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Journal description
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Details for article 133 of 201 found articles
| Title: |
Modeling of Thermal Processes in “Package-on-Package” Type Multichip Microcircuits |
| Author: |
Belyaev, M. A. Putrolainen, V. V. Seredov, P. N. Lunkov, P. V. |
| Appeared in: |
Russian electrical engineering |
| Paging: | Volume 92 () nr. 7 pages 369-374 |
| Year: |
2021-09-21 |
| Contents: | |
| Publisher: |
Pleiades Publishing, Moscow |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 133 of 201 found articles
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