nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
Achieving consistent results with thick-film
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1972 |
11 |
3 |
p. 246- 1 p. |
artikel |
2 |
A complementary MOS 1.2 V watch circuit using ion implantation
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1972 |
11 |
3 |
p. 248- 1 p. |
artikel |
3 |
A computerized algorithm for determining the reliability of redundant configurations
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1972 |
11 |
3 |
p. 239- 1 p. |
artikel |
4 |
A cost-based availability allocation algorithm
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1972 |
11 |
3 |
p. 238- 1 p. |
artikel |
5 |
Active distributed RC low-pass filters
|
Dutta Roy, S.C. |
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1972 |
11 |
3 |
p. 293-295 3 p. |
artikel |
6 |
A method for the measurement of the turn-on condition in MOS transistors
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1972 |
11 |
3 |
p. 244- 1 p. |
artikel |
7 |
A multichannel high-speed data acquisition and processing system
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1972 |
11 |
3 |
p. 238- 1 p. |
artikel |
8 |
Analysis of maintenance man loading via simulation
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1972 |
11 |
3 |
p. 239- 1 p. |
artikel |
9 |
Analysis of silicon nitride layers deposited from SiH4 and N2 on silicon
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1972 |
11 |
3 |
p. 243- 1 p. |
artikel |
10 |
A pattern recognition technique for system error analysis
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1972 |
11 |
3 |
p. 238- 1 p. |
artikel |
11 |
Applications of interested circuit technology to microwave frequencies
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1972 |
11 |
3 |
p. 241-242 2 p. |
artikel |
12 |
Applications of the scanning low energy electron (SLEEP) for MOS device evaluation
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1972 |
11 |
3 |
p. 248- 1 p. |
artikel |
13 |
A practical approach to reliability
|
G.W.A.D., |
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1972 |
11 |
3 |
p. 254- 1 p. |
artikel |
14 |
A review of the electrical and optical properties of III–V compound semiconductor films
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1972 |
11 |
3 |
p. 244- 1 p. |
artikel |
15 |
Automatic wire bonder for external connectors for thin film circuits
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1972 |
11 |
3 |
p. 245-246 2 p. |
artikel |
16 |
A versatile packaging system for hybrids
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1972 |
11 |
3 |
p. 246- 1 p. |
artikel |
17 |
Beam-lead devices for hybrid integrated circuits
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1972 |
11 |
3 |
p. 247- 1 p. |
artikel |
18 |
Beam lead technology
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1972 |
11 |
3 |
p. 240-241 2 p. |
artikel |
19 |
Build gated video amplifiers
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1972 |
11 |
3 |
p. 241- 1 p. |
artikel |
20 |
Bus-connectable TTL adds a new state to binary logic
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1972 |
11 |
3 |
p. 243- 1 p. |
artikel |
21 |
Calendar of international conferences, symposia, lectures and meetings of interest
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1972 |
11 |
3 |
p. 229-230 2 p. |
artikel |
22 |
Call for papers
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1972 |
11 |
3 |
p. 233- 1 p. |
artikel |
23 |
Capacitives methods of determination of the energy distribution of electron traps in semiconductors
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1972 |
11 |
3 |
p. 244- 1 p. |
artikel |
24 |
CHAMP: The Cranfield Hybrid Automatic Maintenance Program
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1972 |
11 |
3 |
p. 238- 1 p. |
artikel |
25 |
Characteristics of the junction-gate field effect transistor with short channel length
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1972 |
11 |
3 |
p. 244- 1 p. |
artikel |
26 |
Clip-and-read comparator finds IC failures
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1972 |
11 |
3 |
p. 236- 1 p. |
artikel |
27 |
C/MOS watch kit aims at potential $50 million market
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1972 |
11 |
3 |
p. 242- 1 p. |
artikel |
28 |
Component value spread and network function tolerances: an optimal design procedure
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1972 |
11 |
3 |
p. 237- 1 p. |
artikel |
29 |
Computerized Testing of thin-film circuit conductors
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1972 |
11 |
3 |
p. 246- 1 p. |
artikel |
30 |
Conference report 18th Annual Reliability Symposium, U.S.A.
