| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A centralized temperature control system for diffusion furnaces
|
|
|
1973
|
12 |
3 |
p. 208-
1 p.
|
artikel
|
| 2 |
A comparison of the thermal and electrical characteristics of a beam lead chip
|
|
|
1973
|
12 |
3 |
p. 209-
1 p.
|
artikel
|
| 3 |
A design approach for LSI using chip selection and circuits modification techniques
|
|
|
1973
|
12 |
3 |
p. 207-
1 p.
|
artikel
|
| 4 |
Adhesives for microelectronics
|
|
|
1973
|
12 |
3 |
p. 206-
1 p.
|
artikel
|
| 5 |
A fluxless and oxygen-free soldering technique for thick-film circuits
|
|
|
1973
|
12 |
3 |
p. 211-
1 p.
|
artikel
|
| 6 |
A look at reliability: tubes and solid state
|
|
|
1973
|
12 |
3 |
p. 203-
1 p.
|
artikel
|
| 7 |
A 70 MHz static shift register with high integration density
|
|
|
1973
|
12 |
3 |
p. 209-
1 p.
|
artikel
|
| 8 |
Analysis and development of a thermocompression bond schedule for beam lead devices
|
|
|
1973
|
12 |
3 |
p. 208-
1 p.
|
artikel
|
| 9 |
Analysis of computer system reliability and maintainability
|
|
|
1973
|
12 |
3 |
p. 205-
1 p.
|
artikel
|
| 10 |
A new reliability prediction method for hybrid circuits
|
|
|
1973
|
12 |
3 |
p. 205-
1 p.
|
artikel
|
| 11 |
A new thick-film ruthenium-niobium resistor system
|
|
|
1973
|
12 |
3 |
p. 211-212
2 p.
|
artikel
|
| 12 |
An exact analysis of the Method-One maintainability demonstration plan in MIL-STD-471
|
|
|
1973
|
12 |
3 |
p. 204-
1 p.
|
artikel
|
| 13 |
An innovation in gold paste
|
|
|
1973
|
12 |
3 |
p. 214-
1 p.
|
artikel
|
| 14 |
Announcement
|
|
|
1973
|
12 |
3 |
p. i-
1 p.
|
artikel
|
| 15 |
Anomalous behaviour of MIPS thin-film transducers
|
|
|
1973
|
12 |
3 |
p. 211-
1 p.
|
artikel
|
| 16 |
A personal view of the Bayesian controversy in reliability and statistics
|
|
|
1973
|
12 |
3 |
p. 199-
1 p.
|
artikel
|
| 17 |
Applied maintainability engineering
|
Reiche, Hans
|
|
1973
|
12 |
3 |
p. 219-
1 p.
|
artikel
|
| 18 |
A reliability algebra of four-state safety devices
|
|
|
1973
|
12 |
3 |
p. 204-205
2 p.
|
artikel
|
| 19 |
A reliability study of insulated gate field effect transistors with an Al2O3-SiO2 gate structure
|
|
|
1973
|
12 |
3 |
p. 202-
1 p.
|
artikel
|
| 20 |
A systems approach to semiconductor slicing to improve wafer quality and productivity
|
|
|
1973
|
12 |
3 |
p. 208-
1 p.
|
artikel
|
| 21 |
Automatic laser resistor trimming
|
|
|
1973
|
12 |
3 |
p. 216-
1 p.
|
artikel
|
| 22 |
A versatile design giving both N-type and S-type of negative-resistances
|
|
|
1973
|
12 |
3 |
p. 207-
1 p.
|
artikel
|
| 23 |
A yield analysis model for hybrid microelectronic circuits
|
|
|
1973
|
12 |
3 |
p. 214-
1 p.
|
artikel
|
| 24 |
Bayesian acceptance sampling
|
|
|
1973
|
12 |
3 |
p. 199-
1 p.
|
artikel
|
| 25 |
Be effective—Not down
|
Reiche, Hans
|
|
1973
|
12 |
3 |
p. 181-182
2 p.
|
artikel
|
| 26 |
Better understanding of FET operation yields viable monolithic J-FET op. amp.
|
|
|
1973
|
12 |
3 |
p. 208-
1 p.
