| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A bonding-wire failure mode in plastic encaponlated integrated circuits
|
|
|
1973
|
12 |
6 |
p. 494-
1 p.
|
artikel
|
| 2 |
A current pulse screening test for metal step coverage
|
|
|
1973
|
12 |
6 |
p. 499-
1 p.
|
artikel
|
| 3 |
Analysis of electrical overstress failures
|
|
|
1973
|
12 |
6 |
p. 491-
1 p.
|
artikel
|
| 4 |
Analysis of integrated circuit failure modes and failure mechanisms derived from high temperature operating life tests
|
|
|
1973
|
12 |
6 |
p. 495-
1 p.
|
artikel
|
| 5 |
An elusive open-circuit failure mode in thin-film chip resistors
|
|
|
1973
|
12 |
6 |
p. 494-
1 p.
|
artikel
|
| 6 |
A new complementary bipolar transistor structure
|
|
|
1973
|
12 |
6 |
p. 500-
1 p.
|
artikel
|
| 7 |
A new static shift register with dynamic transfer
|
|
|
1973
|
12 |
6 |
p. 499-
1 p.
|
artikel
|
| 8 |
A see-saw IC logic astable oscillator
|
|
|
1973
|
12 |
6 |
p. 499-
1 p.
|
artikel
|
| 9 |
Auto-Auto Relay Set controlled by LSI Programmable Logic
|
|
|
1973
|
12 |
6 |
p. 499-
1 p.
|
artikel
|
| 10 |
Avalanche breakdown characteristics of alloyed silicon p-n junctions
|
|
|
1973
|
12 |
6 |
p. 492-
1 p.
|
artikel
|
| 11 |
Avalanche breakdown in polycrystalline silicon films
|
|
|
1973
|
12 |
6 |
p. 501-
1 p.
|
artikel
|
| 12 |
Avalanche breakdown voltage of diffused junctions in silicon
|
|
|
1973
|
12 |
6 |
p. 500-
1 p.
|
artikel
|
| 13 |
Bell Labs' new thin-film hybrid may be most complex ever built
|
|
|
1973
|
12 |
6 |
p. 502-
1 p.
|
artikel
|
| 14 |
Bonding degradation in the tantalum nitride-chromium-gold metallization system
|
|
|
1973
|
12 |
6 |
p. 493-
1 p.
|
artikel
|
| 15 |
Building reliability into reed switches
|
|
|
1973
|
12 |
6 |
p. 493-
1 p.
|
artikel
|
| 16 |
Calendar of International Conferences, Symposia, Lectures and Meetings of Interest
|
|
|
1973
|
12 |
6 |
p. 485-486
2 p.
|
artikel
|
| 17 |
Carrier heating effects in junctions at very low currents
|
|
|
1973
|
12 |
6 |
p. 500-
1 p.
|
artikel
|
| 18 |
Chopper circuit put on op-amp chip
|
|
|
1973
|
12 |
6 |
p. 499-
1 p.
|
artikel
|
| 19 |
Chopper-stabilized IC op amps achieve precision, speed, economy
|
|
|
1973
|
12 |
6 |
p. 499-
1 p.
|
artikel
|
| 20 |
C-MOS may help majority logic win designers' vote
|
|
|
1973
|
12 |
6 |
p. 498-
1 p.
|
artikel
|
| 21 |
Component linearity test improves reliability screening through measurement of third harmonic index
|
|
|
1973
|
12 |
6 |
p. 491-
1 p.
|
artikel
|
| 22 |
Computers help design reliable telephone systems
|
Gambrill, L.M.
|
|
1973
|
12 |
6 |
p. 505-511
7 p.
|
artikel
|
| 23 |
Contact failures of crossbar switching system
|
|
|
1973
|
12 |
6 |
p. 496-497
2 p.
|
artikel
|
| 24 |
Determination of neutral region carrier concentrations in P-N junctions using quasi fermi levels
|
|
|
1973
|
12 |
6 |
p. 500-
1 p.
|
artikel
|
| 25 |
Discussion about the number of wiring layers for logic LSL
|
|
|
1973
|
12 |
6 |
p. 498-
1 p.
|
artikel
|
| 26 |
Dissolution rates and reliability effects of Au, Ag, Ni and Cu in lead base solders
|
|
|
1973
|
12 |
6 |
p. 493-
1 p.
