nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
A buried N + SIC integrated Hall element
|
|
|
1973 |
12 |
1 |
p. 26- 1 p. |
artikel |
2 |
Admittance of p-n junctions containing traps
|
|
|
1973 |
12 |
1 |
p. 24-25 2 p. |
artikel |
3 |
Aerospace computer technology catches up with ground gear
|
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|
1973 |
12 |
1 |
p. 24- 1 p. |
artikel |
4 |
Albedo horizon sensor using hybrid circuitry
|
|
|
1973 |
12 |
1 |
p. 23- 1 p. |
artikel |
5 |
An analysis of voltage bias stressing characteristics of tantalum thin film capacitor
|
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|
1973 |
12 |
1 |
p. 27- 1 p. |
artikel |
6 |
An automated integrated circuit layout design program of a systematic chip using building blocks
|
|
|
1973 |
12 |
1 |
p. 22- 1 p. |
artikel |
7 |
An automated integrated circuit layout design program of a systematic chip using building blocks
|
|
|
1973 |
12 |
1 |
p. 21- 1 p. |
artikel |
8 |
An externally controllable monolithic operational amplifier
|
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|
1973 |
12 |
1 |
p. 24- 1 p. |
artikel |
9 |
Application of MOS in consumer and industrial equipment
|
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|
1973 |
12 |
1 |
p. 23- 1 p. |
artikel |
10 |
A review of new methods and attitudes in reliability engineering
|
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|
1973 |
12 |
1 |
p. 16- 1 p. |
artikel |
11 |
A review of the technological and electromagnetic limitations of hybrid circuits for microwave applications
|
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|
1973 |
12 |
1 |
p. 28- 1 p. |
artikel |
12 |
Bayes' equation, reliability, and multiple hypothesis testing
|
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|
1973 |
12 |
1 |
p. 16- 1 p. |
artikel |
13 |
BIGFET makes IGFET more versatile
|
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|
1973 |
12 |
1 |
p. 22- 1 p. |
artikel |
14 |
Bonded crossovers for thin film circuits
|
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|
1973 |
12 |
1 |
p. 27- 1 p. |
artikel |
15 |
Bridging the analog and digital worlds with linear ICs
|
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|
1973 |
12 |
1 |
p. 21- 1 p. |
artikel |
16 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
|
|
1973 |
12 |
1 |
p. 1-2 2 p. |
artikel |
17 |
Characteristics of P-channel MOS field effect transistors with ion-implanted channels
|
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|
1973 |
12 |
1 |
p. 30- 1 p. |
artikel |
18 |
Charge induced instability in 709 operational amplifiers
|
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|
1973 |
12 |
1 |
p. 21- 1 p. |
artikel |
19 |
CMSO finally gets it all together
|
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|
1973 |
12 |
1 |
p. 20- 1 p. |
artikel |
20 |
Computer aided thermal design of LSI packages
|
|
|
1973 |
12 |
1 |
p. 21- 1 p. |
artikel |
21 |
Computer calculation of device circuit, equipment and system reliability
|
|
|
1973 |
12 |
1 |
p. 16- 1 p. |
artikel |
22 |
Computer helps design of complementary MOS logic
|
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|
1973 |
12 |
1 |
p. 21- 1 p. |
artikel |
23 |
Consumer integrated circuits in amateur design
|
|
|
1973 |
12 |
1 |
p. 23-24 2 p. |
artikel |
24 |
Course
|
|
|
1973 |
12 |
1 |
p. 3-5 3 p. |
artikel |
25 |
Cut system testing and trouble shooting
|
|
|
1973 |
12 |
1 |
p. 19- 1 p. |
artikel |
26 |
Deposition and evaluation on thin films by d.c. ion beam sputtering
|
