nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
Accurate reliability analysis of concurrent checking circuits employing an efficient analytical method
|
An, T. |
|
2015 |
|
3-4 |
p. 696-703 8 p. |
artikel |
2 |
A dual-rail compact defect-tolerant multiplexer
|
Ben Dhia, A. |
|
2015 |
|
3-4 |
p. 662-670 9 p. |
artikel |
3 |
Ageing and thermal recovery of advanced SiGe heterojunction bipolar transistors under long-term mixed-mode and reverse stress conditions
|
Fischer, G.G. |
|
2015 |
|
3-4 |
p. 498-507 10 p. |
artikel |
4 |
A mid-value select voter
|
Krstic, M.D. |
|
2005 |
|
3-4 |
p. 733-738 6 p. |
artikel |
5 |
An accurate closed-expression model for FinFETs parasitic resistance
|
Pereira, A.S.N. |
|
2015 |
|
3-4 |
p. 470-480 11 p. |
artikel |
6 |
Analysis of hot-carrier degradation in a SOI LDMOS transistor with a steep retrograde drift doping profile
|
Cortés, I. |
|
2005 |
|
3-4 |
p. 493-498 6 p. |
artikel |
7 |
An efficient BTX sensor based on p-type nanoporous titania thin films
|
Dutta, K. |
|
2015 |
|
3-4 |
p. 558-564 7 p. |
artikel |
8 |
An evaluation of dwell time and mean cyclic temperature parameters in the Engelmaier model
|
George, Elviz |
|
2015 |
|
3-4 |
p. 582-587 6 p. |
artikel |
9 |
A new method for the lifetime determination of submicron metal interconnects by means of a parallel test structure
|
Vanstreels, K. |
|
2005 |
|
3-4 |
p. 753-759 7 p. |
artikel |
10 |
A return on investment analysis of applying health monitoring to LED lighting systems
|
Chang, Moon-Hwan |
|
2015 |
|
3-4 |
p. 527-537 11 p. |
artikel |
11 |
A review of CMOS latchup and electrostatic discharge (ESD) in bipolar complimentary MOSFET (BiCMOS) Silicon Germanium technologies: Part II—Latchup
|
Voldman, Steven H. |
|
2005 |
|
3-4 |
p. 437-455 19 p. |
artikel |
12 |
A study of post-etch wet clean on electrical and reliability performance of Cu/low k interconnections
|
Tsang, C.F. |
|
2005 |
|
3-4 |
p. 517-525 9 p. |
artikel |
13 |
Bandwidth of integrated photodiodes in standard CMOS for CD/DVD applications
|
Radovanović, Saša |
|
2005 |
|
3-4 |
p. 705-710 6 p. |
artikel |
14 |
Bipolar SCR ESD devices
|
Vashchenko, V.A. |
|
2005 |
|
3-4 |
p. 457-471 15 p. |
artikel |
15 |
Burnout properties of microwave pulse injected on GaAs PHEMT
|
Zhang, Cunbo |
|
2015 |
|
3-4 |
p. 508-513 6 p. |
artikel |
16 |
Characterization and modeling of power MOSFET switching times variations under constant electrical stress
|
Sezgin, Hatice Gül |
|
2015 |
|
3-4 |
p. 492-497 6 p. |
artikel |
17 |
Characterization of bump arrays at RF/microwave frequencies
|
Ndip, Ivan N. |
|
2005 |
|
3-4 |
p. 551-558 8 p. |
artikel |
18 |
Characterization of flexural and thermo-mechanical behavior of plastic ball grid package assembly using moiré interferometry
|
Joo, Jinwon |
|
2005 |
|
3-4 |
p. 637-646 10 p. |
artikel |
19 |
Chemical and diffusion-controlled curing kinetics of an underfill material
|
He, Yi |
|
2005 |
|
3-4 |
p. 689-695 7 p. |
artikel |
20 |
Cross-layer investigation of continuous-time sigma–delta modulator under aging effects
|
Cai, Hao |
|
2015 |
|
3-4 |
p. 645-653 9 p. |
artikel |
21 |
Degradation behavior by DC-accelerated and pulse-current stress in Co/Cr/Y/Al/Ni co-doped ZnO–PrO1.83-based varistors
|
Nahm, Choon-W. |
|
2015 |
|
3-4 |
p. 565-571 7 p. |
artikel |
22 |
Design and analyze of transient-induced latch-up in RS485 transceiver with on-chip TVS
|
Jiang, Qi |
|
2015 |
|
3-4 |
p. 637-644 8 p. |
artikel |
23 |
Design of a folded cascode opamp with increased immunity to conducted electromagnetic interference in 0.18μm CMOS
|
Richelli, Anna |
|
2015 |
|
3-4 |
p. 654-661 8 p. |
artikel |
24 |
