| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A detailed analysis of three-level electron transfer
|
|
|
1971
|
10 |
3 |
p. 149-
1 p.
|
artikel
|
| 2 |
Advanced technologies extend LSI capability
|
|
|
1971
|
10 |
3 |
p. 145-146
2 p.
|
artikel
|
| 3 |
Advantages of IGFETS in integrated circuits
|
|
|
1971
|
10 |
3 |
p. 146-
1 p.
|
artikel
|
| 4 |
A laser maching system for making integrated circuit masks
|
|
|
1971
|
10 |
3 |
p. 152-153
2 p.
|
artikel
|
| 5 |
An electrometer MOST
|
|
|
1971
|
10 |
3 |
p. 148-
1 p.
|
artikel
|
| 6 |
Anodic transformation of silicon nitride obtained by reactive cathode sputtering
|
|
|
1971
|
10 |
3 |
p. 152-
1 p.
|
artikel
|
| 7 |
Applying integrated circuits to transmission systems
|
|
|
1971
|
10 |
3 |
p. 148-
1 p.
|
artikel
|
| 8 |
A review of present practice in reliability engineering
|
Butler, B.E.
|
|
1971
|
10 |
3 |
p. 195-208
14 p.
|
artikel
|
| 9 |
A single substrate thin-film active telephone network using TMM capacitors and tantalum nitride resistors
|
|
|
1971
|
10 |
3 |
p. 147-
1 p.
|
artikel
|
| 10 |
Build a sawtooth generator with three ICs
|
|
|
1971
|
10 |
3 |
p. 148-
1 p.
|
artikel
|
| 11 |
Carrier accumulation and space-charge-limited current flow in fleld-effect transistors
|
|
|
1971
|
10 |
3 |
p. 148-
1 p.
|
artikel
|
| 12 |
Characteristics of parallel-plate transmission lines on silicon-siliconoxide system
|
|
|
1971
|
10 |
3 |
p. 145-
1 p.
|
artikel
|
| 13 |
Characterization of thick-film resistives for maximum production yields
|
|
|
1971
|
10 |
3 |
p. 152-
1 p.
|
artikel
|
| 14 |
Choice of a process inspection scheme for attribute data
|
|
|
1971
|
10 |
3 |
p. 143-
1 p.
|
artikel
|
| 15 |
Chromium/cobalt—an extremely versatile thin-film technology
|
|
|
1971
|
10 |
3 |
p. 152-
1 p.
|
artikel
|
| 16 |
Compare reliability at a glance
|
|
|
1971
|
10 |
3 |
p. 144-
1 p.
|
artikel
|
| 17 |
Computer aided design of IC and LSI devices
|
|
|
1971
|
10 |
3 |
p. 146-
1 p.
|
artikel
|
| 18 |
Computerized mask-making for complex memory chips
|
|
|
1971
|
10 |
3 |
p. 146-147
2 p.
|
artikel
|
| 19 |
Conference report
|
Jacobs, Richard M.
|
|
1971
|
10 |
3 |
p. 137-140
4 p.
|
artikel
|
| 20 |
Covalent bonds in semiconductors
|
|
|
1971
|
10 |
3 |
p. 150-151
2 p.
|
artikel
|
| 21 |
Design and development for reliability
|
Melvin, J.G.
|
|
1971
|
10 |
3 |
p. 209-215
7 p.
|
artikel
|
| 22 |
Designing for automatic testing: the concept and general approach
|
|
|
1971
|
10 |
3 |
p. 143-
1 p.
|
artikel
|
| 23 |
Diffusion in semiconductors
|
G.W.A.D.,
|
|
1971
|
10 |
3 |
p. 156-
1 p.
|
artikel
|
| 24 |
Digital circuits invadec GHz range
|
|
|
1971
|
10 |
3 |
p. 148-
1 p.
|
artikel
|
| 25 |
Double injection in semiconductors heavily doped with deep two-level traps
|
|
|
1971
|
10 |
3 |
p. 150-
1 p.
|
artikel
|
| 26 |
Effect of stress on the carrier generation rate in gold-doped silicon
|
|
|
1971
|
10 |
3 |
p. 149-
1 p.
|
artikel
|
| 27 |
Electrical conduction in cermet films
|
|
|
1971
|
10 |
3 |
p. 151-
1 p.
|
artikel
|
| 28 |
Electronic integrated circuits and systems
|
G.W.A.D.,
|
|
1971
|
10 |
3 |
p. 155-
1 p.
