nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
Advanced electrical and stability characterization of untrimmed and variously trimmed thick-film and LTCC resistors
|
Dziedzic, Andrzej |
|
2006 |
100-101 |
2-4 |
p. 352-359 8 p. |
artikel |
2 |
A methodology for the calculation of stress migration in die-level interconnects
|
Dauksher, W. |
|
2006 |
100-101 |
2-4 |
p. 616-625 10 p. |
artikel |
3 |
An investigation into the effects of probing and wire bonding stress on the reliability of BOAC
|
Chen, K.M. |
|
2006 |
100-101 |
2-4 |
p. 335-342 8 p. |
artikel |
4 |
An optical characterization technique for hygroscopic expansion of polymers and plastic packages
|
Su, Fei |
|
2006 |
100-101 |
2-4 |
p. 600-609 10 p. |
artikel |
5 |
A numerical failure analysis on lead breakage issues of ultra fine pitch flip chip-on-flex and tape carrier packages during chip/film assembly process
|
Jang, Changsoo |
|
2006 |
100-101 |
2-4 |
p. 487-495 9 p. |
artikel |
6 |
An unusual mechanical failure mode in gold ballbonds at 50μm pitch due to degradation at the Au–Au4Al interface during ageing in air at 175°C
|
Breach, C.D. |
|
2006 |
100-101 |
2-4 |
p. 543-557 15 p. |
artikel |
7 |
Bondability window and power input for wire bonding
|
Han, Lei |
|
2006 |
100-101 |
2-4 |
p. 610-615 6 p. |
artikel |
8 |
Deformation mechanism and its effect on electrical conductivity of ACF flip chip package under thermal cycling condition: An experimental study
|
Kwon, Woon-Seong |
|
2006 |
100-101 |
2-4 |
p. 589-599 11 p. |
artikel |
9 |
Determination of the thermal conductivity of composite low-k dielectrics for advanced interconnect structures
|
Chen, F. |
|
2006 |
100-101 |
2-4 |
p. 232-243 12 p. |
artikel |
10 |
Effect of wire diameter on the thermosonic bond reliability
|
Murali, Sarangapani |
|
2006 |
100-101 |
2-4 |
p. 467-475 9 p. |
artikel |
11 |
Effects of hot carriers in offset gated polysilicon thin-film transistors
|
Hatzopoulos, A.T. |
|
2006 |
100-101 |
2-4 |
p. 311-316 6 p. |
artikel |
12 |
Effects of process conditions on reliability, microstructure evolution and failure modes of SnAgCu solder joints
|
Arulvanan, Periannan |
|
2006 |
100-101 |
2-4 |
p. 432-439 8 p. |
artikel |
13 |
Electromigration of Cu/low dielectric constant interconnects
|
Hu, C.-K. |
|
2006 |
100-101 |
2-4 |
p. 213-231 19 p. |
artikel |
14 |
Electrostatic discharge protection scheme without leakage current path for CMOS IC operating in power-down-mode condition on a system board
|
Lin, Kun-Hsien |
|
2006 |
100-101 |
2-4 |
p. 301-310 10 p. |
artikel |
15 |
Evaluation of displacement rate effect in shear test of Sn–3Ag–0.5Cu solder bump for flip chip application
|
Kim, Jong-Woong |
|
2006 |
100-101 |
2-4 |
p. 535-542 8 p. |
artikel |
16 |
Experimental characterization and mechanical behavior analysis of intermetallic compounds of Sn–3.5Ag lead-free solder bump with Ti/Cu/Ni UBM on copper chip
|
Peng, Chih-Tang |
|
2006 |
100-101 |
2-4 |
p. 523-534 12 p. |
artikel |
17 |
Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition
|
Lai, Yi-Shao |
|
2006 |
100-101 |
2-4 |
p. 645-650 6 p. |
artikel |
18 |
Hot-carrier reliability of submicron NMOSFETs and integrated NMOS low noise amplifiers
|
Naseh, Sasan |
|
2006 |
100-101 |
2-4 |
p. 201-212 12 p. |
artikel |
19 |
Impact of the number of chips on the reliability of the solder balls for wire-bonded stacked-chip ball grid array packages
|
Jen, Yi-Ming |
|
2006 |
100-101 |
2-4 |
p. 386-399 14 p. |
artikel |
20 |
Lead-free 0201 manufacturing, assembly and reliability test results
|
Ramkumar, S. Manian |
|
2006 |
100-101 |
2-4 |
p. 244-262 19 p. |
artikel |
21 |
Low temperature electrical measurements of silicon bipolar monolithic microwave integrated circuit (MMIC) amplifiers
|
Keimasi, Mohammadreza |
|
2006 |
100-101 |
2-4 |
p. 326-334 9 p. |
artikel |
22 |
Modeling and simulation for a drop-impact analysis of multi-layered printed circuit boards
|
Wang, Yuqi |
|
2006 |
100-101 |
2-4 |
p. 558-573 16 p. |
artikel |
23 |