|
Jacobs, Richard M. |
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1972 |
11 |
3 |
p. 257-261 5 p. |
artikel |
31 |
Correlation between the presence of dislocations and vacancies in N-Type gallium arsenide
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1972 |
11 |
3 |
p. 236- 1 p. |
artikel |
32 |
Courses in microelectronics and reliability
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1972 |
11 |
3 |
p. 231-232 2 p. |
artikel |
33 |
Defects in medical electronics draw heavy fire from hospitals
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1972 |
11 |
3 |
p. 238- 1 p. |
artikel |
34 |
Design curves for flat square spiral inductors
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1972 |
11 |
3 |
p. 247- 1 p. |
artikel |
35 |
Determining subminiature lamp life
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1972 |
11 |
3 |
p. 235-236 2 p. |
artikel |
36 |
Development of screenable high dielectric constant ceramic-glass dielectrics
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1972 |
11 |
3 |
p. 242- 1 p. |
artikel |
37 |
Dynamic bulk negative differential conductivity in semiconductors
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1972 |
11 |
3 |
p. 245- 1 p. |
artikel |
38 |
Dynamic MOS shift registers can also simulate stack and silo memories
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1972 |
11 |
3 |
p. 242- 1 p. |
artikel |
39 |
Editorial
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G.W.A.D., |
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1972 |
11 |
3 |
p. 223- 1 p. |
artikel |
40 |
Effective surface mobility theory
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1972 |
11 |
3 |
p. 245- 1 p. |
artikel |
41 |
Effects of deep-level impurities on popcorn-noise in bipolar junction transistors
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1972 |
11 |
3 |
p. 244- 1 p. |
artikel |
42 |
Effects of the substrate on surface state noise in silicon MOS FET's
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1972 |
11 |
3 |
p. 241- 1 p. |
artikel |
43 |
Einfluss des abstandes emitter-basiskontakt auf die stromverstärkung bipolarer transistoren
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1972 |
11 |
3 |
p. 243- 1 p. |
artikel |
44 |
Ellipsometry as applied to the measurement of the thicknesses and indices of oxide films on silicon
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1972 |
11 |
3 |
p. 245- 1 p. |
artikel |
45 |
Ensuring carrier system reliability
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1972 |
11 |
3 |
p. 239- 1 p. |
artikel |
46 |
Equivalent circuit for conductivity-temperature characteristics of the PdO/Ag-Pd glaze resistors
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1972 |
11 |
3 |
p. 246-247 2 p. |
artikel |
47 |
Errata
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1972 |
11 |
3 |
p. 301-303 3 p. |
artikel |
48 |
Evaluation of epoxy encapsulants and their levels of contamination
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1972 |
11 |
3 |
p. 235- 1 p. |
artikel |
49 |
Focus on linear ICs
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1972 |
11 |
3 |
p. 240- 1 p. |
artikel |
50 |
Formation of NiSi and current transport across the NiSi-Si interface
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1972 |
11 |
3 |
p. 243- 1 p. |
artikel |
51 |
10 GHZ Si Schottky-barrier impatt diode with hyperabrupt impurity distribution produced by ion implantation
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1972 |
11 |
3 |
p. 248-249 2 p. |
artikel |
52 |
How to avoid custom hybrid circuit pitfalls
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1972 |
11 |
3 |
p. 247- 1 p. |
artikel |
53 |
IC phase meter beats high costs
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1972 |
11 |
3 |
p. 241- 1 p. |
artikel |
54 |
ICs simplify v.-f. and v.-t. conversions
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1972 |
11 |
3 |
p. 240- 1 p. |
artikel |
55 |
Influence of excess current carriers drift upon a current-voltage characteristic of the germanium p-n junction diode
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1972 |
11 |
3 |
p. 245- 1 p. |
artikel |
56 |
Inhomogeneous distribution of free chargecarriers in the space charge region of semiconductors due to the insulating layer
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1972 |
11 |
3 |
p. 245- 1 p. |
artikel |
57 |
Integrated circuit industry
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1972 |
11 |
3 |
p. 239- 1 p. |
artikel |
58 |
Interdependence of the electrical properties and the defect structure in heteropitaxial germanium and silicon
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1972 |
11 |
3 |
p. 236-237 2 p. |
artikel |
59 |
Investigation of processes of manufacture and application of dielectric films on the basis of aluminium nitride in MIS transistors
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1972 |
11 |
3 |
p. 241- 1 p. |
artikel |
60 |
Items of interest
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1972 |
11 |
3 |
p. 225-228 4 p. |
artikel |
61 |
Latent image can provide chips with built-in control memories
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1972 |
11 |
3 |
p. 242- 1 p. |
artikel |
62 |
Locating and repairing faults in multilayer motherboards
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1972 |
11 |
3 |
p. 236- 1 p. |
artikel |
63 |
Magnetic sensitivity of a MAGFET of uniform channel current density
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1972 |
11 |
3 |
p. 243- 1 p. |
artikel |
64 |
Maintenance documentation: a necessary good or a necessary evil?