|
artikel
|
| 27 |
Distributed mosfet amplifier using Microstrip
|
|
|
1973
|
12 |
6 |
p. 499-
1 p.
|
artikel
|
| 28 |
Effect of ionizing radiation on second breakdown
|
|
|
1973
|
12 |
6 |
p. 492-
1 p.
|
artikel
|
| 29 |
Electromigration studies on aluminium-copper stripes
|
|
|
1973
|
12 |
6 |
p. 492-
1 p.
|
artikel
|
| 30 |
Electron beam fabrication
|
|
|
1973
|
12 |
6 |
p. 502-
1 p.
|
artikel
|
| 31 |
Expected value and variance of failure time in redundant systems
|
|
|
1973
|
12 |
6 |
p. 496-
1 p.
|
artikel
|
| 32 |
Fabrication techniques and screening procedures for high reliability transferred electron diodes
|
|
|
1973
|
12 |
6 |
p. 496-
1 p.
|
artikel
|
| 33 |
Failure analysis applications of anger electron spectroscopy
|
|
|
1973
|
12 |
6 |
p. 491-492
2 p.
|
artikel
|
| 34 |
Failure analysis applications of the scanning electron microscope
|
|
|
1973
|
12 |
6 |
p. 492-
1 p.
|
artikel
|
| 35 |
Failure analysis of oxide defects
|
|
|
1973
|
12 |
6 |
p. 501-
1 p.
|
artikel
|
| 36 |
Failure analysis of surface inversion
|
|
|
1973
|
12 |
6 |
p. 501-
1 p.
|
artikel
|
| 37 |
Failure analysis of wire bonds
|
|
|
1973
|
12 |
6 |
p. 494-
1 p.
|
artikel
|
| 38 |
Failure analysis using the electron microprobe
|
|
|
1973
|
12 |
6 |
p. 492-
1 p.
|
artikel
|
| 39 |
Failure analysis using the ion microprobe
|
|
|
1973
|
12 |
6 |
p. 492-
1 p.
|
artikel
|
| 40 |
For the real cost of a design, factor in reliability
|
|
|
1973
|
12 |
6 |
p. 497-
1 p.
|
artikel
|
| 41 |
Further studies on the reliability of thin-film nickel-chromium resistors
|
|
|
1973
|
12 |
6 |
p. 494-
1 p.
|
artikel
|
| 42 |
Highly reliable mesh emitter transistor
|
|
|
1973
|
12 |
6 |
p. 493-
1 p.
|
artikel
|
| 43 |
High-reliability plastic package for integrated circuits
|
|
|
1973
|
12 |
6 |
p. 496-
1 p.
|
artikel
|
| 44 |
High speed positioning
|
|
|
1973
|
12 |
6 |
p. 498-
1 p.
|
artikel
|
| 45 |
Hybrids for microwave gear get boost from thick-film technology
|
|
|
1973
|
12 |
6 |
p. 502-
1 p.
|
artikel
|
| 46 |
Hybrid technology solves tough design problems
|
|
|
1973
|
12 |
6 |
p. 501-
1 p.
|
artikel
|
| 47 |
IBM reliability experience with hybrid microcircuits
|
|
|
1973
|
12 |
6 |
p. 496-
1 p.
|
artikel
|
| 48 |
ICs blow the whistle on faults
|
|
|
1973
|
12 |
6 |
p. 492-
1 p.
|
artikel
|
| 49 |
Improved reliability of electron devices through optimized of coverage of surface topography
|
|
|
1973
|
12 |
6 |
p. 502-
1 p.
|
artikel
|
| 50 |
Influence of surface treatment of silicon on the effective impurity charge density in surface states of MOS structures
|
|
|
1973
|
12 |
6 |
p. 500-
1 p.
|
artikel
|
| 51 |
Intermetallic characterization
|
|
|
1973
|
12 |
6 |
p. 498-499
2 p.
|
artikel
|
| 52 |
Investigation of radiation-induced defects in silicon p-n junctions
|
|
|
1973
|
12 |
6 |
p. 493-
1 p.
|
artikel
|
| 53 |
Japanese IC metallization method halled as reliability ‘breakthrough’
|
|
|
1973
|
12 |
6 |
p. 497-498
2 p.
