| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A Bayesian time-to-failure distribution
|
|
|
1971
|
10 |
5 |
p. 301-
1 p.
|
artikel
|
| 2 |
A critique of MOS/LSI testing
|
|
|
1971
|
10 |
5 |
p. 307-
1 p.
|
artikel
|
| 3 |
A design procedure for discard VS repair decisions
|
|
|
1971
|
10 |
5 |
p. 306-
1 p.
|
artikel
|
| 4 |
A facelifting for NASA's reliability requirements
|
|
|
1971
|
10 |
5 |
p. 302-
1 p.
|
artikel
|
| 5 |
A hybrid repeater using integrated circuits
|
|
|
1971
|
10 |
5 |
p. 309-
1 p.
|
artikel
|
| 6 |
Aluminum-aluminum oxide metallurgy for enhanced electromigration resistance in monolithic circuits
|
|
|
1971
|
10 |
5 |
p. 304-
1 p.
|
artikel
|
| 7 |
An integrated predictor of system reliability
|
|
|
1971
|
10 |
5 |
p. 307-
1 p.
|
artikel
|
| 8 |
An investigation of microplasma noise in zener diodes with the SEM
|
|
|
1971
|
10 |
5 |
p. 313-
1 p.
|
artikel
|
| 9 |
An MOS-LSI memory reliability program for a commercial computer application
|
|
|
1971
|
10 |
5 |
p. 303-
1 p.
|
artikel
|
| 10 |
Application of sputtering in the fabrication of semiconductor devices
|
|
|
1971
|
10 |
5 |
p. 309-
1 p.
|
artikel
|
| 11 |
Applications determine the design, materials, processes and package
|
|
|
1971
|
10 |
5 |
p. 302-
1 p.
|
artikel
|
| 12 |
A study of an ordinary and empirical Bayes approach to reliability estimation in the gamma life testing model
|
|
|
1971
|
10 |
5 |
p. 302-
1 p.
|
artikel
|
| 13 |
Avalanche currents in planar structures
|
|
|
1971
|
10 |
5 |
p. 311-
1 p.
|
artikel
|
| 14 |
Behaviour of a complex system with stand-by redundancy under different repair echelons
|
Srivastava, S.S.
|
|
1971
|
10 |
5 |
p. 375-380
6 p.
|
artikel
|
| 15 |
Boundary conditions at p-n junctions
|
|
|
1971
|
10 |
5 |
p. 311-
1 p.
|
artikel
|
| 16 |
Call for papers
|
|
|
1971
|
10 |
5 |
p. 297-
1 p.
|
artikel
|
| 17 |
Capacitance voltage measurements on N-type InAs MOS diodes
|
|
|
1971
|
10 |
5 |
p. 311-
1 p.
|
artikel
|
| 18 |
Charge transfer devices
|
|
|
1971
|
10 |
5 |
p. 311-
1 p.
|
artikel
|
| 19 |
Chip handling equipment for hybrid microcircuits
|
|
|
1971
|
10 |
5 |
p. 308-
1 p.
|
artikel
|
| 20 |
Computer aided reliability assurance system for ICs
|
|
|
1971
|
10 |
5 |
p. 304-
1 p.
|
artikel
|
| 21 |
Conductor film metallizations for use in tantalum film integrated circuits
|
|
|
1971
|
10 |
5 |
p. 312-
1 p.
|
artikel
|
| 22 |
Courses in microelectronics and reliability
|
|
|
1971
|
10 |
5 |
p. 293-295
3 p.
|
artikel
|
| 23 |
Current density distribution across the pn junction of a partially contacted diode at high forward bias
|
|
|
1971
|
10 |
5 |
p. 310-311
2 p.
|
artikel
|
| 24 |
Deferred state sampling procedures
|
|
|
1971
|
10 |
5 |
p. 301-
1 p.
|
artikel
|
| 25 |
Degradation and passivation of light emitting diodes
|
|
|
1971
|
10 |
5 |
p. 304-
1 p.
|
artikel
|
| 26 |
Design evaluation of distributed saturation characteristics in integrated devices
|
|
|
1971
|
10 |
5 |
p. 310-
1 p.
|
artikel
|
| 27 |
Detection of loose particles within electronic component cavities
|
|
|
1971
|
10 |
5 |
p. 303-
1 p.
|
artikel
|
| 28 |
Development of a model for distributed saturation characteristics in integrated devices
|
|
|
1971
|
10 |
5 |
p. 310-
1 p.
