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                                       Details for article 31 of 40 found articles
 
 
  Study on the Fluid–Structure Interaction at Different Layout of Stacked Chip in Molded Packaging
 
 
Title: Study on the Fluid–Structure Interaction at Different Layout of Stacked Chip in Molded Packaging
Author: Ishak, M. H. H.
Abdullah, M. Z.
Aziz, M. S. Abdul
Saad, A. A.
Abdullah, M. K.
Loh, W. K.
Ooi, R. C.
Ooi, C. K.
Appeared in: Arabian journal for science and engineering
Paging: Volume 42 (2017) nr. 11 pages 4743-4757
Year: 2017
Contents:
Publisher: Springer Berlin Heidelberg, Berlin/Heidelberg
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 31 of 40 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands