| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A 12 bit monolithic IC D to A converter
|
|
|
1971
|
10 |
1 |
p. 23-
1 p.
|
artikel
|
| 2 |
A critique of chip-joining techniques
|
|
|
1971
|
10 |
1 |
p. 21-22
2 p.
|
artikel
|
| 3 |
Aging effects in gold thermocompression bonds to complex metallizations
|
|
|
1971
|
10 |
1 |
p. 16-
1 p.
|
artikel
|
| 4 |
A model for computation of second breakdown in transistors
|
|
|
1971
|
10 |
1 |
p. 16-
1 p.
|
artikel
|
| 5 |
A monolithic radiation-hardened operational amplifier
|
|
|
1971
|
10 |
1 |
p. 22-
1 p.
|
artikel
|
| 6 |
Analytical study of a standby redundant intermittently working complex system
|
Bajaj, C.P.
|
|
1971
|
10 |
1 |
p. 43-51
9 p.
|
artikel
|
| 7 |
An approach to field repair of avionics computers
|
|
|
1971
|
10 |
1 |
p. 17-
1 p.
|
artikel
|
| 8 |
An approach to the minimization of misclassification in the repair of equipment
|
|
|
1971
|
10 |
1 |
p. 17-
1 p.
|
artikel
|
| 9 |
An improved technique for etching aluminium interconnect patterns on integrated circuits
|
Hines, R.E.
|
|
1971
|
10 |
1 |
p. 59-
1 p.
|
artikel
|
| 10 |
An investigation of inversion layer induced leakage current in abrupt p-n junctions
|
|
|
1971
|
10 |
1 |
p. 25-
1 p.
|
artikel
|
| 11 |
Application of laser systems to microelectronics and silicon wafer dicing
|
|
|
1971
|
10 |
1 |
p. 27-
1 p.
|
artikel
|
| 12 |
Application of scanning electron microscopy to integrated circuit failure
|
|
|
1971
|
10 |
1 |
p. 17-
1 p.
|
artikel
|
| 13 |
A review of some recent vacuum studies
|
|
|
1971
|
10 |
1 |
p. 27-
1 p.
|
artikel
|
| 14 |
A simple apparatus for d.c. bias sputtering
|
|
|
1971
|
10 |
1 |
p. 27-
1 p.
|
artikel
|
| 15 |
Assessing component life from field service tests
|
|
|
1971
|
10 |
1 |
p. 18-
1 p.
|
artikel
|
| 16 |
Associative memory chips: fast, versatile—and here
|
|
|
1971
|
10 |
1 |
p. 22-
1 p.
|
artikel
|
| 17 |
Automatic plasma machines for stripping photoresist
|
|
|
1971
|
10 |
1 |
p. 20-
1 p.
|
artikel
|
| 18 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
|
|
1971
|
10 |
1 |
p. 5-7
3 p.
|
artikel
|
| 19 |
Call for papers
|
|
|
1971
|
10 |
1 |
p. 9-
1 p.
|
artikel
|
| 20 |
Carrier transport across metal-semiconductor barriers
|
|
|
1971
|
10 |
1 |
p. 23-
1 p.
|
artikel
|
| 21 |
Circuit design for thick-film hybrids
|
|
|
1971
|
10 |
1 |
p. 25-
1 p.
|
artikel
|
| 22 |
Clean rooms
|
|
|
1971
|
10 |
1 |
p. 18-
1 p.
|
artikel
|
| 23 |
Complementary transistors in integrated circuits
|
|
|
1971
|
10 |
1 |
p. 19-
1 p.
|
artikel
|
| 24 |
Computer aided design for photomask production
|
|
|
1971
|
10 |
1 |
p. 20-
1 p.
|
artikel
|
| 25 |
Contamination control in integrated circuits
|
|
|
1971
|
10 |
1 |
p. 16-
1 p.
|
artikel
|
| 26 |
Control of quality and reliability in the massproduction of electronic equipment
|
|
|
1971
|
10 |
1 |
p. 18-
1 p.
