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                             125 results found
no title author magazine year volume issue page(s) type
1 Achieving consistent results with thick-film 1972
 11 3 p. 246-
1 p.
 article
2 A complementary MOS 1.2 V watch circuit using ion implantation 1972
 11 3 p. 248-
1 p.
 article
3 A computerized algorithm for determining the reliability of redundant configurations 1972
 11 3 p. 239-
1 p.
 article
4 A cost-based availability allocation algorithm 1972
 11 3 p. 238-
1 p.
 article
5 Active distributed RC low-pass filters Dutta Roy, S.C.
 1972
 11 3 p. 293-295
3 p.
 article
6 A method for the measurement of the turn-on condition in MOS transistors 1972
 11 3 p. 244-
1 p.
 article
7 A multichannel high-speed data acquisition and processing system 1972
 11 3 p. 238-
1 p.
 article
8 Analysis of maintenance man loading via simulation 1972
 11 3 p. 239-
1 p.
 article
9 Analysis of silicon nitride layers deposited from SiH4 and N2 on silicon 1972
 11 3 p. 243-
1 p.
 article
10 A pattern recognition technique for system error analysis 1972
 11 3 p. 238-
1 p.
 article
11 Applications of interested circuit technology to microwave frequencies 1972
 11 3 p. 241-242
2 p.
 article
12 Applications of the scanning low energy electron (SLEEP) for MOS device evaluation 1972
 11 3 p. 248-
1 p.
 article
13 A practical approach to reliability G.W.A.D.,
 1972
 11 3 p. 254-
1 p.
 article
14 A review of the electrical and optical properties of III–V compound semiconductor films 1972
 11 3 p. 244-
1 p.
 article
15 Automatic wire bonder for external connectors for thin film circuits 1972
 11 3 p. 245-246
2 p.
 article
16 A versatile packaging system for hybrids 1972
 11 3 p. 246-
1 p.
 article
17 Beam-lead devices for hybrid integrated circuits 1972
 11 3 p. 247-
1 p.
 article
18 Beam lead technology 1972
 11 3 p. 240-241
2 p.
 article
19 Build gated video amplifiers 1972
 11 3 p. 241-
1 p.
 article
20 Bus-connectable TTL adds a new state to binary logic 1972
 11 3 p. 243-
1 p.
 article
21 Calendar of international conferences, symposia, lectures and meetings of interest 1972
 11 3 p. 229-230
2 p.
 article
22 Call for papers 1972
 11 3 p. 233-
1 p.
 article
23 Capacitives methods of determination of the energy distribution of electron traps in semiconductors 1972
 11 3 p. 244-
1 p.
 article
24 CHAMP: The Cranfield Hybrid Automatic Maintenance Program 1972
 11 3 p. 238-
1 p.
 article
25 Characteristics of the junction-gate field effect transistor with short channel length 1972
 11 3 p. 244-
1 p.
 article
26 Clip-and-read comparator finds IC failures 1972
 11 3 p. 236-
1 p.
 article
27 C/MOS watch kit aims at potential $50 million market 1972
 11 3 p. 242-
1 p.
 article
28 Component value spread and network function tolerances: an optimal design procedure 1972
 11 3 p. 237-
1 p.
 article
29 Computerized Testing of thin-film circuit conductors 1972
 11 3 p. 246-
1 p.
 article
30 Conference report 18th Annual Reliability Symposium, U.S.A. Jacobs, Richard M.
 1972
 11 3 p. 257-261
5 p.
 article
31 Correlation between the presence of dislocations and vacancies in N-Type gallium arsenide 1972
 11 3 p. 236-
1 p.
 article
32 Courses in microelectronics and reliability 1972
 11 3 p. 231-232
2 p.
 article
33 Defects in medical electronics draw heavy fire from hospitals 1972
 11 3 p. 238-
1 p.
 article
34 Design curves for flat square spiral inductors 1972
 11 3 p. 247-
1 p.
 article
35 Determining subminiature lamp life 1972
 11 3 p. 235-236
2 p.
 article
36 Development of screenable high dielectric constant ceramic-glass dielectrics 1972
 11 3 p. 242-
1 p.
 article
37 Dynamic bulk negative differential conductivity in semiconductors 1972
 11 3 p. 245-
1 p.
 article
38 Dynamic MOS shift registers can also simulate stack and silo memories 1972
 11 3 p. 242-
1 p.
 article
39 Editorial G.W.A.D.,
 1972
 11 3 p. 223-
1 p.
 article
40 Effective surface mobility theory 1972
 11 3 p. 245-
1 p.
 article
41 Effects of deep-level impurities on popcorn-noise in bipolar junction transistors 1972
 11 3 p. 244-
1 p.
 article
42 Effects of the substrate on surface state noise in silicon MOS FET's 1972
 11 3 p. 241-
1 p.