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|
1973 |
12 |
1 |
p. 29- 1 p. |
artikel |
27 |
Designing reliability into telephone cables
|
|
|
1973 |
12 |
1 |
p. 18- 1 p. |
artikel |
28 |
Determining optimum burn-in and replacement times using Bayesian decision theory
|
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|
1973 |
12 |
1 |
p. 18- 1 p. |
artikel |
29 |
Development of large thick-film multilayers assemblies
|
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|
1973 |
12 |
1 |
p. 27- 1 p. |
artikel |
30 |
Diffusion of ion-implanted 83Kr KCl, including the effects of channeling, radiation damage and divalent doping
|
|
|
1973 |
12 |
1 |
p. 30- 1 p. |
artikel |
31 |
Déphaseurs microélectronique en bande X et KU
|
|
|
1973 |
12 |
1 |
p. 22- 1 p. |
artikel |
32 |
Drift of the breakdown voltage in highly doped planar junctions
|
Verwey, J.F. |
|
1973 |
12 |
1 |
p. 51-56 6 p. |
artikel |
33 |
Dynamic malfunction limits in high-speed TTL and ECL integrated digital gates
|
Abdel-Latif, M. |
|
1973 |
12 |
1 |
p. 57-58 2 p. |
artikel |
34 |
Editorial Board
|
|
|
1973 |
12 |
1 |
p. IFC- 1 p. |
artikel |
35 |
Effects of complex alloy additions on electromigration in aluminium thin films
|
|
|
1973 |
12 |
1 |
p. 28- 1 p. |
artikel |
36 |
Electrical properties of n-type Si layers doped with proton bombardment induced shallew donors
|
|
|
1973 |
12 |
1 |
p. 26- 1 p. |
artikel |
37 |
Electron and ion beams in microelectronic fabrication processes
|
|
|
1973 |
12 |
1 |
p. 30- 1 p. |
artikel |
38 |
Electronic components for space application PT3
|
|
|
1973 |
12 |
1 |
p. 29- 1 p. |
artikel |
39 |
Electronic processes in metal-silicon nitride-silicon dioxide-silicon systems
|
|
|
1973 |
12 |
1 |
p. 25-26 2 p. |
artikel |
40 |
Evolution of a high-reliability-molded DIP
|
|
|
1973 |
12 |
1 |
p. 17- 1 p. |
artikel |
41 |
Excitation of space charge waves in a one-carrier semiconductor with variable doping
|
|
|
1973 |
12 |
1 |
p. 25- 1 p. |
artikel |
42 |
Experience with Bayesian reliability meassurement of large systems
|
|
|
1973 |
12 |
1 |
p. 20- 1 p. |
artikel |
43 |
Experiments concerning the measurement of floating-emitter potential
|
|
|
1973 |
12 |
1 |
p. 25- 1 p. |
artikel |
44 |
Focus on consumer IC's
|
|
|
1973 |
12 |
1 |
p. 20- 1 p. |
artikel |
45 |
Focus on MSI/LSI testers
|
|
|
1973 |
12 |
1 |
p. 20- 1 p. |
artikel |
46 |
FRAM failure rate appraisal machine—an outline of its concept and application
|
|
|
1973 |
12 |
1 |
p. 15- 1 p. |
artikel |
47 |
Graphic analysis and design of MOSFET astable multivibrators
|
|
|
1973 |
12 |
1 |
p. 22- 1 p. |
artikel |
48 |
High reliability consumer IC's
|
|
|
1973 |
12 |
1 |
p. 17- 1 p. |
artikel |
49 |
High stability cosputtered Ta-50 at. % Al alloy film resistors
|
|
|
1973 |
12 |
1 |
p. 27- 1 p. |
artikel |
50 |
Hole diffusion length in high purity n-GaAs
|
|
|
1973 |
12 |
1 |
p. 26- 1 p. |
artikel |
51 |
Hopping-conduction in Ge-Cr amorphous thin films
|
|
|
1973 |
12 |
1 |
p. 27- 1 p. |
artikel |
52 |
Influence of dislocations on gold diffusion into thin silicon slices
|
|
|
1973 |
12 |
1 |
p. 25- 1 p. |
artikel |
53 |
Influence of temperature on the two band model for negative magnetoresistance in heavily doped semiconductors
|
|
|
1973 |
12 |
1 |
p. 25- 1 p. |
artikel |
54 |
In-house artwork and screen fabrication for prototype thick film circuitry
|
|
|
1973 |
12 |
1 |
p. 28- 1 p. |
artikel |
55 |
Interfacing with MOS circuits
|
|
|
1973 |
12 |
1 |
p. 22- 1 p. |
artikel |
56 |
Is there a reliable screen for VHF power transistors?