|
artikel
|
| 54 |
Laplace transforms for the two-unit cold-standby redundant system
|
|
|
1973
|
12 |
6 |
p. 497-
1 p.
|
artikel
|
| 55 |
Maintenance, replacement and reliability
|
G.W.A.D.,
|
|
1973
|
12 |
6 |
p. 503-
1 p.
|
artikel
|
| 56 |
Median-time-to-failure (MTF) of microwave power transistors under RF conditions
|
|
|
1973
|
12 |
6 |
p. 496-
1 p.
|
artikel
|
| 57 |
Microwave integrated circuits using thick- and thin-film technologies
|
|
|
1973
|
12 |
6 |
p. 501-502
2 p.
|
artikel
|
| 58 |
Minicomputer controls evaluation of epitaxial deposition for ICs
|
|
|
1973
|
12 |
6 |
p. 498-
1 p.
|
artikel
|
| 59 |
MOS/LSI failure analysis techniques
|
|
|
1973
|
12 |
6 |
p. 494-
1 p.
|
artikel
|
| 60 |
Multivariate analysis techniques applied to equipment testing
|
Wilburn Jr., J.B.
|
|
1973
|
12 |
6 |
p. 535-538
4 p.
|
artikel
|
| 61 |
Noncontact testing of interconnections in film integrated circuits using an electron beam
|
|
|
1973
|
12 |
6 |
p. 502-
1 p.
|
artikel
|
| 62 |
Notice
|
|
|
1973
|
12 |
6 |
p. 487-
1 p.
|
artikel
|
| 63 |
Notices and calls for papers
|
|
|
1973
|
12 |
6 |
p. 489-
1 p.
|
artikel
|
| 64 |
On measuring the mechanical properties of aluminum metallization and their relationship to reliability problems
|
|
|
1973
|
12 |
6 |
p. 493-494
2 p.
|
artikel
|
| 65 |
Operational performance of computing systems
|
|
|
1973
|
12 |
6 |
p. 496-
1 p.
|
artikel
|
| 66 |
Optimixing serpentime resistor geometry
|
|
|
1973
|
12 |
6 |
p. 497-
1 p.
|
artikel
|
| 67 |
Papers to be published in future issues
|
|
|
1973
|
12 |
6 |
p. 504-
1 p.
|
artikel
|
| 68 |
Photo-composition and LSI
|
|
|
1973
|
12 |
6 |
p. 498-
1 p.
|
artikel
|
| 69 |
Photomask array placement on slices in LSI processing
|
Tasch Jr., A.F.
|
|
1973
|
12 |
6 |
p. 539-545
7 p.
|
artikel
|
| 70 |
Photoresists part 2—Negative resist systems
|
|
|
1973
|
12 |
6 |
p. 498-
1 p.
|
artikel
|
| 71 |
Photoresists part 3—Positive resist systems
|
|
|
1973
|
12 |
6 |
p. 498-
1 p.
|
artikel
|
| 72 |
Power-system reliability calculations
|
G.W.A.D.,
|
|
1973
|
12 |
6 |
p. 503-
1 p.
|
artikel
|
| 73 |
Projection mask alignment—A production technique
|
|
|
1973
|
12 |
6 |
p. 498-
1 p.
|
artikel
|
| 74 |
Properties of iron oxide films for photomask applications
|
|
|
1973
|
12 |
6 |
p. 498-
1 p.
|
artikel
|
| 75 |
Qualitatsprufung und Fehleranalysen an Banelementen
|
|
|
1973
|
12 |
6 |
p. 492-493
2 p.
|
artikel
|
| 76 |
Reliability analysis of a nuclear reactor fuel charging system
|
|
|
1973
|
12 |
6 |
p. 496-
1 p.
|
artikel
|
| 77 |
Reliability analysis of a system with dependent units
|
Gopalan, M.N.
|
|
1973
|
12 |
6 |
p. 547-
1 p.
|
artikel
|
| 78 |
Reliability improvement by redundancy in electronics systems 3A quantitative comparisen of redundancy schemes
|
|
|
1973
|
12 |
6 |
p. 497-
1 p.
|
artikel
|
| 79 |
Reliability improvements in electron bombarded semiconductor power devices
|
|
|
1973
|
12 |
6 |
p. 495-
1 p.
|
artikel
|
| 80 |
Reliability improvements of plastic semiconductors using gold metallization
|
|
|
1973
|
12 |
6 |
p. 495-
1 p.