|
artikel
|
| 29 |
Diaphragm connection—a new package for complex ICs
|
|
|
1971
|
10 |
5 |
p. 308-
1 p.
|
artikel
|
| 30 |
Double-diffused MOS transistor achieves microwave gain
|
|
|
1971
|
10 |
5 |
p. 309-
1 p.
|
artikel
|
| 31 |
EBS amplifiers debut
|
|
|
1971
|
10 |
5 |
p. 309-
1 p.
|
artikel
|
| 32 |
Economic formulation of reliability objectives
|
|
|
1971
|
10 |
5 |
p. 301-302
2 p.
|
artikel
|
| 33 |
Electrical junction delineation by scanning electron beam technique
|
|
|
1971
|
10 |
5 |
p. 313-
1 p.
|
artikel
|
| 34 |
Engineering application of failure data
|
|
|
1971
|
10 |
5 |
p. 301-
1 p.
|
artikel
|
| 35 |
Enter the ion-implantation age, where “impossibles” are possible
|
|
|
1971
|
10 |
5 |
p. 312-313
2 p.
|
artikel
|
| 36 |
Equivalent circuit concepts for electronic failure analysis
|
|
|
1971
|
10 |
5 |
p. 305-
1 p.
|
artikel
|
| 37 |
Etude de la fiabilite des varactors pour hyperfrequences de structure “MESA”
|
Dorkel, J.
|
|
1971
|
10 |
5 |
p. 347-354
8 p.
|
artikel
|
| 38 |
Evaluation of the mechanical integrity of beam lead devices and bonds using thermomechanical stress waves
|
|
|
1971
|
10 |
5 |
p. 304-
1 p.
|
artikel
|
| 39 |
Factors involved in the scanning electron microscope analysis of glass passivated devices
|
|
|
1971
|
10 |
5 |
p. 303-
1 p.
|
artikel
|
| 40 |
Failure prediction from interval data
|
|
|
1971
|
10 |
5 |
p. 306-
1 p.
|
artikel
|
| 41 |
FET cascode technique optimizes differential amplifier performance
|
|
|
1971
|
10 |
5 |
p. 309-
1 p.
|
artikel
|
| 42 |
FET input reduces IC op amp's bias and offset
|
|
|
1971
|
10 |
5 |
p. 308-
1 p.
|
artikel
|
| 43 |
Gate noise in MOS FET's at moderately high frequencies
|
|
|
1971
|
10 |
5 |
p. 309-310
2 p.
|
artikel
|
| 44 |
Hybrid ICs a major factor in microwave component development
|
|
|
1971
|
10 |
5 |
p. 312-
1 p.
|
artikel
|
| 45 |
ICs on film strip lend themselves to automatic handling by manufacturer and user too
|
|
|
1971
|
10 |
5 |
p. 308-
1 p.
|
artikel
|
| 46 |
Integrated high frequency gyrator circuits
|
Wade, J.G.
|
|
1971
|
10 |
5 |
p. 387-389
3 p.
|
artikel
|
| 47 |
Integrierte mikrowellenschaltungen stand und tendenzen der entwicklung
|
|
|
1971
|
10 |
5 |
p. 307-
1 p.
|
artikel
|
| 48 |
Invited talk
|
|
|
1971
|
10 |
5 |
p. 312-
1 p.
|
artikel
|
| 49 |
Items of interest
|
|
|
1971
|
10 |
5 |
p. 292-
1 p.
|
artikel
|
| 50 |
Large-scale integration in microelectronics
|
|
|
1971
|
10 |
5 |
p. 307-
1 p.
|
artikel
|
| 51 |
LSI tester does all things to all arrays
|
|
|
1971
|
10 |
5 |
p. 309-
1 p.
|
artikel
|
| 52 |
Mechanisms and modes of failure in silicon planar semiconductor devices
|
|
|
1971
|
10 |
5 |
p. 304-305
2 p.
|
artikel
|
| 53 |
Methods of measurement for semiconductor materials process control and devices
|
|
|
1971
|
10 |
5 |
p. 310-
1 p.
|
artikel
|
| 54 |
MIL-STD-781 sequential tests: time to completion
|
|
|
1971
|
10 |
5 |
p. 306-307
2 p.
|
artikel
|
| 55 |
Model semiconductor dielectric function
|
|
|
1971
|
10 |
5 |
p. 310-
1 p.
|
artikel
|
| 56 |
Modes of failure of MOS devices
|
Eccleston, W.
|
|
1971
|
10 |
5 |
p. 325-336
12 p.