 article
43 Einfluss des abstandes emitter-basiskontakt auf die stromverstärkung bipolarer transistoren 1972
 11 3 p. 243-
1 p.
 article
44 Ellipsometry as applied to the measurement of the thicknesses and indices of oxide films on silicon 1972
 11 3 p. 245-
1 p.
 article
45 Ensuring carrier system reliability 1972
 11 3 p. 239-
1 p.
 article
46 Equivalent circuit for conductivity-temperature characteristics of the PdO/Ag-Pd glaze resistors 1972
 11 3 p. 246-247
2 p.
 article
47 Errata 1972
 11 3 p. 301-303
3 p.
 article
48 Evaluation of epoxy encapsulants and their levels of contamination 1972
 11 3 p. 235-
1 p.
 article
49 Focus on linear ICs 1972
 11 3 p. 240-
1 p.
 article
50 Formation of NiSi and current transport across the NiSi-Si interface 1972
 11 3 p. 243-
1 p.
 article
51 10 GHZ Si Schottky-barrier impatt diode with hyperabrupt impurity distribution produced by ion implantation 1972
 11 3 p. 248-249
2 p.
 article
52 How to avoid custom hybrid circuit pitfalls 1972
 11 3 p. 247-
1 p.
 article
53 IC phase meter beats high costs 1972
 11 3 p. 241-
1 p.
 article
54 ICs simplify v.-f. and v.-t. conversions 1972
 11 3 p. 240-
1 p.
 article
55 Influence of excess current carriers drift upon a current-voltage characteristic of the germanium p-n junction diode 1972
 11 3 p. 245-
1 p.
 article
56 Inhomogeneous distribution of free chargecarriers in the space charge region of semiconductors due to the insulating layer 1972
 11 3 p. 245-
1 p.
 article
57 Integrated circuit industry 1972
 11 3 p. 239-
1 p.
 article
58 Interdependence of the electrical properties and the defect structure in heteropitaxial germanium and silicon 1972
 11 3 p. 236-237
2 p.
 article
59 Investigation of processes of manufacture and application of dielectric films on the basis of aluminium nitride in MIS transistors 1972
 11 3 p. 241-
1 p.
 article
60 Items of interest 1972
 11 3 p. 225-228
4 p.
 article
61 Latent image can provide chips with built-in control memories 1972
 11 3 p. 242-
1 p.
 article
62 Locating and repairing faults in multilayer motherboards 1972
 11 3 p. 236-
1 p.
 article
63 Magnetic sensitivity of a MAGFET of uniform channel current density 1972
 11 3 p. 243-
1 p.
 article
64 Maintenance documentation: a necessary good or a necessary evil? 1972
 11 3 p. 238-
1 p.
 article
65 Measurement of electrical properties of sputtered tantalum films at low temperatures 1972
 11 3 p. 246-
1 p.
 article
66 Methods for visual characterization of trimmed thick-film resistors 1972
 11 3 p. 247-248
2 p.
 article
67 Models for contacts to planar devices 1972
 11 3 p. 240-
1 p.
 article
68 Modular structured circuits and their fault diagnosis 1972
 11 3 p. 237-
1 p.
 article
69 MOS two-dimensional study 1972
 11 3 p. 244-245
2 p.
 article
70 Multiplying made easy for digital assemblies 1972
 11 3 p. 240-
1 p.
 article
71 Noise and y-parameters in MOS FET's 1972
 11 3 p. 244-
1 p.
 article
72 Non-repairable items Mayhew, A.J.
 1972
 11 3 p. 283-284
2 p.
 article
73 On-line system availability and service simulation (OLSASS) 1972
 11 3 p. 237-
1 p.
 article
74 On the study of irradiated MOS structures at very low frequency 1972
 11 3 p. 241-
1 p.
 article
75 Optimal redundancy and availability allocation in multistage systems 1972
 11 3 p. 237-
1 p.
 article
76 Order statistics and reliability Singh, N.
 1972
 11 3 p. 297-299
3 p.
 article
77 Papers to be published in future issues 1972
 11 3 p. 255-
1 p.
 article
78 PCM plus C/MOS spells reliable, low-dissipation data acquisition 1972
 11 3 p. 242-
1 p.
 article
79 Phase-lock loop comes to fm stereo wrapped in an IC package 1972
 11 3 p. 241-
1 p.
 article
80 Phonon effects in energy loss spectra of fast electrons in metal films 1972
 11 3 p. 247-
1 p.
 article
81 Physical characterization of electronic materials devices and thin films (1.12.69–1.12.70) 1972
 11 3 p. 239-
1 p.
 article
82 Physical origins of burst noise in transistors 1972
 11 3 p. 245-
1 p.
 article
83 Planox process smoothes path to greater MOS density 1972
 11 3 p. 240-
1 p.
 article
84 Plastic encapsulated transistors 1972
 11 3 p. 242-
1 p.