|
artikel
|
| 27 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
|
|
1973
|
12 |
3 |
p. 183-184
2 p.
|
artikel
|
| 28 |
Carrier transport and storage effects in Au ion implanted SiO2 structures
|
|
|
1973
|
12 |
3 |
p. 216-
1 p.
|
artikel
|
| 29 |
Characterization of a thick-film resistor conduction mechanism
|
|
|
1973
|
12 |
3 |
p. 214-
1 p.
|
artikel
|
| 30 |
Circuit cost reduction
|
|
|
1973
|
12 |
3 |
p. 206-
1 p.
|
artikel
|
| 31 |
Complementary MOS offers many advantages to the digital-systems designer
|
|
|
1973
|
12 |
3 |
p. 208-209
2 p.
|
artikel
|
| 32 |
Computer applications to the hybrid microelectronic circuit design
|
|
|
1973
|
12 |
3 |
p. 214-
1 p.
|
artikel
|
| 33 |
Computer controlled test systems—can hybrid circuit manufacturers employ them successfully?
|
|
|
1973
|
12 |
3 |
p. 213-214
2 p.
|
artikel
|
| 34 |
Conference report 19th Annual Reliability and Maintainability Symposium, U.S.A.
|
Jacobs, Richard M.
|
|
1973
|
12 |
3 |
p. 191-197
7 p.
|
artikel
|
| 35 |
Controlled diffraction as the basis of an out-of-contact masking system
|
|
|
1973
|
12 |
3 |
p. 208-
1 p.
|
artikel
|
| 36 |
Courses
|
|
|
1973
|
12 |
3 |
p. 185-
1 p.
|
artikel
|
| 37 |
Cut the testing time of digital circuits
|
|
|
1973
|
12 |
3 |
p. 209-
1 p.
|
artikel
|
| 38 |
Designing out connector unreliability
|
|
|
1973
|
12 |
3 |
p. 204-
1 p.
|
artikel
|
| 39 |
Design techniques for synthesis of fault-tolerant asynchronous networks
|
|
|
1973
|
12 |
3 |
p. 206-
1 p.
|
artikel
|
| 40 |
Dominant trends affecting the future structure of the semiconductor industry
|
|
|
1973
|
12 |
3 |
p. 206-
1 p.
|
artikel
|
| 41 |
Edge-connector failure mechanisms
|
|
|
1973
|
12 |
3 |
p. 202-
1 p.
|
artikel
|
| 42 |
Effects of test capability on system reliability and availability
|
|
|
1973
|
12 |
3 |
p. 205-206
2 p.
|
artikel
|
| 43 |
Electrical contacts to ion cleaned n-type gallium arsenide
|
|
|
1973
|
12 |
3 |
p. 217-
1 p.
|
artikel
|
| 44 |
Electrical properties of MOS capacitors with oxide grown in the presence of HCL
|
|
|
1973
|
12 |
3 |
p. 209-210
2 p.
|
artikel
|
| 45 |
Emission of vapours from plastic materials
|
|
|
1973
|
12 |
3 |
p. 200-
1 p.
|
artikel
|
| 46 |
Epoxy die mounting and microelectronics—a new technology
|
|
|
1973
|
12 |
3 |
p. 207-
1 p.
|
artikel
|
| 47 |
Estimating Weibull parameters for a general class of devices from limited failure data
|
|
|
1973
|
12 |
3 |
p. 201-
1 p.
|
artikel
|
| 48 |
Exact frequency dependent complex admittance of the MOS diode including surface states, Shockley-Read-Hall (SRH) impurity effects and low temperature dopant impurity response
|
|
|
1973
|
12 |
3 |
p. 210-
1 p.
|
artikel
|
| 49 |
EXACT—the international system for exchange of information on electronic components
|
|
|
1973
|
12 |
3 |
p. 200-
1 p.
|
artikel
|
| 50 |
Experimental studies and applications of vanadium oxides
|
|
|
1973
|
12 |
3 |
p. 213-
1 p.
|
artikel
|
| 51 |
Explosive bonding of electrical interconnections
|
|
|
1973
|
12 |
3 |
p. 207-
1 p.
|
artikel
|
| 52 |
Faster cheaper quality assessment
|
|
|
1973
|
12 |
3 |
p. 201-
1 p.