|
artikel
|
| 81 |
Reliability of conductors and crossovers for film integrated circuits
|
|
|
1973
|
12 |
6 |
p. 495-
1 p.
|
artikel
|
| 82 |
Series equivalent circuit representation of SiO2-Si interface and oxide trap states
|
|
|
1973
|
12 |
6 |
p. 500-
1 p.
|
artikel
|
| 83 |
Simulation of a complex microelectronic module containing analogue and digital elements
|
|
|
1973
|
12 |
6 |
p. 497-
1 p.
|
artikel
|
| 84 |
Small-signal characteristics of semiconductor punch-through injection and transit-time diedes
|
|
|
1973
|
12 |
6 |
p. 500-
1 p.
|
artikel
|
| 85 |
Some preliminary studies of the structure of ion bornbarded thin films
|
|
|
1973
|
12 |
6 |
p. 502-
1 p.
|
artikel
|
| 86 |
Special Report—Semiconductor memories are taking over data-storage applications
|
|
|
1973
|
12 |
6 |
p. 499-
1 p.
|
artikel
|
| 87 |
Stability of thick-film resistors under high electromagnetic stress
|
|
|
1973
|
12 |
6 |
p. 502-
1 p.
|
artikel
|
| 88 |
Temperature-humidity acceleration of metal-electrolysis failure in semiconductor devices
|
|
|
1973
|
12 |
6 |
p. 495-
1 p.
|
artikel
|
| 89 |
The effect of retarding field on the base transport characteristics of planar transistors
|
|
|
1973
|
12 |
6 |
p. 501-
1 p.
|
artikel
|
| 90 |
The problems of reliability growth and demonstration with military electronics
|
Green, J.E.
|
|
1973
|
12 |
6 |
p. 513-520
8 p.
|
artikel
|
| 91 |
The reliability of failure rates
|
Van Diest, H.G.
|
|
1973
|
12 |
6 |
p. 521-524
4 p.
|
artikel
|
| 92 |
The reliability of independent exponential series systems—A bayesian approach. Technical report
|
|
|
1973
|
12 |
6 |
p. 496-
1 p.
|
artikel
|
| 93 |
Thermal behavior of thick-film
|
|
|
1973
|
12 |
6 |
p. 501-
1 p.
|
artikel
|
| 94 |
Thermal study of circuit card assembly
|
Watson, D.
|
|
1973
|
12 |
6 |
p. 531-534
4 p.
|
artikel
|
| 95 |
The solid tantalum capacitor—A “solid” contributor to reliability
|
|
|
1973
|
12 |
6 |
p. 494-
1 p.
|
artikel
|
| 96 |
Thick film pastes for multilayer use
|
|
|
1973
|
12 |
6 |
p. 501-
1 p.
|
artikel
|
| 97 |
To-5 discoloration and bondability
|
|
|
1973
|
12 |
6 |
p. 493-
1 p.
|
artikel
|
| 98 |
Torque and thermal cycling as methods of testing reliability of reflow-soldered chip-to-substrate joints
|
|
|
1973
|
12 |
6 |
p. 494-495
2 p.
|
artikel
|
| 99 |
Transistor base-emitter junction protection improves reliability
|
|
|
1973
|
12 |
6 |
p. 492-
1 p.
|
artikel
|
| 100 |
Unconventional uses for IC timers can be found everywhere. Build anything from car tachometers to program controllers with these simple devices
|
|
|
1973
|
12 |
6 |
p. 499-
1 p.
|
artikel
|
| 101 |
Unusual filter concept promises high-Q, low-frequency IC device
|
|
|
1973
|
12 |
6 |
p. 497-
1 p.
|
artikel
|
| 102 |
Use of a pulse laser technique in failure analysis
|
|
|
1973
|
12 |
6 |
p. 492-
1 p.
|
artikel
|
| 103 |
Who wants reliable plastic semiconductors
|
|
|
1973
|
12 |
6 |
p. 495-496
2 p.
|
artikel
|
| 104 |
Why specifications—What do they assure
|
|
|
1973
|
12 |
6 |
p. 491-
1 p.
|
artikel
|
| 105 |
Wire-bond reliability in hybrid microcircuits
|
|
|
1973
|
12 |
6 |
p. 495-
1 p.
|
artikel
|
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