Moisture induced degradation of multilayer ceramic capacitors
|
Donahoe, Daniel N. |
|
2006 |
100-101 |
2-4 |
p. 400-408 9 p. |
artikel |
24 |
[No title]
|
Stojcev, Mile |
|
2006 |
100-101 |
2-4 |
p. 653-654 2 p. |
artikel |
25 |
[No title]
|
Stojcev, Mile |
|
2006 |
100-101 |
2-4 |
p. 651-652 2 p. |
artikel |
26 |
Numerical analysis of a double avalanche region IMPATT diode on the basis of nonlinear model
|
Zemliak, Alexander M. |
|
2006 |
100-101 |
2-4 |
p. 293-300 8 p. |
artikel |
27 |
Optical source reliability in recent optical fiber transmission systems and consumer electronics
|
Fukuda, Mitsuo |
|
2006 |
100-101 |
2-4 |
p. 263-269 7 p. |
artikel |
28 |
Oxidation of copper pads and its influence on the quality of Au/Cu bonds during thermosonic wire bonding process
|
Chuang, Cheng-Li |
|
2006 |
100-101 |
2-4 |
p. 449-458 10 p. |
artikel |
29 |
Processability and reliability of epoxy adhesive used in microelectronic devices linked to effects of degree of cure and damp heat aging
|
Park, Jongwoo |
|
2006 |
100-101 |
2-4 |
p. 503-511 9 p. |
artikel |
30 |
Reliability study of underfill/chip interface under accelerated temperature cycling (ATC) loading
|
Zhang, Y.L. |
|
2006 |
100-101 |
2-4 |
p. 409-420 12 p. |
artikel |
31 |
Report on 4H–SiC JTE Schottky diodes
|
Chen, L. |
|
2006 |
100-101 |
2-4 |
p. 637-640 4 p. |
artikel |
32 |
Residual compression in area array packages induced by underfill shrinkage
|
Larson, Michael C. |
|
2006 |
100-101 |
2-4 |
p. 496-502 7 p. |
artikel |
33 |
Simplified quantitative stress-induced leakage current (SILC) model for MOS devices
|
Ossaimee, M. |
|
2006 |
100-101 |
2-4 |
p. 287-292 6 p. |
artikel |
34 |
Single event burnout in power diodes: Mechanisms and models
|
Albadri, A.M. |
|
2006 |
100-101 |
2-4 |
p. 317-325 9 p. |
artikel |
35 |
Solder reflow process induced residual warpage measurement and its influence on reliability of flip-chip electronic packages
|
Yang, Se Young |
|
2006 |
100-101 |
2-4 |
p. 512-522 11 p. |
artikel |
36 |
Support excitation scheme for transient analysis of JEDEC board-level drop test
|
Yeh, Chang-Lin |
|
2006 |
100-101 |
2-4 |
p. 626-636 11 p. |
artikel |
37 |
Temperature compensation of piezoresistive micro-machined porous silicon pressure sensor by ANN
|
Pramanik, C. |
|
2006 |
100-101 |
2-4 |
p. 343-351 9 p. |
artikel |
38 |
Temperature profile effects in accelerated thermal cycling of SnPb and Pb-free solder joints
|
Qi, Yan |
|
2006 |
100-101 |
2-4 |
p. 574-588 15 p. |
artikel |
39 |
The negative bias temperature instability in MOS devices: A review
|
Stathis, J.H. |
|
2006 |
100-101 |
2-4 |
p. 270-286 17 p. |
artikel |
40 |
Thermal analysis of bond layer influence on performance of an all-active vertically coupled, microring resonating laser
|
Fleischer, A.S. |
|
2006 |
100-101 |
2-4 |
p. 421-431 11 p. |
artikel |
41 |
Thermal deformation measurements and predictions of MAP–BGA electronic packages
|
Tsai, M.Y. |
|
2006 |
100-101 |
2-4 |
p. 476-486 11 p. |
artikel |
42 |
Thermal performance impacts of heat spreading lids on flip chip packages: With and without heat sinks
|
Wakil, Jamil |
|
2006 |
100-101 |
2-4 |
p. 380-385 6 p. |
artikel |
43 |
Thermal resistance analysis and validation of flip chip PBGA packages
|
Chen, Kuo-Ming |
|
2006 |
100-101 |
2-4 |
p. 440-448 9 p. |
artikel |
44 |
The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition
|
Arshad, Mohd Khairuddin Md |
|
2006 |
100-101 |
2-4 |
p. 367-379 13 p. |
artikel |
45 |
Use of high temperature operating life data to mitigate risks in long-duration space applications that deploy commercial-grade plastic encapsulated semiconductor devices
|
Ganesan, Sanka |
|
2006 |
100-101 |
2-4 |
p. 360-366 7 p. |
artikel |
46 |
Vibration fatigue reliability of BGA-IC package with Pb-free solder and Pb–Sn solder
|
Kim, YoungBae |
|
2006 |
100-101 |
2-4 |
p. 459-466 8 p. |
artikel |
47 |
X-ray ion mobility spectrometer
|
Pershenkov, V.S. |
|
2006 |
100-101 |
2-4 |
p. 641-644 4 p. |
artikel |