|
artikel
|
| 53 |
Fine-line printing revisited: a look at new dimensions in screens and masks
|
|
|
1973
|
12 |
3 |
p. 207-
1 p.
|
artikel
|
| 54 |
Graphical and other methods of microcircuit thermal analysis at the desk
|
|
|
1973
|
12 |
3 |
p. 209-
1 p.
|
artikel
|
| 55 |
How to purchase thick-film equipment and materials
|
|
|
1973
|
12 |
3 |
p. 211-
1 p.
|
artikel
|
| 56 |
Hybrid microcircuits—their application in U.K. domestic colour television receivers
|
|
|
1973
|
12 |
3 |
p. 212-213
2 p.
|
artikel
|
| 57 |
Hybrid scan matrix for processor interface
|
|
|
1973
|
12 |
3 |
p. 215-
1 p.
|
artikel
|
| 58 |
Hybrid tantalum chip capacitors. A new encapsulated tantalum chip capacitor designed especially for direct microcircuit substrate mounting
|
|
|
1973
|
12 |
3 |
p. 213-
1 p.
|
artikel
|
| 59 |
IC automatic shutter system for EE cameras
|
|
|
1973
|
12 |
3 |
p. 209-
1 p.
|
artikel
|
| 60 |
Influence of the protective gas pressure on showering in dry reed contacts
|
|
|
1973
|
12 |
3 |
p. 203-
1 p.
|
artikel
|
| 61 |
Intermediate compounds in the thin-films of Mn-Bi system
|
|
|
1973
|
12 |
3 |
p. 211-
1 p.
|
artikel
|
| 62 |
Investigation of mounting discrete chip components for hybrid microelectronic applications
|
|
|
1973
|
12 |
3 |
p. 213-
1 p.
|
artikel
|
| 63 |
Ionen-Mikrosonden-Analysatoren
|
|
|
1973
|
12 |
3 |
p. 217-
1 p.
|
artikel
|
| 64 |
Ion implantation for silicon device fabrication
|
|
|
1973
|
12 |
3 |
p. 217-
1 p.
|
artikel
|
| 65 |
Ion implantation in semiconductors—Part II: damage production and annealing
|
|
|
1973
|
12 |
3 |
p. 216-
1 p.
|
artikel
|
| 66 |
Laser resistor trimming analysis using a resistive sheet analogy
|
|
|
1973
|
12 |
3 |
p. 215-
1 p.
|
artikel
|
| 67 |
Materials and processes for electron devices
|
|
|
1973
|
12 |
3 |
p. 200-
1 p.
|
artikel
|
| 68 |
Mechanical design of microwave integrated circuit enclosures
|
|
|
1973
|
12 |
3 |
p. 209-
1 p.
|
artikel
|
| 69 |
Metallization failures caused by organic adhesives used in hybrid microelectronic devices
|
|
|
1973
|
12 |
3 |
p. 202-
1 p.
|
artikel
|
| 70 |
Microstructure and reliability of ceramic chip capacitors
|
|
|
1973
|
12 |
3 |
p. 203-
1 p.
|
artikel
|
| 71 |
Mos integrated circuit design
|
G.W.A.D.,
|
|
1973
|
12 |
3 |
p. 219-
1 p.
|
artikel
|
| 72 |
Multilayer board plated-thru-hole failure mechanisms
|
|
|
1973
|
12 |
3 |
p. 202-203
2 p.
|
artikel
|
| 73 |
Multilayer debugging process (a new method of screening)
|
|
|
1973
|
12 |
3 |
p. 203-
1 p.
|
artikel
|
| 74 |
Multiprocessor systems for reliability—a comparative study
|
|
|
1973
|
12 |
3 |
p. 205-
1 p.
|
artikel
|
| 75 |
Need to keep digital data secure
|
|
|
1973
|
12 |
3 |
p. 209-
1 p.
|
artikel
|
| 76 |
New 4096-bit MOS chip is heart of fast, compact computer memory
|
|
|
1973
|
12 |
3 |
p. 209-
1 p.
|
artikel
|
| 77 |
New epoxy package increases IC reliability
|
|
|
1973
|
12 |
3 |
p. 201-
1 p.
