| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Accelerated aging and thermal cycling of low melting temperature alloys as wet thermal interface materials
|
Roy, Chandan K.
|
|
2015
|
100-101 |
12PB |
p. 2698-2704
7 p.
|
artikel
|
| 2 |
Adding a self-reset feature to the Bulk-BICS with dynamic storage cell
|
Simionovski, Alexandre
|
|
2015
|
100-101 |
12PB |
p. 2748-2753
6 p.
|
artikel
|
| 3 |
AlN capping layer inserted between Cu and SiCN dielectric barrier layer for enhancing reliability of 28nm technological node and beyond
|
Zhou, Ming
|
|
2015
|
100-101 |
12PB |
p. 2705-2711
7 p.
|
artikel
|
| 4 |
A novel photodiode based on Ruthenium(II) complex containing polydentate pyridine as photocatalyst
|
Soylu, M.
|
|
2015
|
100-101 |
12PB |
p. 2685-2688
4 p.
|
artikel
|
| 5 |
Breakdown data generation and in-die deconvolution methodology to address BEOL and MOL dielectric breakdown challenges
|
Chen, F.
|
|
2015
|
100-101 |
12PB |
p. 2727-2747
21 p.
|
artikel
|
| 6 |
Comparative evaluation of the short-circuit withstand capability of 1.2kV silicon carbide (SiC) power transistors in real life applications
|
Kampitsis, Georgios
|
|
2015
|
100-101 |
12PB |
p. 2640-2646
7 p.
|
artikel
|
| 7 |
Development of C-Line plot technique for the characterization of edge effects in acoustic imaging: A case study using flip chip package geometry
|
Lee, Chean Shen
|
|
2015
|
100-101 |
12PB |
p. 2762-2768
7 p.
|
artikel
|
| 8 |
Dynamic compact thermal model of high power light emitting diode
|
Lai, Wei
|
|
2015
|
100-101 |
12PB |
p. 2663-2670
8 p.
|
artikel
|
| 9 |
Editorial Board
|
|
|
2015
|
100-101 |
12PB |
p. IFC-
1 p.
|
artikel
|
| 10 |
Effect of NBTI/PBTI aging and process variations on write failures in MOSFET and FinFET flip-flops
|
Khalid, Usman
|
|
2015
|
100-101 |
12PB |
p. 2614-2626
13 p.
|
artikel
|
| 11 |
Exploring design diversity redundancy to improve resilience in mixed-signal systems
|
Chenet, Cristiano P.
|
|
2015
|
100-101 |
12PB |
p. 2833-2844
12 p.
|
artikel
|
| 12 |
Failure-mechanism analysis for vertical high-power LEDs under external pressure
|
Chen, Guanggao
|
|
2015
|
100-101 |
12PB |
p. 2671-2677
7 p.
|
artikel
|
| 13 |
Fault-tolerant carry look-ahead adder architectures robust to multiple simultaneous errors
|
Valinataj, Mojtaba
|
|
2015
|
100-101 |
12PB |
p. 2845-2857
13 p.
|
artikel
|
| 14 |
Heavy-ion irradiation study in SOI-based and bulk-based junctionless FinFETs using 3D-TCAD simulation
|
Vinodhkumar, N.
|
|
2015
|
100-101 |
12PB |
p. 2647-2653
7 p.
|
artikel
|
| 15 |
Hot carrier effect on a single SiGe HBT's EMI response
|
Xiong, Cen
|
|
2015
|
100-101 |
12PB |
p. 2627-2633
7 p.
|
artikel
|
| 16 |
Inverse Gaussian distribution based timing analysis of Sub-threshold CMOS circuits
|
Chen, Jiaoyan
|
|
2015
|
100-101 |
12PB |
p. 2754-2761
8 p.
|
artikel
|
| 17 |
Liquid Crystal Polymer for QFN packaging: Predicted thermo-mechanical fatigue and Design for Reliability
|
Chenniki, Walide
|
|
2015
|
100-101 |
12PB |
p. 2793-2798
6 p.
|
artikel
|
| 18 |
Microscale temperature sensing using novel reliable silicon vertical microprobe array: Computation and experiment
|
Matin, M.A.
|
|
2015
|
100-101 |
12PB |
p. 2689-2697
9 p.
|
artikel
|
| 19 |
Numerical simulation and fatigue life estimation of BGA packages under random vibration loading
|
Liu, Fang
|
|
2015
|
100-101 |
12PB |
p. 2777-2785
9 p.
|
artikel
|
| 20 |
Optical degradation mechanisms of mid-power white-light LEDs in LM-80-08 tests
|
Huang, Jianlin
|
|
2015
|
100-101 |
12PB |
p. 2654-2662
9 p.
|
artikel
|
| 21 |
Quantification of silicone degradation for LED packages using finite element analysis
|
Zhang, Sung-Uk
|
|
2015
|
100-101 |
12PB |
p. 2678-2684
7 p.
|
artikel
|
| 22 |
Simulation study on the lifetime of electrochemical capacitors using the accelerated degradation test under temperature and voltage stresses
|
Kim, Yu Tack
|
|
2015
|
100-101 |
12PB |
p. 2712-2720
9 p.
|
artikel
|
| 23 |
Study on reliability of PQFP assembly with lead free solder joints under random vibration test
|
Che, F.X.
|
|
2015
|
100-101 |
12PB |
p. 2769-2776
8 p.
|
artikel
|
| 24 |
System efficient ESD design
|
Gossner, H.
|
|
2015
|
100-101 |
12PB |
p. 2607-2613
7 p.
|
artikel
|
| 25 |
Temperature dependence of self-healing characteristics of metallized polypropylene film
|
Li, Haoyuan
|
|
2015
|
100-101 |
12PB |
p. 2721-2726
6 p.
|
artikel
|
| 26 |
The surface energies of β-Sn — A new concept for corrosion and whisker mitigation
|
Eckold, P.
|
|
2015
|
100-101 |
12PB |
p. 2799-2807
9 p.
|
artikel
|
| 27 |
The tensile impact properties of aged Sn–3Ag–0.5Cu/Cu solder joints
|
Nguyen, Van Luong
|
|
2015
|
100-101 |
12PB |
p. 2808-2816
9 p.
|
artikel
|
| 28 |
Transient stress characterization of AlGaN/GaN HEMTs due to electrical and thermal effects
|
Jones, Jason P.
|
|
2015
|
100-101 |
12PB |
p. 2634-2639
6 p.
|
artikel
|
| 29 |
Using RBF networks for detection and prediction of flip chip with missing bumps
|
Liao, Guanglan
|
|
2015
|
100-101 |
12PB |
p. 2817-2825
9 p.
|
artikel
|
| 30 |
Using SOM neural network for X-ray inspection of missing-bump defects in three-dimensional integration
|
Liao, Guanglan
|
|
2015
|
100-101 |
12PB |
p. 2826-2832
7 p.
|
artikel
|
| 31 |
Verification of empirical warp-based design criteria of space electronic boards
|
Ben Fekih, Lassaad
|
|
2015
|
100-101 |
12PB |
p. 2786-2792
7 p.
|
artikel
|
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