and nickel-chromium
|
|
|
1974
|
13 |
1 |
p. 19-
1 p.
|
article
|
| 66 |
Operational behaviour of a complex system with two out of M failed components
|
|
|
1974
|
13 |
1 |
p. 12-
1 p.
|
article
|
| 67 |
Operational behaviour of a stand-by redundant system with scheduled maintenance
|
|
|
1974
|
13 |
1 |
p. 12-
1 p.
|
article
|
| 68 |
Papers to be published in future issues
|
|
|
1974
|
13 |
1 |
p. 21-
1 p.
|
article
|
| 69 |
Plastic power ICs need skillful thermal design
|
|
|
1974
|
13 |
1 |
p. 15-
1 p.
|
article
|
| 70 |
Prediction of operator performance for sonar maintenance
|
|
|
1974
|
13 |
1 |
p. 11-
1 p.
|
article
|
| 71 |
Processing and performance of tantalum nitride thin film resistor networks with ±50 ppm/°C TCR
|
|
|
1974
|
13 |
1 |
p. 18-19
2 p.
|
article
|
| 72 |
Pulse burnout of microwave mixer diodes
|
|
|
1974
|
13 |
1 |
p. 10-
1 p.
|
article
|
| 73 |
Quality and the Courts
|
|
|
1974
|
13 |
1 |
p. 9-
1 p.
|
article
|
| 74 |
Quantification of Man-Machine system reliability in process control
|
|
|
1974
|
13 |
1 |
p. 12-
1 p.
|
article
|
| 75 |
Recent advances in negative and positive photoresist technology
|
|
|
1974
|
13 |
1 |
p. 14-
1 p.
|
article
|
| 76 |
Redundancy allocations in a system with many stages
|
|
|
1974
|
13 |
1 |
p. 13-
1 p.
|
article
|
| 77 |
Relating factory test failure results to field reliability, required field maintenance, and to total life cycle costs
|
|
|
1974
|
13 |
1 |
p. 9-
1 p.
|
article
|
| 78 |
Reliability block diagram analysis
|
Staley, J.E.
|
|
1974
|
13 |
1 |
p. 33-47
15 p.
|
article
|
| 79 |
Reliability of a quasi-redundant electronic system with “standby” in the main unit
|
|
|
1974
|
13 |
1 |
p. 12-13
2 p.
|
article
|
| 80 |
Reliability of some redundant systems with repair
|
|
|
1974
|
13 |
1 |
p. 11-
1 p.
|
article
|
| 81 |
Reliability optimization of a system by zero-one programming
|
|
|
1974
|
13 |
1 |
p. 12-
1 p.
|
article
|
| 82 |
Reliability studies on the 2-Level Al/SiO2/Al system
|
|
|
1974
|
13 |
1 |
p. 10-
1 p.
|
article
|
| 83 |
Resin attachment of semiconductor dice on to film circuits
|
|
|
1974
|
13 |
1 |
p. 19-
1 p.
|
article
|
| 84 |
Sawing alumina substrates with a CO2 laser
|
|
|
1974
|
13 |
1 |
p. 20-
1 p.
|
article
|
| 85 |
Scanning electron microscope analysis of surface defects on alumina ceramic substrates
|
|
|
1974
|
13 |
1 |
p. 10-
1 p.
|
article
|
| 86 |
Sense amplifier design is key to 1-transistor cell in 4096-bit RAM
|
|
|
1974
|
13 |
1 |
p. 15-
1 p.
|
article
|
| 87 |
Single-layer packaging slashes ceramin-DIP costs in half
|
|
|
1974
|
13 |
1 |
p. 14-
1 p.
|
article
|
| 88 |
Stand-by redundancy complex system's reliability
|
|
|
1974
|
13 |
1 |
p. 13-
1 p.
|
article
|
| 89 |
Stochastic behaviour of an intermittently working electronic equipment with imperfect switching
|
|
|
1974
|
13 |
1 |
p. 11-
1 p.
|
article
|
| 90 |
The accelerated ageing of plastic encapsulated semiconductor devices in environments containing a high vapour pressure of water
|
Sinnadurai, F.N.
|
|
1974
|
13 |
1 |
p. 23-27
5 p.
|
article
|
| 91 |
The assesment of connector reliability
|
|
|
1974
|
13 |
1 |
p. 10-
1 p.
|
article
|
| 92 |
The current trend in CMOS technology
|
|
|
1974
|
13 |
1 |
p. 14-
1 p.
|
article
|
| 93 |
The growth of GaP single crystals by liquid encapsulated Czochralski pulling
|
|
|
1974
|
13 |
1 |
p. 17-
1 p.
|
article
|
| 94 |
The growth of silver and copper single crystals on silicon and the selective removal of silicon by electrochemical displacement
|
|
|
1974
|
13 |
1 |
p. 17-
1 p.
|
article
|
| 95 |
The influence of structural damage on the electronic properties of amorphous germanium
|
|
|
1974
|
13 |
1 |
p. 18-
1 p.
|
article
|
| 96 |
The load life characteristics of thick-film resistors
|
|
|
1974
|
13 |
1 |
p. 18-
1 p.
|
article
|
| 97 |
The performance of gyrator and leapfrog inductorless filters, using integrated circuits
|
|
|
1974
|
13 |
1 |
p. 16-
1 p.
|
article
|
| 98 |
Thermal capture of electrons and holes at zinc centers in silicon
|
|
|
1974
|
13 |
1 |
p. 16-17
2 p.
|
article
|
| 99 |
The robustness of reliability predictions for series systems of identical components
|
|
|
1974
|
13 |
1 |
p. 11-
1 p.
|
article
|
| 100 |
The thermal demands of electronic design
|
|
|
1974
|
13 |
1 |
p. 14-
1 p.
|
article
|
| 101 |
Three-dimensional impurity profile of an epitaxial layer
|
|
|
1974
|
13 |
1 |
p. 16-
1 p.
|
article
|
| 102 |
Utilization of reliability measurements in bayesian inference: Models and human performance
|
|
|
1974
|
13 |
1 |
p. 11-12
2 p.
|
article
|
| 103 |
Verfahren zur Elimination von Gehauseeinflussen bei Vierpolmessungen an Integrierten Schaltungen
|
|
|
1974
|
13 |
1 |
p. 15-16
2 p.
|
article
|
| 104 |
Yield optimization of integrated circuits
|
|
|
1974
|
13 |
1 |
p. 14-
1 p.
|
article
|
Journal description