|
artikel
|
| 78 |
Notices and calls for papers
|
|
|
1973
|
12 |
3 |
p. 187-190
4 p.
|
artikel
|
| 79 |
Operational behaviour of a stand-by redundant system with scheduled maintenance
|
Govil, A.K.
|
|
1973
|
12 |
3 |
p. 243-247
5 p.
|
artikel
|
| 80 |
Optimum reliability route in communication networks
|
|
|
1973
|
12 |
3 |
p. 204-
1 p.
|
artikel
|
| 81 |
Papers to be published in future issues
|
|
|
1973
|
12 |
3 |
p. 221-
1 p.
|
artikel
|
| 82 |
Potential measurement and stabilization of an isolated target using electron beams
|
|
|
1973
|
12 |
3 |
p. 216-
1 p.
|
artikel
|
| 83 |
Practical approach simplifies IC oscillator design
|
|
|
1973
|
12 |
3 |
p. 208-
1 p.
|
artikel
|
| 84 |
Preliminary calculation of the probability of survival of systems
|
|
|
1973
|
12 |
3 |
p. 249-252
4 p.
|
artikel
|
| 85 |
Printable switches for thick-film microelectronics
|
|
|
1973
|
12 |
3 |
p. 212-
1 p.
|
artikel
|
| 86 |
Procedures for selection of semiconductor diodes for use in undersea cable systems
|
|
|
1973
|
12 |
3 |
p. 203-
1 p.
|
artikel
|
| 87 |
Quantization effects in semiconductor inversion and accumulation layers
|
|
|
1973
|
12 |
3 |
p. 210-
1 p.
|
artikel
|
| 88 |
Redundancy allocations in a system with many stages
|
Misra, K.B.
|
|
1973
|
12 |
3 |
p. 223-228
6 p.
|
artikel
|
| 89 |
Reliability definitions
|
|
|
1973
|
12 |
3 |
p. 200-
1 p.
|
artikel
|
| 90 |
Reliability jargon means nothing
|
|
|
1973
|
12 |
3 |
p. 201-
1 p.
|
artikel
|
| 91 |
Reliability of a self-repairing system with scheduled maintenance
|
|
|
1973
|
12 |
3 |
p. 204-
1 p.
|
artikel
|
| 92 |
Reliability optimization of a system by zero-one programming
|
Misra, K.B.
|
|
1973
|
12 |
3 |
p. 229-233
5 p.
|
artikel
|
| 93 |
Reliability prediction of a two-unit standby redundant system with standby failure
|
|
|
1973
|
12 |
3 |
p. 205-
1 p.
|
artikel
|
| 94 |
Reliability terms and definitions based on the conceptual relationship between reliability and quality
|
|
|
1973
|
12 |
3 |
p. 201-
1 p.
|
artikel
|
| 95 |
Reliable optoelectronic circuit design
|
|
|
1973
|
12 |
3 |
p. 205-
1 p.
|
artikel
|
| 96 |
Resin attachment of semiconductor dice on to film circuits
|
Nolan, P.C.G.
|
|
1973
|
12 |
3 |
p. 235-241
7 p.
|
artikel
|
| 97 |
Semiconductor device developments in the 1960s
|
|
|
1973
|
12 |
3 |
p. 206-
1 p.
|
artikel
|
| 98 |
Silicon integrated circuits with 10′pF/mil2-thin-film capacitors
|
|
|
1973
|
12 |
3 |
p. 210-
1 p.
|
artikel
|
| 99 |
Simple mathematical model of shift of threshold voltage induced in an MOS transistor by testing at elevated temperatures
|
|
|
1973
|
12 |
3 |
p. 208-
1 p.
|
artikel
|
| 100 |
Some effects of temperature on material properties and device reliability
|
|
|
1973
|
12 |
3 |
p. 204-
1 p.
|
artikel
|
| 101 |
Some experiences in developing methods and machines for a semiconductor mounting operation in a thick-film hybrid facility
|
|
|
1973
|
12 |
3 |
p. 212-
1 p.
|
artikel
|
| 102 |
Stochastic behaviour of a complex system with standby redundancy
|
|
|
1973
|
12 |
3 |
p. 204-
1 p.
