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Journal description
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Details for article 23 of 33 found articles
| Title: |
Processing and warpage evaluation of Package-on-Packages with various epoxy molding compounds |
| Author: |
Jung, Dong-Myung Kim, Min-Young Oh, Tae-Sung |
| Appeared in: |
Electronic materials letters |
| Paging: | Volume 10 (2014) nr. 2 pages 467-471 |
| Year: |
2014 |
| Contents: | |
| Publisher: |
The Korean Institute of Metals and Materials, Springer |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 23 of 33 found articles
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