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1972 |
11 |
3 |
p. 238- 1 p. |
artikel |
65 |
Measurement of electrical properties of sputtered tantalum films at low temperatures
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1972 |
11 |
3 |
p. 246- 1 p. |
artikel |
66 |
Methods for visual characterization of trimmed thick-film resistors
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1972 |
11 |
3 |
p. 247-248 2 p. |
artikel |
67 |
Models for contacts to planar devices
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1972 |
11 |
3 |
p. 240- 1 p. |
artikel |
68 |
Modular structured circuits and their fault diagnosis
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1972 |
11 |
3 |
p. 237- 1 p. |
artikel |
69 |
MOS two-dimensional study
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1972 |
11 |
3 |
p. 244-245 2 p. |
artikel |
70 |
Multiplying made easy for digital assemblies
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1972 |
11 |
3 |
p. 240- 1 p. |
artikel |
71 |
Noise and y-parameters in MOS FET's
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1972 |
11 |
3 |
p. 244- 1 p. |
artikel |
72 |
Non-repairable items
|
Mayhew, A.J. |
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1972 |
11 |
3 |
p. 283-284 2 p. |
artikel |
73 |
On-line system availability and service simulation (OLSASS)
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1972 |
11 |
3 |
p. 237- 1 p. |
artikel |
74 |
On the study of irradiated MOS structures at very low frequency
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1972 |
11 |
3 |
p. 241- 1 p. |
artikel |
75 |
Optimal redundancy and availability allocation in multistage systems
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1972 |
11 |
3 |
p. 237- 1 p. |
artikel |
76 |
Order statistics and reliability
|
Singh, N. |
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1972 |
11 |
3 |
p. 297-299 3 p. |
artikel |
77 |
Papers to be published in future issues
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1972 |
11 |
3 |
p. 255- 1 p. |
artikel |
78 |
PCM plus C/MOS spells reliable, low-dissipation data acquisition
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1972 |
11 |
3 |
p. 242- 1 p. |
artikel |
79 |
Phase-lock loop comes to fm stereo wrapped in an IC package
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1972 |
11 |
3 |
p. 241- 1 p. |
artikel |
80 |
Phonon effects in energy loss spectra of fast electrons in metal films
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1972 |
11 |
3 |
p. 247- 1 p. |
artikel |
81 |
Physical characterization of electronic materials devices and thin films (1.12.69–1.12.70)
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1972 |
11 |
3 |
p. 239- 1 p. |
artikel |
82 |
Physical origins of burst noise in transistors
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1972 |
11 |
3 |
p. 245- 1 p. |
artikel |
83 |
Planox process smoothes path to greater MOS density
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1972 |
11 |
3 |
p. 240- 1 p. |
artikel |
84 |
Plastic encapsulated transistors
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1972 |
11 |
3 |
p. 242- 1 p. |
artikel |
85 |
Plastic packaging of hybrid circuits—a review
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1972 |
11 |
3 |
p. 248- 1 p. |
artikel |
86 |
Power Schottky diode design and comparison with the junction diode
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1972 |
11 |
3 |
p. 242- 1 p. |
artikel |
87 |
Preparation of silicon n-type films by sublimation in vacuum
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1972 |
11 |
3 |
p. 242- 1 p. |
artikel |
88 |
Proceedings of the International Conference on the Physics and Chemistry of Semiconductor Heterojunctions and Layer Structures
|
G.W.A.D., |
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1972 |
11 |
3 |
p. 253- 1 p. |
artikel |
89 |
Protect your transitors against turn-on or testing transient damage
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1972 |
11 |
3 |
p. 236- 1 p. |
artikel |
90 |
Pyrohydrolytic Al2O3 for MOS applications
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1972 |
11 |
3 |
p. 240- 1 p. |
artikel |
91 |
Relcomp: a computer program for calculating system reliability and MTBF
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1972 |
11 |
3 |
p. 237- 1 p. |
artikel |
92 |
Reliability and maintainability parameters evaluated with simulation
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1972 |
11 |
3 |
p. 237-238 2 p. |
artikel |
93 |
Reliability comparisons
|
Kitson, B.R. |
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1972 |
11 |
3 |
p. 287-292 6 p. |
artikel |
94 |
Reliability prediction of a two-unit standby redundant system with standby failure
|
Garg, R.C. |
|
1972 |
11 |
3 |
p. 263-267 5 p. |
artikel |
95 |
Report on investigations of radiation resistance of the FBH 162 RTL integrated circuit