Detailed study and projection of hard breakdown evolution in ultra-thin gate oxides
|
Suehle, J.S. |
|
2005 |
|
3-4 |
p. 419-426 8 p. |
artikel |
25 |
Development of a fast method for optimization of Au ball bond process
|
Gomes, J. |
|
2015 |
|
3-4 |
p. 602-607 6 p. |
artikel |
26 |
Effect of aluminum concentration on the microstructure and mechanical properties of Sn–Cu–Al solder alloy
|
Yang, Li |
|
2015 |
|
3-4 |
p. 596-601 6 p. |
artikel |
27 |
Electrothermal characterization of silicon-on-glass VDMOSFETs
|
Nenadović, N. |
|
2005 |
|
3-4 |
p. 541-550 10 p. |
artikel |
28 |
Elimination of stress induced dislocation in deep Poly Sinker LDMOS technology
|
Xu, Xiangming |
|
2015 |
|
3-4 |
p. 486-491 6 p. |
artikel |
29 |
Evaluation of electrolessly deposited NiP integral resistors on flexible polyimide substrate
|
Waris, Tuomas F. |
|
2005 |
|
3-4 |
p. 665-673 9 p. |
artikel |
30 |
Evaluation of parasitic capacitances for interconnection buses crossing in different layers
|
Jarosz, A. |
|
2005 |
|
3-4 |
p. 761-765 5 p. |
artikel |
31 |
Extended Sensor Reliability Evaluation Method in multi-sensor control systems
|
Łęczycki, Paweł |
|
2015 |
|
3-4 |
p. 671-678 8 p. |
artikel |
32 |
Failure mechanisms in thermal inkjet printhead analyzed by experiments and numerical simulation
|
Lim, Ji-hyuk |
|
2005 |
|
3-4 |
p. 473-478 6 p. |
artikel |
33 |
Fatigue life and resistance analysis of COG assemblies under hygrothermal aging
|
Zhang, Wenguo |
|
2015 |
|
3-4 |
p. 623-629 7 p. |
artikel |
34 |
Flip chip attachment on flexible LCP substrate using an ACF
|
Frisk, L. |
|
2005 |
|
3-4 |
p. 583-588 6 p. |
artikel |
35 |
Gate dielectric breakdown in the time-scale of ESD events
|
Weir, Bonnie E. |
|
2005 |
|
3-4 |
p. 427-436 10 p. |
artikel |
36 |
Hot carrier effect on the bipolar transistors’ response to electromagnetic interference
|
Xiong, Cen |
|
2015 |
|
3-4 |
p. 514-519 6 p. |
artikel |
37 |
Hybrid reliability assessment for packaging prototyping
|
Lu, Hua |
|
2005 |
|
3-4 |
p. 597-609 13 p. |
artikel |
38 |
Impact of gate-leakage currents on CMOS circuit performance
|
Marras, Alessandro |
|
2005 |
|
3-4 |
p. 499-506 8 p. |
artikel |
39 |
Impact of wafer charging on hot carrier reliability and optimization of latent damage detection methodology in advanced CMOS technologies
|
Goguenheim, D. |
|
2005 |
|
3-4 |
p. 487-492 6 p. |
artikel |
40 |
Improving reliability of beveled power semiconductor devices passivated by SIPOS
|
Wang, Ying |
|
2005 |
|
3-4 |
p. 535-539 5 p. |
artikel |
41 |
Improving the power cycling performance of IGBT modules by plating the emitter contact
|
Özkol, Emre |
|
2015 |
|
3-4 |
p. 552-557 6 p. |
artikel |
42 |
Improving the reliability of the Benes network for use in large-scale systems
|
Jahanshahi, Mohsen |
|
2015 |
|
3-4 |
p. 679-695 17 p. |
artikel |
43 |
Inside front cover - Editorial board
|
|
|
2015 |
|
3-4 |
p. IFC- 1 p. |
artikel |
44 |
Intermediate wafer level bonding and interface behavior
|
Pan, C.T. |
|
2005 |
|
3-4 |
p. 657-663 7 p. |
artikel |
45 |
Leakage current study and relevant defect localization in integrated circuit failure analysis
|
Wu, Chunlei |
|
2015 |
|
3-4 |
p. 463-469 7 p. |
artikel |
46 |
Low voltage SILC and P- and N-MOSFET gate oxide reliability
|
Petit, C. |
|
2005 |
|
3-4 |
p. 479-485 7 p. |
artikel |
47 |
Maximum pulse current estimation for high accuracy power capability prediction of a Li-Ion battery
|
Lee, Seongjun |
|
2015 |
|
3-4 |
p. 572-581 10 p. |
artikel |
48 |
Measuring process capability based on C PK with gauge measurement errors
|
Pearn, W.L. |
|
2005 |
|
3-4 |
p. 739-751 13 p. |
artikel |
49 |
Microstructure, tensile and electrical properties of gold-coated silver bonding wire