 article
85 Plastic packaging of hybrid circuits—a review 1972
 11 3 p. 248-
1 p.
 article
86 Power Schottky diode design and comparison with the junction diode 1972
 11 3 p. 242-
1 p.
 article
87 Preparation of silicon n-type films by sublimation in vacuum 1972
 11 3 p. 242-
1 p.
 article
88 Proceedings of the International Conference on the Physics and Chemistry of Semiconductor Heterojunctions and Layer Structures G.W.A.D.,
 1972
 11 3 p. 253-
1 p.
 article
89 Protect your transitors against turn-on or testing transient damage 1972
 11 3 p. 236-
1 p.
 article
90 Pyrohydrolytic Al2O3 for MOS applications 1972
 11 3 p. 240-
1 p.
 article
91 Relcomp: a computer program for calculating system reliability and MTBF 1972
 11 3 p. 237-
1 p.
 article
92 Reliability and maintainability parameters evaluated with simulation 1972
 11 3 p. 237-238
2 p.
 article
93 Reliability comparisons Kitson, B.R.
 1972
 11 3 p. 287-292
6 p.
 article
94 Reliability prediction of a two-unit standby redundant system with standby failure Garg, R.C.
 1972
 11 3 p. 263-267
5 p.
 article
95 Report on investigations of radiation resistance of the FBH 162 RTL integrated circuit 1972
 11 3 p. 239-240
2 p.
 article
96 Scientific sabotage of switching systems 1972
 11 3 p. 236-
1 p.
 article
97 Selective placing of solders and brazes in the assembly of hybrid microelectronic circuits 1972
 11 3 p. 247-
1 p.
 article
98 Semiconductors G.W.A.D.,
 1972
 11 3 p. 251-
1 p.
 article
99 Solder joint design in hybrid circuits 1972
 11 3 p. 246-
1 p.
 article
100 Some economic problems related to burn-in programs 1972
 11 3 p. 238-239
2 p.
 article
101 Statistical fatigue models: a survey 1972
 11 3 p. 235-
1 p.
 article
102 Surface breakdown in silicon planar diodes equipped with field plate 1972
 11 3 p. 236-
1 p.
 article
103 Surface self-diffusion of metals G.W.A.D.,
 1972
 11 3 p. 252-
1 p.
 article
104 Survey of second breakdown phenomena mechanisms and damage in semiconductor junction devices 1972
 11 3 p. 236-
1 p.
 article
105 Testing techniques that assure reliable semiconductor devices 1972
 11 3 p. 236-
1 p.
 article
106 The design and performance of an r.f. sputtering machine with continuous production capability 1972
 11 3 p. 247-
1 p.
 article
107 The development of polyimide multiplayer boards containing flexible circuitry 1972
 11 3 p. 240-
1 p.
 article
108 The direct emulsion screen as tool for high resolution thick film printing 1972
 11 3 p. 246-
1 p.
 article
109 The effect of static electricity on thick-film resistors 1972
 11 3 p. 247-
1 p.
 article
110 The effect of temperature cycling on aluminum-film interconnections 1972
 11 3 p. 241-
1 p.
 article
111 The mobility of positrons in semiconductors 1972
 11 3 p. 243-
1 p.
 article
112 Theory of metallic contacts on high resistivity solids (II) deep traps 1972
 11 3 p. 242-243
2 p.
 article
113 The rheology and viscometers of microelectronics 1972
 11 3 p. 246-
1 p.
 article
114 The unserviceable probability of a class of telecommunications networks 1972
 11 3 p. 239-
1 p.
 article
115 The use of lasers for resistor trimming 1972
 11 3 p. 248-
1 p.
 article
116 Thick-film hybrids meet satellite requirements—part 1 1972
 11 3 p. 247-
1 p.
 article
117 Thick-film hybrids meet satellite requirements—part 2 1972
 11 3 p. 248-
1 p.
 article
118 Thick-film microelectronics, fabrication, design and applications G.W.A.D.,
 1972
 11 3 p. 251-252
2 p.
 article
119 Thin-film microcircuit technology—v.h.f. to microwave 1972
 11 3 p. 248-
1 p.
 article
120 Transport of the short life-time carriers in homogeneous semiconductors 1972
 11 3 p. 243-
1 p.
 article
121 Transport properties of europium oxide thin films 1972
 11 3 p. 246-
1 p.
 article
122 TSEE spectra of differently produced SiO2 films 1972
 11 3 p. 245-
1 p.
 article
123 Use of a reaction rate method to predict failure times of adhesive bonds at constant stress 1972
 11 3 p. 236-
1 p.
 article
124 Variation analysis and design of experiments as an aid to design quality assurance Talbot, J.P.P.
 1972
 11 3 p. 269-281
13 p.
 article
125 Who's responsible for product safety? 1972
 11 3 p. 235-
1 p.
 article
                             125 results found
 
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