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Journal description
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Details for article 27 of 34 found articles
| Title: |
Reaction diffusions of Cu6Sn5 and Cu3Sn intermetallic compound in the couple of Sn-3.5Ag eutectic solder and copper substrate |
| Author: |
Yoon, Jeong -Won Lee, Chang -Bae Kim, Dae -Up Jung, Seung -Boo |
| Appeared in: |
Metals and materials international |
| Paging: | Volume 9 (2003) nr. 2 pages 193-199 |
| Year: |
2003 |
| Contents: | |
| Publisher: |
The Korean Institute of Metals and Materials, Seoul |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 27 of 34 found articles
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