|
Ingram-Cotton, J. |
|
1973 |
12 |
1 |
p. 35-42 8 p. |
artikel |
57 |
Keeping up with new dimensions in IC applications
|
|
|
1973 |
12 |
1 |
p. 20- 1 p. |
artikel |
58 |
Keramische substrate fur Mikro-Schaltkreise
|
|
|
1973 |
12 |
1 |
p. 22- 1 p. |
artikel |
59 |
Laser beam technology for the microelectronics industry
|
|
|
1973 |
12 |
1 |
p. 30- 1 p. |
artikel |
60 |
Laser resistance trimming from the measurement point of view
|
|
|
1973 |
12 |
1 |
p. 29- 1 p. |
artikel |
61 |
Line drivers are not limited to computer systems
|
|
|
1973 |
12 |
1 |
p. 21- 1 p. |
artikel |
62 |
Liquid cooling of microelectronic devices by free and forced convection
|
|
|
1973 |
12 |
1 |
p. 20- 1 p. |
artikel |
63 |
Logic design with programmable arrays
|
|
|
1973 |
12 |
1 |
p. 21- 1 p. |
artikel |
64 |
LSI converts an old technique into low-cost a-d conversion
|
|
|
1973 |
12 |
1 |
p. 24- 1 p. |
artikel |
65 |
Lumped approximation to distributed RC notch networks for linear integrated circuits
|
|
|
1973 |
12 |
1 |
p. 22- 1 p. |
artikel |
66 |
MAS-ROM—Electrically-Reprogrammable ROM with Decoder
|
|
|
1973 |
12 |
1 |
p. 23- 1 p. |
artikel |
67 |
MAS-ROM—the fabrication and memory characteristics
|
|
|
1973 |
12 |
1 |
p. 24- 1 p. |
artikel |
68 |
Metal-nitride-oxide IC memory retains data for meter reader
|
|
|
1973 |
12 |
1 |
p. 24- 1 p. |
artikel |
69 |
Microwave integrated circuits
|
|
|
1973 |
12 |
1 |
p. 23- 1 p. |
artikel |
70 |
MOS/LSI circuit design: designing-in reliability
|
|
|
1973 |
12 |
1 |
p. 19- 1 p. |
artikel |
71 |
N-channel MOS bids for mainframes
|
|
|
1973 |
12 |
1 |
p. 23- 1 p. |
artikel |
72 |
Nonexistence of localized band tail states in substitutional semiconductor alloys and some other disordered systems
|
|
|
1973 |
12 |
1 |
p. 26-27 2 p. |
artikel |
73 |
Notices and calls for papers
|
|
|
1973 |
12 |
1 |
p. 7-10 4 p. |
artikel |
74 |
Papers to be published in future issues
|
|
|
1973 |
12 |
1 |
p. 33- 1 p. |
artikel |
75 |
Planar multi-layer interconnect structure
|
|
|
1973 |
12 |
1 |
p. 22-23 2 p. |
artikel |
76 |
P-n junctions in polycrystalline-silicon films
|
|
|
1973 |
12 |
1 |
p. 25- 1 p. |
artikel |
77 |
Practical technique for measuring probability density
|
|
|
1973 |
12 |
1 |
p. 15- 1 p. |
artikel |
78 |
Prediction of IC and LSI performance by specialized vibration/detection test for presence of conductive particles
|
|
|
1973 |
12 |
1 |
p. 19- 1 p. |
artikel |
79 |
Preliminary program 1973 Reliability Physics Symposium
|
|
|
1973 |
12 |
1 |
p. 11-13 3 p. |
artikel |
80 |
Prior distributions fitted to observed reliability data
|
|
|
1973 |
12 |
1 |
p. 15-16 2 p. |
artikel |
81 |
Processing of emulsion photomasks for semiconductor applications
|
|
|
1973 |
12 |
1 |
p. 22- 1 p. |
artikel |
82 |
Properties and appearance of abnormal defects in evaporated chromium films
|
|
|
1973 |
12 |
1 |
p. 28- 1 p. |
artikel |
83 |
Raman scattering by silicon
|
|
|
1973 |
12 |
1 |
p. 26- 1 p. |
artikel |
84 |
Reactively evaporated titanium nitride resistors for microcircuits
|
|
|
1973 |
12 |
1 |
p. 29- 1 p. |
artikel |
85 |
Reliability considerations in plastic encapsulated microcircuits
|
|
|
1973 |
12 |
1 |
p. 18- 1 p. |
artikel |
86 |
Reliability experience of digital telemetry
|
|
|
1973 |
12 |
1 |
p. 19- 1 p. |
artikel |
87 |
Reliability improvement by process control
|
|
|
1973 |
12 |
1 |
p. 16- 1 p. |
artikel |
88 |
Reliability improvement of wire bonds subjected to fatigue stresses
|
|
|
1973 |
12 |
1 |
p. 18- 1 p. |
artikel |
89 |
Reliability improvement with new passivation of solid encapsulated transistors
|
|
|
1973 |
12 |
1 |
p. 17- 1 p. |
artikel |
90 |
Reliability modeling. Tool of the system analyst
|
|
|
1973 |
12 |
1 |
p. 16- 1 p. |
artikel |
91 |
Reliability of ILS Airborne equipment category III
|
|
|
1973 |
12 |
1 |
p. 18-19 2 p. |
artikel |
92 |
Reliability of tantalum thin film capacitor
|
|
|
1973 |
12 |
1 |