|
artikel
|
| 103 |
Study of fault-tolerant computing (first semiannual technical progress report)
|
|
|
1973
|
12 |
3 |
p. 206-
1 p.
|
artikel
|
| 104 |
Techniques for the design of two-level faulttolerant logic networks
|
|
|
1973
|
12 |
3 |
p. 206-
1 p.
|
artikel
|
| 105 |
Temperature distributions in hybrid circuit substrates
|
|
|
1973
|
12 |
3 |
p. 213-
1 p.
|
artikel
|
| 106 |
The degradation of MOS transistors resulting from junction avalanche breakdown
|
|
|
1973
|
12 |
3 |
p. 202-
1 p.
|
artikel
|
| 107 |
The economics of automatic testing
|
|
|
1973
|
12 |
3 |
p. 200-
1 p.
|
artikel
|
| 108 |
The effect of equipment reliability upon plant system performance
|
|
|
1973
|
12 |
3 |
p. 205-
1 p.
|
artikel
|
| 109 |
The effect of prolonged elevated temperature exposure on thick-film resistors
|
|
|
1973
|
12 |
3 |
p. 214-
1 p.
|
artikel
|
| 110 |
The effects of device configuration in the degradation of GaP red light-emitting diodes
|
|
|
1973
|
12 |
3 |
p. 202-
1 p.
|
artikel
|
| 111 |
The impact of ion implantation on silicon device and circuit technology
|
|
|
1973
|
12 |
3 |
p. 215-216
2 p.
|
artikel
|
| 112 |
Theory of impurity states in semiconductors
|
|
|
1973
|
12 |
3 |
p. 210-
1 p.
|
artikel
|
| 113 |
The philosophy and mathematics of Bayes' equation
|
|
|
1973
|
12 |
3 |
p. 199-
1 p.
|
artikel
|
| 114 |
Thermal expansion compatibility of ceramic chip capacitors mounted on alumina substrates
|
|
|
1973
|
12 |
3 |
p. 213-
1 p.
|
artikel
|
| 115 |
The sintering mechanism in a silver-palladium film
|
|
|
1973
|
12 |
3 |
p. 215-
1 p.
|
artikel
|
| 116 |
Thick-film capacitor with a rutilium dielectric
|
|
|
1973
|
12 |
3 |
p. 211-
1 p.
|
artikel
|
| 117 |
Thick-film equipment—a customer's experience
|
|
|
1973
|
12 |
3 |
p. 211-
1 p.
|
artikel
|
| 118 |
Thick-film materials for electro-optical applications
|
|
|
1973
|
12 |
3 |
p. 212-
1 p.
|
artikel
|
| 119 |
Thick-film registration made easy
|
|
|
1973
|
12 |
3 |
p. 215-
1 p.
|
artikel
|
| 120 |
Thick-film resistor adjustment in high voltage discharge
|
|
|
1973
|
12 |
3 |
p. 215-
1 p.
|
artikel
|
| 121 |
Thick-film resistor production monitoring by means of a graphical computer printout
|
|
|
1973
|
12 |
3 |
p. 214-215
2 p.
|
artikel
|
| 122 |
Thin-film nickel-chromium resistor failures in integrated circuits
|
|
|
1973
|
12 |
3 |
p. 202-
1 p.
|
artikel
|
| 123 |
Threshold shift calculations for ion implanted MOS devices
|
|
|
1973
|
12 |
3 |
p. 216-217
2 p.
|
artikel
|
| 124 |
To test or not to test—what is it worth?
|
|
|
1973
|
12 |
3 |
p. 199-200
2 p.
|
artikel
|
| 125 |
Transient-testing vital to airborne systems reliability
|
|
|
1973
|
12 |
3 |
p. 205-
1 p.
|
artikel
|
| 126 |
Trends in semiconductor digital circuits
|
|
|
1973
|
12 |
3 |
p. 208-
1 p.
|
artikel
|
| 127 |
Watch out for traps in hybrid IC tests
|
|
|
1973
|
12 |
3 |
p. 208-
1 p.
|
artikel
|
| 128 |
Wire bonds: determining a meaningful value for strength
|
|
|
1973
|
12 |
3 |
p. 201-202
2 p.
|
artikel
|
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