|
artikel
|
| 27 |
Current controlled negative resistance in semiconductors
|
|
|
1971
|
10 |
1 |
p. 24-
1 p.
|
artikel
|
| 28 |
Custom design of thin-film hybrid circuits
|
|
|
1971
|
10 |
1 |
p. 26-
1 p.
|
artikel
|
| 29 |
Design considerations for a flip-chip joining technique
|
|
|
1971
|
10 |
1 |
p. 21-
1 p.
|
artikel
|
| 30 |
Editorial Board
|
|
|
1971
|
10 |
1 |
p. IFC-
1 p.
|
artikel
|
| 31 |
Effects of image force and tunneling on current transport in metal-semiconductor (Schottky Barrier) contacts
|
|
|
1971
|
10 |
1 |
p. 24-
1 p.
|
artikel
|
| 32 |
Effet de valence en éléctromigration dans l'argent
|
|
|
1971
|
10 |
1 |
p. 16-
1 p.
|
artikel
|
| 33 |
Evaluation of packaged ICs—part 4. Circuit layout and processing
|
|
|
1971
|
10 |
1 |
p. 21-
1 p.
|
artikel
|
| 34 |
Factors affecting the reliability of sliding contacts
|
Jowett, C.E.
|
|
1971
|
10 |
1 |
p. 53-57
5 p.
|
artikel
|
| 35 |
FEN filter design using tantalum and silicon integrated circuits
|
|
|
1971
|
10 |
1 |
p. 22-
1 p.
|
artikel
|
| 36 |
Forming contacts on metallized silicon slices
|
|
|
1971
|
10 |
1 |
p. 21-
1 p.
|
artikel
|
| 37 |
IC customer design—Part 3. Bipolar integrated circuit components
|
|
|
1971
|
10 |
1 |
p. 20-
1 p.
|
artikel
|
| 38 |
IC customer-design—Part 4, “practice from theory”
|
|
|
1971
|
10 |
1 |
p. 19-
1 p.
|
artikel
|
| 39 |
IC pattern exposure by scanning electron beam apparatus
|
|
|
1971
|
10 |
1 |
p. 27-
1 p.
|
artikel
|
| 40 |
Inference on Weibull percentiles and shape parameter from maximum likelihood estimates
|
|
|
1971
|
10 |
1 |
p. 15-
1 p.
|
artikel
|
| 41 |
Interfacing circuitry for use with MIC7400 series TTL
|
|
|
1971
|
10 |
1 |
p. 19-
1 p.
|
artikel
|
| 42 |
Ion implantation offers a bagful of benefits for MOS
|
|
|
1971
|
10 |
1 |
p. 27-
1 p.
|
artikel
|
| 43 |
Items of interest
|
|
|
1971
|
10 |
1 |
p. 3-4
2 p.
|
artikel
|
| 44 |
Maintainability demonstration test performed on a computer system
|
|
|
1971
|
10 |
1 |
p. 18-
1 p.
|
artikel
|
| 45 |
Maintenance management data systems for electronic equipments
|
Clements, W.G.
|
|
1971
|
10 |
1 |
p. 37-41
5 p.
|
artikel
|
| 46 |
Measuring technique of integrated circuits—present status and future prospects
|
|
|
1971
|
10 |
1 |
p. 18-
1 p.
|
artikel
|
| 47 |
Mechanical design of chip components for “flip” and short beam-lead mounting
|
|
|
1971
|
10 |
1 |
p. 20-
1 p.
|
artikel
|
| 48 |
Metallization processes in fabrication of Schottkybarrier FET's
|
|
|
1971
|
10 |
1 |
p. 21-
1 p.
|
artikel
|
| 49 |
Microelectronics in airborne equipment
|
|
|
1971
|
10 |
1 |
p. 23-
1 p.
|
artikel
|
| 50 |
MOS and vertical junction device characteristics of epitaxial silicon on low aluminum-rich spinel
|
|
|
1971
|
10 |
1 |
p. 24-
1 p.