|
artikel
|
| 57 |
Monolithic main memory—new reliability and serviceability environment
|
|
|
1971
|
10 |
5 |
p. 306-
1 p.
|
artikel
|
| 58 |
Monte Carlo analysis of system outage
|
Malec, H.A.
|
|
1971
|
10 |
5 |
p. 339-345
7 p.
|
artikel
|
| 59 |
MOST digital logic circuits in silicon films deposited on sapphire substrates
|
|
|
1971
|
10 |
5 |
p. 311-
1 p.
|
artikel
|
| 60 |
New LSI packaging opens the way for the micromini era
|
|
|
1971
|
10 |
5 |
p. 308-
1 p.
|
artikel
|
| 61 |
Non-destructive semiconductor testing using scanned laser techniques
|
|
|
1971
|
10 |
5 |
p. 313-
1 p.
|
artikel
|
| 62 |
On simplifying mission reliability calculations
|
|
|
1971
|
10 |
5 |
p. 306-
1 p.
|
artikel
|
| 63 |
Operational testing of L.S.I. arrays by stroboscopic scanning electron microscopy
|
Plows, G.S.
|
|
1971
|
10 |
5 |
p. 317-318
2 p.
|
artikel
|
| 64 |
Optimization of Aegis availability
|
|
|
1971
|
10 |
5 |
p. 305-
1 p.
|
artikel
|
| 65 |
Papers to be published in future issues
|
|
|
1971
|
10 |
5 |
p. 315-
1 p.
|
artikel
|
| 66 |
Parametric dependencies in thick-film screening
|
|
|
1971
|
10 |
5 |
p. 311-312
2 p.
|
artikel
|
| 67 |
Part Two: system designers eye multichip LSI packages
|
|
|
1971
|
10 |
5 |
p. 308-
1 p.
|
artikel
|
| 68 |
Prediction intervals for life testing
|
|
|
1971
|
10 |
5 |
p. 306-
1 p.
|
artikel
|
| 69 |
Rate control for vacuum co-deposition of thin-film cermets
|
|
|
1971
|
10 |
5 |
p. 312-
1 p.
|
artikel
|
| 70 |
Recent United Kingdom patents in microelectronics
|
|
|
1971
|
10 |
5 |
p. 299-300
2 p.
|
artikel
|
| 71 |
Reduction of the base/collector capacitance in high speed logic IC transistors by collector-profiling
|
Downey, A.
|
|
1971
|
10 |
5 |
p. 381-385
5 p.
|
artikel
|
| 72 |
Redundancy configurations and their effect on system reliability
|
Evans, R.A.
|
|
1971
|
10 |
5 |
p. 355-357
3 p.
|
artikel
|
| 73 |
Relation of the particle size of RuO2 in cermet resistor inks to the electrical properties of fired resistors
|
|
|
1971
|
10 |
5 |
p. 311-
1 p.
|
artikel
|
| 74 |
Reliability and stability of carbon film resistors
|
Stanley, K.W.
|
|
1971
|
10 |
5 |
p. 359-374
16 p.
|
artikel
|
| 75 |
Reliability approach to ship systems
|
|
|
1971
|
10 |
5 |
p. 306-
1 p.
|
artikel
|
| 76 |
Reliability considerations in STD development
|
|
|
1971
|
10 |
5 |
p. 306-
1 p.
|
artikel
|
| 77 |
Reliability data for improving ship systems
|
|
|
1971
|
10 |
5 |
p. 305-306
2 p.
|
artikel
|
| 78 |
Reliability of real-time telemetry stations for the AZUR satellite
|
|
|
1971
|
10 |
5 |
p. 307-
1 p.
|
artikel
|
| 79 |
Reliability studies of MOS Si-gate arrays
|
|
|
1971
|
10 |
5 |
p. 304-
1 p.
|
artikel
|
| 80 |
Reliable systems operation of amorphous semi-conductor memories
|
|
|
1971
|
10 |
5 |
p. 305-
1 p.
|
artikel
|
| 81 |
Reliable testing of electronic equipment
|
Hemingway, T.K.
|
|
1971
|
10 |
5 |
p. 391-396
6 p.
|
artikel
|
| 82 |
Responsive reliability proposals in a tight market
|
|
|
1971
|
10 |
5 |
p. 302-
1 p.
|
artikel
|
| 83 |
Silicon wafer technology—state of the art
|
|
|
1971
|
10 |
5 |
p. 309-
1 p.