|
artikel
|
| 29 |
Elimination of reflections in high-speed integrated digital gates at low power consumption
|
Abdel-Latif, M.
|
|
1971
|
10 |
3 |
p. 225-
1 p.
|
artikel
|
| 30 |
Experiments concerning the life testing of transistors—I
|
Kemény, A.P.
|
|
1971
|
10 |
3 |
p. 169-194
26 p.
|
artikel
|
| 31 |
Explore IC performance
|
|
|
1971
|
10 |
3 |
p. 145-
1 p.
|
artikel
|
| 32 |
Field effect electronics
|
G.W.A.D.,
|
|
1971
|
10 |
3 |
p. 155-
1 p.
|
artikel
|
| 33 |
Grüneisen constant of some semiconductors
|
|
|
1971
|
10 |
3 |
p. 150-
1 p.
|
artikel
|
| 34 |
Homogeneous thin-film attenuators
|
|
|
1971
|
10 |
3 |
p. 151-
1 p.
|
artikel
|
| 35 |
Hybrid audio power amplifier. SEI-ICHI-DENDA
|
|
|
1971
|
10 |
3 |
p. 147-
1 p.
|
artikel
|
| 36 |
Hybrid resistor trimming: an industry report
|
|
|
1971
|
10 |
3 |
p. 152-
1 p.
|
artikel
|
| 37 |
Integrated-circuit digital logic families. II: TTL devices
|
|
|
1971
|
10 |
3 |
p. 147-
1 p.
|
artikel
|
| 38 |
Integrated-circuit digital logic families; I: Requirements and features of a logic family; RTL, DTL and HTL devices
|
|
|
1971
|
10 |
3 |
p. 147-
1 p.
|
artikel
|
| 39 |
Integrated logic circuits
|
|
|
1971
|
10 |
3 |
p. 148-
1 p.
|
artikel
|
| 40 |
Interface states in metal-oxide-semiconductor field-effect transistors
|
|
|
1971
|
10 |
3 |
p. 149-150
2 p.
|
artikel
|
| 41 |
Low-cost video distribution amplifier gives increased reliability
|
|
|
1971
|
10 |
3 |
p. 144-
1 p.
|
artikel
|
| 42 |
Low-temperature passivation of semiconductor devices and their reliability
|
|
|
1971
|
10 |
3 |
p. 143-144
2 p.
|
artikel
|
| 43 |
LSI testers: still a hardsell?
|
|
|
1971
|
10 |
3 |
p. 146-
1 p.
|
artikel
|
| 44 |
Materials: potting and encapsulating: silicones for microcircuits
|
|
|
1971
|
10 |
3 |
p. 147-
1 p.
|
artikel
|
| 45 |
Microcircuits for the microwave sweeper
|
|
|
1971
|
10 |
3 |
p. 148-
1 p.
|
artikel
|
| 46 |
Microelectronics—Trends and problems
|
Dietrich, Paul
|
|
1971
|
10 |
3 |
p. 133-134
2 p.
|
artikel
|
| 47 |
Microjoining techniques
|
|
|
1971
|
10 |
3 |
p. 147-
1 p.
|
artikel
|
| 48 |
Microwave integrated circuit fabrication
|
|
|
1971
|
10 |
3 |
p. 146-
1 p.
|
artikel
|
| 49 |
Minimum facilities for production of thin-film hybrid circuitry
|
|
|
1971
|
10 |
3 |
p. 152-
1 p.
|
artikel
|
| 50 |
Modulator as a customer designed silicon integrated circuit
|
|
|
1971
|
10 |
3 |
p. 147-
1 p.
|
artikel
|
| 51 |
MOS course, part 6. Testing MOS
|
|
|
1971
|
10 |
3 |
p. 145-
1 p.
|
artikel
|
| 52 |
Negative differential conductivity in semiconductors
|
|
|
1971
|
10 |
3 |
p. 150-
1 p.
|
artikel
|
| 53 |
Notice
|
|
|
1971
|
10 |
3 |
p. 135-136
2 p.
|
artikel
|
| 54 |
Papers to be published in future issues
|
|
|
1971
|
10 |
3 |
p. 157-
1 p.
|
artikel
|
| 55 |
Parallel multiplier gets boost from IC iterative logic
|
|
|
1971
|
10 |
3 |
p. 148-
1 p.
|
artikel
|
| 56 |
Photomodulation of the photoemissive yield near threshold in silicon
|
|
|
1971
|
10 |
3 |
p. 149-
1 p.