|
artikel
|
| 51 |
MOS review
|
|
|
1971
|
10 |
1 |
p. 19-
1 p.
|
artikel
|
| 52 |
Noise in microelectronic active RC filters
|
Bozic, S.M.
|
|
1971
|
10 |
1 |
p. 31-36
6 p.
|
artikel
|
| 53 |
Notice of meeting
|
|
|
1971
|
10 |
1 |
p. 11-
1 p.
|
artikel
|
| 54 |
On the preparation of epitaxial films of III-V compounds
|
|
|
1971
|
10 |
1 |
p. 25-
1 p.
|
artikel
|
| 55 |
Photoetching and screen printing of conductor patterns for face-down-bonded devices
|
|
|
1971
|
10 |
1 |
p. 21-
1 p.
|
artikel
|
| 56 |
Plastic coatings for electronics
|
Dummer, G.W.A.
|
|
1971
|
10 |
1 |
p. 30-
1 p.
|
artikel
|
| 57 |
Platinum-silicide contacts to silicon semiconductor devices
|
|
|
1971
|
10 |
1 |
p. 20-
1 p.
|
artikel
|
| 58 |
Polishing and sectioning of microelectronic components
|
|
|
1971
|
10 |
1 |
p. 16-
1 p.
|
artikel
|
| 59 |
Prediction of the stability of thin-film resistors
|
|
|
1971
|
10 |
1 |
p. 26-27
2 p.
|
artikel
|
| 60 |
Preliminary data for a new high performance resistor series
|
|
|
1971
|
10 |
1 |
p. 26-
1 p.
|
artikel
|
| 61 |
Process variables in thick-film resistor fabrication
|
|
|
1971
|
10 |
1 |
p. 26-
1 p.
|
artikel
|
| 62 |
Projection masking, thin photoresist layers and interference effects
|
|
|
1971
|
10 |
1 |
p. 21-
1 p.
|
artikel
|
| 63 |
Quantum and temperature effects on capacitance in degenerate p-n junctions
|
|
|
1971
|
10 |
1 |
p. 25-
1 p.
|
artikel
|
| 64 |
Quantum mechanical calculation of the carrier distribution and the thickness of the inversion layer of a MOS field-effect transistor
|
|
|
1971
|
10 |
1 |
p. 23-24
2 p.
|
artikel
|
| 65 |
Recent developments in thin-film hybrid microcircuits
|
|
|
1971
|
10 |
1 |
p. 26-
1 p.
|
artikel
|
| 66 |
Recent United Kingdom patents in microelectronics
|
|
|
1971
|
10 |
1 |
p. 13-14
2 p.
|
artikel
|
| 67 |
Reduction of electromigration in aluminum films by copper doping
|
|
|
1971
|
10 |
1 |
p. 27-
1 p.
|
artikel
|
| 68 |
Reliability analysis of redundant networks using flow graphs
|
|
|
1971
|
10 |
1 |
p. 17-
1 p.
|
artikel
|
| 69 |
Reliability and the importance of maintenance
|
|
|
1971
|
10 |
1 |
p. 17-
1 p.
|
artikel
|
| 70 |
Reliability in action
|
|
|
1971
|
10 |
1 |
p. 17-
1 p.
|
artikel
|
| 71 |
Reliability of systems with standby components
|
|
|
1971
|
10 |
1 |
p. 17-
1 p.
|
artikel
|
| 72 |
Reliable electronic assembly production
|
Rackstraw, R.R.
|
|
1971
|
10 |
1 |
p. 29-30
2 p.
|
artikel
|
| 73 |
Resistor trimming and micromachining with a Yag Laser
|
|
|
1971
|
10 |
1 |
p. 22-
1 p.
|
artikel
|
| 74 |
Significance of equipment reliability in a telephone network
|
|
|
1971
|
10 |
1 |
p. 18-
1 p.