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1972 |
11 |
3 |
p. 239-240 2 p. |
artikel |
96 |
Scientific sabotage of switching systems
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1972 |
11 |
3 |
p. 236- 1 p. |
artikel |
97 |
Selective placing of solders and brazes in the assembly of hybrid microelectronic circuits
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1972 |
11 |
3 |
p. 247- 1 p. |
artikel |
98 |
Semiconductors
|
G.W.A.D., |
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1972 |
11 |
3 |
p. 251- 1 p. |
artikel |
99 |
Solder joint design in hybrid circuits
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1972 |
11 |
3 |
p. 246- 1 p. |
artikel |
100 |
Some economic problems related to burn-in programs
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1972 |
11 |
3 |
p. 238-239 2 p. |
artikel |
101 |
Statistical fatigue models: a survey
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1972 |
11 |
3 |
p. 235- 1 p. |
artikel |
102 |
Surface breakdown in silicon planar diodes equipped with field plate
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1972 |
11 |
3 |
p. 236- 1 p. |
artikel |
103 |
Surface self-diffusion of metals
|
G.W.A.D., |
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1972 |
11 |
3 |
p. 252- 1 p. |
artikel |
104 |
Survey of second breakdown phenomena mechanisms and damage in semiconductor junction devices
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1972 |
11 |
3 |
p. 236- 1 p. |
artikel |
105 |
Testing techniques that assure reliable semiconductor devices
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1972 |
11 |
3 |
p. 236- 1 p. |
artikel |
106 |
The design and performance of an r.f. sputtering machine with continuous production capability
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1972 |
11 |
3 |
p. 247- 1 p. |
artikel |
107 |
The development of polyimide multiplayer boards containing flexible circuitry
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1972 |
11 |
3 |
p. 240- 1 p. |
artikel |
108 |
The direct emulsion screen as tool for high resolution thick film printing
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1972 |
11 |
3 |
p. 246- 1 p. |
artikel |
109 |
The effect of static electricity on thick-film resistors
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1972 |
11 |
3 |
p. 247- 1 p. |
artikel |
110 |
The effect of temperature cycling on aluminum-film interconnections
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1972 |
11 |
3 |
p. 241- 1 p. |
artikel |
111 |
The mobility of positrons in semiconductors
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1972 |
11 |
3 |
p. 243- 1 p. |
artikel |
112 |
Theory of metallic contacts on high resistivity solids (II) deep traps
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1972 |
11 |
3 |
p. 242-243 2 p. |
artikel |
113 |
The rheology and viscometers of microelectronics
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1972 |
11 |
3 |
p. 246- 1 p. |
artikel |
114 |
The unserviceable probability of a class of telecommunications networks
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1972 |
11 |
3 |
p. 239- 1 p. |
artikel |
115 |
The use of lasers for resistor trimming
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1972 |
11 |
3 |
p. 248- 1 p. |
artikel |
116 |
Thick-film hybrids meet satellite requirements—part 1
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1972 |
11 |
3 |
p. 247- 1 p. |
artikel |
117 |
Thick-film hybrids meet satellite requirements—part 2
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1972 |
11 |
3 |
p. 248- 1 p. |
artikel |
118 |
Thick-film microelectronics, fabrication, design and applications
|
G.W.A.D., |
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1972 |
11 |
3 |
p. 251-252 2 p. |
artikel |
119 |
Thin-film microcircuit technology—v.h.f. to microwave
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1972 |
11 |
3 |
p. 248- 1 p. |
artikel |
120 |
Transport of the short life-time carriers in homogeneous semiconductors
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1972 |
11 |
3 |
p. 243- 1 p. |
artikel |
121 |
Transport properties of europium oxide thin films
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1972 |
11 |
3 |
p. 246- 1 p. |
artikel |
122 |
TSEE spectra of differently produced SiO2 films
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1972 |
11 |
3 |
p. 245- 1 p. |
artikel |
123 |
Use of a reaction rate method to predict failure times of adhesive bonds at constant stress
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1972 |
11 |
3 |
p. 236- 1 p. |
artikel |
124 |
Variation analysis and design of experiments as an aid to design quality assurance
|
Talbot, J.P.P. |
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1972 |
11 |
3 |
p. 269-281 13 p. |
artikel |
125 |
Who's responsible for product safety?
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1972 |
11 |
3 |
p. 235- 1 p. |
artikel |