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                                       Details for article 25 of 48 found articles
 
 
  Modeling and investigation on wafer shape in wafer rotational grinding method
 
 
Title: Modeling and investigation on wafer shape in wafer rotational grinding method
Author: Tang, Keyan
Kang, Renke
Guo, Dongming
Song, Li
Appeared in: The international journal of advanced manufacturing technology
Paging: Volume 64 (2012) nr. 5-8 pages 707-714
Year: 2012
Contents:
Publisher: Springer-Verlag, London
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 25 of 48 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands