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Journal description
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Details for article 129 of 219 found articles
| Title: |
Mitigation and Mechanism of Tin Whisker on Micro-bumps by Hard and Soft Underfills |
| Author: |
Shan, Zhenzhen Lin, Ke Hu, Anmin Li, Ming |
| Appeared in: |
Electronic materials letters |
| Paging: | Volume 18 () nr. 6 pages 547-558 |
| Year: |
2022-10-25 |
| Contents: | |
| Publisher: |
The Korean Institute of Metals and Materials, Seoul |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 129 of 219 found articles
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