|
artikel
|
| 75 |
Silicon gate technology
|
|
|
1971
|
10 |
1 |
p. 25-
1 p.
|
artikel
|
| 76 |
Standardization and reliability
|
Dummer, G.W.A.
|
|
1971
|
10 |
1 |
p. 1-
1 p.
|
artikel
|
| 77 |
Surface-related failure mechanisms in integrated circuit arrays
|
|
|
1971
|
10 |
1 |
p. 16-
1 p.
|
artikel
|
| 78 |
Technological advances in large-scale integration
|
|
|
1971
|
10 |
1 |
p. 22-
1 p.
|
artikel
|
| 79 |
Temperature and field dependences of the generation-recombination noise and the thermal emission rates at the gold acceptor center in silicon
|
|
|
1971
|
10 |
1 |
p. 24-
1 p.
|
artikel
|
| 80 |
The application of a radio influence voltage test to the detection of voids in elastomers
|
|
|
1971
|
10 |
1 |
p. 15-
1 p.
|
artikel
|
| 81 |
The application of sputtering to beam-lead technology
|
|
|
1971
|
10 |
1 |
p. 20-
1 p.
|
artikel
|
| 82 |
The C-V technique as an analytical tool
|
|
|
1971
|
10 |
1 |
p. 19-
1 p.
|
artikel
|
| 83 |
The diffusion of gold in thin silicon slices
|
|
|
1971
|
10 |
1 |
p. 25-
1 p.
|
artikel
|
| 84 |
The effect of geometry on the characteristics of thick film resistors
|
|
|
1971
|
10 |
1 |
p. 26-
1 p.
|
artikel
|
| 85 |
The influence of donor-acceptor pair formation and space charge on the fabrication of p-n junctions by diffusion
|
|
|
1971
|
10 |
1 |
p. 23-
1 p.
|
artikel
|
| 86 |
The investigation of double layers in semiconductor technology
|
|
|
1971
|
10 |
1 |
p. 25-
1 p.
|
artikel
|
| 87 |
The lumped-element approach to microwave integrated circuits
|
|
|
1971
|
10 |
1 |
p. 22-
1 p.
|
artikel
|
| 88 |
The mechanical engineer and electronic reliability
|
|
|
1971
|
10 |
1 |
p. 15-
1 p.
|
artikel
|
| 89 |
The metal-semiconductor contact: An old device with a new future
|
|
|
1971
|
10 |
1 |
p. 20-
1 p.
|
artikel
|
| 90 |
Theoretical phonon limited electron mobility in silicon
|
|
|
1971
|
10 |
1 |
p. 23-
1 p.
|
artikel
|
| 91 |
Thermal design problems with high speed ICs—I
|
|
|
1971
|
10 |
1 |
p. 19-
1 p.
|
artikel
|
| 92 |
The state variable approach to system effectiveness
|
|
|
1971
|
10 |
1 |
p. 17-
1 p.
|
artikel
|
| 93 |
The thermal runaway mechanism of second breakdown phenomenon
|
|
|
1971
|
10 |
1 |
p. 16-
1 p.
|
artikel
|
| 94 |
Thick-film glass-ceramic capacitors
|
|
|
1971
|
10 |
1 |
p. 25-26
2 p.
|
artikel
|
| 95 |
Titanium nitride/titanium resistive glazes
|
|
|
1971
|
10 |
1 |
p. 26-
1 p.
|
artikel
|
| 96 |
Transistor, diode and parasitic modeling for integrated circuit design
|
|
|
1971
|
10 |
1 |
p. 20-
1 p.
|
artikel
|
| 97 |
Ultrasonic bonding of ICs to thick film pedestals
|
|
|
1971
|
10 |
1 |
p. 22-
1 p.
|
artikel
|
| 98 |
Why MSI?
|
|
|
1971
|
10 |
1 |
p. 19-
1 p.
|
artikel
|
| 99 |
Wide band amplifier in thin film technique
|
|
|
1971
|
10 |
1 |
p. 26-
1 p.
|
artikel
|
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