|
artikel
|
| 84 |
Spinel may make MOS faster than T2L
|
|
|
1971
|
10 |
5 |
p. 309-
1 p.
|
artikel
|
| 85 |
Stripline Gunn oscillators are compatible with microwave ICs
|
|
|
1971
|
10 |
5 |
p. 308-
1 p.
|
artikel
|
| 86 |
Studies of bonding mechanisms and failure modes in thermocompression bonds of gold-plated leads to Ti-Au metallized substrates
|
|
|
1971
|
10 |
5 |
p. 305-
1 p.
|
artikel
|
| 87 |
Study of failure modes of multilevel large-scale integrated circuits
|
|
|
1971
|
10 |
5 |
p. 303-
1 p.
|
artikel
|
| 88 |
Subnanosecond delays in circuit complexes measures by slice probing
|
|
|
1971
|
10 |
5 |
p. 308-
1 p.
|
artikel
|
| 89 |
Substratmaterialien für integrierte Mikrowellen-schaltungen
|
|
|
1971
|
10 |
5 |
p. 307-
1 p.
|
artikel
|
| 90 |
Successful matchmakers: miniconnectors for digital ICs
|
|
|
1971
|
10 |
5 |
p. 309-
1 p.
|
artikel
|
| 91 |
System design in MOS/LSI
|
|
|
1971
|
10 |
5 |
p. 309-
1 p.
|
artikel
|
| 92 |
System evaluation and feedback data
|
|
|
1971
|
10 |
5 |
p. 305-
1 p.
|
artikel
|
| 93 |
The case for emitter-coupled logic
|
|
|
1971
|
10 |
5 |
p. 308-
1 p.
|
artikel
|
| 94 |
The determination of oxygen and carbon in semiconductors
|
Clegg, J.B.
|
|
1971
|
10 |
5 |
p. 397-
1 p.
|
artikel
|
| 95 |
The influence of stationary dislocations and stacking faults on some transistor parameters
|
|
|
1971
|
10 |
5 |
p. 303-
1 p.
|
artikel
|
| 96 |
The monolithic phase-locked-loop—a versatile building block
|
|
|
1971
|
10 |
5 |
p. 310-
1 p.
|
artikel
|
| 97 |
The response of the threshold voltages of the transistors in simple MOS circuits to tests at elevated temperatures
|
|
|
1971
|
10 |
5 |
p. 305-
1 p.
|
artikel
|
| 98 |
Thermal control for high density packaging
|
|
|
1971
|
10 |
5 |
p. 308-
1 p.
|
artikel
|
| 99 |
Thermal excursion can cause bond problems
|
|
|
1971
|
10 |
5 |
p. 304-
1 p.
|
artikel
|
| 100 |
The SEM as a defect analysis tool for semiconductor memories
|
|
|
1971
|
10 |
5 |
p. 313-
1 p.
|
artikel
|
| 101 |
The 9th annual reliability engineering and management Institute the University of Arizona, division of continuing education
|
|
|
1971
|
10 |
5 |
p. 295-296
2 p.
|
artikel
|
| 102 |
Thick-film filter designed for television signals
|
|
|
1971
|
10 |
5 |
p. 312-
1 p.
|
artikel
|
| 103 |
Thin-film technologies—a summary of their place in microelectronics
|
|
|
1971
|
10 |
5 |
p. 312-
1 p.
|
artikel
|
| 104 |
Three new technologies converge in high-performance instruments
|
|
|
1971
|
10 |
5 |
p. 307-308
2 p.
|
artikel
|
| 105 |
Total confidence limits on observed reliability
|
|
|
1971
|
10 |
5 |
p. 302-
1 p.
|
artikel
|
| 106 |
Total reliability requirement procedure for large-scale integrated circuit array devices
|
|
|
1971
|
10 |
5 |
p. 303-
1 p.
|
artikel
|
| 107 |
Type-all system for determining semiconductor conductivity type
|
|
|
1971
|
10 |
5 |
p. 311-
1 p.
|
artikel
|
| 108 |
Variables affecting thermally induced surface reconstruction in Al-metal
|
|
|
1971
|
10 |
5 |
p. 304-
1 p.
|
artikel
|
| 109 |
“Weibull” decreasing hazard rate—help or hoax?
|
|
|
1971
|
10 |
5 |
p. 302-
1 p.
|
artikel
|
| 110 |
Whither microelectronics?
|
Foley, F.M.
|
|
1971
|
10 |
5 |
p. 291-
1 p.
|
artikel
|
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