|
Tseng, Yi-Wei |
|
2015 |
|
3-4 |
p. 608-612 5 p. |
artikel |
50 |
Modeling, simulation and temperature compensation of porous polysilicon capacitive humidity sensor using ANN technique
|
Islam, T. |
|
2005 |
|
3-4 |
p. 697-703 7 p. |
artikel |
51 |
MOS current divider based PGA
|
Sanz, M. Teresa |
|
2005 |
|
3-4 |
p. 727-732 6 p. |
artikel |
52 |
MOSFET channel resistance characterization from the triode region to impact ionization region with the inductive breakdown network
|
Lee, Chie-In |
|
2015 |
|
3-4 |
p. 481-485 5 p. |
artikel |
53 |
100 μm Pitch flip chip on foil assemblies with adhesive interconnections
|
de Vries, J. |
|
2005 |
|
3-4 |
p. 527-534 8 p. |
artikel |
54 |
Novel concepts for reliability technology
|
Ryu, Dongsu |
|
2005 |
|
3-4 |
p. 611-622 12 p. |
artikel |
55 |
Processing quality results for electroless/electroplating of high-aspect ratio plated through holes in industrially produced printed circuit boards
|
Siau, Sam |
|
2005 |
|
3-4 |
p. 675-687 13 p. |
artikel |
56 |
Real-time fault-tolerance with hot-standby topology for conditional sum adder
|
Mukherjee, Atin |
|
2015 |
|
3-4 |
p. 704-712 9 p. |
artikel |
57 |
Reliability of thin films: Experimental study on mechanical and thermal behavior of indium tin oxide and poly(3,4-ethylenedioxythiophene)
|
Alkhazaili, Atif |
|
2015 |
|
3-4 |
p. 538-546 9 p. |
artikel |
58 |
Response surface models for efficient, modular estimation of solder joint reliability in area array packages
|
Zhang, L. |
|
2005 |
|
3-4 |
p. 623-635 13 p. |
artikel |
59 |
Review of add-on process modules for high-frequency silicon technology
|
Burghartz, J.N. |
|
2005 |
|
3-4 |
p. 409-418 10 p. |
artikel |
60 |
Robust dual-direction SCR with low trigger voltage, tunable holding voltage for high-voltage ESD protection
|
Wang, Yang |
|
2015 |
|
3-4 |
p. 520-526 7 p. |
artikel |
61 |
SiLK™ etch optimization and electrical characterization for 0.13 μm interconnects
|
Murthy, Ramana |
|
2005 |
|
3-4 |
p. 507-516 10 p. |
artikel |
62 |
Study of anisotropic conductive adhesive joint behavior under 3-point bending
|
Rizvi, M.J. |
|
2005 |
|
3-4 |
p. 589-596 8 p. |
artikel |
63 |
Systematic evaluation of thermal interface materials—a case study in high power amplifier design
|
Maguire, Luke |
|
2005 |
|
3-4 |
p. 711-725 15 p. |
artikel |
64 |
Temperature mapping by μ-Raman spectroscopy over cross-section area of power diode in forward biased conditions
|
Kociniewski, T. |
|
2015 |
|
3-4 |
p. 547-551 5 p. |
artikel |
65 |
The effect of the echo-time of a bipolar pulse waveform on molten metallic droplet formation by squeeze mode piezoelectric inkjet printing
|
Wu, Cheng-Han |
|
2015 |
|
3-4 |
p. 630-636 7 p. |
artikel |
66 |
The formation and growth of intermetallic compounds and shear strength at Sn–Zn solder/Au–Ni–Cu interfaces
|
Kim, K.S. |
|
2005 |
|
3-4 |
p. 647-655 9 p. |
artikel |
67 |
The fundamentals of thermal-mass diffusion analogy
|
Wong, E.H. |
|
2015 |
|
3-4 |
p. 588-595 8 p. |
artikel |
68 |
Theoretical investigation on hermeticity testing of MEMS packages based on MIL-STD-883E
|
Tao, Yi |
|
2005 |
|
3-4 |
p. 559-566 8 p. |
artikel |
69 |
Ultra-thin high-density LSI packaging substrate for advanced CSPs and SiPs
|
Shimoto, Tadanori |
|
2005 |
|
3-4 |
p. 567-574 8 p. |
artikel |
70 |
Vacuum effect on the void formation of the molded underfill process in flip chip packaging
|
Guo, Xue-Ru |
|
2015 |
|
3-4 |
p. 613-622 10 p. |
artikel |
71 |
Verification of submodeling technique in thermomechanical reliability assessment of flip-chip package assembly
|
Lai, Yi-Shao |
|
2005 |
|
3-4 |
p. 575-582 8 p. |
artikel |