p. 17-18 2 p. |
artikel |
93 |
Reliability test of MOS-LSI-memory for the improvement of the fabrication techniques
|
|
|
1973 |
12 |
1 |
p. 17- 1 p. |
artikel |
94 |
Resistance drift in Pd-Ag thick film resistors
|
|
|
1973 |
12 |
1 |
p. 28- 1 p. |
artikel |
95 |
Resistivity and carrier lifetime in gold-doped silicon (Final Report)
|
|
|
1973 |
12 |
1 |
p. 26- 1 p. |
artikel |
96 |
Review of electronic techniques—radio components—reliability of thin-film resistors
|
|
|
1973 |
12 |
1 |
p. 29- 1 p. |
artikel |
97 |
Screening techniques for intermittent shorts
|
|
|
1973 |
12 |
1 |
p. 17- 1 p. |
artikel |
98 |
Sixteen-bit conversion gets a lift from IC technology
|
|
|
1973 |
12 |
1 |
p. 24- 1 p. |
artikel |
99 |
Solid state electronic devices
|
G.W.A.D., |
|
1973 |
12 |
1 |
p. 32- 1 p. |
artikel |
100 |
Special report: semiconductor RAMs land computer mainframe jobs
|
|
|
1973 |
12 |
1 |
p. 24- 1 p. |
artikel |
101 |
Spotty defects in oxidised floating-zoned dislocation-free silicon crystals
|
|
|
1973 |
12 |
1 |
p. 25- 1 p. |
artikel |
102 |
Sputtered layers featuring high area resistance and low temperature coefficient
|
|
|
1973 |
12 |
1 |
p. 27-28 2 p. |
artikel |
103 |
Stability of nickel-chromium thin film resistors
|
|
|
1973 |
12 |
1 |
p. 27- 1 p. |
artikel |
104 |
State of art of reliability practice in the European Computer Market
|
|
|
1973 |
12 |
1 |
p. 15- 1 p. |
artikel |
105 |
Stochastic behaviour of an intermittently working electronic equipment with imperfect switching
|
Kashyap, N.K. |
|
1973 |
12 |
1 |
p. 45-50 6 p. |
artikel |
106 |
Surface and bulk changes in Czochralski and float-zone silicon during IC processing
|
|
|
1973 |
12 |
1 |
p. 26- 1 p. |
artikel |
107 |
Switched collector impedance IC memory
|
|
|
1973 |
12 |
1 |
p. 23- 1 p. |
artikel |
108 |
Tantalum-glass cermet thin film resistors
|
|
|
1973 |
12 |
1 |
p. 28- 1 p. |
artikel |
109 |
Temperature-humidity acceleration factors for plastic transistors and integrated circuits
|
|
|
1973 |
12 |
1 |
p. 18- 1 p. |
artikel |
110 |
Test IC voltage regulators with one general-purpose circuit
|
|
|
1973 |
12 |
1 |
p. 20- 1 p. |
artikel |
111 |
Testing and fabrication of wire-bond electrical connections—A comprehensive survey
|
G.W.A.D., |
|
1973 |
12 |
1 |
p. 31- 1 p. |
artikel |
112 |
The components of computers Part 2: the coming of LSI
|
|
|
1973 |
12 |
1 |
p. 23- 1 p. |
artikel |
113 |
The computation of yield and drift reliability of electronic circuits
|
|
|
1973 |
12 |
1 |
p. 18- 1 p. |
artikel |
114 |
The failure physics approach to IC reliability
|
|
|
1973 |
12 |
1 |
p. 16- 1 p. |
artikel |
115 |
The great bipolar RAM race
|
|
|
1973 |
12 |
1 |
p. 24- 1 p. |
artikel |
116 |
The load life characteristics of thick-film resistors
|
Holmes, P.J. |
|
1973 |
12 |
1 |
p. 61-71 11 p. |
artikel |
117 |
The maintenance of datel 600 multipoint networks
|
|
|
1973 |
12 |
1 |
p. 19- 1 p. |
artikel |
118 |
The reliability of coaxial line transmission systems
|
|
|
1973 |
12 |
1 |
p. 19- 1 p. |
artikel |
119 |
Thermal characteristics of beam-lead chips
|
|
|
1973 |
12 |
1 |
p. 21- 1 p. |
artikel |
120 |
Thermodynamic stability of thin ferroelectric films
|
|
|
1973 |
12 |
1 |
p. 29- 1 p. |
artikel |
121 |
The self-registered MOSFET—a brief review
|
|
|
1973 |
12 |
1 |
p. 22- 1 p. |
artikel |
122 |
The use of current gain as an indicator for the formation of hot spots due to current crowding in power transistors
|
|
|
1973 |
12 |
1 |
p. 17- 1 p. |
artikel |
123 |
Thick-film circuits
|
G.W.A.D., |
|
1973 |
12 |
1 |
p. 31- 1 p. |
artikel |
124 |
Thin film hybrid integrated circuits for communication systems
|
|
|
1973 |
12 |
1 |
p. 28- 1 p. |
artikel |
125 |
Two economical techniques for making complex logic bipolar integrated circuit
|
|
|
1973 |
12 |
1 |
p. 23- 1 p. |
artikel |
126 |
X-ray lithography—a new high resolution replication process
|
|
|
1973 |
12 |
1 |
p. 30- 1 p. |
artikel |