|
artikel
|
| 57 |
Plastic ICs entice military
|
|
|
1971
|
10 |
3 |
p. 145-
1 p.
|
artikel
|
| 58 |
Possible new multi-layer interconnection methods for integrated circuits
|
|
|
1971
|
10 |
3 |
p. 146-
1 p.
|
artikel
|
| 59 |
Power system reliability evaluation
|
|
|
1971
|
10 |
3 |
p. 144-
1 p.
|
artikel
|
| 60 |
Quality, product description and conformance
|
|
|
1971
|
10 |
3 |
p. 143-
1 p.
|
artikel
|
| 61 |
Recent United Kingdom patents in microelectronics
|
|
|
1971
|
10 |
3 |
p. 141-142
2 p.
|
artikel
|
| 62 |
Reliability in the design specification
|
|
|
1971
|
10 |
3 |
p. 145-
1 p.
|
artikel
|
| 63 |
Reliability of electronic construction units increased by means of dynamic optimization
|
|
|
1971
|
10 |
3 |
p. 145-
1 p.
|
artikel
|
| 64 |
Reliability of hybrid microcircuits in use today
|
|
|
1971
|
10 |
3 |
p. 144-
1 p.
|
artikel
|
| 65 |
Reliability of switching networks for impediment of trunk lines
|
|
|
1971
|
10 |
3 |
p. 144-145
2 p.
|
artikel
|
| 66 |
Reliability testing
|
|
|
1971
|
10 |
3 |
p. 144-
1 p.
|
artikel
|
| 67 |
Selection of thermocouples for temperature profiling of semiconductor diffusion furnaces
|
|
|
1971
|
10 |
3 |
p. 149-
1 p.
|
artikel
|
| 68 |
Solid-state switching for aircraft electric systems
|
|
|
1971
|
10 |
3 |
p. 147-148
2 p.
|
artikel
|
| 69 |
Some important process and performance characteristics of “Birox” thick-film resistor compositions
|
|
|
1971
|
10 |
3 |
p. 152-
1 p.
|
artikel
|
| 70 |
Special aspects of reliability and maintainability in nuclear stations
|
Wolfe, W.A.
|
|
1971
|
10 |
3 |
p. 217-223
7 p.
|
artikel
|
| 71 |
Stochastic behaviour of an intermittently working system with stand-by redundancy
|
Srivastava, S.S.
|
|
1971
|
10 |
3 |
p. 159-167
9 p.
|
artikel
|
| 72 |
Swing to passive DIPs looks like a stampede
|
|
|
1971
|
10 |
3 |
p. 145-
1 p.
|
artikel
|
| 73 |
Testing integrated circuits
|
|
|
1971
|
10 |
3 |
p. 145-
1 p.
|
artikel
|
| 74 |
The characteristics of thermal grown silicon oxide film
|
|
|
1971
|
10 |
3 |
p. 150-
1 p.
|
artikel
|
| 75 |
The effects of particle size control in the metal powder systems on the characteristics of palladium silver thick-film resistors
|
|
|
1971
|
10 |
3 |
p. 151-
1 p.
|
artikel
|
| 76 |
The influence of non-uniformly doped substrates on MOS C-V curves
|
|
|
1971
|
10 |
3 |
p. 151-
1 p.
|
artikel
|
| 77 |
The theory of surface states on semiconductors
|
|
|
1971
|
10 |
3 |
p. 148-149
2 p.
|
artikel
|
| 78 |
The why's and how's of semiconductor chips
|
|
|
1971
|
10 |
3 |
p. 148-
1 p.
|
artikel
|
| 79 |
Thin-film lumped-element microwave integrated circuits
|
|
|
1971
|
10 |
3 |
p. 151-152
2 p.
|
artikel
|
| 80 |
Thin-film microelectronics: a review
|
|
|
1971
|
10 |
3 |
p. 152-
1 p.
|
artikel
|
| 81 |
Transient annealing of defects in irradiated silicon devices
|
|
|
1971
|
10 |
3 |
p. 144-
1 p.
|
artikel
|
| 82 |
Transistor gyrator using thin-film circuits
|
|
|
1971
|
10 |
3 |
p. 151-
1 p.
|
artikel
|
| 83 |
Untersuchung gesputterter SiO2-schichten auf Sieinkristallen
|
|
|
1971
|
10 |
3 |
p. 149-
1 p.
|
artikel
|
| 84 |
Uses and advantages of chip resistors
|
|
|
1971
|
10 |
3 |
p. 148-
1 p.
|
artikel
|
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